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Printed Circuit Board (PCB) Market size to grow by USD 19.05 billion from 2022 to 207, The rising industry automation is an emerging trend shaping the market, Technavio

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NEW YORK, March 4, 2024 /PRNewswire/ — The printed circuit board (PCB) market is set to grow by USD 19.05 billion from 2022 to 2027. The market is estimated to be progressing at a CAGR of 5.05% during the forecast period. The report offers an up-to-date analysis regarding the current global market scenario, the latest trends and drivers, and the overall market environment. The rising industry automation is an emerging trend shaping the market. There is increasing adoption of automation across industries as several desktops and machines are being set up for more effective and efficient control systems. As a result, several industries are forced to adapt to automation to sustain the competition in the market, as automation offers them optimum efficiency in productivity, operation costs, product quality, and safety. But due to the increasing adoption, optimum power consumption can be a significant challenge. Hence PCBs are increasingly adopted across industries to ensure efficient power consumption within the minimal size of the application. One of the main functionality of PCBs includes withstanding peak temperatures and voltages. Hence, such factors are expected to drive market growth during the forecast period. Download Sample Report in minutes!

Market Report Coverage

Details

Page number

179

Base year

2022

Historic period

2017-2021

Forecast period

2023-2027

Growth momentum & CAGR

Accelerate at a CAGR of 5.05%

Market growth 2023-2027

USD 19.06 billion

Market structure

Fragmented

YoY growth (%)

4.25

Regional analysis

APAC, North America, Europe, Middle East and Africa, and South America

Performing market contribution

APAC at 84%

Key countries

US, China, Taiwan, South Korea, and Japan

The rising adoption of smartphones

Factors such as the availability of low-cost smartphones and growing global Internet penetration are expected to fuel the adoption of smartphones globally. Furthermore, developing economies like India and China are becoming significant emerging markets for smartphones due to the rising disposable income of people and growing population. Additionally, there is an increasing advancement in smartphone technology from G LTE to 5G, with RF front-ends using up more space in 5G smartphones. Hence, such factors are expected to drive market growth during the forecast period.

Environmental concerns regarding the disposal of PCBs can hinder market growth. Download Sample Report in minutes!

Market Segmentation

This report extensively covers market segmentation by end-user (communication network infrastructure, consumer electronics, automotive electronics, military and aerospace, and others), product (4-6 low, substrates, 1-2 sided, flexible, and others),  and geography (APAC, North America, Europe, Middle East and Africa, and South America).

The market share growth by the communication network infrastructure segment is significant for market growth during the forecast period. The rapid transition from 4G to 5G in the US  and other developed economies is fuelling the communication network infrastructure segment. As a result, it will propel the demand for PCBs as it is an essential component for communication network infrastructure equipment such as enterprise network equipment, wireline network equipment, subscriber equipment, and cable/multiservice operator equipment. Hence, such factors are expected to drive the growth of this segment which in turn will drive the growth of the market during the forecast period. View Sample Report

Companies Mentioned

Advanced Circuits Inc.China Circuit Technology Shantou Corp.Compeq Manufacturing Co. Ltd.Daedeok Electronics Co. Ltd.Dana Inc.Dynamic Electronics Co. Ltd.Ibiden Co. Ltd.Korea Circuit Co. Ltd.MFS Technology S Pte Ltd.NOK Corp.Samsung Electronics Co. Ltd.Shenzhen Kinwong Electronic Co. Ltd.Shenzhen SenYan Circuit Co. Ltd.Sumitomo Electric Industries Ltd.SVR Technologies Pvt. Ltd.Toyota Motor Corp.TTM Technologies Inc.United Microelectronics Corp.Vishal InternationalZhen Ding Technology Holding Ltd.

Vendor Offerings

Samsung Electronics Co. Ltd: The company offers printed circuit boards such as Samsung ST1000LM024, and Samsung HD753LJ.NOK Corp: The company offers printed circuit boards such as Single sided FPCs, Double sided FPCs, and Multilayer FPCs.Shenzhen Kinwong Electronic Co. Ltd: The company offers printed circuit boards such as 2, 3, 4, and 6-layer PCB. Gain instant access to 17,000+ market research reports. Technavio’s SUBSCRIPTION platform

Analyst Review

The Printed Circuit Board (PCB) market is experiencing a significant transformation, driven by technological advancements and the rapid proliferation of 5G, Internet of Things (IoT), and Artificial Intelligence. These innovations are reshaping various sectors, including Consumer Electronics, Industrial Internet of Things (IIoT), and End-User Industries.

The advent of 5G technology is propelling the demand for PCBs in Smartphones, Tablets, and other Smart Devices, as they require high-performance PCBs to handle the increased data transfer speeds and connectivity. Moreover, the rise of IoT and Internet of Vehicles is leading to an exponential growth in PCB usage in Wearable Devices, Airplane Cockpit Instruments, and MRI Systems.

As the demand for Consumer Electronics continues to soar, PCB manufacturers are facing challenges related to Miniaturization and Design Complexities. To address these challenges, the industry is focusing on Integrated Manufacturing processes and collaborating with Design and Engineering Partners to develop innovative solutions.

However, the rapid evolution of electronics also raises concerns about Electronic Waste and Hazardous Materials such as Lead, Mercury, Cadmium, and Brominated Flame Retardants present in PCBs. Efforts are being made to mitigate environmental impact through initiatives like CSIL (Circular Supply-Chain Initiative for Lead-Free Electronics).

In response to the growing demand for high-quality PCBs, suppliers are enhancing their Electronic Components and PCB Power capabilities to meet the requirements of OEMs and various industries. This has led to a surge in PCB Sales across the globe, contributing to the resilience of the Global Economy.

In conclusion, the PCB market is witnessing dynamic changes fueled by advancements in technology and the increasing integration of electronics in everyday life. With a focus on innovation, sustainability, and collaboration, the industry is poised for continued growth and development in the years to come. View Sample Report

Related Reports:
The flexible printed circuit board market size is expected to increase by USD 1.64 billion from 2021 to 2026, and the market’s growth momentum will accelerate at a CAGR of 3.73%.

The North American miniature circuit breaker market size is estimated to grow at a CAGR of 5.22% between 2022 and 2027. The market size is forecast to increase by USD 75.89 million

TOC

Executive SummaryMarket LandscapeMarket SizingHistoric Market SizeFive Forces AnalysisMarket Segmentation by End-UserMarket Segmentaion by ProductCustomer LandscapeGeographic LandscapeDrivers, Challenges, and TrendsCompany LandscapeCompany AnalysisAppendix

About US
Technavio is a leading global technology research and advisory company. Their research and analysis focus on emerging market trends and provide actionable insights to help businesses identify market opportunities and develop effective strategies to optimize their market positions. With over 500 specialized analysts, Technavio’s report library consists of more than 17,000 reports and counting, covering 800 technologies, spanning 50 countries. Their client base consists of enterprises of all sizes, including more than 100 Fortune 500 companies. This growing client base relies on Technavio’s comprehensive coverage, extensive research, and actionable market insights to identify opportunities in existing and potential markets and assess their competitive positions within changing market scenarios.

Contact
Technavio Research
Jesse Maida
Media & Marketing Executive
US: +1 844 364 1100
UK: +44 203 893 3200
Email: media@technavio.com
Website: www.technavio.com

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Chef Robotics Physical AI Models Can Now Automate Baked Goods Packing

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SAN FRANCISCO, April 29, 2026 /PRNewswire/ — Chef Robotics, a leader in physical AI for the food industry, today announced that Chef robots can now automate tray assembly for baked goods packing. The application places baked products, such as burger buns, chocolate chip cookies, biscotti, butter cookies, biscuits, fortune cookies, granola bars, rusks, and shortbreads into trays and packaging containers before sealing.

Watch Chef robots in action.

Baked goods packing has historically been difficult to automate for high-mix production. Each item behaves differently on the production line—a granola bar compresses under the wrong grip, while a biscotti or rusk can crack if placed at the wrong angle. Surface textures range from glazed and smooth to crumbly and irregular, and strict presentation requirements leave little room for error. This variability has made it challenging for automation systems to reliably handle baked goods at production speeds, leaving food manufacturers dependent on manual labor and traditional bakery equipment.

To address this, Chef built its baked goods packing application on its existing piece-picking capability, which uses Chef’s AI-powered computer vision and physical AI models trained across diverse real-world production environments. This allows Chef robots to assess each item’s position, shape, and orientation in real time and determine how to pick the items from the pan and place them quickly and precisely without damaging them.

The baked goods packing application supports four distinct placement capabilities.

First, Chef’s vision system detects the angle at which each item sits in the pan and reorients it after picking, placing it on the tray at the exact angle required, regardless of its original position, enabling retail-ready presentation for SKUs that require precise angular placement.

Second, Chef robots can place multiple baked goods into the same packaging container in a single automated pass, completing full tray assembly without manual intervention.

Third, for packaging containers with multiple small compartments, Chef robots can precisely place items into each designated section, including multiple items in the same compartment, using Chef’s AI vision model to detect compartment positions and orientations in real time.

Fourth, Chef’s vision system identifies the exact center of each tray and places every item at a predefined offset from that center, ensuring a uniform, consistent arrangement across every pack regardless of how trays arrive on the conveyor.

For food manufacturers evaluating bakery systems and baked goods packaging automation, the application offers higher throughput, reduced labor dependency, and consistent presentation across shifts. The capability runs on Chef’s existing robotic hardware and software, allowing manufacturers to deploy it without requiring any changes to their production lines.

Chef’s baked goods packing application is available in the U.S., Canada, Germany, and the UK and is included as part of Chef’s robotics-as-a-service (RaaS) pricing model.

About Chef Robotics
Chef is the first company to have commercialized a scalable AI-driven food robotics solution. With over 104 million servings made in production, Chef leverages ChefOS, an AI platform for food manipulation, to offer a Robotics-as-a-Service solution that helps industry-leading food companies increase production volume and meet demand. Headquartered in San Francisco, CA, Chef aims to empower humans to do what humans do best by accelerating the advent of intelligent machines. Visit https://chefrobotics.ai to learn more.

View original content:https://www.prnewswire.com/news-releases/chef-robotics-physical-ai-models-can-now-automate-baked-goods-packing-302756923.html

SOURCE Chef Robotics

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Technology

Chef Robotics Physical AI Models Can Now Automate Baked Goods Packing

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on

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SAN FRANCISCO, April 29, 2026 /PRNewswire/ — Chef Robotics, a leader in physical AI for the food industry, today announced that Chef robots can now automate tray assembly for baked goods packing. The application places baked products, such as burger buns, chocolate chip cookies, biscotti, butter cookies, biscuits, fortune cookies, granola bars, rusks, and shortbreads into trays and packaging containers before sealing.

Watch Chef robots in action.

Baked goods packing has historically been difficult to automate for high-mix production. Each item behaves differently on the production line—a granola bar compresses under the wrong grip, while a biscotti or rusk can crack if placed at the wrong angle. Surface textures range from glazed and smooth to crumbly and irregular, and strict presentation requirements leave little room for error. This variability has made it challenging for automation systems to reliably handle baked goods at production speeds, leaving food manufacturers dependent on manual labor and traditional bakery equipment.

To address this, Chef built its baked goods packing application on its existing piece-picking capability, which uses Chef’s AI-powered computer vision and physical AI models trained across diverse real-world production environments. This allows Chef robots to assess each item’s position, shape, and orientation in real time and determine how to pick the items from the pan and place them quickly and precisely without damaging them.

The baked goods packing application supports four distinct placement capabilities.

First, Chef’s vision system detects the angle at which each item sits in the pan and reorients it after picking, placing it on the tray at the exact angle required, regardless of its original position, enabling retail-ready presentation for SKUs that require precise angular placement.

Second, Chef robots can place multiple baked goods into the same packaging container in a single automated pass, completing full tray assembly without manual intervention.

Third, for packaging containers with multiple small compartments, Chef robots can precisely place items into each designated section, including multiple items in the same compartment, using Chef’s AI vision model to detect compartment positions and orientations in real time.

Fourth, Chef’s vision system identifies the exact center of each tray and places every item at a predefined offset from that center, ensuring a uniform, consistent arrangement across every pack regardless of how trays arrive on the conveyor.

For food manufacturers evaluating bakery systems and baked goods packaging automation, the application offers higher throughput, reduced labor dependency, and consistent presentation across shifts. The capability runs on Chef’s existing robotic hardware and software, allowing manufacturers to deploy it without requiring any changes to their production lines.

Chef’s baked goods packing application is available in the U.S., Canada, Germany, and the UK and is included as part of Chef’s robotics-as-a-service (RaaS) pricing model.

About Chef Robotics
Chef is the first company to have commercialized a scalable AI-driven food robotics solution. With over 104 million servings made in production, Chef leverages ChefOS, an AI platform for food manipulation, to offer a Robotics-as-a-Service solution that helps industry-leading food companies increase production volume and meet demand. Headquartered in San Francisco, CA, Chef aims to empower humans to do what humans do best by accelerating the advent of intelligent machines. Visit https://chefrobotics.ai to learn more.

View original content:https://www.prnewswire.com/news-releases/chef-robotics-physical-ai-models-can-now-automate-baked-goods-packing-302756923.html

SOURCE Chef Robotics

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Air Products to Expand Industrial Gas Supply for Samsung Electronics’ Next-Generation Semiconductor Fab in South Korea

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New investment underscores the company’s long-term commitment to Korea and its leading role in the global semiconductor industry 

LEHIGH VALLEY, Pa., April 29, 2026 /PRNewswire/ — Air Products (NYSE:APD), a world-leading industrial gases company and serving Samsung globally, today announced it has been selected by Samsung to supply industrial gases for its new advanced semiconductor fab in Pyeongtaek, Gyeonggi Province, South Korea.

Under the agreement, Air Products will build, own and operate multiple state-of-the-art production facilities and a bulk specialty gas supply system to supply nitrogen, oxygen, argon, and hydrogen for Samsung’s new semiconductor fab. The new facilities are expected to come onstream in multiple phases from 2028 through 2030.

Air Products has a long track record of executing multiple phase expansions in Pyeongtaek to support Samsung’s growing manufacturing needs. This latest project represents Air Products’ largest investment to date in the semiconductor industry and will establish Pyeongtaek as the company’s single largest operations site globally supporting the electronics industry. 

“Air Products is honored to be selected once again by Samsung and to have their continued confidence as a trusted partner supporting their strategic growth plans,” said SR Kim, President, Air Products Korea. “This significant investment reinforces Air Products’ role as a leading global supplier to the semiconductor industry and underscores our long-standing commitment to supporting our strategic customers with safety, reliability, efficiency and excellent service.”

Air Products has served the global electronics industry for more than 40 years, supplying industrial gases safely and reliably to many of the world’s leading technology companies. The company has operated in Korea for more than 50 years and has established a strong position in electronics and manufacturing sectors.

About Air Products

Air Products (NYSE: APD) is a world-leading industrial gases company in operation for over 85 years focused on serving energy, environmental, and emerging markets and generating a cleaner future. The Company supplies essential industrial gases, related equipment and applications expertise to customers in dozens of industries, including refining, chemicals, metals, electronics, manufacturing, medical and food. As the leading global supplier of hydrogen, Air Products also develops, engineers, builds, owns and operates some of the world’s largest clean hydrogen projects, supporting the transition to low- and zero-carbon energy in the industrial and heavy-duty transportation sectors. Through its sale of equipment businesses, the Company also provides turbomachinery, membrane systems and cryogenic containers globally.

Air Products had fiscal 2025 sales of $12 billion from operations in approximately 50 countries. For more information, visit airproducts.com or follow us on LinkedInXFacebook or Instagram.

This release contains “forward-looking statements” within the safe harbor provisions of the Private Securities Litigation Reform Act of 1995. These forward-looking statements are based on management’s expectations and assumptions as of the date of this release and are not guarantees of future performance. While forward-looking statements are made in good faith and based on assumptions, expectations and projections that management believes are reasonable based on currently available information, actual performance and financial results may differ materially from projections and estimates expressed in the forward-looking statements because of many factors, including the risk factors described in our Annual Report on Form 10-K for the fiscal year ended September 30, 2025 and other factors disclosed in our filings with the Securities and Exchange Commission. Except as required by law, we disclaim any obligation or undertaking to update or revise any forward-looking statements contained herein to reflect any change in the assumptions, beliefs or expectations or any change in events, conditions or circumstances upon which any such forward-looking statements are based.

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SOURCE Air Products

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