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Next-Gen Computing: MiTAC and TYAN Launch Intel® Xeon® 6 Processor-Based Servers for AI, HPC, Cloud, and Enterprise Workloads at COMPUTEX 2024

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TAIPEI, June 3, 2024 /PRNewswire/ — the subsidiary of MiTAC Holdings Corp.(TSE:3706), MiTAC Computing Technology and its server brand TYAN®, the leading manufacturer in server platform design worldwide, unveil their new server systems and motherboards optimized for today’s AI, HPC, cloud, and enterprise workloads at COMPUTEX 2024, Booth # M1120 in Taipei, Taiwan from June 4 to June 7. Harnessing the power of the latest Intel® Xeon® 6 processor and 4th and 5th Gen Intel® Xeon® Scalable processors, these solutions deliver cutting-edge performance.

“For over a decade, MiTAC has worked with Intel at the forefront of server technology innovation, consistently delivering cutting-edge solutions tailored for AI and high-performance computing (HPC). The integration of Intel’s latest Xeon 6 processors into our MiTAC and TYAN server platforms transforms computational capabilities, significantly enhancing AI performance, boosting efficiency, and scaling cloud operations. These advancements empower our customers with a competitive edge through superior performance and optimized total cost of ownership,” said Rick Hwang, President of MiTAC Computing Technology Corporation.

New MiTAC/TYAN servers with Intel Xeon 6: trusted performance and exceptional efficiency
Intel® Xeon® 6 introduces two classes of processors to meet diverse requirements. Featuring high memory bandwidth and rich I/O with up to 8 channels of DDR5, up to 64 lanes of CXL 2.0, and up to 88 lanes of PCIe 5.0, Intel Xeon 6700 with Efficient-cores (E-cores) deliver high core density and exceptional performance per watt, offering distinct advantages for cloud-scale workloads that demand high throughput. With exceptional memory bandwidth and I/O, Performance-cores (P-cores) excel in the widest range of workloads and provide better AI performance than other CPUs. Additionally, the built-in accelerators of P-cores give an additional boost to targeted workloads for greater performance and efficiency. E-cores and P-cores have a compatible architecture with a shared software stack and enjoy the support of the largest ecosystem of hardware and software vendors.

MiTAC presents two new dual-socket server platforms powered by Intel® Xeon® 6 processors. Tailored for HPC and AI workloads, TX86-E7148 (codenamed “Katmai Pass”) is the follow-on model of Intel server D50DNP family that accommodates up to 4 computing modules within a 2U enclosure and supports both air and liquid cooling for different facility infrastructure. TX77A-E7142 (codenamed “Deer Creek Pass”), the follow-on model of Intel server M50FCP family, is a full-featured, performance-optimized platform made for data-intensive applications.

TYAN debuts three Intel® Xeon® 6-based server products at COMPUTEX. First up is the Thunder HX FT83B-B7149, a 4U dual-socket server platform designed for massive-parallel AI and HPC workloads. Featuring 32 DDR5 RDIMM slots and up to 8 double-width PCIe 5.0 x16 slots, FT83B-B7149 is a powerful platform for computing intensive AI and HPC applications. The next is Thunder CX GC73A-B5660, a single-socket 1U server accommodating 12 hot-swap NVMe U.2 drive bays, 2 standard PCIe 5.0 x16 and 2 OCP 3.0 mezzanine slots for on-prem. edge compute/storage applications. Lastly, TYAN presents the Tempest HX S5662, a single-socket AI server motherboard in standard CEB form factor built for multiple GPU cards deployment. It supports 8 DDR5 RDIMM slots, 5 PCIe 5.0 x16 slots, 2 NVMe M.2 slots, dual 25GbE and one GbE ports.

 4th and 5th Gen Intel® Xeon® Scalable processor server platforms: meeting the growing needs of AI, HPC, and cloud 
In July 2023, Intel transitioned the right to manufacture and sell products based on the Intel Data Center Solution Group (DSG) designs to MiTAC. Ever since then, MiTAC has dedicated itself to continuous investment in and support for the DSG product lineup. This year at COMPUTEX 2024, MiTAC unveils its DSG products. The Intel server D50DNP family, powered by 4th and 5th Gen Intel Xeon Scalable processors or the Intel Xeon CPU Max series, delivers exceptional computing performance, along with enhanced AI and in-memory analytics acceleration integrated into the processor. In the meantime, the Intel server M50FCP family delivers outstanding compute performance, high-speed I/O, and memory throughput for most of mainstream server applications.

TYAN also offers a diverse range of products supporting 4th and 5th Gen Intel® Xeon® Scalable processors. For deskside AI servers, TYAN introduces the Thunder HX FT65T-B5652, a rack-convertible, pedestal single-socket server platform designed for up to 4 double-slot GPU cards adoption.

TYAN provides several types of density servers for different workload requirement in space-constraint datacenters. The Thunder CX TD76-B5658 is a 2U enclosure accommodates 4 single-socket server nodes for high-density computing requirement; Thunder CX GC68A-B7136 is a 1U dual-socket server implementation with 16 DDR5 RDIMM slots and hybrid storage configuration; Thunder CX GC79A-B7132 is the other 1U dual-socket server provides up to 32 DDR5 RDIMM slots and all-flash configuration,

For mainstream 2U dual-socket storage servers, Thunder HX TS75A-B7132 and Thunder SX TS70A-B7136 are the two platforms providing high data IOPs with hybrid 2.5″ drive configurations whereas Thunder SX TS70-B7136 is the other implementation for larger storage capacity requirement by having 12 3.5″ hybrid drive bays. For cold data storage, Thunder SX TX88-B5652, a single-socket storage server featuring 24 3.5″ SATA and 2 2.5″ NVMe hot-swappable and tool-less drive bays, is recommended.

In addition to server systems, TYAN also showcases its 4th and 5th Gen Intel® Xeon® CPU-based industry standard motherboards at the booth. The highlighted products are Tempest HX S5652 – an AI server board designed for deploying multiple GPU cards in CEB form factor and Tempest HX S7130, a mainstream dual-socket board supporting 5 PCIe 5.0 slots in EEB form factor.

Apart from the mentioned products, MiTAC and TYAN also provide other solutions to cater to various needs. One solution is the TYAN Thunder CX GX40-B5573, equipped with Intel Xeon E-2400 processors, tailored for cloud and on-premise computing. This 1U one-socket server system is designed for cost-effective edge computing, presenting an ideal option for small businesses. And, there’s an O-RAN DU server presented by MiTAC: the WS1S11 (Whitestone2). This DU server supports 4th Gen Intel® Xeon® Scalable processors with Intel®  vRAN boost and features IEEE1588 time sync, synchronous ethernet, onboard NIC for ORAN FH/MH, and dual -48VDC power input.

About MiTAC Computing Technology Corp. 
MiTAC Computing Technology Corp, a MiTAC Holdings Corp. (TSE:3706) subsidiary, specializes in cloud and edge computing solutions and has over 30 years of design and manufacturing expertise. With a strong focus on large-scale data centers, the company offers flexible and customized supply models for various systems and applications. Its product lineup includes TYAN servers, ORAN servers, high-performance AI servers, and data center products. Intel Datacenter Solutions Group (DSG) transited its business to MiTAC since July 2023, allowing MiTAC expanding its product offerings with cutting-edge total cost of ownership solutions for next-gen data center equipment.

MiTAC Computing Technology Corporation website: www.mitacmct.com

MiTAC DSG website: https://datacentersolutions.mitacmct.com/

About TYAN
TYAN, as a leading server brand of MiTAC Computing Technology Corporation under the MiTAC Holdings Corp. (TSE:3706), designs, manufactures and markets advanced x86 and x86-64 server/workstation board technology, platforms and server solution products. Its products are sold to OEMs, VARs, System Integrators and Resellers worldwide for a wide range of applications. TYAN enables its customers to be technology leaders by providing scalable, highly-integrated, and reliable products for a wide range of applications such as server appliances and solutions for HPC, hyper-scale/data center, server storage, AI and security appliance markets. For more information, please visit TYAN’s website at http://www.tyan.com or MiTAC Computing Technology Corporation website at http://www.mitacmct.com

Intel, the Intel logo, and other marks are trademarks of Intel Corporation or its subsidiaries.

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Technosylva Introduces First-of-Its-Kind Urban Conflagration Modeling for the Built Environment

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Significant enhancements deliver critical fire intelligence in the wildland-urban interface, helping utilities and emergency agencies protect lives and infrastructure

LA JOLLA, Calif., April 22, 2026 /PRNewswire/ — Technosylva, the global leader in wildfire and extreme weather science and technology, today launched major enhancements to its urban conflagration model that predicts how fires spread through populated areas and quantifies risk to buildings. The model addresses a key limitation of traditional wildfire science: much of it has focused on wildland areas, classifying urban areas as “non-burnable.” This limitation slows fire simulations at the community boundary, leaving fire agencies, utilities, and insurers with limited forward visibility into how fire will behave in populated communities.

 

Technosylva’s capabilities provide two notable wildfire modeling enhancements. First, the urban conflagration model simulates how fires will behave in the wildland urban interface (WUI), where characteristics such as structure density, vegetation encroachment, and fuel types result in fundamental differences compared to wildland fires. Second, the Dynamic Building Loss Factor provides unprecedented insight into the vulnerability of structures. This information enables utilities and agencies to undertake appropriate mitigations, such as asset hardening, undergrounding lines, vegetation management, and community education and engagement.

“Recent devastating fires have made one thing clear: populated areas face disproportionate impacts—and require greater focus to protect them,” said Bryan Spear, CEO of Technosylva. “Traditional wildfire models were designed for wildland fuels and fire behavior. Our approach builds on that foundation by showing how fires actually move through communities. By more accurately modeling the risks and consequences, utilities and fire agencies can make smarter, risk-based decisions to mitigate wildfire risks, communicate threats, maintain power, and better protect the communities they serve.”

According to a 2023 article in the Proceedings of the National Academy of Sciences [1], “community fire destruction has become a national crisis.” Recent disasters in Lahaina, Gatlinburg, and Marshall show why. Many communities aren’t built to withstand ignition, and once a structure catches fire, it can quickly spread flames and embers to neighboring buildings. The result is fast-moving, large-scale destruction with lasting impacts on entire communities.

Key Technology Advances Addressing Critical Industry Needs

Technosylva’s unique model was trained on a comprehensive database of WUI fires, examining environmental conditions, weather patterns, and fuel characteristics to understand the drivers of urban conflagration. One of the primary challenges in modeling fire behavior in the built environment is a limited number of historical fires upon which to draw conclusions and build scalable models. Technosylva’s modeling approach has overcome these challenges, effectively capturing the complex interactions between wildfire and the built environment.

Notable enhancements to Technosylva’s modeling approach include:

WUI Fuel Mapping: Development of 12 unique WUI fuel types that more accurately reflect the manner in which the infrastructure in the built environment becomes a fuel source for the fire. This is critical for understanding how the characteristics of the built environment impact the rate of spread, intensity, and speed of fires in the WUI.Dynamic Building Loss Factor: Machine learning models to capture expected building loss, leveraging characteristics such as structure characteristics and building age that drive vulnerability. Combined with assessments of topography, vegetation, and other building properties such as density and proximity to roads, this intelligence identifies not just whether a community is threatened, but the types of structures and conditions that result in the highest risk.Characterization of Fire Behavior Under Extreme Conditions: Calibrated to accurately reflect urban encroachment and fire spread rates in WUI environments—particularly during the most extreme events. Capturing fires that have historically been labeled as “outliers” is critical for utilities and communities to understand and prepare for potential worst-case scenarios.High-Resolution Weather Integration: Captures localized wind patterns, humidity gradients, and temperature variations at a scale matched to “neighborhood-level” fire behavior.

Large-scale urban fires were once rare, but in recent years their frequency and severity has increased dramatically. When wildfires reach communities, the “fuel” is no longer just vegetation—it’s homes and businesses. In Lahaina alone, a single urban conflagration caused an estimated $4 to $6 billion in economic losses. The consequences can be devastating for both life and property. Technosylva’s modeling has evolved to capture how fires spread through the built environment, enabling utilities and agencies to make more informed, risk-based decisions.

[1] https://www.fs.usda.gov/rm/pubs_journals/2023/rmrs_2023_calkin_d001.pdf

About Technosylva
Technosylva is the leading provider of wildfire and extreme weather modeling, risk mitigation, and operational response software. Technosylva’s market-leading solutions, enhanced by AI and machine learning capabilities, provide real-time and predictive insights into developing wildfire and extreme weather risks to support electric utility, insurance, and government agency customers. Founded in 1997, Technosylva has offices in La Jolla, CA, León, Spain, and Calgary, Canada. Learn more at www.Technosylva.com.

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Lucian Deaton
Senior Digital Marketing Manager
412620@email4pr.com

Colin Mahoney
Mahoney Communications Group
412620@email4pr.com
212.220.6045

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Parks Associates: Roku (28%) and Samsung (23%) Dominate Connected TV Platforms, Controlling Access to Streaming Audiences in the US Market

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Data shows Amazon, LG, and Vizio hold smaller shares as platform control drives content discovery, advertising, and monetization

PLANO, Texas, April 22, 2026 /PRNewswire/ — Parks Associates’ latest US household research from the Streaming Video Tracker shows the connected TV platform market remains concentrated among a small group of leading operating systems, with Roku OS (28%) and Samsung’s Tizen OS (23%) accounting for the largest share of usage in US broadband households.

The firm’s data shows Amazon Fire TV, LG webOS, and Vizio SmartCast maintain mid-tier positions, while platforms such as Apple tvOS, gaming consoles, and Android TV hold smaller shares. This distribution reinforces the role of smart TV operating systems as the primary gateway for streaming content and services.

“Control of the platform layer is central to competition in the connected TV market,” said Michael Goodman, Director, Entertainment, Parks Associates. “Operating systems determine what content consumers see, how services are positioned, and how advertising is delivered.”

Recent trends highlighted in the research include:

Platform concentration: A small number of operating systems account for the majority of CTV (connected TV) usage, limiting visibility for services without strong distribution partnerships.Stable market share: Platform rankings have remained consistent over time, with Roku showing modest growth and Samsung maintaining a strong installed base.Advertising control: Leading platforms manage ad inventory, data collection, and targeting, shaping monetization across the ecosystem.Discovery and engagement: The TV OS plays a key role in recommendations, search, and user experience, influencing viewing behavior.

The data highlights the importance of platform ecosystems, as control of the TV operating system impacts content distribution, advertising revenue, and consumer engagement across the CTV market. With the growing role of AI in the TV OS for search and personalization, the importance of platform ecosystems is only going to grow in the coming years.

For more information, contact Mindi Sue Sternblitz-Rubenstein. Request information about Parks Associates’ Streaming Video Tracker.

Parks Associates will host the ninth annual Future of Video at the Marina del Rey Marriott in California, November 17-18. 

About Parks Associates
Parks Associates helps companies identify new opportunities, refine strategy, and accelerate growth in connected technology markets through data-driven insights and industry expertise. With more than 40 years of experience, the firm delivers proprietary consumer and industry research, market forecasts, and strategic analysis that guide business decisions across personal, connected home, small business, and commercial technology ecosystems. Parks Associates supports clients in navigating evolving markets including AI, security, smart home, broadband, entertainment, energy, multifamily, smart buildings, and connected health.

The firm also fosters industry growth and collaboration by convening thousands of leaders each year through its flagship executive conferences, including CONNECTIONS™, Connected Health Summit, Smart Energy Summit, Smart Spaces, and Future of Video. Learn more at https://www.parksassociates.com.

Follow Parks Associates on LinkedIn, Facebook, and Instagram.

Mindi Sue Sternblitz-Rubenstein
Parks Associates
972.490.1113
412621@email4pr.com 

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FINBOA Named Double Finalist for 2026 Banking Tech Awards

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FINBOA recognized in ‘Best of RegTech’ and ‘Best-as-a-Service’ categories

HOUSTON, April 22, 2026 /PRNewswire/ — FINBOA, Inc., a leader in process automation solutions for regulatory compliance in financial institutions, is proud to announce it has been named a finalist in two categories for the 2026 Banking Tech Awards: Excellence in Tech Awards. The company was recognized in the Best RegTech Solution category for its FINBOA BI-Disputes solution and in the Best “as-a-Service” Solution category for its FINBOA Treasury Onboarding solution. As a shortlist finalist, FINBOA’s software has been identified as an innovation leader in the U.S. Banking and RegTech space.

“Being named a finalist in two categories at the Banking Tech Awards is a strong validation of our mission to simplify and modernize complex banking operations,” said Raj Singal, CEO of FINBOA. “FINBOA Treasury Onboarding and BI-Disputes solutions were built to solve real challenges our bank and credit union clients face every day; such as eliminating manual effort, improving regulatory compliance and timely access to information to guide decision-making. We’re proud to see both solutions recognized for their impact and innovation.”

The FINBOA Treasury Onboarding solution was selected as a finalist in the Best “as-a-Service” category for providing intuitive automated workflows to replace manual, paper-based, and fragmented processes for new account setups. The solution accelerates account activation, shortens time to revenue, and enhances the commercial client experience, without requiring core system integration. Its zero-integration deployment model enables financial institutions to modernize quickly while minimizing operational disruption. FINBOA clients using the solution have noted the time-saving impact of process automation on their workflows. For example, First Oklahoma Bank’s Senior Vice President, Kristy Smith noted, “Within just two months, we transformed our Treasury Onboarding from a slow, manual process—relying on paper and email—to a fully digitized workflow. The feedback from both customers and staff has been overwhelmingly positive. FINBOA made that possible.”

FINBOA BI-Disputes, recognized in the RegTech category, extends the value of FINBOA Payment Disputes solution by transforming dispute data into clear, actionable insights through an intuitive interface that eliminates time-consuming manual reporting and provides instant visibility into detailed views of dispute information. The solution enables stakeholders to quickly generate audit and board-ready reports while strengthening compliance by tracking Reg E deadlines, provisional credits, and resolution requirements. Advanced fraud analytics provide insights on emerging trends and high-risk merchants, empowering financial institutions to make more confident decisions, reduce risk, and optimize dispute management performance.

The 2026 Banking Tech Awards celebrate excellence and innovation in the use of IT in financial services worldwide. Winners will be announced on May 28, 2026 at a special awards event in New York.

About FINBOA

FINBOA provides intelligent process automation software to banks, credit unions and service providers to simplify compliance processing by eliminating manual systems. Solutions include FINBOA Payment Disputes, FINBOA BI-Disputes, FINBOA Exception Management, and FINBOA Treasury Onboarding. FINBOA delivers transformative software proven to enable institutional growth by reducing operational costs and risk. Headquartered in Houston, FINBOA is trusted to help over 500 financial institutions nationwide achieve targeted business outcomes and peace of mind. Learn more at www.finboa.com or follow us on LinkedIn and X social media platforms.

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