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Semiconductor IP Market size is set to grow by USD 2.71 billion from 2024-2028, complex chip designs and use of multi-core technologies to boost the market growth, Technavio

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NEW YORK, June 18, 2024 /PRNewswire/ — The global semiconductor IP market  size is estimated to grow by USD 2.71 billion from 2024-2028, according to Technavio. The market is estimated to grow at a CAGR of over 7.47%  during the forecast period. Complex chip designs and use of multi-core technologies is driving market growth, with a trend towards emergence of nanophotonic ICs. However, reuse of semiconductor IP  poses a challenge. Key market players include Achronix Semiconductor Corp., Advanced Micro Devices Inc., Alphawave IP Group plc, Arm Ltd., Arteric Inc., Cadence Design Systems Inc., CAST Inc., CEVA Inc., Dolphin Design SAS, Dream Chip Technologies GmbH, eMemory Technology Inc., Faraday Technology Corp., Imagination Technologies Ltd., Lattice Semiconductor Corp., Perceptia Devices Australia, Rambus Inc., Siemens AG, Synopsys Inc., VeriSilicon Microelectronics Shanghai Co. Ltd., and videantis GmbH.

Get a detailed analysis on regions, market segments, customer landscape, and companies – Click for the snapshot of this report

Forecast period

2024-2028

Base Year

2023

Historic Data

2018 – 2022

Segment Covered

End-user (Fabless semiconductor companies, IDMs, and Foundries), Application (Mobile computing devices, Consumer electronics, Automotive, Industrial automation, and Others), Form Factor (Processor IP, Physical IP, and Digital IP), and Geography (North America, APAC, Europe, South America, and Middle East and Africa)

Region Covered

North America, APAC, Europe, South America, and Middle East and Africa

Key companies profiled

Achronix Semiconductor Corp., Advanced Micro Devices Inc., Alphawave IP Group plc, Arm Ltd., Arteric Inc., Cadence Design Systems Inc., CAST Inc., CEVA Inc., Dolphin Design SAS, Dream Chip Technologies GmbH, eMemory Technology Inc., Faraday Technology Corp., Imagination Technologies Ltd., Lattice Semiconductor Corp., Perceptia Devices Australia, Rambus Inc., Siemens AG, Synopsys Inc., VeriSilicon Microelectronics Shanghai Co. Ltd., and videantis GmbH

Key Market Trends Fueling Growth

The semiconductor IP market is experiencing growth due to the integration of nanophotonic structures in electronic devices. These structures enable the development of miniaturized semiconductor devices with higher integration densities, high-density optoelectronic ICs for optical fiber communication, and flexible electronics circuits. IBM is a leading vendor in this space, having developed low-cost, commercially available electronic-photonic ICs. The adoption of nanophotonic technology for transistor development, such as carbon nanotube transistors, is increasing design complexity and driving innovation in memory chip layout design. The global nanophotonic IC market is expected to reach USD79.42 million by 2021, growing at a CAGR of 14.51%. 

The Semiconductor Intellectual Property (IP) market is experiencing significant growth due to the increasing demand for advanced technologies. Chip companies require efficient and effective IP cores for their designs. Memory IP, such as SRAM and ROM, is a major segment in this market. Processors, connectivity IP, and interface IP are also key areas of focus. The trend towards miniaturization and higher performance is driving the need for new and innovative IP solutions. Companies like Intellectual Property (IP) providers offer a wide range of IP cores for various applications. These IP cores are essential for the design and development of modern electronic systems. The IP market is competitive, with many players vying for market share. However, those who can provide high-quality, reliable, and cost-effective IP solutions will thrive in this market. 

Research report provides comprehensive data on impact of trend. For more details- Download a Sample Report

Market Challenges

The semiconductor industry faces significant challenges with third-party IP usage, leading to extensive IP reuse over the past 15 years. Companies often lack proper methods to manage and track IP cores, including crucial RTL data and licensing metadata. This oversight can result in unintentional IP reuse, causing financial penalties and legal issues. Few companies prioritize IP block management, leaving many vulnerable to IP violations. Instances of unintentional IP reuse include new design teams mistakenly using third-party IP and engineers unaware of IP agreement terms. Annual IP reuse increases financial liability for companies at risk of IP violations. Proper IP management is essential to mitigate these challenges and ensure the semiconductor IP market’s growth.The semiconductor IP market faces several challenges in today’s technology landscape. Intellectual property (IP) providers must keep up with the rapid advancements in technology, such as the increasing complexity of designs and the need for smaller, more power-efficient chips. Technologies like FinFET and 7nm processes require new and innovative IP solutions. Additionally, the growing importance of security and reliability in semiconductor designs presents a challenge for IP providers. Cost and time-to-market pressures also loom large, making it essential for IP providers to offer flexible licensing models and efficient design integration. Competition from both established players and new entrants adds to the complexity of the market. Overall, the semiconductor IP market requires providers to be agile, innovative, and responsive to meet the evolving needs of the industry.

For more insights on driver and challenges – Download a Sample Report

Segment Overview 

This semiconductor ip market report extensively covers market segmentation by

End-user 1.1 Fabless semiconductor companies1.2 IDMs1.3 FoundriesApplication 2.1 Mobile computing devices2.2 Consumer electronics2.3 Automotive2.4 Industrial automation2.5 OthersForm Factor3.1 Processor IP3.2 Physical IP3.3 Digital IPGeography 4.1 North America4.2 APAC4.3 Europe4.4 South America4.5 Middle East and Africa

1.1 Fabless semiconductor companies-  In the semiconductor industry, fabless companies opt for third-party IP licenses to minimize manufacturing overheads and reduce design time. This approach saves fabless companies an average of USD90-190 million and cuts down designing time by half, compared to in-house processor development. Notable companies, including Actions Semiconductor, Allwinner Technology, Marvell, AMD, Broadcom, MediaTek, Microchip, Rambus, Qualcomm, Xilinx, and Realtek, have adopted this strategy to meet OEM requirements and bring semiconductor devices to market more efficiently. The use of third-party IPs is projected to continue growing in the forecast period.

For more information on market segmentation with geographical analysis including forecast (2024-2028) and historic data (2018 – 2022)  – Download a Sample Report

Research Analysis

The Semiconductor IP market plays a crucial role in system design, enabling the creation of various electronic devices in sectors such as telecommunications, automotive, consumer electronics, industrial devices, and emerging technologies. Chip design processes involve significant development expenses, making IP cores an essential component for operational efficiency and cost-effectiveness. SoC designs incorporate processors, memory modules, analog circuits, and interface modules from IP providers. Collaboration between semiconductor manufacturers and IP providers is essential for innovation, product launches, and time-to-market advantages. Design efficiency, chip reliability, and performance are key considerations in the selection of IP cores. Intellectual property protection is essential to prevent patent infringement and maintain a competitive edge in research and development. Market expansion in various sectors drives the demand for semiconductor IP solutions.

Market Research Overview

The Semiconductor Intellectual Property (IP) market refers to the buying and selling of pre-designed and tested semiconductor IP cores and blocks. These IP cores and blocks include digital signal processing (DSP) cores, memory interfaces, and processor cores, among others. The semiconductor IP market caters to various industries such as automotive, consumer electronics, industrial, and telecommunications. The market is driven by the increasing demand for miniaturization, cost reduction, and time-to-market considerations in semiconductor design. The semiconductor IP market also offers benefits such as reduced design risk, faster time-to-market, and lower development costs. The market is expected to grow significantly due to the increasing adoption of advanced technologies such as artificial intelligence (AI), machine learning (ML), and the Internet of Things (IoT).

Table of Contents:

1 Executive Summary
2 Market Landscape
3 Market Sizing
4 Historic Market Size
5 Five Forces Analysis
6 Market Segmentation

End-userFabless Semiconductor CompaniesIDMsFoundriesApplicationMobile Computing DevicesConsumer ElectronicsAutomotiveIndustrial AutomationOthersForm FactorProcessor IPPhysical IPDigital IPGeographyNorth AmericaAPACEuropeSouth AmericaMiddle East And Africa

7 Customer Landscape
8 Geographic Landscape
9 Drivers, Challenges, and Trends
10 Company Landscape
11 Company Analysis
12 Appendix

About Technavio

Technavio is a leading global technology research and advisory company. Their research and analysis focuses on emerging market trends and provides actionable insights to help businesses identify market opportunities and develop effective strategies to optimize their market positions.

With over 500 specialized analysts, Technavio’s report library consists of more than 17,000 reports and counting, covering 800 technologies, spanning across 50 countries. Their client base consists of enterprises of all sizes, including more than 100 Fortune 500 companies. This growing client base relies on Technavio’s comprehensive coverage, extensive research, and actionable market insights to identify opportunities in existing and potential markets and assess their competitive positions within changing market scenarios.

Contacts

Technavio Research
Jesse Maida
Media & Marketing Executive
US: +1 844 364 1100
UK: +44 203 893 3200
Email: media@technavio.com
Website: www.technavio.com/

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TI celebrates 70 years of innovation in Europe alongside leading customers to engineer next-generation systems

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 Companies including ABB Robotics, Porsche, Schneider Electric and Husqvarna Group are working with TI to enable advancements in how the world moves, lives and works

News highlights:

TI is celebrating 70 years of operations in Europe, underscoring its commitment to helping customers across the continent and around the world solve their most complex engineering challenges.From early automotive electronics to today’s AI-driven infrastructure, TI has supported seven decades of technological advancement across Europe’s key industries.Through partnerships with key European companies, TI is shaping the future of mobility, automation and sustainable energy management.

MUNICH, Nov. 3, 2026 /PRNewswire/ — Texas Instruments (TI) (Nasdaq: TXN) is celebrating 70 years of operations in Europe, demonstrating its long history of semiconductor innovation, research and development, manufacturing and customer partnership in the region. This milestone is a key part of TI’s near 100-year legacy of driving the technological advancements that power the modern world. The anniversary coincides with TI’s participation at electronica 2026, November 10-13, in Munich, Germany.

“Our 70-year commitment to Europe is a significant part of our story, but it is also a reflection of TI’s passion – creating a better world by making electronics more affordable through semiconductors,” said Robert Berghoff, president of TI EMEA. “Our focus remains on empowering engineers in Europe and around the world as they navigate the transition toward more autonomous, AI-driven and intelligent systems. Whether through our local engineering or our global manufacturing scale, we are dedicated to providing reliable, high-performance semiconductors that help our customers solve their most complex design challenges.”

Innovating what’s next in intelligent systems
With the industry’s most comprehensive portfolio of more than 80,000 analog and embedded processing semiconductors, TI enables efficient power management, precise sensing, seamless connectivity and AI processing at the edge. Globally, TI helps more than 100,000 customers, including leading companies in Europe, accelerate innovation across key markets, from industrial automation systems that increase productivity to safer, more advanced vehicles.

Transforming industrial automation with ABB Robotics
As ABB Robotics advances the next generation of Autonomous Versatile Robotics (AVR™), physical AI is enabling robots to perceive, reason and act in increasingly dynamic industrial environments. Achieving this requires innovation across the technology stack, from sensing and computing to control and power management. TI semiconductor technology helps support the performance, efficiency and real-time control requirements of intelligent robotic systems. Technologies including real-time control microcontrollers, sensing solutions and motor-control components play an important role in enabling increasingly autonomous, adaptive and connected automation solutions.

“The transition toward physical AI and with it autonomous versatile robotics depends on advances across the entire technology ecosystem,” said Johan Ernlund, Global R&D Manager – Platform, ABB Robotics. “TI’s leadership in real-time processing, sensing and motor control provides important building blocks for the next generation of industrial automation. Together, we are helping create robotic systems that can operate safely, intelligently and efficiently in increasingly complex environments.”­­

Architecting next-generation vehicles with Porsche 
As the automotive industry shifts toward vehicles that are more intelligent and immersive, the need for advanced, efficient semiconductor solutions has never been more critical. In partnership with Porsche, TI is enabling a new era of automotive excellence through industry-leading audio and gallium nitride (GaN) technologies.

“Bringing next-generation vehicle experiences to our customers means that we are not just adopting technology, but actively driving it forward,” said Lars Heuken, Strategic Semiconductor Management, Porsche. “By working with TI to integrate GaN technology, we can achieve more efficient and compact designs without compromising on performance. This collaboration also allows us to define the next step in high-end audio performance, ensuring an exceptional experience inside the cabin.”

Powering AI from grid to gate with Schneider Electric
As AI infrastructure and sustainable energy drive unprecedented power demands, TI is partnering with Schneider Electric to solve critical design challenges and enable the next generation of AI data centers. By combining TI’s semiconductor innovations – including advanced power conversion, improved energy efficiency and scalable infrastructure – with Schneider Electric’s power management expertise, the two companies are enabling higher power density in increasingly compact footprints.

“At Schneider Electric, we’re focused on building a more sustainable and resilient future,” said Ard Verboon, Chief Procurement Officer, Schneider Electric. “As an enabler of the energy transition, we’re constantly seeking the high-efficiency power solutions that today’s critical design challenges demand. TI’s technologies provide the building blocks for systems that require resilience and efficiency, from energy management systems to industrial automation.”

Accelerating innovation in intelligent outdoor systems with Husqvarna Group 
As consumers demand greater convenience and reduced maintenance through more autonomous and connected outdoor products, engineers must accelerate the transition from concept to implementation at unprecedented speeds. TI and Husqvarna Group have been collaborating to bring next-generation products to market, from smart watering solutions to robot lawn mowers. By leveraging TI’s advanced development tools, Husqvarna Group engineers can optimize every stage of the development cycle, allowing them to focus on high-value innovation: building the smart, connected solutions that set new standards for precision and ease of use.

TI at electronica 2026
At electronica 2026, TI will showcase how its analog and embedded processing products are helping innovate what’s next in intelligent systems. Demonstrations include the latest advancements in automation, automotive, sustainable energy and more. Visit ti.com/electronica for more information.

About Texas Instruments
Texas Instruments Incorporated (Nasdaq: TXN) is a global semiconductor company that designs, manufactures and sells analog and embedded processing chips for markets such as industrial, automotive, data center, personal electronics and communications equipment. At our core, we have a passion to create a better world by making electronics more affordable through semiconductors. This passion is alive today as each generation of innovation builds upon the last to make our technology more reliable, more affordable and lower power, making it possible for semiconductors to go into electronics everywhere. Learn more at TI.com.

Trademarks
All registered trademarks and other trademarks belong to their respective owners.

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SOURCE Texas Instruments

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New Businessolver Research Finds CEOs and CHROs Expect Empathy to Cost Them Authority

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Data shows 59% of CEOs and 51% of CHROs expect their decisions to be challenged when they lead with empathy

DENVER, Nov. 3, 2026 /PRNewswire/ — The two executives most responsible for shaping workplace culture expect to pay a price for leading with empathy. In new Businessolver research, 59% of CEOs and 51% of CHROs (or Chief People Officers) say their decisions will be challenged if they lead with empathy. Yet 99% of CEOs and 88% of CHROs believe empathy contributes to business results.

The findings come from Part 2 of Businessolver’s 2026 State of Workplace Empathy C-Suite Special Report, “Inside America’s C-suite: What happens when executives don’t feel safe?” The study of 1,000 employees and 300 C-suite executives, including CEOs, CFOs, CIOs/CTOs, and CHROs/CPOs, is part of the company’s 11th annual study on empathy at work.

Executives name the CEO as the leader with the most influence over a culture of empathy. But 43% of CEOs fear they will lose respect if they demonstrate empathy at work, and 61% say empathy is hard to demonstrate consistently in their day-to-day work.

“Executives have overwhelmingly accepted the business case for empathy, but data shows many still don’t feel safe acting on it,” said Marcy Klipfel, chief engagement officer at Businessolver. “It’s a shocking trend that so many chief people leaders feel constrained in their ability to lead with the empathy employees need. When the CEO and CHRO brace for pushback every time they lead with empathy, that tension impacts how decisions are made. And ultimately, employees feel it long before it shows up in turnover or declining productivity.”

The report also surfaced patterns that complicate how boards and HR leaders think about culture at the top:

Empathy feels riskiest where it’s needed most. 78% of executives in toxic cultures fear losing respect for showing empathy, compared with 14% in non-toxic cultures, a 64-point gap.Executives and employees disagree about who sets the tone for empathy. Just 2% of executives say non-manager employees have the most impact on workplace empathy, compared with 32% of employees.Millennial executives report the most friction putting empathy into practice. 34% say empathy gets in the way of their personal business goals, more than twice the rate of Gen X executives (16%).Employees are 1.7X more likely than executives to report a mental health issue in the past year (55% vs. 33%). Among those affected, 54% of employees report depression, compared with 12% of executives.

The report details how each C-suite role experiences coworker intimidation and mental health strain differently. Taken together, Businessolver’s C-suite reports suggest business performance can look strong even as trust and psychological safety erode below the surface.

Download the full report at https://businessolver.com/resources/2026-state-of-workplace-empathy-c-suite-special-report-p2/

About Businessolver
Since 1998, Businessolver has delivered market-changing benefits technology that empowers empathetic service supported by an intrinsic responsiveness to client needs. The company creates client programs that maximize benefits program investment, minimize risk exposure, and engage employees with easy-to-use solutions and communication tools to assist them in making wise and cost-efficient benefits selections. Founded by HR professionals, Businessolver’s unwavering service-oriented culture and secure SaaS platform provide measurable success in its mission to provide complete client delight.

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SOURCE Businessolver

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Buchanan & Edwards Wins Seven-Year Prime Contract to Support Critical National Security Missions

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New Award Expands BE’s Systems Integration and Technical Advisory Support for Critical National Security Missions

WASHINGTON, Nov. 3, 2026 /PRNewswire-PRWeb/ — Buchanan & Edwards (BE) announced today that it has been awarded a seven-year, Cost Plus Fixed Fee Level of Effort prime contract to provide systems integration, engineering, technical, and operational expertise in support of critical national security missions.

This award demonstrates the value BE brings at the intersection of technology, mission, and people.

Under the award, BE will provide highly skilled Systems Integrators (SI) and Systems Engineering Technical Advisor (SETA) professionals supporting complex mission requirements in the Chantilly, Virginia area. The work will span systems integration and interoperability, requirements development, technical analysis, program planning, risk identification and mitigation, technology assessment, and coordination across mission stakeholders.

“This is an important win for BE and a reflection of the trust our team has built through a deep understanding of our customers and their missions,” said Tara Davey, Mission Sector President at BE. “The work requires experienced professionals who can bring together technical expertise, sound analysis, and strong collaboration to help our customer navigate complex challenges and move critical mission priorities forward.”

Skilled personnel will work alongside government stakeholders to help coordinate technical activities, evaluate requirements and emerging technologies, identify and mitigate risks, and provide actionable recommendations that support informed decision-making.

“This award demonstrates the value BE brings at the intersection of technology, mission, and people,” said Chris Bellios, CEO of BE. “Winning a new seven-year prime contract is a significant milestone for our organization and reinforces the strength of our long-term growth strategy. It gives our teams the opportunity to bring the right expertise to the table, work alongside our customer, and deliver meaningful impact across missions of national importance.”

The award will create opportunities for cleared Systems Integrators, Systems Engineering and Technical Advisor professionals, engineers, analysts, and other technical specialists supporting missions in the Chantilly area.

Interested candidates can explore current opportunities at https://teambe.us/careers

About BE

Since 1998, BE has safeguarded the security and prosperity of the American people as a trusted partner to the defense, intelligence, law enforcement, and citizen services communities. We deliver unmatched technical and operational capabilities that drive mission success in today’s complex landscape. With a future-focused approach and an unwavering commitment to our clients, we design and implement solutions that strengthen, secure, and advance critical missions.

For additional information, please visit our websites at www.teambe.us

Media Contact: Scott King, sking@teambe.us

Media Contact

Scott King, Buchanan & Edwards (BE), 1 703-535-5511, sking@teambe.us, www.teambe.us

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SOURCE Buchanan & Edwards (BE)

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