Connect with us

Technology

ScaleFlux’s Cutting-Edge ECC Technology Set to Revolutionize DRAM Reliability

Published

on

ScaleFlux is set to transform AI and data center RAS (reliability, availability, and serviceability) with its groundbreaking ECC (Error Correction Coding) technology. As conventional ECC methods buckle under the pressure of climbing memory error rates, undermining system reliability, ScaleFlux’s innovative approach using list decoding shatters the limitations, offering rapid and efficient correction of complex errors. This disruptive technology not only boosts DRAM reliability and security but also slashes costs by making use of lower-cost DRAM chips viable, paving the way for a more resilient and cost-effective computing infrastructure. ScaleFlux is not just meeting the demands of the future—it’s redefining them.

MILPITAS, Calif., June 12, 2024 /PRNewswire-PRWeb/ — The fact that the global AI market is set to add $15.7 trillion to the world economy by 2030 (1) means that the rapidly evolving landscape of data centers and artificial intelligence (AI) technology makes the need for reliable, high-performance memory solutions more critical than ever to avoid the increasing costs of downtime from component and system failures. “Under the combination of growing DRAM densities and increasing challenges with DRAM error rates, we saw the need for a new style of error correction coding,” said Tong Zhang, Chief Scientist of ScaleFlux. He continued, “the hyperbolic growth of AI infrastructure and the emergence of memory expansion with Compute Express Link (CXL) has the cascading effect of driving up DRAM capacities and traffic, exacerbating the need for innovation in ECC.”

“ScaleFlux’s groundbreaking ECC technology is set to transform AI and data center reliability. Using innovative list decoding, it overcomes the limitations of conventional ECC methods under rising memory error rates, enhancing DRAM reliability and cutting costs.”

As DRAM technology advances towards 10nm and beyond and the error rates in the media grow, the need for DRAM fault tolerance becomes increasingly paramount. This is where error correction coding (ECC) steps in, playing a vital role in ensuring the reliability of the data and, subsequently, the data centers. Without this crucial error correction, data can readily become corrupted, resulting in “garbage in, garbage out” calculations and even costly system crashes. Traditional ECC methods face challenges in handling these increased error rates while meeting the stringent latency constraints. A new solution is needed.

Error Rates on the Rise
Four key trends are multiplying the frequency of memory errors:

1. Increasing memory capacity density: Current server and GPU systems can support a terabyte (1TB) or more of DRAM! This capacity expands even further with Compute Express Link (CXL) memory modules.
2. Increasing fault-caused blast radius: As Cloud computing infrastructure continues to scale out, the crash of one server caused by memory errors will potentially compromise more and more connected servers. This will many-fold amplify the fatal impact of memory bit errors.
3. Increasing memory access speeds: As the industry has progressed from DDR3 through DDR4 to DDR5, transfer rates have quadrupled from 1600Mb/s to 6400Mb/s with further accelerations on the way.
4. Increasing vulnerability to soft errors and defects in the memory media: As memory manufacturers move to newer manufacturing lithography, the memory bit cells shrink, introducing more susceptibility (2) to soft errors and defects.

Considering that errors per second are a function of the memory capacity, the blast radius, the rate of access to the memory, and the inherent rate of errors in the memory media the increases in all these factors clearly makes for a significant challenge to reliability.

Throw on top of that the combination of increasing complexity of error detection with the system-level performance hits from uncorrectable errors and it’s a real nightmare situation for maintaining system reliability and avoiding costly downtime.

Conventional ECC can no longer cut it
The conventional ECC methods typically follow minimum distance bounded decoding, capable of correcting up to ‘t’ symbol errors using ECC with a minimum distance of ‘2t+1’. To meet stringent latency constraints, many DRAM ECC design solutions protect each data access unit (e.g., 64-byte cache line) by interleaving multiple short-length ECC codewords that each correct only 1 or few symbols at very low latency (1~3 clock cycles).

However, when it comes to tolerating more errors from DRAM devices, conventional methods will become largely inadequate, leading to uncorrectable errors and hence catastrophic failures in data centers.

In layman’s terms, think of computer’s memory like a document. ECC functions as a spell checker, detecting and correcting errors like typos that may occur when saving or retrieving data. However, conventional ECC, like a basic spell checker, has its limitations. It can only catch and fix certain types of errors, like single-letter mistakes. If multiple errors occur or the errors are too complex, conventional ECC may struggle to correct them effectively, leaving your data vulnerable to inaccuracies.

Enter an innovative ECC methodology
ScaleFlux, a fabless semiconductor company innovating in the field of data center storage and memory technology, has developed a groundbreaking ECC solution that will revolutionize DRAM fault tolerance. ScaleFlux presented this solution at the IEEE RAS in Data Centers Summit on June 12, 2024. Unlike conventional ECC approaches, ScaleFlux’s solution leverages list decoding, a branch of coding theory with origins dating back to the 1950s but largely forgotten in modern applications due to its computational complexity.

Central to ScaleFlux’s innovation is the application of list decoding, which aims at correcting more-than-‘t’ errors. ScaleFlux’s solution departs from the conventional ECC paradigm by protecting each 64-byte cache line with a single codeword while ensuring decoding latency as low as 1~3 clock cycles. This approach enables the correction of more-than-‘t’ errors from any combination of two DRAM devices at very high speed and with low computational complexity. Moreover, list decoding offers the added benefit of avoiding mis-correction by detecting decoding errors when the list contains two codewords of similar likelihood.

To realize this innovative ECC technology, ScaleFlux developed a robust mathematical framework to analyze correction, detection, and mis-correction probabilities. They also engineered a highly parallel VLSI-friendly architecture for ultra-low-latency decoding. Successful demonstrations on FPGA platforms verified more-than-‘t’ error correction with extremely low mis-correction probability. As a part of the development effort, ScaleFlux collaborated with key ecosystem partners including memory suppliers, CPU vendors, and hyperscalers.

“Innovations like ScaleFlux’s decoding ECC methodology may be capable of enabling high-reliability CXL solutions,” said Jim Pappas, CXL Consortium Chairperson. “CXL technology-based advancements ultimately enable the industry to meet the demands of expanding memory capacity and bandwidth.”

Remember, it’s not just about memory
The impact of ScaleFlux’s ECC technology extends beyond improving DRAM reliability. By accommodating less reliable, lower-cost DRAM chips, it can reduce the total cost of ownership (TCO) for data center operators. Furthermore, it enhances immunity to security risks associated with malicious DRAM RowHammer attacks, bolstering data center security.

ScaleFlux’s innovative ECC design solution is set to revolutionize DRAM fault tolerance, offering new levels of reliability and performance benefits for computing infrastructure. With its potential to lower costs, enhance security, and push the boundaries of RAS (Reliability, Availability, and Serviceability), this technology is poised to shape the future of data center and AI computing infrastructure.

Summing it up
ScaleFlux’s ECC technology represents a significant advancement in DRAM fault tolerance, addressing the challenges faced by data centers while unlocking new possibilities for innovation at the system level. “As we embark on this journey towards more resilient and efficient computing infrastructure, ScaleFlux’s innovations are blazing the trail for progress in the ever-evolving landscape of AI and data center technology,” says JB Baker VP of Products at ScaleFlux.

About ScaleFlux  
In an era where data reigns supreme, ScaleFlux emerges as the vanguard of computational storage and memory solutions, poised to redefine the landscape of IT infrastructure. With a commitment to innovation, ScaleFlux introduces a revolutionary approach to storage and memory that seamlessly combines hardware and software, designed to unlock unprecedented performance, efficiency, reliability, and scalability for data-intensive applications. As the world stands on the brink of a data explosion, ScaleFlux’s cutting-edge technology offers a beacon of hope, promising not just to manage the deluge but to transform it into actionable insights and value, heralding a new dawn for businesses and data centers worldwide. For more details, visit https://scaleflux.com/.  

References:
1. Downie, Chris. How Data Centers Can Simultaneously Enable AI Growth and ESG Progress. 13 May 2024, http://www.datacenterdynamics.com/en/opinions/how-data-centers-can-simultaneously-enable-ai-growth-and-esg-progress/. Accessed 7 June 2024.
2. Meixner, Anne. “DRAM Test and Inspection Just Gets Tougher.” Semiconductor Engineering, 7 Nov. 2023, semiengineering.com/dram-test-and-inspection-just-gets-tougher/. Accessed 7 June 2024.

Media Inquiries: 
Karla Jo Helms 
JOTO PR™ 
727-777-4619 
jotopr.com 

Media Contact

Karla Jo Helms, JOTO PR™, 727-777-4629, khelms@jotopr.com , jotopr.com

View original content to download multimedia:https://www.prweb.com/releases/scalefluxs-cutting-edge-ecc-technology-set-to-revolutionize-dram-reliability-302170448.html

SOURCE JOTO PR™

Continue Reading

Technology

Ridero Raises $2.7 Million to Tackle Vehicle Affordability Through AI-Powered Financial Infrastructure

Published

on

By

Backed by RiverPark Ventures, NY Ventures, Green Egg Ventures, Blackpoint Capital, and Potamkin Ventures, Ridero is expanding access to flexible vehicle financing.

NEW YORK, Nov. 9, 2026 /PRNewswire/ — Ridero, an AI-powered automotive financial infrastructure company, today announced $2.7 million in total pre-seed funding, with backing from RiverPark Ventures, NY Ventures, Green Egg Ventures, Blackpoint Capital, and Potamkin Ventures.

The funding will accelerate Ridero’s mission to address the growing vehicle affordability crisis by enabling financial institutions and automotive retailers to offer more flexible financing options at scale.

As vehicle prices and financing costs continue to pressure American households, traditional automotive financing products have struggled to keep pace with changing consumer needs. Ridero is building the technology infrastructure to expand access to alternatives to conventional auto loans, including new- and used-vehicle leasing and balloon financing.

“Millions of vehicles have historically been difficult to lease because the financial infrastructure needed to support them at scale hasn’t existed,” said Brock Thompson, Co-Founder and CEO of Ridero. “We’re building that infrastructure to give lenders and dealers more ways to make vehicles affordable and accessible,” said Natalie Williams, Co-Founder and CTO of Ridero.

Ridero’s platform combines AI-powered deal structuring, risk analytics, and automated lender connectivity to help financial institutions launch, distribute, and manage residual-based financing products.

The company’s technology is already in use at dealerships across the Northeast and Southern United States. Ridero has also established a strategic partnership with Auto Financial Group (AFG) to expand access to residual-based financing products and integrated with Tekion to bring its financing capabilities into existing dealership workflows.

Ridero is advancing additional strategic partnerships and technology integrations with financial institutions and automotive technology providers.

The funding will support continued product development, expansion of institutional partnerships, and growth of Ridero’s team.

About Ridero

Ridero is an AI-powered financial infrastructure company modernizing automotive finance. Its platform connects financial institutions and automotive retailers, enabling the launch, distribution, and management of flexible vehicle financing products, including new- and used-vehicle leasing and balloon financing.

Ridero was founded by Brock Thompson and Natalie Williams, who bring complementary backgrounds in institutional investing and artificial intelligence. Thompson previously worked at The Carlyle Group and The Amherst Group, while Williams came from Capstone Investment Advisors and UBS. Both founders attended Columbia University together.

Website: ridero.ai

View original content to download multimedia:https://www.prnewswire.com/news-releases/ridero-raises-2-7-million-to-tackle-vehicle-affordability-through-ai-powered-financial-infrastructure-302933733.html

SOURCE Ridero

Continue Reading

Technology

OpenHear BM420 Named a CES® 2027 Innovation Awards® Honoree

Published

on

By

Recognized in the Accessibility & Longevity category, the open-ear bone conduction hearing aid reflects Shokz’s expanding expertise in hearing care

AUSTIN, Texas, Nov. 9, 2026 /PRNewswire/ — Shokz, a pioneer in open-ear audio technology, today announced that OpenHear BM420 has been named a CES® 2027 Innovation Awards® Honoree in the Accessibility & Longevity category. Developed by Shokz’s affiliated professional hearing-care company ShokzHear, the device reflects the application of Shokz’s bone conduction expertise to hearing solutions designed with comfort, accessibility and everyday wearability in mind.

OpenHear BM420 is a professionally fitted, non-surgical bone conduction hearing aid designed to provide an alternative to traditional in-ear hearing aids and implantable bone conduction solutions. Its open-ear design keeps the ear canal unobstructed for comfort during extended wear, while individually adjustable hearing settings, directional microphones and background noise reduction help improve speech clarity in everyday environments.

“In hearing care, performance matters, but so does whether people feel comfortable wearing a device day after day,” said Fengyun Liao, Director of ShokzHear. “OpenHear BM420 brings our experience in open-ear bone conduction technology to that challenge, offering an alternative designed around both hearing assistance and everyday comfort. We’re honored to have this approach recognized by the CES Innovation Awards®.”

This recognition comes as Shokz prepares for CES 2027, where the company will showcase continued innovation in open-ear technology, including expanding applications beyond traditional audio.

OpenHear BM420 will be available beginning November 20, 2026, in the U.S. through participating hearing centers, ENT clinics and hospitals.

The CES Innovation Awards® program, owned and produced by the Consumer Technology Association (CTA)®, is an annual competition recognizing outstanding design and engineering in consumer technology. Entries are evaluated by a panel of industry experts, including engineers, designers and members of the media. The 2027 honorees, including product descriptions and images, can be found at ces.tech/ces-innovation-awards.

To learn more about Shokz, ShokzHear, OpenHear BM420 or the complete OpenHear Series, visit ShokzHear.com or follow @ShokzHear on Instagram, LinkedIn and YouTube.

About ShokzHear
ShokzHear is an affiliated company of Shokz, a global leader in bone conduction technology and open-ear acoustics. Drawing on more than a decade of innovation in consumer audio, ShokzHear is dedicated to advancing professional hearing care through accessible and comfortable hearing solutions, leveraging its expertise across both bone conduction and air conduction technologies. Its OpenHear series combines innovative acoustic engineering with everyday wearability, helping eligible individuals with hearing loss experience a different, more comfortable way to hear. Learn more about the brand at ShokzHear.com.

About CES®
CES is the most powerful tech event in the world – the proving ground for breakthrough technologies and global innovators. This is where the world’s biggest brands do business and meet new partners, and the sharpest innovators hit the stage. Owned and produced by the Consumer Technology Association (CTA)®, CES features every aspect of the tech sector. CES 2027 takes place Jan. 6-9, 2027, in Las Vegas. Learn more at CES.tech and follow CES on social.

The CES® Innovation Awards® are based upon descriptive materials submitted to the judges. CTA did not verify the accuracy of any submission or of any claims made and did not test the item to which the award was given.

View original content to download multimedia:https://www.prnewswire.com/news-releases/openhear-bm420-named-a-ces-2027-innovation-awards-honoree-302933652.html

SOURCE SHOKZ

Continue Reading

Technology

Bankers Expect Higher Funding Costs as Outlook for Loan Demand Softens

Published

on

By

ARLINGTON, Va., Nov. 9, 2026 /PRNewswire/ — Bank executives expect a tougher operating environment over the next year, with continued pressure on funding and little improvement in loan demand, according to a survey by fintech IntraFi.

Eighty-seven percent of respondents expect funding costs to increase in the next 12 months, up 84 points from the third quarter of 2025.

“Bankers are facing pressure on both sides of the balance sheet,” said Mark Jacobsen, CEO and cofounder of IntraFi. “The challenge is how to pursue growth without sacrificing profitability or stretching balance sheets. That puts a premium on disciplined pricing, strong customer relationships, and flexibility in how banks fund their business.”

IntraFi’s third quarter Bank Executive Business Outlook Survey was conducted online from October 5 to October 19, 2026, and includes responses from 411 bank CEOs, presidents, CFOs, and COOs nationwide.

Bond market volatility is also shaping bankers’ outlook. Over the next 12 months, 58% said the most significant potential effect of current long-term interest rates and bond market volatility on their securities portfolios would be higher funding costs or pressure on net interest margins. Another 16% cited further unrealized losses that could limit capital flexibility.

Other key findings

Balance sheet strategy: 47% are maintaining their current strategies, while 22% are accepting lower securities balances to make room for loans or cash and liquidity.Economy: 83% expect economic conditions to worsen or remain unchanged over the next 12 months.Access to capital: 78% expect access to capital to remain unchanged.Mortgages: 74% are not pursuing products or programs to help homeowners locked into low mortgage rates move or upgrade their homes.

Download the full report.

About IntraFi

A trusted partner chosen by more than 3,000 financial services companies, IntraFi defines success not by the volume of transactions it enables, but by the quality of relationships it forms. Its network, established over 20 years ago, connects institutions of all sizes to help participants build stronger relationships with their customers, fund more loans, seamlessly manage their liquidity needs, and earn fee income.

The network brings scale, giving each participant access to tens of billions of dollars in funding, the highest per-depositor and per-bank capacity, and the peace of mind of being able to make large-dollar placements.

View original content:https://www.prnewswire.com/news-releases/bankers-expect-higher-funding-costs-as-outlook-for-loan-demand-softens-302933750.html

SOURCE IntraFi

Continue Reading

Trending