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EarFun’s New Premium Flagship Adaptive ANC Wireless Earbuds with Uncompromising Lossless Audio Featuring Auracast™

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SANTA MONICA, Calif., Aug. 5, 2024 /PRNewswire/ — The Air Pro 4 will be EarFun’s next-gen flagship from their highly esteemed Air Pro series. Featuring a deep slate of upgrades and fresh tech, the sound and noise cancelation experience is expected to be an unparalleled value. In step with the successful model lineup, EarFun’s Air Pro 4 intends to deliver the very best in sound, connectivity, ergonomics, and customization for under $100.

A very first for the price segment, EarFun integrates the all-new Auracast™ wireless technology to allow listeners to tune in and out of local broadcasts and to connect and share audio between personal devices. Whereas wireless earbuds are usually confined to an individual experience, the Air Pro 4 becomes a shared experience, allowing others nearby to share music or streams. As far as wireless features go, Auracast™ is just the beginning. LE Audio and LC3 codec are featured to bring efficiency and greater versatility when using the Air Pro 4. With the implementation of the battery-saving LE Bluetooth Audio, EarFun’s latest TWS earbud flagship brings the latest Bluetooth 5.4 standard for the fastest and most secure wireless connection. Not only are connection times instantaneous, but the utilization of the superior LC3 codec, over the widely used SBC, allows the Air Pro 4’s dynamic drivers to take advantage of higher resolution formats thanks to greater preservation of file integrity.

Powered by the combination of the cutting-edge Snapdragon Sound™ chip and the latest Qualcomm QCC 3091 chip, you can enjoy certified Hi-Res audio to hear music at the highest bitrate. In addition, the Air Pro 4 is both LDAC and aptX™ certified, offering complete compatibility with a variety of source devices and playback up to 990 kbps and 24-bits. No matter the wireless protocol or codec, the Air Pro 4 has you completely covered.

On the go, the Air Pro 4 is a true wireless audio companion. With 6 microphones and an AI-assisted noise reduction algorithm, the Air Pro 4 can help you immerse yourself in the music by shrinking environmental noise for a total escape. The adaptive hybrid system achieves unprecedented depth in noise cancellation, canceling up to a staggering 50dB of noise across a wide range of frequencies, effectively blocking up to 99.6% of unwanted environmental noise. Coupled with EarFun’s proprietary QuietSmart™ 3.0 technology and AI adaptive algorithms, it automatically detects varying environmental noise levels and adjusts the noise cancellation intensity accordingly, delivering the most comfortable listening experience. When calls come in, cVc™ 8.0 technology ensures clear conversations anywhere.

Sound quality is central to EarFun’s philosophy and as evidence, the Air Pro 4 comes with dual 10mm Composite Dynamic Drivers that produce riveting bass and crystal clear highs that bring out the best aspects of every genre. When gaming or streaming, the Ultra Low Latency Mode keeps voices and visuals in sync under a seamless <50ms. Toggle this mode and do much more using the dedicated EarFun Audio App for full control and options for user customization. Here you can also manage the Multi-Device connections.

The stunning earbuds’ robust IPX5 certification protects them from a day at the gym and trail runs in the rain. No matter the occasion the Air Pro 4 offers ample playback to get you through the day. With ANC off, you can listen for up to 11 hours straight on a single charge and up to a total of 52 hours with the USB-C charging case. When using active noise cancellation, expect up to 7.5 hours on a single charge and up to 35 total hours, respectively.  And when short on time the Air Pro 4 can be Quick Charged for 10 minutes to provide 2 hours of playback.

Key Features of Air Pro 4

Supports aptX™ Lossless and LDAC for high-quality audio streaming.Compatible with Bluetooth LE Audio and Auracast™ for advanced connectivity.Upgraded Audio SoC Qualcomm® QCC3091Meets high-resolution audio wireless standards.Compatible with Snapdragon Sound™ for superior audio experience.Features QuietSmart™ 3.0 with adaptive noise reduction technology.Increased ANC noise reduction level 50dBEnhanced voice call performance with cVc™ 8.0 and AI technology.Bluetooth version upgrade Bluetooth 5.4Extended playback time (with ANC off and charging case, 52 hoursIncludes wearing detection function.Supports Google Fast Pair for quick and easy pairing.

Pricing and Availability

EarFun Air Pro 4 will be priced at $89.99 and is available now on Myearfun.com and Amazon.com.

For more information on EarFun Air Pro 4 and the rest of the EarFun wireless audio collection, visit www.myearfun.com.

About EarFun

EarFun, an audio brand established in California in 2018, is run by an experienced group of industrial designers, acoustic engineers and music enthusiasts who shared the goal of creating next-generation wireless audio devices. The EarFun team is driven by a passion for music and a commitment to delivering solutions that use the latest technology to improve sound for wireless audio products. EarFun has become one of the most acclaimed wireless audio brands worldwide within just 3 years.

Media Contact: Helen Shaw, marketing@myearfun.com

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SOURCE EarFun, Inc

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Chef Robotics Physical AI Models Can Now Automate Baked Goods Packing

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SAN FRANCISCO, April 29, 2026 /PRNewswire/ — Chef Robotics, a leader in physical AI for the food industry, today announced that Chef robots can now automate tray assembly for baked goods packing. The application places baked products, such as burger buns, chocolate chip cookies, biscotti, butter cookies, biscuits, fortune cookies, granola bars, rusks, and shortbreads into trays and packaging containers before sealing.

Watch Chef robots in action.

Baked goods packing has historically been difficult to automate for high-mix production. Each item behaves differently on the production line—a granola bar compresses under the wrong grip, while a biscotti or rusk can crack if placed at the wrong angle. Surface textures range from glazed and smooth to crumbly and irregular, and strict presentation requirements leave little room for error. This variability has made it challenging for automation systems to reliably handle baked goods at production speeds, leaving food manufacturers dependent on manual labor and traditional bakery equipment.

To address this, Chef built its baked goods packing application on its existing piece-picking capability, which uses Chef’s AI-powered computer vision and physical AI models trained across diverse real-world production environments. This allows Chef robots to assess each item’s position, shape, and orientation in real time and determine how to pick the items from the pan and place them quickly and precisely without damaging them.

The baked goods packing application supports four distinct placement capabilities.

First, Chef’s vision system detects the angle at which each item sits in the pan and reorients it after picking, placing it on the tray at the exact angle required, regardless of its original position, enabling retail-ready presentation for SKUs that require precise angular placement.

Second, Chef robots can place multiple baked goods into the same packaging container in a single automated pass, completing full tray assembly without manual intervention.

Third, for packaging containers with multiple small compartments, Chef robots can precisely place items into each designated section, including multiple items in the same compartment, using Chef’s AI vision model to detect compartment positions and orientations in real time.

Fourth, Chef’s vision system identifies the exact center of each tray and places every item at a predefined offset from that center, ensuring a uniform, consistent arrangement across every pack regardless of how trays arrive on the conveyor.

For food manufacturers evaluating bakery systems and baked goods packaging automation, the application offers higher throughput, reduced labor dependency, and consistent presentation across shifts. The capability runs on Chef’s existing robotic hardware and software, allowing manufacturers to deploy it without requiring any changes to their production lines.

Chef’s baked goods packing application is available in the U.S., Canada, Germany, and the UK and is included as part of Chef’s robotics-as-a-service (RaaS) pricing model.

About Chef Robotics
Chef is the first company to have commercialized a scalable AI-driven food robotics solution. With over 104 million servings made in production, Chef leverages ChefOS, an AI platform for food manipulation, to offer a Robotics-as-a-Service solution that helps industry-leading food companies increase production volume and meet demand. Headquartered in San Francisco, CA, Chef aims to empower humans to do what humans do best by accelerating the advent of intelligent machines. Visit https://chefrobotics.ai to learn more.

View original content:https://www.prnewswire.com/news-releases/chef-robotics-physical-ai-models-can-now-automate-baked-goods-packing-302756923.html

SOURCE Chef Robotics

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Chef Robotics Physical AI Models Can Now Automate Baked Goods Packing

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SAN FRANCISCO, April 29, 2026 /PRNewswire/ — Chef Robotics, a leader in physical AI for the food industry, today announced that Chef robots can now automate tray assembly for baked goods packing. The application places baked products, such as burger buns, chocolate chip cookies, biscotti, butter cookies, biscuits, fortune cookies, granola bars, rusks, and shortbreads into trays and packaging containers before sealing.

Watch Chef robots in action.

Baked goods packing has historically been difficult to automate for high-mix production. Each item behaves differently on the production line—a granola bar compresses under the wrong grip, while a biscotti or rusk can crack if placed at the wrong angle. Surface textures range from glazed and smooth to crumbly and irregular, and strict presentation requirements leave little room for error. This variability has made it challenging for automation systems to reliably handle baked goods at production speeds, leaving food manufacturers dependent on manual labor and traditional bakery equipment.

To address this, Chef built its baked goods packing application on its existing piece-picking capability, which uses Chef’s AI-powered computer vision and physical AI models trained across diverse real-world production environments. This allows Chef robots to assess each item’s position, shape, and orientation in real time and determine how to pick the items from the pan and place them quickly and precisely without damaging them.

The baked goods packing application supports four distinct placement capabilities.

First, Chef’s vision system detects the angle at which each item sits in the pan and reorients it after picking, placing it on the tray at the exact angle required, regardless of its original position, enabling retail-ready presentation for SKUs that require precise angular placement.

Second, Chef robots can place multiple baked goods into the same packaging container in a single automated pass, completing full tray assembly without manual intervention.

Third, for packaging containers with multiple small compartments, Chef robots can precisely place items into each designated section, including multiple items in the same compartment, using Chef’s AI vision model to detect compartment positions and orientations in real time.

Fourth, Chef’s vision system identifies the exact center of each tray and places every item at a predefined offset from that center, ensuring a uniform, consistent arrangement across every pack regardless of how trays arrive on the conveyor.

For food manufacturers evaluating bakery systems and baked goods packaging automation, the application offers higher throughput, reduced labor dependency, and consistent presentation across shifts. The capability runs on Chef’s existing robotic hardware and software, allowing manufacturers to deploy it without requiring any changes to their production lines.

Chef’s baked goods packing application is available in the U.S., Canada, Germany, and the UK and is included as part of Chef’s robotics-as-a-service (RaaS) pricing model.

About Chef Robotics
Chef is the first company to have commercialized a scalable AI-driven food robotics solution. With over 104 million servings made in production, Chef leverages ChefOS, an AI platform for food manipulation, to offer a Robotics-as-a-Service solution that helps industry-leading food companies increase production volume and meet demand. Headquartered in San Francisco, CA, Chef aims to empower humans to do what humans do best by accelerating the advent of intelligent machines. Visit https://chefrobotics.ai to learn more.

View original content:https://www.prnewswire.com/news-releases/chef-robotics-physical-ai-models-can-now-automate-baked-goods-packing-302756923.html

SOURCE Chef Robotics

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Air Products to Expand Industrial Gas Supply for Samsung Electronics’ Next-Generation Semiconductor Fab in South Korea

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New investment underscores the company’s long-term commitment to Korea and its leading role in the global semiconductor industry 

LEHIGH VALLEY, Pa., April 29, 2026 /PRNewswire/ — Air Products (NYSE:APD), a world-leading industrial gases company and serving Samsung globally, today announced it has been selected by Samsung to supply industrial gases for its new advanced semiconductor fab in Pyeongtaek, Gyeonggi Province, South Korea.

Under the agreement, Air Products will build, own and operate multiple state-of-the-art production facilities and a bulk specialty gas supply system to supply nitrogen, oxygen, argon, and hydrogen for Samsung’s new semiconductor fab. The new facilities are expected to come onstream in multiple phases from 2028 through 2030.

Air Products has a long track record of executing multiple phase expansions in Pyeongtaek to support Samsung’s growing manufacturing needs. This latest project represents Air Products’ largest investment to date in the semiconductor industry and will establish Pyeongtaek as the company’s single largest operations site globally supporting the electronics industry. 

“Air Products is honored to be selected once again by Samsung and to have their continued confidence as a trusted partner supporting their strategic growth plans,” said SR Kim, President, Air Products Korea. “This significant investment reinforces Air Products’ role as a leading global supplier to the semiconductor industry and underscores our long-standing commitment to supporting our strategic customers with safety, reliability, efficiency and excellent service.”

Air Products has served the global electronics industry for more than 40 years, supplying industrial gases safely and reliably to many of the world’s leading technology companies. The company has operated in Korea for more than 50 years and has established a strong position in electronics and manufacturing sectors.

About Air Products

Air Products (NYSE: APD) is a world-leading industrial gases company in operation for over 85 years focused on serving energy, environmental, and emerging markets and generating a cleaner future. The Company supplies essential industrial gases, related equipment and applications expertise to customers in dozens of industries, including refining, chemicals, metals, electronics, manufacturing, medical and food. As the leading global supplier of hydrogen, Air Products also develops, engineers, builds, owns and operates some of the world’s largest clean hydrogen projects, supporting the transition to low- and zero-carbon energy in the industrial and heavy-duty transportation sectors. Through its sale of equipment businesses, the Company also provides turbomachinery, membrane systems and cryogenic containers globally.

Air Products had fiscal 2025 sales of $12 billion from operations in approximately 50 countries. For more information, visit airproducts.com or follow us on LinkedInXFacebook or Instagram.

This release contains “forward-looking statements” within the safe harbor provisions of the Private Securities Litigation Reform Act of 1995. These forward-looking statements are based on management’s expectations and assumptions as of the date of this release and are not guarantees of future performance. While forward-looking statements are made in good faith and based on assumptions, expectations and projections that management believes are reasonable based on currently available information, actual performance and financial results may differ materially from projections and estimates expressed in the forward-looking statements because of many factors, including the risk factors described in our Annual Report on Form 10-K for the fiscal year ended September 30, 2025 and other factors disclosed in our filings with the Securities and Exchange Commission. Except as required by law, we disclaim any obligation or undertaking to update or revise any forward-looking statements contained herein to reflect any change in the assumptions, beliefs or expectations or any change in events, conditions or circumstances upon which any such forward-looking statements are based.

View original content to download multimedia:https://www.prnewswire.com/news-releases/air-products-to-expand-industrial-gas-supply-for-samsung-electronics-next-generation-semiconductor-fab-in-south-korea-302757497.html

SOURCE Air Products

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