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JOLT CAPITAL CLOSES ITS FIRST INVESTMENT IN QUEBEC

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Investment of nearly $40 million to develop chip design in Quebec

MONTREAL, Dec. 16, 2024 /CNW/ – Jolt Capital, a French private equity firm specializing in growth investments in deep tech companies, announces its very first investment in Quebec with the acquisition of part of Dolphin Design’s activities, a leader in semiconductor design. This investment of nearly 40 million Canadian dollars marks a decisive step for Jolt Capital, which aims to make Quebec its development base for the North American market.

With this acquisition, Jolt Capital buys the intellectual property (IP) design activities for power management and analog signals from Dolphin Design’s division, previously part of the Soitec group, thus consolidating its expertise in semiconductors and establishing a Canadian structure to support the company’s expansion under the name Dolphin Semiconductor. The development plan includes relocating the headquarters to Montreal and injecting capital directly into the Quebec entity, thus contributing to Quebec’s technological innovation ecosystem.

Canada is a particularly strategic market for Jolt Capital, with a high-performing innovation ecosystem and many deep-tech companies. This investment in Dolphin Semiconductor is an important milestone in implementing our vision of making Quebec our operational base in North America and demonstrates our commitment to developing our presence in Canada in the long term. Jolt Capital’s office in Montreal, in addition to strengthening our local presence, will lead our investments and business development activities in Canada as well as coordinate our other points of presence in the region, notably in Silicon Valley and Boston,” said the company’s president, Jean Schmitt.

Dolphin Semiconductor, already operating in Quebec under the name Dolphin Integration, plans to expand its current team of about thirty people based in Saint-Laurent. This investment will enhance its production and development capabilities for new technologies while creating job opportunities. Recruitment will target talents that will accelerate the development of intellectual property blocks already sold to top-tier suppliers. The Quebec subsidiary will also eventually have an executive who will sit on Dolphin Semiconductor’s global management committee, thus strengthening local decision-making. Additionally, board meetings will be held regularly in person in Montreal, with the addition of two new board members, including an independent one, based in Quebec. In this regard, Claude Jean, Senior Vice President of Teledyne Dalsa, will be appointed as an independent board member of Dolphin Semiconductor. This appointment underscores the company’s commitment to local expertise and strategic development in Quebec.

“We are excited to take a new step in the development of Dolphin Semiconductor with the strategic support of Jolt Capital. This partnership will allow us to create a global leader in IP blocks in the semiconductor field, positioning the company in key markets in North America, Europe, and Asia,” said Laurent Monge, newly appointed CEO of Dolphin Semiconductor.

“The arrival of an investor of Jolt Capital’s stature in Quebec testifies to the vitality of our technological ecosystem and the recognition of the excellence of our local expertise. It is essential to support the establishment of such players, who act as catalysts for innovation, generate job opportunities, and consolidate our international presence,” said Claude Jean, independent board member of Dolphin Semiconductor and Senior Vice President of Teledyne Dalsa.

This first investment by Jolt Capital in Quebec was made possible with the strategic support of the Ministry of Economy, Innovation and Energy (MEIE), which facilitated key connections. It also benefited from the collaboration of Mr. Henri-Paul Rousseau, Quebec’s General Delegate in Paris, and Ms. Michèle Boisvert, who previously held this position. Both actively supported the investment fund in its efforts to establish itself in Montreal.

About Jolt Capital

With nearly €600 million in assets under management, Jolt Capital invests in cutting-edge B2B technology companies, transforming them into global leaders. The Jolt Capital team is comprised exclusively of seasoned investors and former executives from high-tech companies. Its proprietary artificial intelligence platform, Jolt.Ninja, enhances deal flow, accelerates the due diligence process, and automatically identifies investment and acquisition targets. In June 2024, Jolt Capital announced the opening of its North American headquarters in Montreal, overseeing capital deployment in Canada and driving business development efforts for the firm and its portfolio companies across North America. Jolt Capital also maintains a presence in Paris, Lausanne, Copenhagen, London, Tokyo, and Silicon Valley.

About Dolphin Semiconductor

Dolphin Semiconductor is a company specializing in the design and development of analog and mixed-signal integrated circuits, offering advanced technological solutions for various applications, particularly in the automotive, Internet of Things (IoT), and power electronics fields. With teams based in France and Quebec, Dolphin Semiconductor stands out for its expertise in energy-efficient integrated circuits, optimizing performance while reducing consumption. The company develops intellectual property (IP) blocks, which are essential design bricks for manufacturing any electronic chip. With unique expertise and a research and innovation-centered approach, Dolphin Semiconductor establishes itself as a preferred partner for companies wishing to design innovative and high-performance electronic systems, meeting the most advanced technological requirements of the semiconductor market.

SOURCE Jolt Capital

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Chef Robotics Physical AI Models Can Now Automate Baked Goods Packing

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SAN FRANCISCO, April 29, 2026 /PRNewswire/ — Chef Robotics, a leader in physical AI for the food industry, today announced that Chef robots can now automate tray assembly for baked goods packing. The application places baked products, such as burger buns, chocolate chip cookies, biscotti, butter cookies, biscuits, fortune cookies, granola bars, rusks, and shortbreads into trays and packaging containers before sealing.

Watch Chef robots in action.

Baked goods packing has historically been difficult to automate for high-mix production. Each item behaves differently on the production line—a granola bar compresses under the wrong grip, while a biscotti or rusk can crack if placed at the wrong angle. Surface textures range from glazed and smooth to crumbly and irregular, and strict presentation requirements leave little room for error. This variability has made it challenging for automation systems to reliably handle baked goods at production speeds, leaving food manufacturers dependent on manual labor and traditional bakery equipment.

To address this, Chef built its baked goods packing application on its existing piece-picking capability, which uses Chef’s AI-powered computer vision and physical AI models trained across diverse real-world production environments. This allows Chef robots to assess each item’s position, shape, and orientation in real time and determine how to pick the items from the pan and place them quickly and precisely without damaging them.

The baked goods packing application supports four distinct placement capabilities.

First, Chef’s vision system detects the angle at which each item sits in the pan and reorients it after picking, placing it on the tray at the exact angle required, regardless of its original position, enabling retail-ready presentation for SKUs that require precise angular placement.

Second, Chef robots can place multiple baked goods into the same packaging container in a single automated pass, completing full tray assembly without manual intervention.

Third, for packaging containers with multiple small compartments, Chef robots can precisely place items into each designated section, including multiple items in the same compartment, using Chef’s AI vision model to detect compartment positions and orientations in real time.

Fourth, Chef’s vision system identifies the exact center of each tray and places every item at a predefined offset from that center, ensuring a uniform, consistent arrangement across every pack regardless of how trays arrive on the conveyor.

For food manufacturers evaluating bakery systems and baked goods packaging automation, the application offers higher throughput, reduced labor dependency, and consistent presentation across shifts. The capability runs on Chef’s existing robotic hardware and software, allowing manufacturers to deploy it without requiring any changes to their production lines.

Chef’s baked goods packing application is available in the U.S., Canada, Germany, and the UK and is included as part of Chef’s robotics-as-a-service (RaaS) pricing model.

About Chef Robotics
Chef is the first company to have commercialized a scalable AI-driven food robotics solution. With over 104 million servings made in production, Chef leverages ChefOS, an AI platform for food manipulation, to offer a Robotics-as-a-Service solution that helps industry-leading food companies increase production volume and meet demand. Headquartered in San Francisco, CA, Chef aims to empower humans to do what humans do best by accelerating the advent of intelligent machines. Visit https://chefrobotics.ai to learn more.

View original content:https://www.prnewswire.com/news-releases/chef-robotics-physical-ai-models-can-now-automate-baked-goods-packing-302756923.html

SOURCE Chef Robotics

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Chef Robotics Physical AI Models Can Now Automate Baked Goods Packing

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SAN FRANCISCO, April 29, 2026 /PRNewswire/ — Chef Robotics, a leader in physical AI for the food industry, today announced that Chef robots can now automate tray assembly for baked goods packing. The application places baked products, such as burger buns, chocolate chip cookies, biscotti, butter cookies, biscuits, fortune cookies, granola bars, rusks, and shortbreads into trays and packaging containers before sealing.

Watch Chef robots in action.

Baked goods packing has historically been difficult to automate for high-mix production. Each item behaves differently on the production line—a granola bar compresses under the wrong grip, while a biscotti or rusk can crack if placed at the wrong angle. Surface textures range from glazed and smooth to crumbly and irregular, and strict presentation requirements leave little room for error. This variability has made it challenging for automation systems to reliably handle baked goods at production speeds, leaving food manufacturers dependent on manual labor and traditional bakery equipment.

To address this, Chef built its baked goods packing application on its existing piece-picking capability, which uses Chef’s AI-powered computer vision and physical AI models trained across diverse real-world production environments. This allows Chef robots to assess each item’s position, shape, and orientation in real time and determine how to pick the items from the pan and place them quickly and precisely without damaging them.

The baked goods packing application supports four distinct placement capabilities.

First, Chef’s vision system detects the angle at which each item sits in the pan and reorients it after picking, placing it on the tray at the exact angle required, regardless of its original position, enabling retail-ready presentation for SKUs that require precise angular placement.

Second, Chef robots can place multiple baked goods into the same packaging container in a single automated pass, completing full tray assembly without manual intervention.

Third, for packaging containers with multiple small compartments, Chef robots can precisely place items into each designated section, including multiple items in the same compartment, using Chef’s AI vision model to detect compartment positions and orientations in real time.

Fourth, Chef’s vision system identifies the exact center of each tray and places every item at a predefined offset from that center, ensuring a uniform, consistent arrangement across every pack regardless of how trays arrive on the conveyor.

For food manufacturers evaluating bakery systems and baked goods packaging automation, the application offers higher throughput, reduced labor dependency, and consistent presentation across shifts. The capability runs on Chef’s existing robotic hardware and software, allowing manufacturers to deploy it without requiring any changes to their production lines.

Chef’s baked goods packing application is available in the U.S., Canada, Germany, and the UK and is included as part of Chef’s robotics-as-a-service (RaaS) pricing model.

About Chef Robotics
Chef is the first company to have commercialized a scalable AI-driven food robotics solution. With over 104 million servings made in production, Chef leverages ChefOS, an AI platform for food manipulation, to offer a Robotics-as-a-Service solution that helps industry-leading food companies increase production volume and meet demand. Headquartered in San Francisco, CA, Chef aims to empower humans to do what humans do best by accelerating the advent of intelligent machines. Visit https://chefrobotics.ai to learn more.

View original content:https://www.prnewswire.com/news-releases/chef-robotics-physical-ai-models-can-now-automate-baked-goods-packing-302756923.html

SOURCE Chef Robotics

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Air Products to Expand Industrial Gas Supply for Samsung Electronics’ Next-Generation Semiconductor Fab in South Korea

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New investment underscores the company’s long-term commitment to Korea and its leading role in the global semiconductor industry 

LEHIGH VALLEY, Pa., April 29, 2026 /PRNewswire/ — Air Products (NYSE:APD), a world-leading industrial gases company and serving Samsung globally, today announced it has been selected by Samsung to supply industrial gases for its new advanced semiconductor fab in Pyeongtaek, Gyeonggi Province, South Korea.

Under the agreement, Air Products will build, own and operate multiple state-of-the-art production facilities and a bulk specialty gas supply system to supply nitrogen, oxygen, argon, and hydrogen for Samsung’s new semiconductor fab. The new facilities are expected to come onstream in multiple phases from 2028 through 2030.

Air Products has a long track record of executing multiple phase expansions in Pyeongtaek to support Samsung’s growing manufacturing needs. This latest project represents Air Products’ largest investment to date in the semiconductor industry and will establish Pyeongtaek as the company’s single largest operations site globally supporting the electronics industry. 

“Air Products is honored to be selected once again by Samsung and to have their continued confidence as a trusted partner supporting their strategic growth plans,” said SR Kim, President, Air Products Korea. “This significant investment reinforces Air Products’ role as a leading global supplier to the semiconductor industry and underscores our long-standing commitment to supporting our strategic customers with safety, reliability, efficiency and excellent service.”

Air Products has served the global electronics industry for more than 40 years, supplying industrial gases safely and reliably to many of the world’s leading technology companies. The company has operated in Korea for more than 50 years and has established a strong position in electronics and manufacturing sectors.

About Air Products

Air Products (NYSE: APD) is a world-leading industrial gases company in operation for over 85 years focused on serving energy, environmental, and emerging markets and generating a cleaner future. The Company supplies essential industrial gases, related equipment and applications expertise to customers in dozens of industries, including refining, chemicals, metals, electronics, manufacturing, medical and food. As the leading global supplier of hydrogen, Air Products also develops, engineers, builds, owns and operates some of the world’s largest clean hydrogen projects, supporting the transition to low- and zero-carbon energy in the industrial and heavy-duty transportation sectors. Through its sale of equipment businesses, the Company also provides turbomachinery, membrane systems and cryogenic containers globally.

Air Products had fiscal 2025 sales of $12 billion from operations in approximately 50 countries. For more information, visit airproducts.com or follow us on LinkedInXFacebook or Instagram.

This release contains “forward-looking statements” within the safe harbor provisions of the Private Securities Litigation Reform Act of 1995. These forward-looking statements are based on management’s expectations and assumptions as of the date of this release and are not guarantees of future performance. While forward-looking statements are made in good faith and based on assumptions, expectations and projections that management believes are reasonable based on currently available information, actual performance and financial results may differ materially from projections and estimates expressed in the forward-looking statements because of many factors, including the risk factors described in our Annual Report on Form 10-K for the fiscal year ended September 30, 2025 and other factors disclosed in our filings with the Securities and Exchange Commission. Except as required by law, we disclaim any obligation or undertaking to update or revise any forward-looking statements contained herein to reflect any change in the assumptions, beliefs or expectations or any change in events, conditions or circumstances upon which any such forward-looking statements are based.

View original content to download multimedia:https://www.prnewswire.com/news-releases/air-products-to-expand-industrial-gas-supply-for-samsung-electronics-next-generation-semiconductor-fab-in-south-korea-302757497.html

SOURCE Air Products

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