Technology
Supermicro Unveils New X14 AI, Rackmount, Multi-Node, and Edge Server Families Based on Intel® Xeon® 6 Processors with E-cores and Soon, P-cores Systems With Liquid Cooling
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2 years agoon
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Supermicro’s Expanded, Proven Portfolio Includes Systems Designed for Maximum Performance-Per-Watt on Cloud-Native, Storage Optimized, and Scale-Out Workloads, and Air and Liquid- Cooled Systems for AI and HPC Environments
SAN JOSE, Calif. and TAIPEI, June 4, 2024 /PRNewswire/ — Computex 2024 — Supermicro, Inc. (NASDAQ: SMCI), a Total IT Solution Provider for AI, Cloud, Storage, and 5G/Edge, is launching its X14 server portfolio with support for Intel® Xeon® 6700-series processors with E-cores, and will provide future support of Intel Xeon 6900 series processors with P-cores. Based on platforms proven over several generations, the new Supermicro X14 servers support the latest Intel Xeon 6 processors, starting with a family of rackmount servers supporting enterprise, cloud service provider, mid-range, and entry models, including the Hyper, CloudDC, and WIO platforms. Also, the density and efficiency-optimized multi-node servers, the SuperBlade®, with up to 34,560 cores per rack, BigTwin®, and GrandTwin®, will incorporate this new processor. Supermicro’s Petascale storage systems and Edge and Telco-optimized servers, such as the Hyper-E and short-depth compact systems, will also be available. In the future, high-performance systems will soon be available with Intel Xeon 6900-series processors with P-cores. Systems with Intel Xeon 6 processors with P-cores will deliver 2-3X* better performance for AI workloads and 2.8X* higher memory bandwidth. Future systems using the Intel Xeon 6 processors with E-cores are expected to deliver 2.5X* higher rack density than previous generations and a 2.4X* performance per watt improvement, resulting in reduced PUE of a data center to as low as 1.05.
“Supermicro is an industry leader in designing, building, and delivering workload-optimized solutions at scale, including data center scale liquid cooling. The new X14 servers will provide even greater flexibility and customization options to our customers,” said Charles Liang, president and CEO of Supermicro. “The Supermicro X14 product families are our most powerful and flexible systems we have ever designed and are optimized for a wide range of applications, from the data center to the edge. We see that up to 20% of data centers will need to be liquid cooled in the future, and Supermicro is uniquely positioned to offer an entire solution, from cold plates to cooling towers.”
For greater efficiency and lower TCO, Supermicro offers liquid cooling solutions that can be added to any deployment, including CPU and GPU cold plates, a cooling distribution unit, manifold, tubing, and a cooling tower, with all components developed and manufactured in-house for a complete solution.
The new Intel Xeon 6 processors with E-cores feature a single thread per core. They are optimized for workloads that benefit from a more significant number of energy-efficient cores to run more simultaneous instances at once using less power, such as cloud-native CDNs, network microservices, cloud-native applications such as Kubernetes, application DevOps, unstructured databases, and scale-out analytics.
Supermicro X14 systems powered by the new Intel Xeon 6 processors feature pin compatibility between E-core and P-core variants. Current and future Supermicro systems will feature up to 576 cores per node, DDR5-6400 and MCR DIMMs with up to 8800 MT/s, CXL 2.0, wider E1.S and E3.S support, and up to 400G networking. The new Intel Xeon 6 processors will be available in the 6700-series, an upgraded version of previous generation Intel Xeon processors, and the 6900-series, an all-new class of processors to maximize performance. Intel Xeon 6900-series processors will feature more cores, higher TDP, increased memory channels, and support for MCR DIMMs. The Supermicro X14 platform is also the first Supermicro platform to support the OCP Data Center Modular Hardware System (DC-MHS), which reduces complexity and simplifies maintenance for large cloud service providers and hyperscalers.
“Intel is executing on its roadmap to deliver ‘4 nodes in 5 years’, and with Xeon 6, we are introducing revolutionary new processor features including our first ever enterprise-class Efficient-core products for cloud-native and scale-out workloads ,” said Ryan Tabrah, VP and GM of Xeon 6 E-Core Products at Intel. “These new processors are enabling our partners such as Supermicro to develop new Xeon systems which are denser and more efficient than ever before, helping customers to achieve their business goals while lowering TCO.”
The Supermicro portfolio of X14 systems is performance-optimized and energy-efficient, incorporates improved manageability and security, supports open industry standards, and is rack-scale optimized. With a global production capacity of 5,000 racks per month, including 1,350 liquid-cooled racks, Supermicro’s expert engineers can design, build, validate, and deliver complete systems with industry-leading time-to-market.
Launching today with Intel Xeon 6700-series processors with E-cores:
SuperBlade® – Supermicro’s high-performance, density-optimized, and energy-efficient multi-node platform optimized for AI, Data Analytics, HPC, Cloud, and Enterprise workloads. With these new blade systems, one rack can feature up to 34,560 Xeon compute cores.
Hyper – Flagship performance rackmount servers designed for scale-out cloud workloads, with storage & I/O flexibility that provides a custom fit for a wide range of application needs.
CloudDC – All-in-one platform for cloud data centers, based on the OCP Data Center Modular Hardware System (DC-MHS) with flexible I/O and storage configurations and dual AIOM slots (PCIe 5.0; OCP 3.0 compliant) for maximum data throughput.
WIO – Offers flexible I/O configurations in a cost-effective architecture to deliver truly optimized systems for specific enterprise requirements.
BigTwin® – 2U 2-Node or 2U 4-Node platform providing superior density, performance, and serviceability with dual processors per node and hot-swappable tool-less design. These systems are ideal for cloud, storage, and media workloads with new models, including E3.S drive support for superior density and throughput.
GrandTwin® – Purpose-built for single-processor performance and memory density, featuring front (cold aisle) hot-swappable nodes and front or rear I/O for easier serviceability. Now available with E1.S drives for better storage density and throughput.
Hyper-E – Delivers the power and flexibility of our flagship Hyper family optimized for deployment in edge environments. Edge-friendly features include a short-depth chassis and front I/O, making Hyper-E suitable for edge data centers and telco cabinets. These short-depth systems support up to 3 high-performance GPU or FPGA cards.
Edge/Telco – High-density processing power in compact form factors optimized for telco cabinet and Edge data center installation. Optional DC power configurations and enhanced operating temperatures up to 55° C (131° F).
Petascale Storage – Industry-leading storage density and performance with EDSFF E1.S and E3.S drives, allowing unprecedented capacity and performance in a single 1U or 2U chassis.
Coming Soon with upcoming Intel Xeon 6 6900-series processors with P-cores:
GPU Servers with PCIe GPUs – Systems supporting advanced accelerators to deliver dramatic performance gains and cost savings. These systems are designed for HPC, AI training, rendering, and VDI workloads.
Universal GPU Servers – These are the most powerful servers for large-scale AI training and large language models. Open, modular, standards-based servers that provide superior performance and serviceability with GPU options, including the latest PCIe, OAM, and NVIDIA SXM technologies.
New Multi-node Servers – High-density 2U4N systems optimized for HPC, data center, financial services, manufacturing, and scientific research applications. Front-accessible service design allows cold-aisle serviceability with flexible I/O and drive configurations.
* Compared to 4th Gen Intel Xeon Scalable Processors. Based on architectural projections as of August 21, 2023, relative to the prior generation. Your results may vary.
About Super Micro Computer, Inc.
Supermicro (NASDAQ: SMCI) is a global leader in Application-Optimized Total IT Solutions. Founded and operating in San Jose, California, Supermicro is committed to delivering first to market innovation for Enterprise, Cloud, AI, and 5G Telco/Edge IT Infrastructure. We are a Total IT Solutions manufacturer with server, AI, storage, IoT, switch systems, software, and support services. Supermicro’s motherboard, power, and chassis design expertise further enable our development and production, enabling next generation innovation from cloud to edge for our global customers. Our products are designed and manufactured in-house (in the US, Taiwan, and the Netherlands), leveraging global operations for scale and efficiency and optimized to improve TCO and reduce environmental impact (Green Computing). The award-winning portfolio of Server Building Block Solutions® allows customers to optimize for their exact workload and application by selecting from a broad family of systems built from our flexible and reusable building blocks that support a comprehensive set of form factors, processors, memory, GPUs, storage, networking, power, and cooling solutions (air-conditioned, free air cooling or liquid cooling).
Supermicro, Server Building Block Solutions, and We Keep IT Green are trademarks and/or registered trademarks of Super Micro Computer, Inc.
All other brands, names, and trademarks are the property of their respective owners.
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Technology
Goodwill Houston and CompuCycle Launch Tech Recycle Workforce Training Program for Students with Disabilities
Published
25 minutes agoon
October 20, 2026By
HOUSTON, Oct. 20, 2026 /PRNewswire/ — Goodwill Houston and CompuCycle today announced Tech Recycle, a workforce training program that turns school districts’ retired electronics into paid vocational training for transition-age students with disabilities. Goodwill Houston operates the program and pays every student. CompuCycle, a Houston-based electronics recycler, provides certified data destruction and recycling for the districts’ devices.
Tech Recycle is a 12-week paid work-based learning program that helps students on the autism spectrum build skills and prepare for future employment, at no cost to them.
How Does Tech Recycle Work?
Districts send retired electronics to CompuCycle for certified data destruction and receive audit-ready documentation before sending the wiped devices to Goodwill Houston to be used in instruction.Students join a 12-week paid work-based learning program run by Goodwill Houston, gaining hands-on experience and skills that can support future employment.Goodwill Houston funds student paychecks in full, separate from the value returned to districts.CompuCycle recycles the scrap materials in-house at its 130,000 sq ft Houston facility and returns recovered material value to the districts.
From One Classroom to a Regional Workforce Program
Tech Recycle grew out of TechCycle, a program CompuCycle launched with Pearland ISD, supported by seed funding from Texas A&M and covered by ABC13. Goodwill Houston now runs it as Tech Recycle.
“Goodwill Houston saw what it could be across the region and built the training around it. Our job is to keep the recycling secure, certified, and done right here in Houston,” said Kelly Adels Hess, CEO of CompuCycle.
Building a Pathway to Success for Students with Autism
“We have run into so many students who have a passion for telling you how things work and taking them apart. But we did not have a pathway set aside for them. The greatest part about this program is we’re paying these students. They now have certified training and a resume builder,” said Vernee Sampson, Senior Manager of Vocational Rehabilitation Programs at Goodwill Houston.
“Most arrive assuming that they can’t do this or this isn’t for them, but we want them to walk away believing that they can do it,” said Alicia Franklin, Career Coach and instructor for Tech Recycle.
How Can Districts and Organizations Get Involved?
School districts that want to train their students through Tech Recycle can contact Goodwill Houston. Organizations with retired electronics can send them through CompuCycle. Learn more about the CompuCycle and Goodwill Houston partnership.
“Community impact is the point of Tech Recycle. A district retires its devices, we recycle them securely, and Goodwill Houston turns that into paid training for students. When a recycler, a nonprofit, and a school district work together, the whole community benefits,” Hess said.
Join the Conversation at E-Scrap
Kelly Adels Hess will lead a workshop, “Community Partnerships, Real Impact,” at the E-Scrap Conference in New Orleans on October 27 from 8:30 to 9:30 a.m.
About Goodwill Houston
Goodwill Houston is a nonprofit organization dedicated to changing lives through the power of work. Serving individuals and families across the Greater Houston area, Goodwill Houston provides workforce development, job training, career services and other programs designed to help people build skills, overcome barriers to employment and achieve greater independence.
About CompuCycle
CompuCycle is a Houston-based IT asset disposition and electronics recycling company. It holds R2v3, e-Stewards, and ISO 27001 certifications, the only electronics recycler in Texas with all three.
Media Contacts
CompuCycle: Kelly Adels Hess, CEO, khess@compucycle.com, 713-869-6700Goodwill Houston: Mia Brooks, Events and Public Relations Coordinator, MBrooks@goodwillhouston.org, 713-805-7031
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Technology
xTool Launches C1 Color Cutter : The Full-Color Cutting Machine Built to Scan, Print, and Cut with Precision
Published
25 minutes agoon
October 20, 2026By
PARIS, Oct. 20, 2026 /PRNewswire/ — xTool, a global pioneer in digital fabrication and smart desktop manufacturing, announces today its expansion into the craft cutter market with the launch of the xTool C1 Color Cutter.
Engineered under the slogan “Scan It. Print It. Cut It. Always in One Workflow,” the C1 solves long-standing industry challenges by integrating high-precision CIS scanning, CMYK full-color inkjet printing, and dynamic blade cutting into a single automated desktop workstation.
Starting October 20th, 2026, xTool is launching its official global pre-order campaign, offering an exclusive £10 deposit incentive that provides early buyers with substantial machine discounts, physical material bundles, and livestream giveaway entries.
Beyond Lasers and Printers : The Natural Evolution into Craft Cutting
The launch of the xTool C1 marks a milestone in xTool’s strategy to build a fully integrated hardware and software ecosystem for creators, DIY enthusiasts, and small-business owners. Building on its global leadership in desktop laser engravers and digital printers, xTool is bringing its expertise in precision mechanics and automation to traditional blade cutting.
By combining full-color printing and precision cutting in one compact machine, the C1 eliminates the need for separate printers, manual material transfers, and error-prone registration marks, simplifying workflows for paper crafts, vinyl graphics, HTV, apparel, and stickers.
Designed for Advanced Crafters and Small Businesses
For DIY enthusiasts, its integrated print-and-cut workflow helps reduce material waste, alignment errors, and the need to cut and weed multiple layers of vinyl. Complex projects involving heat transfer vinyl (HTV) for textile customisation, sticker making, and paper crafts become easier to complete.
For entrepreneurs and small businesses producing customised apparel, labels, packaging, or promotional items, the C1 is a valuable addition to their production workflow. It helps improve productivity, reduce manufacturing costs, and deliver professional-quality results.
Seamless Print-and-Cut Workflow
Combining CMYK inkjet printing with precision blade cutting, the C1 prints directly onto materials before cutting, eliminating registration marks, maximizing printable space, and minimizing alignment errors and waste. Its proprietary Duraproof ink produces vibrant, waterproof, fade-resistant graphics that can withstand up to 30 home washes on textiles.
Built-In CIS Scanner and Live Preview
An integrated Contact Image Sensor (CIS) provides a 1:1 live preview, allowing users to position designs accurately, including leftover materials. Additional features include automatic contour extraction, material nesting, and QR-code-based parameter setup.
AI-Powered Atomm Creation Suite
xTool’s Atomm software transforms text prompts and images into ready-to-cut vectors, with tools for background removal, artistic text, line-art conversion, and 3D papercraft templates, reducing design preparation from hours to minutes.
Versatile Materials and Tools
Compatible with Fine-Point, Deep-Point, Rotary, and 3mm Cutting blades, Foil-Transfer tips, and detail pens, the C1 supports paper, cardstock, vinyl, HTV, leather, balsa wood, and fabrics. Optional accessories include an Electrostatic Mat and Roll Holder with built-in trimmer.
Pre-Order Details
Global pre-orders open on October 20th, 2026, with prices starting at £399 and reservations available for a £10 deposit. Several bundles will be offered, including the first-ever C1 bundle with Atomm Membership.
Pre-order customers will receive exclusive £10 Pre-Order Bonus Perks, including a material kit with over 10 crafting materials, a 20% Material Card valid for 180 days across the xTool store, and entry into a livestream giveaway to win a free C1.
Final payments and global shipping begin November 5, 2026. Further details are available at xtool.com.
About xTool
xTool is a brand founded in 2020 that specialises in smart digital fabrication machines. The company’s mission is to foster creativity by developing intelligent, user-friendly tools that leverage advanced technologies to significantly lower the barriers to creation.
The brand primarily serves makers, DIY enthusiasts, and the education sector by combining powerful software with safe, easy-to-use hardware. xTool provides users with new opportunities to bring their creative ideas to life efficiently and professionally.
For more information: xtool.com
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Technology
Green Data Center Market worth $197.02 billion by 2031 – Report by MarketsandMarkets™
Published
26 minutes agoon
October 20, 2026By
DELRAY BEACH, Fla., Oct. 20, 2026 /PRNewswire/ — According to MarketsandMarkets™, the global Green Data Center Market is expanding rapidly, with a projected market size anticipated to rise from about USD 60.77 billion in 2026 to USD 197.02 billion by 2031, featuring a CAGR of 26.5%.
Browse 303 market data Tables and 60 Figures spread through 240 Pages and in-depth TOC on “Green Data Center Market – Global Forecast to 2031”
Green Data Center Market Size & Forecast:
Market Size Available for Years: 2021–20312025 Market Size: USD 48.26 billion2026 Market Size: USD 60.77 billion2031 Projected Market Size: USD 197.02 billionCAGR (2026–2031): 26.5%
Green Data Center Market Trends & Insights:
The global market is gaining momentum as data center operators and enterprises respond to rising energy costs, increasingly stringent sustainability regulations, and growing commitments to reduce carbon emissions.The infrastructure segment is expected to hold the largest market value of USD 39.31 billion by 2026.The building management software is projected to grow at the highest CAGR of 32.1% during the forecast period.Cloud and hyperscale data centers are expected to dominate the market during the forecast period.Retail and e-commerce enterprises are projected to grow at the highest CAGR during the forecast period.North America is estimated to dominate the market with the highest value of USD 25.12 billion by 2026.
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Green data centers are transforming digital infrastructure by integrating technologies such as renewable energy systems, liquid and immersion cooling, and intelligent energy management solutions to enable sustainability at scale. These innovations improve power usage efficiency, reduce carbon emissions, and support compliance with increasingly stringent global sustainability regulations, accelerating adoption across hyperscale facilities, colocation providers, and enterprise data centers. By incorporating energy-efficient and environmentally optimized technologies into core operations, green data centers enhance long-term resilience, regulatory alignment, and cost efficiency for energy-intensive workloads. This infrastructure enables organizations to support AI-driven applications, cloud services, and high-density computing environments more efficiently, while reducing reliance on fossil fuel-based power systems and minimizing overall environmental impact.
By Cooling Infrastructure, Green Air Cooling will register the largest market share during the forecast period
Green air cooling is expected to remain a key thermal management solution in data centers, driven by the growing emphasis on energy efficiency, sustainability, and reduced environmental impact. Key components include Computer Room Air Handlers (CRAH) and Computer Room Air Conditioning (CRAC) units, which use chilled water and refrigerant-based systems, respectively, to maintain optimal temperature and humidity conditions. These systems are increasingly equipped with variable-speed fans, advanced controls, and high-efficiency motors to reduce energy consumption and improve overall cooling performance. Energy-efficient air-cooled chillers further complement these systems by using low Global Warming Potential (GWP) refrigerants and incorporating free-cooling modes that leverage ambient outdoor air to reduce cooling energy requirements. Additional approaches, including hot/cold aisle containment, variable airflow management, and intelligent monitoring systems, enable cooling capacity to be dynamically adjusted according to real-time demand, improving energy efficiency. Emerging vendors and solution providers can capitalize on this trend by developing advanced thermal management technologies. Carrier’s investment in ZutaCore, announced in February 2025, highlights the industry’s increasing focus on advanced cooling solutions. The collaboration aims to deliver scalable and energy-efficient thermal management systems capable of addressing the rising cooling requirements of modern data centers. To capture these opportunities, vendors can focus on developing innovative cooling technologies that improve efficiency and support sustainability objectives. Strategic collaborations, industry partnerships, and continuous technological innovation will remain important for strengthening capabilities in the evolving green data center cooling market.
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Software segment is poised for the fastest growth rate during the forecast period
The software segment is expected to register the highest CAGR in the Green Data Center Market, driven by growing demand for intelligent automation, energy optimization, operational visibility, and regulatory compliance. Data Center Infrastructure Management (DCIM) software provides real-time visibility into power consumption, cooling performance, server utilization, and environmental conditions, enabling operators to identify inefficiencies, optimize resource allocation, and maintain high availability. Building Management Systems (BMS) integrate electrical, mechanical, and HVAC systems to automate energy-efficient facility operations while regulating lighting, temperature, and airflow to minimize energy waste and improve cooling efficiency. Compliance software supports adherence to environmental standards, industry regulations, and sustainability certifications such as LEED and ISO 50001 by automating reporting, documentation, and audit processes, thereby improving transparency and accountability. Specialized software solutions, including AI-driven predictive workload management and energy analytics platforms, can dynamically optimize cooling, power distribution, and IT workloads based on real-time demand, reducing energy consumption, environmental impact, and operating costs. Emerging vendors and solution providers can capitalize on this growth through strategic partnerships, technology integration, and AI-enabled capabilities. For instance, in August 2025, Vertiv acquired Waylay NV, a Belgium-based AI-powered software provider, to strengthen monitoring, optimization, and operational efficiency across data center systems. By developing advanced software solutions, collaborating with established technology providers, and leveraging AI, automation, and analytics, vendors can support sustainable, efficient, and regulatory-compliant green data center operations while addressing the growing demand for intelligent infrastructure management.
North America accounts for the largest market during the forecast period
North America is witnessing measurable growth in green data center activity, driven by corporate decarbonization targets, rising onsite power costs, and the increasing need to deploy high-density computing infrastructure with lower water and energy intensity. According to the US Energy Information Administration, solar power generation in the United States increased by 25% in 2024, while wind power generation grew by 8%, improving the availability of low-carbon electricity for hyperscale and colocation data center campuses. Additionally, Schneider Electric announced collaborative AI data center reference designs with NVIDIA in December 2024 that support liquid cooling at densities of up to 132 kilowatts per rack, highlighting supplier responses to rising rack power densities and efficiency requirements. Federal and commercial developments during 2024 and 2025 are also influencing procurement timelines and technical specifications. The White House issued an executive order in July 2025 aimed at accelerating federal permitting for large data center projects and supporting infrastructure. By streamlining approvals for facilities exceeding 100 megawatts or involving capital expenditures of at least USD 500 million, the order supports faster deployment of next-generation data centers, enabling integration of renewable power, liquid cooling systems, and energy-efficient designs. Schneider Electric also introduced and validated new electrical and liquid cooling reference designs through 2024 and 2025, creating standardized deployment pathways for integrators and data center owners. Vendors and solution providers are increasingly focusing on liquid cooling systems, modular electrical skids, facility-level heat recovery, and advanced DCIM capabilities to address evolving procurement requirements amid faster permitting processes and increasing renewable power availability.
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Top Companies in Green Data Center Market:
The Top Companies in Green Data Center Market are Schneider Electric (France), Vertiv (US), Eaton (US), Daikin (Japan), ABB (Switzerland), Delta Electronics (Taiwan), Siemens (Germany), Carrier (US), and GE Vernova (US).
Green Data Center Market – Investment & funding +Merger & Acquisition
Investment and Funding Context
The global Green Data Center Market is attracting strong investment from hyperscalers, cloud providers, colocation operators, and enterprises seeking sustainable ways to expand capacity for AI, high-performance computing, and edge workloads. Investment is increasingly directed toward energy-efficient power and cooling systems, eco-friendly IT modules, high-density green AI pods, and sustainable manufacturing capacity.
Capital is also flowing toward companies developing technologies that address the power, cooling, and energy-efficiency requirements of sustainable AI infrastructure. For example, Eaton completed its USD 9.5 billion acquisition of Boyd Thermal in March 2026, adding liquid cooling and thermal management capabilities for high-density, energy-efficient data centers. Similarly, Vertiv agreed in September 2026 to acquire UtilityInnovation Group for approximately USD 1.45 billion to add microgrid controls, on-site generation orchestration, and behind-the-meter power architecture that shorten time to power. Schneider Electric completed the acquisition of a 75% controlling interest in Motivair for USD 850 million in February 2025 to strengthen its liquid cooling portfolio for AI data centers. These investments and strategic transactions demonstrate the increasing emphasis on energy-efficient, low-carbon, and rapidly deployable power and cooling infrastructure across the green data center ecosystem.
Revenue Shift Context
The market is shifting from conventional, energy-intensive data center infrastructure toward energy-efficient, low-carbon, and sustainability-oriented architectures as operators seek to reduce power consumption, operating costs, and carbon emissions. The rapid growth of AI and high-performance computing is accelerating this transition by increasing power density and cooling requirements, creating greater demand for efficient power distribution, advanced thermal management, renewable energy integration, and intelligent energy management. Technologies such as liquid cooling, high-efficiency UPS systems, renewable-powered generation, energy storage, and intelligent monitoring platforms are increasingly being integrated into data center infrastructure to improve energy utilization and support sustainability targets. Operators are also adopting modular and prefabricated solutions that improve deployment efficiency while incorporating energy-efficient power and cooling systems.
Revenue opportunities are consequently expanding beyond conventional energy-efficiency equipment toward integrated green infrastructure solutions, including renewable energy systems, liquid and immersion cooling, energy storage, high-efficiency power systems, AI-enabled energy management, DCIM platforms, carbon monitoring, and heat recovery technologies. The growing deployment of high-density AI infrastructure is particularly increasing demand for liquid cooling, optimized power architectures, and real-time energy monitoring capable of maintaining performance while controlling energy consumption.
Mergers and Acquisitions
Mergers, acquisitions, and strategic investments are increasingly shaping the Green Data Center Market as infrastructure providers seek to strengthen capabilities across energy-efficient power systems, advanced cooling, renewable energy integration, and intelligent energy management. Recent activity is focused on expanding sustainable technology portfolios, enhancing vertical integration across critical infrastructure components, and accelerating the development and deployment of energy-efficient solutions for AI-ready and high-density data center environments.
GREEN DATA CENTER MARKET: MERGERS AND ACQUISITIONS, AUGUST 2025–SEPTEMBER 2026
Month and Year
Deal Type
Company 1
Company 2
Description
September 2026
Acquisition
Eaton (Ireland)
COL Group (Italy) (from Oaktree)
Eaton signed a deal to buy COL Group at an enterprise value of about EUR 810 million. COL makes medium-voltage distribution equipment, including SF6-free switchgear, grid automation, and modular power systems. The deal expands Eaton’s European manufacturing for data center and utility customers.
September 2026
Acquisition
Vertiv (US)
King Environmental Services (KES) (Ireland)
Vertiv agreed to buy this Europe-based provider of fluid management, commissioning, and load-testing services for liquid-cooled data centers. It extends Vertiv’s thermal services into EMEA, building on PurgeRite in North America.
April 2026
Acquisition
Vertiv (US)
BMarko Structures (US)
Vertiv acquired BMarko to bring structural fabrication in-house and expand capacity for manufactured, prefabricated, and converged infrastructure solutions.
November 2025
Acquisition
Eaton (Ireland)
Boyd Thermal (US)
Eaton announced the USD 9.5 billion purchase of Boyd’s thermal business, which closed on March 12, 2026. It adds liquid cooling and thermal components for data centers, and about 80% of Boyd’s business serves that market.
Company Revenue Share Details
The global Green Data Center Market is led by established power, cooling, and electrical infrastructure providers competing across energy-efficient power distribution, power backup and energy storage, green air and liquid cooling, and DCIM and energy management software. Major participants include Schneider Electric, Vertiv, Eaton, ABB, and Hitachi Energy, alongside other global and regional players such as Daikin, Delta Electronics, Siemens, Carrier, and STULZ. Competition is increasingly shaped by the ability to offer integrated power and cooling portfolios that lower PUE, support renewable and low-carbon power integration, and handle the higher rack densities of AI workloads.
Competition is also shifting toward vertical integration and end-to-end offerings that span grid interconnect to chip. Recent transactions demonstrate this focus on liquid cooling, thermal management, and sustainable power distribution. For example, Eaton’s USD 9.5 billion acquisition of Boyd Thermal added liquid cooling capabilities. Its agreement to acquire COL Group (EUR 810 million enterprise value) adds SF6-free medium-voltage switchgear.
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Data Center Rack Market by Rack Type (Open Frame, Enclosed), Type (Server Racks, Network Racks), Rack Height (42U & Below, 43U up to 52U), Rack Width (19 Inch, 23 Inch), Data Center Type (Enterprise, Colocation, Hyperscale) – Global Forecast to 2030
Data Center Solutions Market by Infrastructure [Power (Critical Power, Backup, Distribution), Mechanical & Cooling (Air Cooled, Liquid Cooling, Heat Pumps), IT (Server, Storage, Networking), Physical (Racks, Cables)], Software – Forecast to 2031
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Goodwill Houston and CompuCycle Launch Tech Recycle Workforce Training Program for Students with Disabilities
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