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TSMC Expands Collaboration with Ansys by Integrating AI Technology to Accelerate 3D-IC Design

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Ansys AI technology improves 3D-IC design productivity, while the broader collaboration advances innovative 3D-IC thermal, mechanical stress, and photonic solutions for AI, HPC, and high-speed data communication semiconductors

/ Key Highlights

Ansys artificial intelligence (AI)-driven solutions demonstrate higher productivity when designing components of 3D integrated circuits (ICs) and provide seamless automation for critical tasksAnsys multiphysics platform supports TSMC customers’ reliability analysis needs for evolving 3D-IC designAnsys and TSMC developed a comprehensive multiphysics analysis workflow for TSMC’s compact universal photonics engine (COUPE) for optical data communication

PITTSBURGH, Sept. 25, 2024 /PRNewswire/ — Ansys (NASDAQ: ANSS) and TSMC have expanded their collaboration to leverage AI for advancing 3D-IC design and develop next generation multiphysics solutions for a wider array of advanced semiconductor technologies. Together, the companies developed new workflows to analyze 3D-IC, photonic, electromagnetic (EM), and radio frequency (RF) designs while achieving higher productivity. These capabilities are critical to creating the world’s leading semiconductor products for high-performance computing (HPC), AI, datacenter connectivity, and wireless telecommunication.

Productivity enhancement with AI

Creating the right 3D-IC design that optimizes thermal and electrical effects — such as channel profile — requires extensive, time-consuming design flows. To minimize this constraint, designers use Ansys optiSLang® process integration and optimization software to quickly identify optimal design configurations through automation. By integrating optiSLang and Ansys RaptorX™ silicon-optimized EM solver for design analysis and modeling into the design process earlier, the solution reduced the number of EM simulations and demonstrated co-optimized channel design. This time savings delivers lower design costs and faster time-to-market.

Additionally, TSMC, Ansys, and Synopsys continue their long-standing collaboration to ensure the best technical solutions for their customers. Together, the companies developed an innovative AI-assisted RF migration flow by combining the RaptorX EM modeling engine with optiSLang that enables customers to automatically migrate analog circuits from one silicon process to another.

Multiphysics analysis for reliability

As TSMC advances 3D-IC packaging technologies, thermal and stress multiphysics analysis has become essential for ensuring the reliability of advanced multi-chip manufacturing. To address this need, TSMC is expanding its collaboration with Ansys RedHawk-SC Electrothermal™ thermal and multiphysics signoff platform for 3D-IC, incorporating mechanical stress analysis solutions to better support mutual customers’ requirements.

TSMC, Ansys, and Synopsys have developed an efficient flow to address multiphysics coupling challenges among timing, thermal, and power integrity. The flow, including Synopsys’ 3DIC Compiler™ exploration-to-signoff platform combined with Ansys solutions RedHawk-SC Electrothermal and Ansys RedHawk-SC™, helps customers reduce design challenges, enhance power, performance, and area (PPA), and ensure the reliability of their designs.

Ansys and TSMC also continue to jointly support the latest version of 3Dblox, with a focus on implementing hierarchical support to address the continuous rise of 3D-IC complexity. The new features of 3Dblox provide modularity and flexibility to help 3D-IC designers shorten the design implementation and analysis cycle.

COUPE solution enablement

TSMC’s COUPE is a 3D-IC assembly that stacks electronic chips on top of photonic chips, connecting fiber optics directly to electronic systems. Ansys, Synopsys, and TSMC are working to jointly enable a COUPE design solution that links a broad range of physics capabilities. The innovative optics simulation flow integrates:

Ansys Zemax OpticStudio® and Ansys Lumerical™ FDTD to simulate photonic devices on sub-wavelength scale and microlens at millimeter scaleAnsys RedHawk-SC and Ansys Totem™ for simulating power delivery network and signal net tracing to ensure voltage drop remains within acceptable design margins and signals can tolerate design current between electrical control IC and photonic ICRaptorX for modeling high-speed inter-chip connections in a multi-die package to accurately capture high-frequency signal behavior, andRedHawk-SC Electrothermal for simulating critical photonic heat and device components and overall 3D stacking thermal integrity

A16 Enablement

TSMC recently announced an advanced, new silicon process A16 that includes innovative backside power contact technology and backside power delivery. While this makes it suitable for AI and HPC applications, thermal management becomes an important reliability consideration. To address this, TSMC and Ansys are collaborating to enable RedHawk-SC Electrothermal to provide accurate thermal analysis. Moreover, TSMC collaborates with Ansys to enable power integrity and reliability technology with Redhawk-SC and Totem. Overall, the solutions will help designers improve performance, enhance power efficiency, and ensure an optimal and reliable design.

“Our advanced process and 3DFabric technologies have made huge strides in enabling more powerful and energy-efficient chips to tackle the ever-increasing computational demands of AI applications, but this also requires design tools that have a deep understanding of complex multi-physics interactions,” said Dan Kochpatcharin, head of Ecosystem and Alliance Management Division at TSMC. “The collaboration with our Open Innovation Platform (OIP) ecosystem partners like Ansys gives our mutual customers reliable access to a very broad range of proven analysis capabilities to deliver reliable solutions for their business needs.”

“Just as semiconductors have a wide range of applications, the Ansys multiphysics platform offers an equally broad range of reliable technical solutions,” said John Lee, vice president and general manager of the semiconductor, electronics, and optics business unit at Ansys. “Whether this be thermal, mechanical, electromagnetic, or a combination of different physics, we strive to ensure that our customers are well equipped with the strongest analysis tools to stay ahead of the curve. The continued collaborations with TSMC and Synopsys are a testament to our understanding of customer needs and how precise, predictively accurate simulation can help them deliver the most powerful products.”

/ About Ansys

Our Mission: Powering Innovation that Drives Human Advancement™

When visionary companies need to know how their world-changing ideas will perform, they close the gap between design and reality with Ansys simulation. For more than 50 years, Ansys software has enabled innovators across industries to push boundaries by using the predictive power of simulation. From sustainable transportation to advanced semiconductors, from satellite systems to life-saving medical devices, the next great leaps in human advancement will be powered by Ansys.

Ansys and any and all ANSYS, Inc. brand, product, service and feature names, logos and slogans are registered trademarks or trademarks of ANSYS, Inc. or its subsidiaries in the United States or other countries. All other brand, product, service and feature names or trademarks are the property of their respective owners.

ANSS–T

/ Contacts

Media

Mary Kate Joyce

724.820.4368

marykate.joyce@ansys.com

Investors

Kelsey DeBriyn

724.820.3927

kelsey.debriyn@ansys.com

 

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SOURCE Ansys

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Zifo Transforms Ontology Engineering with AI-Powered Intelligent Automation

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Advanced AI solution speeds up ontology creation by 80%, generating structured, interoperable knowledge models for science-driven organizations.

CAMBRIDGE, Mass. and CAMBRIDGE, England, April 30, 2026 /PRNewswire/ — Zifo, the leading global enabler of AI and data-driven enterprise informatics for science-driven organizations, has developed an Intelligent Automation solution for Ontology Engineering, which is designed to seamlessly generate structured, interoperable knowledge models while accelerating ontology creation by 80%.

Overcoming the Bottlenecks of Manual Ontology Creation

Manual ontology creation in the biopharma industry has traditionally been a time-consuming process that requires specialized expertise. Organizations frequently struggle with semantic ambiguity, complex integration challenges, and limited scalability, resulting in workflows that can take weeks to complete. Zifo’s AI-powered automation tackles these challenges head-on by eliminating 80% of the manual work through automated class generation, description creation, and precise IRI mapping.

Addressing the Complexities of Semantic Knowledge

Developing comprehensive knowledge models often demands deep domain expertise to define relationships and align terminology. Zifo’s intelligent solution overcomes this by providing an AI-guided workflow featuring an intuitive interface, meaning specialized ontology engineering knowledge is no longer required. By leveraging LLM-powered generation, the solution creates precise definitions with a deep understanding of domain-specific context, while generating standardized synonyms and establishing controlled vocabulary alignment to eliminate inconsistent terminology.

A Solution Designed for Scalable Scientific Data Modeling

The AI-powered solution addresses critical format compatibility and integration points in ontology management:

Seamless Integration: Automated mapping connects directly to established ontologies, including NCIT, CHEBI, OBI, and EFO, via BioPortal and OLS APIs.Massive Scalability: Parallel processing and batch operations empower teams to execute large-scale ontology projects without performance limitations.Automated Hierarchies: The AI autonomously generates semantic relationships and parent-child hierarchies based on domain context and predefined relation vocabularies.Format Compatibility: The solution produces direct OWL/RDF exports with proper URIs, ensuring seamless downstream integration.

Unique Features include:

Multi-Source Integration: The solution combines BioPortal, OLS, and EMBL-EBI APIs to guarantee comprehensive ontology coverage.Intelligent Ranking System: The system uses AI-powered relevance scoring and justification for precise ontology mappings.Precise IRI Mapping: It ensures that each generated class is linked to the correct IRI, directly promoting semantic web compatibility.Human-in-the-Loop Design: The solution automates repetitive tasks while maintaining vital expert oversight.End-to-End Workflow: Users are guided through a complete pipeline, from initial domain knowledge input straight to exportable OWL files.Visual Knowledge Graph: An interactive graph visualization allows for intuitive relationship exploration and validation.Multi-Format Exports: Provides seamless export options in CSV, OWL, or HTML Ontograph formats for downstream use, collaboration, and visualization.

Strategic Value Across the Scientific Chain

This solution breaks down the traditional barriers of data structuring. Built on a robust backend of Python, LangChain, and leading LLM models, alongside a frontend framework using Next.js 15 and Cytoscape.js for graph visualization, the solution is highly adaptable. Furthermore, future optimization enhancements will include provisions for uploading user-defined classes or semi-ready ontologies.

About Zifo

Zifo is the leading global enabler of AI and data-driven enterprise informatics for science-driven organizations. With expertise spanning research, development, manufacturing, and clinical domains, Zifo serves a diverse range of industries including Pharma, Biotech, Chemicals, Food and Beverage, and more. Trusted by over 190 organizations worldwide, Zifo is the partner of choice for advancing digital scientific innovation.

For more information, visit www.zifornd.comhttps://zifornd.com/practical-ai-blueprints/

Logo: https://mma.prnewswire.com/media/2731415/Zifo_Technologies_Logo.jpg

 

View original content:https://www.prnewswire.com/news-releases/zifo-transforms-ontology-engineering-with-ai-powered-intelligent-automation-302758975.html

SOURCE Zifo Technologies

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UNC-Chapel Hill establishes ‘Carolina in the Capital’ with new Washington, D.C. office

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CHAPEL HILL, N.C., April 30, 2026 /PRNewswire/ — The University of North Carolina at Chapel Hill has opened a new office in Washington, D.C., establishing an expanded presence for the University in the nation’s capital and creating exciting opportunities for students, faculty, staff and alumni.

Located at 101 Constitution Avenue NW, the 10,861-square-foot space – coined “Carolina in the Capital” – will support a variety of functions, including educational programming for undergraduate and graduate students, alumni relations and engagement with government partners.

As a leading R1 university, UNC-Chapel Hill annually attracts more than $1.6 billion to the state’s economy to fund research that creates a better quality of life for all its citizens. More than 60% of UNC-Chapel Hill’s total research funding comes from federal sponsors with the majority of that federal funding coming from the National Institutes of Health (NIH), which is based in the Washington area.

“Carolina in the Capital is a state-of-the-art facility that reflects our commitment to creating experiential learning opportunities for our students and faculty,” said Chancellor Lee H. Roberts. “The space is designed as an immersive learning environment where students can translate classroom knowledge into hands-on experience, which has never been more important. The facility also strengthens our ability to support engagement between our staff, alumni, policymakers and partners.”

Supporting students participating in Carolina’s Washington-based academic programs is a priority. For years, students and faculty have relied on temporary or borrowed spaces across the city. The new office provides a permanent home where students can gather, learn and build community while living and studying in Washington. A robust schedule of classes and events will fill the space throughout the year.

The Washington, D.C. region is home to the largest concentration of out-of-state Carolina alumni anywhere in the country. The new office creates a dedicated space to strengthen those connections and support networking, mentorship, professional development and community-building among D.C.-based Tar Heels.

The space will also serve as a platform to bring Carolina’s research and academic expertise into closer conversation with policymakers, industry leaders and member organizations. Carolina is the nation’s 11th largest university in the country based on research volume with primary federal funding coming from NIH and the National Science Foundation (NSF), both based in the D.C. area. Carolina is a proud member of the Association of American Universities (AAU) and the Association of Public & Land Grant Universities (APLU), which are both based in Washington.

The office is funded entirely through the UNC-Chapel Hill Foundation and does not use any state appropriations.

You can view additional photos of the space here.

Media Contact: UNC Media Relations, 919-445-8555, mediarelations@unc.edu

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SOURCE University of North Carolina at Chapel Hill Office of Communications

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Investing.com Acquires Stonki to Accelerate Its Entry into the Agentic AI Era

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The acquisition strengthens Investing.com’s AI capabilities, advancing a next-generation research assistant that can analyze markets, generate insights, and guide investors in real time

NEW YORK, April 30, 2026 /PRNewswire/ — Investing.com, one of the world’s largest financial platforms used by more than 60 million investors each month, today announced the acquisition of Stonki, an AI-powered investing assistant designed to help traders turn ideas into structured, actionable trading plans.

The move marks a major step in the company’s evolution toward agentic AI, strengthening its ability to deliver faster, deeper, and more actionable market insights to a growing base of more than 300,000 paying subscribers across its InvestingPro suite, the company’s premium subscription offering for advanced market data, tools, and AI-driven insights.

Over the past 12 months, nearly 3 million users have used WarrenAI, Investing.com’s AI-powered financial research assistant launched last year, to perform market analysis, making AI a central entry point into the platform’s ecosystem. With the addition of Stonki, the company is moving beyond traditional AI tools toward agentic systems that can proactively guide users through the investment process.

“We’re entering the age of agentic AI, where the technology moves beyond just answering questions to actively helping investors think, analyze, and act,” said Omer Shvili, CEO of Investing.com. “Bringing Stonki.ai into the fold accelerates our goal of building an agentic platform that will serve as a 24/7 analyst for our users. We are developing this to be more than just a tool; it will be a partner that identifies opportunities, tracks unfolding situations, and surfaces trade ideas even when the user isn’t active—giving our users the kind of edge that was previously only available to professional investors.”

Founded in 2025, Stonki is developing a new category of ‘agentic’ AI for investing, enabling users to turn investment ideas into fully defined strategies with entry and exit conditions, risk management rules, and continuous monitoring.

“We started Stonki because, as investors and traders ourselves, we knew how much time and focus it takes to stay on top of the market and properly manage a day trade, a swing trade, an investment idea, or a portfolio,” said Ulas Bilgenoglu and Itay Verkh, co-founders of Stonki. “We set out to build AI that could carry part of that load by continuously monitoring the market, turning ideas into structured strategies, and helping users make better decisions with clear entry and exit conditions, disciplined risk management, and ongoing tracking. Joining Investing.com gives us the scale, data, reach, and strong AI foundation to accelerate that vision. Together, we can create an experience where AI helps users stay ahead of the market, manage risk, and act with greater confidence.”

The acquisition expands Investing.com’s AI capabilities across both technical and fundamental investing workflows. Stonki’s technology is built around persistent, real-time intelligence, continuously monitoring markets, tracking user-defined strategies, and alerting investors when conditions align, rather than relying on one-off prompts or static analysis.

For active traders, the platform is evolving into a real-time analysis engine designed to support high-frequency decision-making with precision and speed. For long-term investors, it is becoming a central hub for research, enabling users to evaluate opportunities, set personalized alerts, and monitor portfolios based on their individual investment strategies.

Users will be able to define specific conditions, such as a stock crossing a long-term moving average, and have the AI continuously monitor the market, analyze relevant signals, and surface actionable insights in real time. The system will also review portfolios on an ongoing basis, helping investors avoid potential losses and uncover new opportunities aligned with their strategy.

This latest step builds on Investing.com’s broader strategy of expanding its AI-powered suite, including WarrenAI, ProPicks AI, and its recently launched AI Chart Analysis, all aimed at delivering faster, more accurate and more actionable insights to investors.

View original content:https://www.prnewswire.com/news-releases/investingcom-acquires-stonki-to-accelerate-its-entry-into-the-agentic-ai-era-302756588.html

SOURCE Investing.com

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