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Radiation-Hardened Electronics Market size is set to grow by USD 275 million from 2024-2028, Rising need for radiation-hardened electronics in space applications to boost the market growth, Technavio

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NEW YORK, June 25, 2024 /PRNewswire/ — The global radiation-hardened electronics market  size is estimated to grow by USD 275 million from 2024-2028, according to Technavio. The market is estimated to grow at a CAGR of  3.2%  during the forecast period.  Rising need for radiation-hardened electronics in space applications is driving market growth, with a trend towards product launches. However, high cost associated with manufacturing  poses a challenge. Key market players include Advanced Micro Devices Inc., Aitech, Amphenol Corp., Analog Devices Inc., BAE Systems Plc, Data Device Corp., Everspin Technologies Inc., Frontgrade Technologies, GSI Technology Inc., HEICO Corp., Honeywell International Inc., Infineon Technologies AG, Mercury Systems Inc., Microchip Technology Inc., Renesas Electronics Corp., Space Micro Inc., STMicroelectronics International N.V., Teledyne Technologies Inc., Texas Instruments Inc., and TTM Technologies Inc..

Get a detailed analysis on regions, market segments, customer landscape, and companies – Click for the snapshot of this report

Forecast period

2024-2028

Base Year

2023

Historic Data

2018 – 2022

Segment Covered

Product Type (Custom made and Commercial-off-the-shelf (COTS)), Component (Power management, Mixed signal ICs, Processors and controllers, and Memory), and Geography (North America, Europe, APAC, South America, and Middle East and Africa)

Region Covered

North America, Europe, APAC, South America, and Middle East and Africa

Key companies profiled

Advanced Micro Devices Inc., Aitech, Amphenol Corp., Analog Devices Inc., BAE Systems Plc, Data Device Corp., Everspin Technologies Inc., Frontgrade Technologies, GSI Technology Inc., HEICO Corp., Honeywell International Inc., Infineon Technologies AG, Mercury Systems Inc., Microchip Technology Inc., Renesas Electronics Corp., Space Micro Inc., STMicroelectronics International N.V., Teledyne Technologies Inc., Texas Instruments Inc., and TTM Technologies Inc.

Key Market Trends Fueling Growth

The radiation-hardened electronics market is experiencing significant growth due to companies’ focus on new product launches. Renesas Electronics and STMicroelectronics are notable players introducing rad-hard devices for satellite power management and cost-conscious space satellites, respectively. These innovations expand product offerings and enhance market share, contributing to the market’s expansion throughout the forecast period. 

The Radiation-Hardened Electronics market is experiencing significant growth due to the increasing demand for advanced technology in various industries. Consumers seek electronics that can withstand harsh environments and radiation, particularly in sectors like aerospace and defense. The use of semiconductors and consumer electronics is on the rise, with safety and reliability being key considerations. The trend towards miniaturization and the integration of multiple functions into single chips is driving innovation in this field. Additionally, the development of new materials and technologies, such as gallium nitride and silicon carbide, is expected to further boost market growth. The market for radiation-hardened electronics is projected to reach USD5 billion by 2025. 

Research report provides comprehensive data on impact of trend. For more details- Download a Sample Report

Market Challenges

The radiation-hardened electronics market entails substantial capital investment for manufacturing. Factors contributing to high costs include facility and equipment expenses, such as building costs and obsolete factories. Manufacturing equipment is another significant expenditure, now outsourced to vendors. Inefficient plant usage and expensive raw materials add to the burden. Defects in products also increase costs, particularly for complex designs. Managing these expenses is a significant challenge for market vendors, potentially hindering growth.The Radiation-Hardened Electronics market faces several challenges in the nuclear and space industries. These industries require electronics that can withstand high levels of radiation without failure. However, designing and manufacturing such electronics is complex and costly. The use of advanced materials and manufacturing processes is essential to create radiation-hardened components. Additionally, testing and certification processes are lengthy and expensive. Furthermore, the need for miniaturization and increased performance adds to the complexity of the market. Despite these challenges, the demand for radiation-hardened electronics continues to grow due to the increasing use of nuclear power and space exploration. Companies must innovate and collaborate to overcome these challenges and meet the needs of their customers.

For more insights on driver and challenges – Download a Sample Report

Segment Overview 

This radiation-hardened electronics market report extensively covers market segmentation by

Product Type1.1 Custom made1.2 Commercial-off-the-shelf (COTS)Component 2.1 Power management2.2 Mixed signal ICs2.3 Processors and controllers2.4 MemoryGeography 3.1 North America3.2 Europe3.3 APAC3.4 South America3.5 Middle East and Africa

1.1 Custom made-  The custom-made segment leads the radiation-hardened electronics market due to high demand from space applications. Space agencies prefer customized solutions for their high-integration, efficient, and compact requirements. In 2023, this segment dominated, and it’s expected to continue during the forecast period. However, high capital investments, long development cycles, and unique user needs pose challenges. Vendors like STMicroelectronics innovate with radiation-hardened ICs for cost-effective space satellites, driving market growth.

For more information on market segmentation with geographical analysis including forecast (2024-2028) and historic data (2018 – 2022)  – Download a Sample Report

Research Analysis

The Radiation-Hardened Electronics Market encompasses the development, production, and implementation of electronics designed to withstand the harsh conditions of the space industry. In sectors such as the Aerospace sector and the Space industry, dependable operation is paramount, even in challenging situations with high radiation levels. Materials science and design techniques are crucial in creating radiation-hardened electronics, ensuring performance and reliability. Testing methodologies are essential to assess the components’ ability to function under various radiation types and energies. The market prioritizes affordability while maintaining safety hazards at a minimum, especially in applications like nuclear power plants where radiation levels are significantly higher. Processors and testing environments are specifically engineered to meet these stringent requirements, contributing to the 1.5 trillion-watt hour (3 terawatt hours) market demand for radiation-hardened electronics.

Market Research Overview

The Radiation-Hardened Electronics Market encompasses the production and sale of electronic components and systems designed to withstand and operate effectively in high-radiation environments. These electronics are essential for various applications in the aerospace, defense, and space industries. The market’s growth is driven by the increasing demand for advanced technology in these sectors, as well as the need for reliable electronics in extreme conditions. The sector includes various components such as sensors, memory, microcontrollers, and power management systems. The design and development of radiation-hardened electronics involve unique challenges, including the use of specialized materials and manufacturing processes. The market is expected to grow significantly in the coming years due to the increasing demand for space exploration and the development of advanced defense technologies.

Table of Contents:

1 Executive Summary
2 Market Landscape
3 Market Sizing
4 Historic Market Size
5 Five Forces Analysis
6 Market Segmentation

Product TypeCustom MadeCommercial-off-the-shelf (COTS)ComponentPower ManagementMixed Signal ICsProcessors And ControllersMemoryGeographyNorth AmericaEuropeAPACSouth AmericaMiddle East And Africa

7 Customer Landscape
8 Geographic Landscape
9 Drivers, Challenges, and Trends
10 Company Landscape
11 Company Analysis
12 Appendix

About Technavio

Technavio is a leading global technology research and advisory company. Their research and analysis focuses on emerging market trends and provides actionable insights to help businesses identify market opportunities and develop effective strategies to optimize their market positions.

With over 500 specialized analysts, Technavio’s report library consists of more than 17,000 reports and counting, covering 800 technologies, spanning across 50 countries. Their client base consists of enterprises of all sizes, including more than 100 Fortune 500 companies. This growing client base relies on Technavio’s comprehensive coverage, extensive research, and actionable market insights to identify opportunities in existing and potential markets and assess their competitive positions within changing market scenarios.

Contacts

Technavio Research
Jesse Maida
Media & Marketing Executive
US: +1 844 364 1100
UK: +44 203 893 3200
Email: media@technavio.com
Website: www.technavio.com/

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SOURCE Technavio

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Chef Robotics Physical AI Models Can Now Automate Baked Goods Packing

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SAN FRANCISCO, April 29, 2026 /PRNewswire/ — Chef Robotics, a leader in physical AI for the food industry, today announced that Chef robots can now automate tray assembly for baked goods packing. The application places baked products, such as burger buns, chocolate chip cookies, biscotti, butter cookies, biscuits, fortune cookies, granola bars, rusks, and shortbreads into trays and packaging containers before sealing.

Watch Chef robots in action.

Baked goods packing has historically been difficult to automate for high-mix production. Each item behaves differently on the production line—a granola bar compresses under the wrong grip, while a biscotti or rusk can crack if placed at the wrong angle. Surface textures range from glazed and smooth to crumbly and irregular, and strict presentation requirements leave little room for error. This variability has made it challenging for automation systems to reliably handle baked goods at production speeds, leaving food manufacturers dependent on manual labor and traditional bakery equipment.

To address this, Chef built its baked goods packing application on its existing piece-picking capability, which uses Chef’s AI-powered computer vision and physical AI models trained across diverse real-world production environments. This allows Chef robots to assess each item’s position, shape, and orientation in real time and determine how to pick the items from the pan and place them quickly and precisely without damaging them.

The baked goods packing application supports four distinct placement capabilities.

First, Chef’s vision system detects the angle at which each item sits in the pan and reorients it after picking, placing it on the tray at the exact angle required, regardless of its original position, enabling retail-ready presentation for SKUs that require precise angular placement.

Second, Chef robots can place multiple baked goods into the same packaging container in a single automated pass, completing full tray assembly without manual intervention.

Third, for packaging containers with multiple small compartments, Chef robots can precisely place items into each designated section, including multiple items in the same compartment, using Chef’s AI vision model to detect compartment positions and orientations in real time.

Fourth, Chef’s vision system identifies the exact center of each tray and places every item at a predefined offset from that center, ensuring a uniform, consistent arrangement across every pack regardless of how trays arrive on the conveyor.

For food manufacturers evaluating bakery systems and baked goods packaging automation, the application offers higher throughput, reduced labor dependency, and consistent presentation across shifts. The capability runs on Chef’s existing robotic hardware and software, allowing manufacturers to deploy it without requiring any changes to their production lines.

Chef’s baked goods packing application is available in the U.S., Canada, Germany, and the UK and is included as part of Chef’s robotics-as-a-service (RaaS) pricing model.

About Chef Robotics
Chef is the first company to have commercialized a scalable AI-driven food robotics solution. With over 104 million servings made in production, Chef leverages ChefOS, an AI platform for food manipulation, to offer a Robotics-as-a-Service solution that helps industry-leading food companies increase production volume and meet demand. Headquartered in San Francisco, CA, Chef aims to empower humans to do what humans do best by accelerating the advent of intelligent machines. Visit https://chefrobotics.ai to learn more.

View original content:https://www.prnewswire.com/news-releases/chef-robotics-physical-ai-models-can-now-automate-baked-goods-packing-302756923.html

SOURCE Chef Robotics

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Technology

Chef Robotics Physical AI Models Can Now Automate Baked Goods Packing

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on

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SAN FRANCISCO, April 29, 2026 /PRNewswire/ — Chef Robotics, a leader in physical AI for the food industry, today announced that Chef robots can now automate tray assembly for baked goods packing. The application places baked products, such as burger buns, chocolate chip cookies, biscotti, butter cookies, biscuits, fortune cookies, granola bars, rusks, and shortbreads into trays and packaging containers before sealing.

Watch Chef robots in action.

Baked goods packing has historically been difficult to automate for high-mix production. Each item behaves differently on the production line—a granola bar compresses under the wrong grip, while a biscotti or rusk can crack if placed at the wrong angle. Surface textures range from glazed and smooth to crumbly and irregular, and strict presentation requirements leave little room for error. This variability has made it challenging for automation systems to reliably handle baked goods at production speeds, leaving food manufacturers dependent on manual labor and traditional bakery equipment.

To address this, Chef built its baked goods packing application on its existing piece-picking capability, which uses Chef’s AI-powered computer vision and physical AI models trained across diverse real-world production environments. This allows Chef robots to assess each item’s position, shape, and orientation in real time and determine how to pick the items from the pan and place them quickly and precisely without damaging them.

The baked goods packing application supports four distinct placement capabilities.

First, Chef’s vision system detects the angle at which each item sits in the pan and reorients it after picking, placing it on the tray at the exact angle required, regardless of its original position, enabling retail-ready presentation for SKUs that require precise angular placement.

Second, Chef robots can place multiple baked goods into the same packaging container in a single automated pass, completing full tray assembly without manual intervention.

Third, for packaging containers with multiple small compartments, Chef robots can precisely place items into each designated section, including multiple items in the same compartment, using Chef’s AI vision model to detect compartment positions and orientations in real time.

Fourth, Chef’s vision system identifies the exact center of each tray and places every item at a predefined offset from that center, ensuring a uniform, consistent arrangement across every pack regardless of how trays arrive on the conveyor.

For food manufacturers evaluating bakery systems and baked goods packaging automation, the application offers higher throughput, reduced labor dependency, and consistent presentation across shifts. The capability runs on Chef’s existing robotic hardware and software, allowing manufacturers to deploy it without requiring any changes to their production lines.

Chef’s baked goods packing application is available in the U.S., Canada, Germany, and the UK and is included as part of Chef’s robotics-as-a-service (RaaS) pricing model.

About Chef Robotics
Chef is the first company to have commercialized a scalable AI-driven food robotics solution. With over 104 million servings made in production, Chef leverages ChefOS, an AI platform for food manipulation, to offer a Robotics-as-a-Service solution that helps industry-leading food companies increase production volume and meet demand. Headquartered in San Francisco, CA, Chef aims to empower humans to do what humans do best by accelerating the advent of intelligent machines. Visit https://chefrobotics.ai to learn more.

View original content:https://www.prnewswire.com/news-releases/chef-robotics-physical-ai-models-can-now-automate-baked-goods-packing-302756923.html

SOURCE Chef Robotics

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Air Products to Expand Industrial Gas Supply for Samsung Electronics’ Next-Generation Semiconductor Fab in South Korea

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New investment underscores the company’s long-term commitment to Korea and its leading role in the global semiconductor industry 

LEHIGH VALLEY, Pa., April 29, 2026 /PRNewswire/ — Air Products (NYSE:APD), a world-leading industrial gases company and serving Samsung globally, today announced it has been selected by Samsung to supply industrial gases for its new advanced semiconductor fab in Pyeongtaek, Gyeonggi Province, South Korea.

Under the agreement, Air Products will build, own and operate multiple state-of-the-art production facilities and a bulk specialty gas supply system to supply nitrogen, oxygen, argon, and hydrogen for Samsung’s new semiconductor fab. The new facilities are expected to come onstream in multiple phases from 2028 through 2030.

Air Products has a long track record of executing multiple phase expansions in Pyeongtaek to support Samsung’s growing manufacturing needs. This latest project represents Air Products’ largest investment to date in the semiconductor industry and will establish Pyeongtaek as the company’s single largest operations site globally supporting the electronics industry. 

“Air Products is honored to be selected once again by Samsung and to have their continued confidence as a trusted partner supporting their strategic growth plans,” said SR Kim, President, Air Products Korea. “This significant investment reinforces Air Products’ role as a leading global supplier to the semiconductor industry and underscores our long-standing commitment to supporting our strategic customers with safety, reliability, efficiency and excellent service.”

Air Products has served the global electronics industry for more than 40 years, supplying industrial gases safely and reliably to many of the world’s leading technology companies. The company has operated in Korea for more than 50 years and has established a strong position in electronics and manufacturing sectors.

About Air Products

Air Products (NYSE: APD) is a world-leading industrial gases company in operation for over 85 years focused on serving energy, environmental, and emerging markets and generating a cleaner future. The Company supplies essential industrial gases, related equipment and applications expertise to customers in dozens of industries, including refining, chemicals, metals, electronics, manufacturing, medical and food. As the leading global supplier of hydrogen, Air Products also develops, engineers, builds, owns and operates some of the world’s largest clean hydrogen projects, supporting the transition to low- and zero-carbon energy in the industrial and heavy-duty transportation sectors. Through its sale of equipment businesses, the Company also provides turbomachinery, membrane systems and cryogenic containers globally.

Air Products had fiscal 2025 sales of $12 billion from operations in approximately 50 countries. For more information, visit airproducts.com or follow us on LinkedInXFacebook or Instagram.

This release contains “forward-looking statements” within the safe harbor provisions of the Private Securities Litigation Reform Act of 1995. These forward-looking statements are based on management’s expectations and assumptions as of the date of this release and are not guarantees of future performance. While forward-looking statements are made in good faith and based on assumptions, expectations and projections that management believes are reasonable based on currently available information, actual performance and financial results may differ materially from projections and estimates expressed in the forward-looking statements because of many factors, including the risk factors described in our Annual Report on Form 10-K for the fiscal year ended September 30, 2025 and other factors disclosed in our filings with the Securities and Exchange Commission. Except as required by law, we disclaim any obligation or undertaking to update or revise any forward-looking statements contained herein to reflect any change in the assumptions, beliefs or expectations or any change in events, conditions or circumstances upon which any such forward-looking statements are based.

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