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Advanced Packaging Market to Reach $119.4 Billion, Globally, by 2032 at 10.6% CAGR: Allied Market Research

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The global advanced packaging market has experienced growth due to several factors such as an increase in demand for miniaturization and expansion of the consumer electronics sector. 

Wilmington, Del., Aug. 7, 2024 /PRNewswire/ — Allied Market Research published a report, titled, “Advanced Packaging Market by Type (Flip chip CSP, Flip-chip ball grid array, Wafer level CSP, 2.5D/3D, Fan-out WLP and Others), End user (Consumer electronics, Automotive, Industrial, Healthcare, Aerospace & defense and Others), By (): Global Opportunity Analysis and Industry Forecast, 2024-2032″. According to the report, the advanced packaging market was valued at $48.5 billion in 2023, and is estimated to reach $119.4 billion by 2032, growing at a CAGR of 10.6% from 2024 to 2032.

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(We are providing report as per your research requirement, including the Latest Industry Insight’s Evolution, Potential and COVID-19 Impact Analysis)

130 – Tables58 – Charts250 – Pages

Prime Determinants of Growth 

The notable factors positively affecting the advanced packaging market include increasing demand for miniaturization of devices and improved system performance and optimization of advanced packaging. However, problems regarding the high cost of advanced packaging technology hamper market growth. Moreover, emerging trends toward fan-out wafer level packaging are expected to offer huge opportunities for the advanced packaging market. 

Report Coverage & Details: 

Report Coverage 

Details 

Forecast Period 

2024–2032 

Base Year 

2023

Market Size in 2023 

$48.5 billion 

Market Size in 2032 

$119.4 billion 

CAGR 

10.6 %

No. of Pages in Report 

250

Segments Covered 

Type, End User, and Region. 

Drivers 

Increasing demand for miniaturizationGrowth in consumer electronics The expansion of IoT applications across various sectors, including industrial, healthcare, and smart homes 

Opportunities 

The growing adoption of electronic components in automotive applications Growth in Data Centers and Cloud Computing 

Restraint 

High costs associated with advanced packaging 

Segment Highlights

The demand for CSP flip chip ball grid array segment in advanced packaging market is driven by its superior performance characteristics, essential for high-performance and compact electronic devices. FCBGA technology offers excellent electrical and thermal performance, allowing for higher interconnection density, improved signal integrity, and efficient heat dissipation. These features are critical for applications in high-performance computing, mobile devices, and consumer electronics. The increasing demand for miniaturization, enhanced processing power, and energy efficiency in these devices fuel the growth of CSP FCBGA packaging solutions, meeting the evolving requirements of advanced semiconductor applications. 

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The demand for the consumer electronics segment in the advanced packaging market is on the rise due to the increasing need for compact, high-performance devices such as smartphones, tablets, wearables, and gaming consoles. Advanced packaging technologies like Fan-Out Wafer-Level Packaging (FOWLP) and Through-Silicon Via (TSV) enable miniaturization, improved power efficiency, and enhanced functionality, which are essential for modern consumer electronics. The rapid adoption of technologies such as 5G, IoT, and AI in these devices further drives the need for sophisticated packaging solutions that support higher processing speeds, better heat dissipation, and greater interconnection density, thus fueling market growth.

Regional Outlook 

In Asia-pacific, China attained the highest market share in the advanced packaging market due to strong semiconductor manufacturing infrastructure, substantial investments in research and development, and a strong focus on technological innovation. China is home to major semiconductor foundries and packaging companies that drive advancements in packaging technologies. In addition, the high demand for consumer electronics, automotive electronics, and telecommunication devices in the domestic market fuels the need for advanced packaging solutions. Government support through favorable policies and initiatives to boost the semiconductor industry further propels China’s leadership position in the advanced packaging market. 

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Key Players: – 

Amkor TechnologyIntel CorporationQualcomm Technologies Inc.Taiwan Semiconductor Manufacturing CompanyIBMMicrochip TechnologyRenesas Electronics CorporationTexas InstrumentsAnalog Devices

The report provides a detailed analysis of these key players in the global advanced packaging market. These players have adopted different strategies such as new product launches, collaborations, expansion, joint ventures, agreements, and others to increase their market share and maintain dominant shares in different regions. The report is valuable in highlighting business performance, operating segments, product portfolio, and strategic moves of market players to showcase the competitive scenario.

Recent Development: 

In October 2023, Advanced Semiconductor Engineering Inc. (ASE) announced the launch of its Integrated Design Ecosystem (IDE), a collaborative design toolset optimized to enhance advanced package architecture across its VIPack platform. This innovative approach facilitates a seamless transition from single-die SoC to multi-die disaggregated IP blocks, including chiplets and memory, for integration using 2.5D or advanced fanout structures. The IDE is designed to systematically boost the efficiency and effectiveness of advanced packaging, supporting the evolving demands of semiconductor technology. 

Key Benefits For Stakeholders:

This report provides a quantitative analysis of the market segments, current trends, estimations, and dynamics of the advanced packaging market analysis from 2024 to 2032 to identify the prevailing advanced packaging market opportunities.The market research is offered along with information related to key drivers, restraints, and opportunities.Porter’s five forces analysis highlights the potency of buyers and suppliers to enable stakeholders make profit-oriented business decisions and strengthen their supplier-buyer network.In-depth analysis of the advanced packaging market segmentation assists to determine the prevailing market opportunities.Major countries in each region are mapped according to their revenue contribution to the global market.Market player positioning facilitates benchmarking and provides a clear understanding of the present position of the market players.The report includes the analysis of the regional as well as global advanced packaging market trends, Advanced Packaging Company List,  Advanced Packaging Market Share by Companies,   Advanced Packaging Industry Report,  Advanced Packaging Sector Analysis,  Semiconductor Advanced Packaging,  Advanced Packaging Technology key players, market segments, application areas, and market growth strategies.

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Advanced Packaging Market Key Segments:

By Type

Flip chip CSPFlip-chip ball grid arrayWafer level CSP2.5D/3DFan-out WLPOthers

By End User

Consumer electronicsAutomotiveIndustrialHealthcareAerospace & defenseOthers

By Region:

North America (U.S., Canada, and Mexico)Europe (UK, Germany, France, Russia, and Rest of Europe)Asia-Pacific (China, Japan, India, Australia, South Korea, and Rest of Asia-Pacific)Latin America (Brazil, Argentina, and Rest of Latin America)Middle East and Africa (UAE, Saudi Arabia, and Rest of Middle East and Africa)

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Trending Reports in Semiconductor and Electronics Industry:

Semiconductor Packaging Market size is expected to reach $60.44 billion by 2030 from $27.10 billion in 2020, growing at a CAGR of 9.10% from 2021 to 2030

Consumer Electronics Packaging Market was valued at $22.1 billion in 2022, and is projected to reach $49.1 billion by 2032, growing at a CAGR of 8.4% from 2023 to 2032

Quad-Flat-No-Lead Packaging Market size was valued at $453.1 million in 2021, and is projected to reach $1.1 billion by 2031, growing at a CAGR of 8.8% from 2022 to 2031

Embedded Die Packaging Technology Market was valued at $69.2 million in 2021, and is projected to reach $370.7 million by 2031, growing at a CAGR of 18.3% from 2022 to 2031

Wafer Level Packaging Market size was valued at $4.5 billion in 2020, and is projected to reach $23.6 billion by 2030, growing at a CAGR of 18.8% from 2021 to 2030.

About Us:

Allied Market Research (AMR) is a full-service market research and business-consulting wing of Allied Analytics LLP based in Wilmington, Delaware. Allied Market Research provides global enterprises as well as medium and small businesses with unmatched quality of “Market Research Reports Insights” and “Business Intelligence Solutions.” AMR has a targeted view to provide business insights and consulting to assist its clients to make strategic business decisions and achieve sustainable growth in their respective market domain.

We are in professional corporate relations with various companies, and this helps us in digging out market data that helps us generate accurate research data tables and confirms utmost accuracy in our market forecasting. Allied Market Research CEO Pawan Kumar is instrumental in inspiring and encouraging everyone associated with the company to maintain high quality of data and help clients in every way possible to achieve success. Each and every data presented in the reports published by us is extracted through primary interviews with top officials from leading companies of domain concerned. Our secondary data procurement methodology includes deep online and offline research and discussion with knowledgeable professionals and analysts in the industry.

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/C O R R E C T I O N — Applied Intuition, Inc./

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In the news release, Applied Intuition Collaborates with Heidelberg Materials to Advance Innovation in Quarry Operations with Autonomous Haulage Fleets, issued 30-Apr-2026 by Applied Intuition, Inc. over PR Newswire, we are advised by the company that changes have been made. The complete, corrected release follows, with additional details at the end:

Applied Intuition Collaborates with Heidelberg Materials to Advance Innovation in Quarry Operations with Autonomous Haulage Fleets

Deployment brings intelligent, vehicle-based autonomy to Australia, establishing a new operating model for construction and mining environments.

SUNNYVALE, Calif., April 30, 2026 /CNW/ — Applied Intuition, Inc., a leader in physical AI, today announced its collaboration with Heidelberg Materials, one of the world’s largest integrated manufacturers of building materials and solutions, to deploy autonomous haulage systems for Heidelberg Materials’ quarry operations, starting at a site in Australia.

Applied Intuition will provide its Self-Driving System (SDS) for Construction to support autonomous haulage operations within Heidelberg Materials’ fleet of construction and mining vehicles in Australia. The deployment marks the next real-world application of Applied Intuition’s autonomy platform in industrial environments. Upon successful completion, it will support the expansion of autonomous operations within Heidelberg Materials’ broader Australian network.

The collaboration also challenges the standard industry model. While autonomy solutions traditionally target the largest quarry sites, this system is designed for smaller operations, including those running just two 40-ton trucks, making it deployable across quarry sites of varying size worldwide.

“No two quarry or construction sites operate the same way, with different layouts, constraints and economics,” said Qasar Younis, co-founder and CEO of Applied Intuition. “We’ve built our platform to adapt to that reality. This partnership shows we can take the same core system used in large mining operations and apply it to smaller, infrastructure-constrained quarry sites, scaling it across hundreds of unique locations.”

For Heidelberg Materials, the partnership is aimed at enhancing safety and operational performance. It also reflects the need for an autonomy solution that can operate at large sites and smaller ones too, whereas traditional autonomous haulage systems are often too infrastructure-heavy or costly to scale. For Applied Intuition, it serves as a proof point that its autonomy platform is designed not just for one-off deployments, but for global scale across construction, quarry and mining environments of any size.

Applied Intuition’s system runs directly on the vehicle, with integrated perception, decision-making and safety systems onboard, enabling reliable operation without constant connectivity or heavy site infrastructure.

The collaboration builds on Applied Intuition’s growing presence in construction and mining autonomy and reinforces its broader physical AI strategy. The same core platform has already been deployed in other industries, including trucking and defense, with learnings from each domain contributing to continuous system improvements. Applied Intuition’s SDS platform strategy also enables the company to bring technologies proven in other domains into construction and mining, helping accelerate development and deployment.

Through this project, Applied Intuition demonstrates the range of its autonomy platform, from some of the largest mining trucks in the world to smaller quarry vehicles operating in constrained, lower-infrastructure environments. Together, these deployments highlight the company’s approach to building scalable autonomy for construction and mining from the ground up.

To learn more about how Applied Intuition is building the future of construction autonomy, visit applied.co.

About Applied Intuition
Applied Intuition, Inc. is powering the future of physical AI. Founded in 2017 and now valued at $15 billion, the Silicon Valley company is creating the digital infrastructure needed to bring intelligence to every moving machine on the planet. Applied Intuition services the automotive, defense, trucking, construction, mining and agriculture industries in three core areas: tools and infrastructure, operating systems and autonomy. Eighteen of the top 20 global automakers, as well as the United States military and its allies, trust the company’s solutions to deliver physical intelligence. Applied Intuition is headquartered in Sunnyvale, California, with offices in Washington, D.C.; San Diego; Ft. Walton Beach, Florida; Ann Arbor, Michigan; London; Stuttgart; Munich; Stockholm; Gothenburg, Sweden; Bangalore; Seoul; and Tokyo. Learn more at applied.co.

Correction: An earlier version of this release incorrectly stated the location of the site noted in the first paragraph.

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SOURCE Applied Intuition, Inc.

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MOREH Demonstrates Production-Ready LLM Inference on Tenstorrent Galaxy, Achieving DGX A100-Class Performance with Improved Cost Efficiency

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Reduces HBM Costs with GPU–Tenstorrent Heterogeneous Distributed Serving
First unveiled at Tenstorrent’s launch event, TT-Deploy, in San Francisco on May 1

SANTA CLARA, Calif., May 1, 2026 /PRNewswire/ — Moreh, an AI infrastructure software company, led by CEO Gangwon Jo, announced that it has successfully validated LLM inference performance on the Tenstorrent Galaxy Wormhole system using its proprietary ‘MoAI Inference Framework.’

Based on tests across leading Mixture-of-Experts (MoE) models—including GPT-OSS, Qwen, GLM, and DeepSeek—Moreh achieved LLM inference performance on Tenstorrent Galaxy Wormhole matching or surpassing NVIDIA DGX A100-class systems, demonstrating a compelling alternative to conventional GPU-centric AI infrastructure.

Moreh also improved cost efficiency by implementing a disaggregated serving architecture that combines GPUs with Tenstorrent Wormhole chips. By utilizing Tenstorrent processors as dedicated prefill accelerators, the company reduced reliance on high-cost HBM and lowered overall infrastructure costs.

The results were first unveiled at Tenstorrent’s launch event, TT-Deploy, held on May 1 in San Francisco.

As a strategic partner of Tenstorrent and a major external contributor to Metalium, Moreh showcased a live LLM inference demo at the event. Building on its experience operating AMD GPU-based production environments in real-world data centers, the company presented its latest technical achievements in ‘Production-Ready LLM Inference on Tenstorrent Galaxy.’

MoAI Inference Framework is a disaggregated inference solution that enables unified operation of heterogeneous GPUs and NPUs—including NVIDIA, AMD, and Tenstorrent—within a single cluster. This allows enterprises to build flexible AI infrastructure strategies without vendor lock-in.

Moreh CEO Gangwon Jo stated, “Achieving production-grade LLM inference performance and stability on Tenstorrent-based systems marks a significant milestone,” and added, “We will continue to enhance performance through deeper optimization across heterogeneous architectures and closer integration with Tenstorrent NPUs.”

Moreh is developing its own core AI infrastructure engine and, through its foundation LLM subsidiary Motif Technologies, is building end-to-end capabilities spanning both infrastructure and model domains. Simultaneously, the company is making its mark in the global market through collaborations with key partners such as AMD, Tenstorrent, and SGLang.

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SOURCE Moreh

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US Startup PerZeption Inc. Announces Collaboration with Alcon Research

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BOSTON, MA, May. 1, 2026 /PRNewswire/ — Advancements in vision correction evaluation require methods that offer both precision and efficiency in detecting clinically meaningful visual differences. Addressing this need, PerZeption is set to present new data validating its AIM+ CSF modeling technology at the Association of Research in Vision and Ophthalmology (ARVO) annual meeting.

Attendees are invited to learn more about this innovative approach during the poster session on May 4, 2026, from 11:15 AM to 1:00 PM, at posterboard #0941.

“We are very excited to collaborate with Alcon, one of the largest companies within the Ophthalmology sector worldwide. “, Dr. Jan Skerswetat said. “The results, presented by Dr Derek Nankivil, indicate that our technology enables rapid, repeatable, and highly sensitive assessment of contrast vision.”

The abstract, titled ‘AIM+ CSF modeling enables efficient detection of clinically meaningful visual differences,’ outlines how PerZeption’s technology supports sensitive, low-burden visual assessment for vision correction evaluation. Data indicates that with approximately six adaptive displays of stimuli and two repeats, studies show around 20 subjects can achieve 90% power to detect a 1 JND (Just Noticeable Difference) change in AULCSF (Area Under the Log Contrast Sensitivity Function). This research also demonstrates AIM+ CSF’s stable repeatability in less than 3 minutes, absence of bias, and robust performance, validating its role as an effective tool for objective visual performance evaluation.

This joint effort highlights a shared dedication to advancing ophthalmology research and developing precise tools for visual assessment. The ARVO annual meeting serves as the world’s foremost event for ophthalmology research, offering a vital platform for sharing scientific breakthroughs and fostering dialogue within the global vision science community.

“In addition to all the exciting research presentations that leverage PerZeption technology at this years’ ARVO meeting, we are also proud to be showcasing PerZeption’s battery of functional tests at our booth, #4027.” Dr. Skerswetat added and noted that there will be opportunities to try out our technology.

This presentation at ARVO represents a significant step in the validation and recognition of PerZeption’s contributions to advanced visual assessment technologies.

About PerZeption Inc
PerZeption delivers vision testing with a rapid, self-administered, and adaptive psychophysical platform delivered via cloud-based software on standard tablets or all-in-one computers. Our flagship platform, Angular Indication Measurement (AIM), enables testing of over 20 visual functions. Our novel approach equips researchers and clinicians with a comprehensive range of visual functions and introduces new tests for which there are no currently available devices. We reduce chairtime. Self-administered tests on a single device in combination with proprietary methods that rapidly assess vision, reduce user’s burden and require minimal training or space, unlike bulky, specialized single-use devices. Finally, cloud-based delivery supports secure in-clinic and remote testing, ensuring consistent, trackable results for clinicians and pharmaceutical companies. 

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SOURCE PerZeption

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