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ASNA and Athinia® collaborate to boost semiconductor manufacturing yields through improved data sharing and traceability of subcomponent parts

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CAMBRIDGE, Mass., July 8, 2024 /PRNewswire/ — Today Athinia® announced a collaboration with ASNA to combine unprecedented data sharing and traceability to improve critical semiconductor component and subcomponent innovation. In today’s fiercely competitive semiconductor landscape, the quality and reliability of components and subcomponents are paramount for achieving superior yield rates and minimizing defects during manufacturing.

ASNA, a pioneering force in the semiconductor manufacturing components segment, has joined forces with Athinia, the secure data and analytics platform for the semiconductor industry, to introduce a revolutionary concept aimed at tracking previously untraceable parts through the entire life cycle of the parts. This innovative initiative is confirming the significance of traceability and analytics, for consumable parts, in boosting yield and reducing defectivity within fabrication processes.

Athinia plays a pivotal role in this endeavor by enabling traceability, comprehensive data analytics and multi-party data sharing to provide a comprehensive understanding for each part’s performance on yield in the manufacturing process. As a result, ASNA can see a full view of how to improve parts, delivering a lower cost of ownership with better fab performance to their customers. 

“As we continue to engage more stakeholders across the semiconductor ecosystem, we can leverage the sharing of data, including data related to the subcomponents used in equipment which results in manufacturing improvements for device makers in their fabs. We are working together with ASNA and device makers to track parts that significantly impact performance and defectivity which were previously untraceable,” said Laura Matz, CEO of Athinia and Chief Science and Technology Officer of Merck.

“Together with ASNA, we are pioneering an industry-leading concept to allow tracking of seals that will provide the industry with valuable insights and potentially enhance overall performance and quality.”

ASNA’s strategic deployment of Athinia extends beyond traditional manufacturing paradigms. ASNA develops innovative solutions that optimize the interplay between components, subcomponents, and overall equipment and wafer performance metrics by establishing the genealogy of parts traceability in the collaboration. This allows for the harnessing of advanced analytics and machine learning capabilities combined with on-wafer data. This proactive approach boosts understanding of critical components to yield, and closed-loop failure analysis elevates product reliability and market competitiveness.

“Components and subcomponent are pivotal in semiconductor manufacturing,” stated Dalia Vernikovsky, CEO at ASNA. “Athinia empowers our engineers with insights and predictive analytics. We now have a normalized understanding of how our parts perform at our customers, allowing us to optimize processes, preempt potential issues, and ultimately make better performing products.”

“Our commitment to excellence in components and subcomponent parts underscores ASNA’s dedication to pushing technological boundaries,” added Dalia Vernikovsky. “Through Athinia, we are poised to meet the evolving demands of global semiconductor markets with unmatched precision and agility.”

About Athinia Technologies LLC

Athinia® provides a data analytics platform that brings manufacturers and materials and equipment suppliers together to share, aggregate, and analyze data to unlock efficiencies and time to market, while improving quality, supply chain, and sustainability – all without taking ownership of data. Athinia® is a partnership between Merck (DAX:MKGAF), and Palantir Technologies Inc. (NYSE:PLTR). Athinia® is headquartered in Cambridge, MA, USA, and operates independently from the Electronics business of Merck. More information can be found at www.athinia.com.

About ASNA:

ASNA is a leading innovator in semiconductor manufacturing, specializing in sealing, gaskets and component expertise. ASNA’s reputation continues to be built on efforts to focus on world-class sealing solutions as well as traceability to mitigate defects that cause yield loss and manufacturing downtime. With a dedication to precision engineering and leveraging Athinia for data-driven insights, ASNA continues to shape the future of semiconductor technologies worldwide. Please visit www.asnaglobal.com for more information.

Press contacts:

Athinia: nuria.aranda-bosch@athinia.com

ASNA: asna.info@appliedsealsglobal.com

 

 

 

View original content:https://www.prnewswire.com/apac/news-releases/asna-and-athinia-collaborate-to-boost-semiconductor-manufacturing-yields-through-improved-data-sharing-and-traceability-of-subcomponent-parts-302189786.html

SOURCE Athinia

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Chef Robotics Physical AI Models Can Now Automate Baked Goods Packing

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SAN FRANCISCO, April 29, 2026 /PRNewswire/ — Chef Robotics, a leader in physical AI for the food industry, today announced that Chef robots can now automate tray assembly for baked goods packing. The application places baked products, such as burger buns, chocolate chip cookies, biscotti, butter cookies, biscuits, fortune cookies, granola bars, rusks, and shortbreads into trays and packaging containers before sealing.

Watch Chef robots in action.

Baked goods packing has historically been difficult to automate for high-mix production. Each item behaves differently on the production line—a granola bar compresses under the wrong grip, while a biscotti or rusk can crack if placed at the wrong angle. Surface textures range from glazed and smooth to crumbly and irregular, and strict presentation requirements leave little room for error. This variability has made it challenging for automation systems to reliably handle baked goods at production speeds, leaving food manufacturers dependent on manual labor and traditional bakery equipment.

To address this, Chef built its baked goods packing application on its existing piece-picking capability, which uses Chef’s AI-powered computer vision and physical AI models trained across diverse real-world production environments. This allows Chef robots to assess each item’s position, shape, and orientation in real time and determine how to pick the items from the pan and place them quickly and precisely without damaging them.

The baked goods packing application supports four distinct placement capabilities.

First, Chef’s vision system detects the angle at which each item sits in the pan and reorients it after picking, placing it on the tray at the exact angle required, regardless of its original position, enabling retail-ready presentation for SKUs that require precise angular placement.

Second, Chef robots can place multiple baked goods into the same packaging container in a single automated pass, completing full tray assembly without manual intervention.

Third, for packaging containers with multiple small compartments, Chef robots can precisely place items into each designated section, including multiple items in the same compartment, using Chef’s AI vision model to detect compartment positions and orientations in real time.

Fourth, Chef’s vision system identifies the exact center of each tray and places every item at a predefined offset from that center, ensuring a uniform, consistent arrangement across every pack regardless of how trays arrive on the conveyor.

For food manufacturers evaluating bakery systems and baked goods packaging automation, the application offers higher throughput, reduced labor dependency, and consistent presentation across shifts. The capability runs on Chef’s existing robotic hardware and software, allowing manufacturers to deploy it without requiring any changes to their production lines.

Chef’s baked goods packing application is available in the U.S., Canada, Germany, and the UK and is included as part of Chef’s robotics-as-a-service (RaaS) pricing model.

About Chef Robotics
Chef is the first company to have commercialized a scalable AI-driven food robotics solution. With over 104 million servings made in production, Chef leverages ChefOS, an AI platform for food manipulation, to offer a Robotics-as-a-Service solution that helps industry-leading food companies increase production volume and meet demand. Headquartered in San Francisco, CA, Chef aims to empower humans to do what humans do best by accelerating the advent of intelligent machines. Visit https://chefrobotics.ai to learn more.

View original content:https://www.prnewswire.com/news-releases/chef-robotics-physical-ai-models-can-now-automate-baked-goods-packing-302756923.html

SOURCE Chef Robotics

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Chef Robotics Physical AI Models Can Now Automate Baked Goods Packing

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SAN FRANCISCO, April 29, 2026 /PRNewswire/ — Chef Robotics, a leader in physical AI for the food industry, today announced that Chef robots can now automate tray assembly for baked goods packing. The application places baked products, such as burger buns, chocolate chip cookies, biscotti, butter cookies, biscuits, fortune cookies, granola bars, rusks, and shortbreads into trays and packaging containers before sealing.

Watch Chef robots in action.

Baked goods packing has historically been difficult to automate for high-mix production. Each item behaves differently on the production line—a granola bar compresses under the wrong grip, while a biscotti or rusk can crack if placed at the wrong angle. Surface textures range from glazed and smooth to crumbly and irregular, and strict presentation requirements leave little room for error. This variability has made it challenging for automation systems to reliably handle baked goods at production speeds, leaving food manufacturers dependent on manual labor and traditional bakery equipment.

To address this, Chef built its baked goods packing application on its existing piece-picking capability, which uses Chef’s AI-powered computer vision and physical AI models trained across diverse real-world production environments. This allows Chef robots to assess each item’s position, shape, and orientation in real time and determine how to pick the items from the pan and place them quickly and precisely without damaging them.

The baked goods packing application supports four distinct placement capabilities.

First, Chef’s vision system detects the angle at which each item sits in the pan and reorients it after picking, placing it on the tray at the exact angle required, regardless of its original position, enabling retail-ready presentation for SKUs that require precise angular placement.

Second, Chef robots can place multiple baked goods into the same packaging container in a single automated pass, completing full tray assembly without manual intervention.

Third, for packaging containers with multiple small compartments, Chef robots can precisely place items into each designated section, including multiple items in the same compartment, using Chef’s AI vision model to detect compartment positions and orientations in real time.

Fourth, Chef’s vision system identifies the exact center of each tray and places every item at a predefined offset from that center, ensuring a uniform, consistent arrangement across every pack regardless of how trays arrive on the conveyor.

For food manufacturers evaluating bakery systems and baked goods packaging automation, the application offers higher throughput, reduced labor dependency, and consistent presentation across shifts. The capability runs on Chef’s existing robotic hardware and software, allowing manufacturers to deploy it without requiring any changes to their production lines.

Chef’s baked goods packing application is available in the U.S., Canada, Germany, and the UK and is included as part of Chef’s robotics-as-a-service (RaaS) pricing model.

About Chef Robotics
Chef is the first company to have commercialized a scalable AI-driven food robotics solution. With over 104 million servings made in production, Chef leverages ChefOS, an AI platform for food manipulation, to offer a Robotics-as-a-Service solution that helps industry-leading food companies increase production volume and meet demand. Headquartered in San Francisco, CA, Chef aims to empower humans to do what humans do best by accelerating the advent of intelligent machines. Visit https://chefrobotics.ai to learn more.

View original content:https://www.prnewswire.com/news-releases/chef-robotics-physical-ai-models-can-now-automate-baked-goods-packing-302756923.html

SOURCE Chef Robotics

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Air Products to Expand Industrial Gas Supply for Samsung Electronics’ Next-Generation Semiconductor Fab in South Korea

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New investment underscores the company’s long-term commitment to Korea and its leading role in the global semiconductor industry 

LEHIGH VALLEY, Pa., April 29, 2026 /PRNewswire/ — Air Products (NYSE:APD), a world-leading industrial gases company and serving Samsung globally, today announced it has been selected by Samsung to supply industrial gases for its new advanced semiconductor fab in Pyeongtaek, Gyeonggi Province, South Korea.

Under the agreement, Air Products will build, own and operate multiple state-of-the-art production facilities and a bulk specialty gas supply system to supply nitrogen, oxygen, argon, and hydrogen for Samsung’s new semiconductor fab. The new facilities are expected to come onstream in multiple phases from 2028 through 2030.

Air Products has a long track record of executing multiple phase expansions in Pyeongtaek to support Samsung’s growing manufacturing needs. This latest project represents Air Products’ largest investment to date in the semiconductor industry and will establish Pyeongtaek as the company’s single largest operations site globally supporting the electronics industry. 

“Air Products is honored to be selected once again by Samsung and to have their continued confidence as a trusted partner supporting their strategic growth plans,” said SR Kim, President, Air Products Korea. “This significant investment reinforces Air Products’ role as a leading global supplier to the semiconductor industry and underscores our long-standing commitment to supporting our strategic customers with safety, reliability, efficiency and excellent service.”

Air Products has served the global electronics industry for more than 40 years, supplying industrial gases safely and reliably to many of the world’s leading technology companies. The company has operated in Korea for more than 50 years and has established a strong position in electronics and manufacturing sectors.

About Air Products

Air Products (NYSE: APD) is a world-leading industrial gases company in operation for over 85 years focused on serving energy, environmental, and emerging markets and generating a cleaner future. The Company supplies essential industrial gases, related equipment and applications expertise to customers in dozens of industries, including refining, chemicals, metals, electronics, manufacturing, medical and food. As the leading global supplier of hydrogen, Air Products also develops, engineers, builds, owns and operates some of the world’s largest clean hydrogen projects, supporting the transition to low- and zero-carbon energy in the industrial and heavy-duty transportation sectors. Through its sale of equipment businesses, the Company also provides turbomachinery, membrane systems and cryogenic containers globally.

Air Products had fiscal 2025 sales of $12 billion from operations in approximately 50 countries. For more information, visit airproducts.com or follow us on LinkedInXFacebook or Instagram.

This release contains “forward-looking statements” within the safe harbor provisions of the Private Securities Litigation Reform Act of 1995. These forward-looking statements are based on management’s expectations and assumptions as of the date of this release and are not guarantees of future performance. While forward-looking statements are made in good faith and based on assumptions, expectations and projections that management believes are reasonable based on currently available information, actual performance and financial results may differ materially from projections and estimates expressed in the forward-looking statements because of many factors, including the risk factors described in our Annual Report on Form 10-K for the fiscal year ended September 30, 2025 and other factors disclosed in our filings with the Securities and Exchange Commission. Except as required by law, we disclaim any obligation or undertaking to update or revise any forward-looking statements contained herein to reflect any change in the assumptions, beliefs or expectations or any change in events, conditions or circumstances upon which any such forward-looking statements are based.

View original content to download multimedia:https://www.prnewswire.com/news-releases/air-products-to-expand-industrial-gas-supply-for-samsung-electronics-next-generation-semiconductor-fab-in-south-korea-302757497.html

SOURCE Air Products

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