Technology
Texas Instruments signs preliminary agreement to receive up to $1.6 billion in CHIPS and Science Act proposed funding for semiconductor manufacturing in Texas and Utah
Published
2 years agoon
By
NEWS HIGHLIGHTS:
The U.S. Department of Commerce has proposed up to $1.6 billion for TI in direct funding through the CHIPS and Science Act to support three 300mm semiconductor wafer fabs under construction in Texas and Utah.TI expects to receive an estimated $6 billion to $8 billion from the U.S. Department of Treasury’s Investment Tax Credit for qualified U.S. manufacturing investments.The company also expects to receive $10 million in proposed funding for workforce development, as it creates over 2,000 new TI jobs and thousands of indirect jobs for construction, suppliers and supporting industries.
LEHI, Utah, and SHERMAN, Texas, Aug. 16, 2024 /PRNewswire/ — Texas Instruments (TI) (Nasdaq: TXN) and the U.S. Department of Commerce have signed a non-binding Preliminary Memorandum of Terms for up to $1.6 billion in proposed direct funding under the CHIPS and Science Act to support three 300mm wafer fabs already under construction in Texas and Utah. In addition, TI expects to receive an estimated $6 billion to $8 billion from the U.S. Department of Treasury’s Investment Tax Credit for qualified U.S. manufacturing investments. The proposed direct funding, coupled with the investment tax credit, would help TI provide a geopolitically dependable supply of essential analog and embedded processing semiconductors.
“The historic CHIPS Act is enabling more semiconductor manufacturing capacity in the U.S., making the semiconductor ecosystem stronger and more resilient,” said Haviv Ilan, president and CEO of Texas Instruments. “Our investments further strengthen our competitive advantage in manufacturing and technology as we expand our 300mm manufacturing operations in the U.S. With plans to grow our internal manufacturing to more than 95% by 2030, we’re building geopolitically dependable, 300mm capacity at scale to provide the analog and embedded processing chips our customers will need for years to come.”
Building geopolitically dependable capacity for analog and embedded processing chips
Since its founding more than 90 years ago, TI has been advancing technology, pioneering the transition from vacuum tubes to transistors and then to integrated circuits. Today, TI is the largest U.S. analog and embedded processing semiconductor manufacturer. TI chips are essential in nearly every type of electronic device, from cars with advanced safety and intelligence systems to life-saving medical equipment and smart appliances that make homes safer and more efficient.
The proposed direct funding under the CHIPS Act would support TI’s investment of more than $18 billion through 2029, which is part of the company’s broader investment in manufacturing. This proposed direct funding will support three new wafer fabs, two in Sherman, Texas, (SM1 and SM2) and one in Lehi, Utah (LFAB2), specifically to:
Construct and build the SM1 cleanroom and complete pilot line for first production;Construct and build the LFAB2 cleanroom for first production; andConstruct the SM2 shell.
These connected, multi-fab sites benefit from shared infrastructure, talent and technology sharing, and a strong network of suppliers and community partners. They will produce semiconductors in 28nm to 130nm technology nodes, which provide the optimal cost, performance, power, precision and voltage levels required for TI’s broad portfolio of analog and embedded processing products.
“With this proposed investment from the Biden-Harris Administration in TI, a global leader of production for current-generation and mature-node chips, we would help secure the supply chain for these foundational semiconductors that are used in every sector of the U.S. economy, and create tens of thousands of jobs in Texas and Utah,” said U.S. Secretary of Commerce Gina Raimondo. “The CHIPS for America program will supercharge American technology and innovation and make our country more secure – and TI is expected to be an important part of the success of the Biden-Harris Administration’s work to revitalize semiconductor manufacturing and development in the U.S.”
Building a stronger workforce
With a long history of supporting its employees to build long-term, successful careers, TI is also investing in building its future workforce. TI will create more than 2,000 company jobs across its three new fabs in Texas and Utah, along with thousands of indirect jobs for construction, suppliers and supporting industries.
“We are proud to work with Texas Instruments as they build new semiconductor fabs in Sherman and solidify Texas as the best state for semiconductors. Texas Instruments invented the microchip in Texas, and we are honored to be home to TI’s semiconductor manufacturing facilities in Dallas, Richardson and Sherman,” said Texas Gov. Greg Abbott. “With this latest project, TI is building on its more than 90-year legacy in Texas and adding thousands of good-paying jobs for Texans to manufacture critically important technology.”
“By investing in semiconductor manufacturing, we are helping secure this vulnerable supply chain, boosting our national security and global competitiveness, and creating new jobs for Texans,” said U.S. Sen. John Cornyn. “The chipmaking capabilities these resources will enable at Texas Instruments will help the U.S. reclaim its leadership role in the critically important semiconductor industry, and I look forward to seeing more Texas-led advancements in the years to come.”
In order to build a future-ready workforce, TI is enhancing the skills of current employees, expanding internships and creating pipeline programs with a focus on building electronic and mechanical skills. TI has robust engagements with 40 community colleges, high schools and military institutions across the U.S. to develop future semiconductor talent.
“Utah is thrilled that Texas Instruments is expanding its manufacturing presence in the Silicon Slopes, furthering the impact Utahns have on critical semiconductor technology,” said Utah Gov. Spencer Cox. “This investment in semiconductor manufacturing not only creates more jobs, but also brings supply chains back to the United States.”
“This proposed CHIPS funding will further support Texas Instruments’ investment in its new semiconductor fab in Lehi —and enhance Utah’s vital role in our national defense and economic success,” said U.S. Senator Mitt Romney. “I was an original sponsor of the CHIPS and Science Act—which made today’s announcement possible—because in order to compete on the world stage, we must continue to promote innovation, foster scientific talent, and expand research here at home. Texas Instruments’ expanded operations will help make the United States more self-reliant for chips essential to our national security and economy.”
Building sustainable manufacturing
TI has a long-standing commitment to responsible, sustainable manufacturing and environmental stewardship. As part of this commitment, TI continually invests in its fabrication processes and equipment to reduce energy, material and water consumption, and greenhouse gas (GHG) emissions.
The company’s 300mm wafer fabs will be entirely powered by renewable electricity. Additionally, all of TI’s new 300mm fabs are designed to meet LEED Gold standards for structural efficiency and sustainability. TI’s 300mm manufacturing facilities bring advantages in reducing waste and improving water and energy consumption per chip.
TI semiconductors are and will increasingly play a critical role in helping reduce the impact on the environment, helping customers create smaller, more efficient and cost-effective technology solutions that in turn drive continued innovation in electrification and the expanded usage of renewable energy.
Learn more:
TI CHIPS Act press kit (includes images, video b-roll, fact sheet)TI Sherman, TX, press kitTI Lehi, UT, press kit
Notice regarding forward-looking statements
This release includes forward-looking statements intended to qualify for the safe harbor from liability established by the Private Securities Litigation Reform Act of 1995. These forward-looking statements generally can be identified by phrases such as TI or its management “believes,” “expects,” “anticipates,” “foresees,” “forecasts,” “estimates” or other words or phrases of similar import. Similarly, statements herein that describe TI’s business strategy, outlook, objectives, plans, intentions or goals also are forward-looking statements. All such forward-looking statements are subject to certain risks and uncertainties that could cause actual results to differ materially from those in forward-looking statements.
See Item 1A of TI’s most recent Form 10-K for a detailed discussion of risk factors that could cause results to differ materially from the forward-looking statements. The forward-looking statements included in this release are made only as of the date of this release, and we undertake no obligation to update the forward-looking statements to reflect subsequent events or circumstances. If we do update any forward-looking statement, you should not infer that we will make additional updates with respect to that statement or any other forward-looking statement.
About Texas Instruments
Texas Instruments Incorporated (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, and sells analog and embedded processing chips for markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems. At our core, we have a passion to create a better world by making electronics more affordable through semiconductors. This passion is alive today as each generation of innovation builds upon the last to make our technology more reliable, more affordable and lower power, making it possible for semiconductors to go into electronics everywhere. Learn more at TI.com.
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SOURCE Texas Instruments
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Technology
Ceva, Inc. Announces First Quarter 2026 Financial Results
Published
1 hour agoon
May 11, 2026By
Highlights strong licensing growth driven by integrated solutions and accelerating edge AI adoption
ROCKVILLE, Md., May 11, 2026 /PRNewswire/ — Ceva, Inc. (NASDAQ: CEVA), the leading licensor of silicon and software IP for the Smart Edge, today announced its financial results for the first quarter ended March 31, 2026.
First Quarter Highlights: *
Delivered total revenues of $27.0 million, up 11% year-over-yearLicensing and related revenues of $17.8 million, up 18% year-over-year and the highest in three yearsRoyalty revenues of $9.2 million, with smart edge royalties up 8% year-over-year, driven by record shipments in Wi-Fi, and strong contribution from cellular IoT, 5G infrastructure and automotive AISigned 14 IP licensing agreements, including several multi-technology engagements with existing customersSecured a major customer win for Bluetooth High Data Throughput (HDT) solution, including Ceva’s internally developed RF technology, demonstrating its system-level connectivity strategyExpanded customer engagements in 5G NTN and Ultra-Wideband, increasing value per designAI represented more than 20% of licensing and related revenues, with strong growth and key production milestones, including the Renesas R-Car V4H platform entering the 2026 Toyota RAV4, alongside a collaboration with NXP for its latest software-defined vehicle processors
*Unless otherwise stated, all comparisons are to first quarter 2025.
Amir Panush, Chief Executive Officer of Ceva, commented, “We delivered a strong start to 2026, highlighted by our highest licensing and related revenues in three years and continued momentum across our connectivity and AI portfolios. Importantly, this quarter reflects the successful execution of our strategy to expand beyond discrete IP into more integrated, system-level solutions. A major Bluetooth HDT licensing agreement, including RF, alongside our expansion in 5G NTN and Ultra-Wideband, demonstrates how we are increasing our value per design and deepening customer engagement. We also saw encouraging trends in royalties, with continued strength across our smart edge markets, partially offset by softness in smartphones.”
“In AI, our growth strategy and relentless focus on market-leading innovation are translating into production, with our technology integrated into leading automotive platforms and entering mass-volume production. With AI contributing over 20% of licensing and related revenues and a strong pipeline of engagements, we believe we are well positioned as the industry accelerates toward hybrid AI and the expansion of Physical AI at the edge.”
Business and Market Highlights
During the first quarter, Ceva signed 14 IP licensing agreements across connectivity, AI, and satellite communications, including several multi-technology engagements aligned with its strategy to deliver more integrated, system-level solutions.
The company secured a major full-stack Bluetooth HDT solution license, marking a key milestone in expanding value per design and increasing royalty contribution, while helping customers reduce integration complexity and accelerate time-to-market. Additional wins included a Wi-Fi 7 design targeting consumer IoT, a Wi-Fi 6 / Bluetooth combo engagement with a leading edge-AI SoC platform provider, and multiple Bluetooth and Wi-Fi agreements.
Ceva also expanded into new connectivity domains, introducing its PentaG-NTN platform and progressing a satellite customer engagement to a more integrated baseband solution. In Ultra-Wideband, the company launched its next-generation platform and secured a new customer as adoption accelerates across industrial and automotive applications.
In AI, Ceva continued to expand its footprint with multiple licensing agreements and achieved a key production milestone, with its AI DSP and accelerator deployed in the Renesas R-Car V4H platform, now entering production in the 2026 Toyota RAV4. The company also announced a collaboration with NXP for its latest software-defined vehicle processors. AI represented more than 20% of licensing and related revenues in the quarter, reflecting strong growth and increasing contribution.
Across its markets, Ceva continues to see strong demand in IoT and AI-driven applications, with record Wi-Fi shipments and significant growth in cellular IoT. These trends, together with the shift toward more integrated, system-level solutions and increasing adoption of Bluetooth and Wi-Fi combo chips, are driving higher value per device and reinforcing the company’s long-term royalty growth model.
Other first quarter financial data: *
GAAP gross margin was 86%, in line with last yearGAAP operating loss was $5.1 million, as compared to a GAAP operating loss of $4.4 millionGAAP net loss was $4.5 million, as compared to a GAAP net loss of $3.3 millionGAAP diluted loss per share was $0.16, as compared to GAAP diluted loss per share of $0.14Non-GAAP gross margin was 87%, in line with last yearNon-GAAP operating income was $0.5 million, as compared to non-GAAP operating income of $0.3 millionNon-GAAP net income and non-GAAP diluted earnings per share were $1.1 million and $0.04, respectively, compared with non-GAAP net income and non-GAAP diluted earnings per share of $1.4 million and $0.06, respectively
*Unless otherwise stated, all comparisons are to first quarter 2025.
Yaniv Arieli, Chief Financial Officer of Ceva, added, “Our first quarter results reflect strong licensing execution and the continued progression toward higher-value, multi-technology engagements. This shift is driving improved economics per deal and strengthening the long-term royalty potential of our business. We also continue to see encouraging trends across our diversified end markets, particularly in IoT and AI-driven applications. We continue to manage the impact of a weaker U.S. dollar and are implementing measures to partially offset the resulting expenses.”
Ceva Conference Call
On May 11, 2026, Ceva management will conduct a conference call at 8:30 a.m. Eastern Time to discuss the operating performance for the quarter.
The conference call will be available via the following dial in numbers:
U.S. Participants: Dial 1-844-435-0316 (Access Code: Ceva)International Participants: Dial +1-412-317-6365 (Access Code: Ceva)
The conference call will also be available live via webcast at the following link: https://app.webinar.net/N8PRLk4oljM. https://app.webinar.net/ePpLk12BRaDhttps://app.webinar.net/GvAklQElMmjPlease go to the web site at least fifteen minutes prior to the call to register.
For those who cannot access the live broadcast, a replay will be available by dialing +1 855-669-9658 or +1 412-317-0088 (access code: 4033535) from one hour after the end of the call until 9:00 a.m. (Eastern Time) on May 18, 2026. The replay will also be available at Ceva’s web site at www.ceva-ip.com.
Forward-Looking Statements
This press release contains forward-looking statements that involve risks and uncertainties, as well as assumptions that if they materialize or prove incorrect, could cause the results of Ceva to differ materially from those expressed or implied by such forward-looking statements and assumptions. Forward-looking statements include statements about Ceva’s positioning for future growth and to serve as a foundational technology provider for intelligent, connected devices, licensing agreement wins, future industry demand, our market position for the future and future growth in the demand of our products, our forecast of financial measures for the following quarter and 2026, our long term targets and underlying assumptions, our future investments, expectations about future market, the success of our strategies and agreements, visibility into future revenue streams, and Ceva’s focus on expense management and profitability improvement. The risks, uncertainties and assumptions that could cause differing Ceva results include: the effect of intense industry competition; the ability of Ceva’s technologies and products incorporating Ceva’s technologies to achieve market acceptance; Ceva’s ability to meet changing needs of end-users and evolving market demands; the lengthy sales cycle for IP and related solutions; Ceva’s ability to diversify royalty streams and license revenues; geopolitical risks and instability, including the impact of tariffs and other trade measures and potential disruptions related to ongoing conflicts in the Middle East; and general market conditions and other risks relating to Ceva’s business and industry, including, but not limited to, those that are described from time to time in our SEC filings. Ceva assumes no obligation to update any forward-looking statements or information, which speak as of their respective dates.
About Ceva, Inc.
Ceva powers the Smart Edge, bridging the digital and physical worlds to bring AI-driven products to life. Our Ceva AI fabric portfolio of silicon and software IP enables devices to Connect, Sense, and Infer – the essential capabilities for the intelligent edge. From 5G, cellular IoT, Bluetooth, Wi-Fi, and UWB connectivity to scalable Edge AI NPUs, AI DSPs, sensor fusion processors and embedded software, Ceva provides the foundational IP for devices that connect, understand their environment, and act in real time.
With more than 21 billion devices shipped and trusted by 400+ customers worldwide, Ceva is the backbone of today’s most advanced smart edge products – from AI-infused wearables and IoT devices to autonomous vehicles and 5G infrastructure. Our differentiated solutions deliver seamless integration into existing design flows, total flexibility to combine solutions based on design needs and ultra–low–power performance in minimal silicon footprint, helping customers accelerate development, reduce risk, and bring innovative products to market faster. As technology evolves toward Physical AI, Ceva’s IP portfolio lays the foundation for systems that are always connected, contextually aware, and capable of intelligent, real-time decision-making.
Visit us at www.ceva-ip.com and follow us on LinkedIn, X, YouTube, Facebook, and Instagram.
CEVA, INC. AND ITS SUBSIDIARIES
INTERIM CONDENSED CONSOLIDATED STATEMENTS OF LOSS – U.S. GAAP
U.S. dollars in thousands, except per share data
Three months ended
March 31,
2026
2025
Unaudited
Unaudited
Revenues:
Licensing and related revenues
$ 17,820
$ 15,042
Royalties
9,204
9,203
Total revenues
27,024
24,245
Cost of revenues
3,729
3,487
Gross profit
23,295
20,758
Operating expenses:
Research and development, net
19,837
17,609
Sales and marketing
3,766
3,449
General and administrative
4,660
3,933
Amortization of intangible assets
117
149
Total operating expenses
28,380
25,140
Operating loss
(5,085)
(4,382)
Financial income, net
1,877
2,100
Remeasurement of marketable equity securities
64
(54)
Loss before taxes on income
(3,144)
(2,336)
Income tax expense
1,315
991
Net loss
$ (4,459)
$ (3,327)
Basic and diluted net loss per share
$ (0.16)
$ (0.14)
Weighted-average shares used to compute net loss
per share (in thousands):
Basic and diluted
27,678
23,764
Unaudited Reconciliation of GAAP to Non-GAAP Financial Measures
U.S. dollars in thousands, except per share data
Three months ended
March 31,
2026
2025
Unaudited
Unaudited
GAAP net loss
$ (4,459)
$ (3,327)
Equity-based compensation expense included in cost of
revenues
182
159
Equity-based compensation expense included in research
and development expenses
2,863
2,466
Equity-based compensation expense included in sales
and marketing expenses
717
566
Equity-based compensation expense included in general
and administrative expenses
1,610
1,132
Amortization of intangible assets related to acquisition of
businesses
176
208
Costs associated with asset acquisition
61
144
Loss (income) associated with the remeasurement of
marketable equity securities
(64)
54
Non-GAAP net income
$ 1,086
$ 1,402
GAAP weighted-average number of Common Stock
used in computation of diluted net loss per share (in
thousands)
27,678
23,764
Weighted-average number of shares related to
outstanding stock-based awards (in thousands)
1,810
1,618
Weighted-average number of Common Stock used
in computation of diluted earnings per share, excluding the
above (in thousands)
29,488
25,382
GAAP diluted loss per share
$ (0.16)
$ (0.14)
Equity-based compensation expense
$ 0.19
$ 0.18
Amortization of intangible assets related to acquisition
of businesses
$ 0.01
$ 0.01
Costs associated with asset acquisition
$ 0.00
$ 0.01
Non-GAAP diluted earnings per share
$ 0.04
$ 0.06
Three months ended
March 31,
2026
2025
Unaudited
Unaudited
GAAP operating loss
$ (5,085)
$ (4,382)
Equity-based compensation expense included in
cost of revenues
182
159
Equity-based compensation expense included in
research and development expenses
2,863
2,466
Equity-based compensation expense included in
sales and marketing expenses
717
566
Equity-based compensation expense included in
general and administrative expenses
1,610
1,132
Amortization of intangible assets related to acquisition
of businesses
176
208
Costs associated with asset acquisition
61
144
Total non-GAAP operating income
$ 524
$ 293
Three months ended
March 31,
2026
2025
Unaudited
Unaudited
GAAP gross profit
$ 23,295
$ 20,758
GAAP gross margin
86 %
86 %
Equity-based compensation expense included in
cost of revenues
182
159
Amortization of intangible assets related to acquisition
of businesses
59
59
Total non-GAAP gross profit
23,536
20,976
Non-GAAP gross margin
87 %
87 %
Three months ended
March 31,
2026
2025
Unaudited
Unaudited
GAAP operating expenses
28,380
25,140
Equity-based compensation expense included in
research and development expenses
(2,863)
(2,466)
Equity-based compensation expense included in
sales and marketing expenses
(717)
(566)
Equity-based compensation expense included in
general and administrative expenses
(1,610)
(1,132)
Amortization of intangible assets related to acquisition
of businesses
(117)
(149)
Costs associated with asset acquisition
(61)
(144)
Total non-GAAP operating expenses
$ 23,012
$ 20,683
CEVA, INC. AND ITS SUBSIDIARIES
INTERIM CONDENSED CONSOLIDATED BALANCE SHEETS
(U.S. dollars in thousands)
March 31,
December 31,
2026
2025 (*)
Unaudited
Unaudited
ASSETS
Current assets:
Cash and cash equivalents
$ 21,367
$ 40,586
Marketable securities and short-term bank deposits
194,326
181,397
Trade receivables, net
17,737
19,495
Unbilled receivables
31,135
29,860
Prepaid expenses and other current assets
16,297
13,498
Total current assets
280,862
284,836
Long-term assets:
Severance pay fund
7,225
7,530
Deferred tax assets, net
274
257
Property and equipment, net
9,010
7,054
Operating lease right-of-use assets
17,190
17,486
Investment in marketable equity securities
119
55
Goodwill
58,308
58,308
Intangible assets, net
868
1,044
Other long-term assets
14,370
11,686
Total assets
$ 388,226
$ 388,256
LIABILITIES AND STOCKHOLDERS’ EQUITY
Current liabilities:
Trade payables
$ 2,388
$ 2,418
Deferred revenues
2,968
3,496
Accrued expenses and other payables
19,224
21,026
Operating lease liabilities
2,794
1,743
Total current liabilities
27,374
28,683
Long-term liabilities:
Accrued severance pay
7,428
7,690
Operating lease liabilities
14,083
14,388
Other accrued liabilities
1,158
1,037
Total liabilities
50,043
51,798
Stockholders’ equity:
Common stock
28
28
Additional paid in-capital
343,298
337,966
Treasury stock
0
(1,591)
Accumulated other comprehensive income (loss)
(660)
79
Accumulated deficit
(4,483)
(24)
Total stockholders’ equity
338,183
336,458
Total liabilities and stockholders’ equity
$ 388,226
$ 388,256
(*) Derived from audited financial statements.
The Company believes that the presentation of non-GAAP measures in the press release is useful to investors in analyzing the results for the quarters ended March 31, 2026, and 2025 because the exclusion of the applicable expenses may provide a meaningful analysis of the Company’s core operating results and comparison of quarterly results. Further, the Company believes it is useful for investors to understand how the expenses associated with the application of FASB ASC No. 718 are reflected in its statements of income. The reconciliation of financial measures should be reviewed in addition to and in conjunction with results presented in accordance with GAAP and are intended to provide additional insight into the Company’s operations that, when viewed with its GAAP results and the accompanying reconciliation, offer a more complete understanding of factors and trends affecting the Company’s business. The reconciliation of financial measures should not be viewed as a substitute for the Company’s reported GAAP results.
A reconciliation of non-GAAP guidance to the corresponding GAAP measures is not available on a forward-looking basis without unreasonable effort due to the uncertainty of expenses that may be incurred in the future, although it is important to note that these factors could be material to the Company’s results computed in accordance with GAAP.
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SOURCE Ceva, Inc.
Technology
Screendragon Launches AI Hub, Enabling Marketing Teams and Agencies to Build and Run AI Agents Inside Real Workflows
Published
1 hour agoon
May 11, 2026By
CORK, Ireland, May 11, 2026 /PRNewswire/ — Screendragon today announced the launch of AI Hub, a new capability within its Agentic Marketing Orchestration platform that enables enterprise marketing teams and agencies to build, deploy and govern their own AI agents directly inside live workflows.
As AI adoption accelerates, teams are struggling to use it properly. AI Hub addresses this by enabling organisations to build their own AI agents and run them inside the workflows that already power their business, so they can harness AI at scale without losing control.
“The market is shifting from selling AI access to controlling AI execution,” said John Briggs, CEO of Screendragon. “Teams have access to AI, but no control over how it runs across the business. AI Hub changes that. It puts AI inside workflows, with the guardrails needed to scale it properly.”
Put AI Where the Work Is
AI Hub is designed to move teams beyond experimentation and into real execution.
Teams can solve their specific problems by building AI agents that:
Plug directly into live workflows Automate real marketing and creative work Keep outputs consistent, compliant and on-brand Control which models are used, and when
From briefing and content creation to approvals and compliance checks, AI becomes part of the process. Not another tab open on someone’s laptop.
Part of a Broader AI System
AI Hub is part of a wider AI offering that runs across the Screendragon platform.
Screendragon brings workflows, people, data and AI into one system, so work runs properly. AI Hub builds on that, giving teams the ability to design and run their own AI agents inside those workflows.
The wider AI offering includes:
Embedded AI Agents – Pre-built agents that automate common tasks inside workflows AI Hub – A flexible environment to build and manage your own agents AI Studio – Advanced tools for designing and optimising AI agents AI Foundry – Expert support to build and scale bespoke AI-driven workflows
Together, this gives teams a clear path. Start with what works out of the box. Then evolve towards fully customised, enterprise-grade AI execution.
Scale AI Without Losing Control of Cost
AI usage grows fast. Costs can grow faster.
AI Hub gives teams control over both:
Route work across AI models based on cost, speed and performance Use open-source models where it makes sense Avoid getting locked into one AI model
So teams can scale AI with confidence, not surprises.
From Experimentation to Execution
Most teams are still experimenting with AI. A few are starting to rely on it.
Very few are running it properly across workflows. That is the gap AI Hub is built to close.
“We were using AI in pockets, but it wasn’t scalable,” said Anne Cogan, CMO, Screendragon. “Now it is built into how we work, improving speed while maintaining full control and compliance.”
Availability
AI Hub is available immediately to all Screendragon customers, enabling them to build and deploy custom AI agents tailored to their workflows and use cases.
About Screendragon
Most marketing and agency teams do not struggle because of bad ideas. They struggle because the system around the work is broken.
Screendragon fixes that.
Screendragon is an Agentic Marketing Orchestration platform that enables enterprise teams and agencies to plan, resource and deliver marketing work with full visibility and control.
It connects workflows, people, data and AI into a single governed system so work runs properly, and AI actually helps instead of getting in the way.
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Logo – https://mma.prnewswire.com/media/2792757/5960921/Screendragon_Logo.jpg
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Technology
BCE to participate in the TD Cowen 28th Annual Telecom & Media Conference
Published
1 hour agoon
May 11, 2026By
MONTRÉAL, May 11, 2026 /CNW/ – Curtis Millen, Executive Vice President and Chief Financial Officer of BCE Inc. (TSX: BCE) (NYSE: BCE) will participate in a fireside chat at the TD Cowen 28th Annual Telecom & Media Conference in Toronto on Thursday, May 14th, 2026, at 10:30 am eastern.
A live webcast will be available on BCE’s website.
BCE is Canada’s largest communications company1, leading the way in advanced fibre and wireless networks, enterprise services and digital media. By delivering next-generation technology that leverages cloud-based and AI-driven solutions, we’re keeping customers connected, informed and entertained while enabling businesses to compete on the world stage. To learn more, please visit Bell.ca or BCE.ca.
____________________________
1 Based on total revenue and total combined customer connections.
Media inquiries:
Ellen Murphy
media@bell.ca
Investor inquiries:
Krishna Somers
krishna.somers@bell.ca
View original content:https://www.prnewswire.com/news-releases/bce-to-participate-in-the-td-cowen-28th-annual-telecom–media-conference-302767397.html
SOURCE BCE Inc.
Crypto funds log $858M in sixth straight week of inflows: CoinShares
Ceva, Inc. Announces First Quarter 2026 Financial Results
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