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Semiconductor Advanced Packaging Market size to increase by USD 29.33 Billion between 2024 to 2029, Market Segmentation by Device, Technology, Geography , Technavio

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NEW YORK, Jan. 6, 2025 /PRNewswire/ — The global semiconductor advanced packaging market size is estimated to grow by USD 29.33 billion from 2025 to 2029, according to Technavio. The market is estimated to grow at a CAGR of over 9.8% during the forecast period. The report provides a comprehensive forecast of key segments below- 

Segmentation Overview

Device 1.1 Analog and mixed ICs1.2 MEMS and sensors1.3 Logic and memory devices1.4 Wireless connectivity devices1.5 CMOS image sensorsTechnology 2.1 Flip chip2.2 FI WLP2.3 2.5D/3D2.4 FO WLPGeography 3.1 APAC3.2 North America3.3 Europe3.4 South America3.5 Middle East and Africa

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1.1 Fastest growing segment:

The Semiconductor Advanced Packaging Market experiences steady growth due to the increasing demand for modern electronic components with enhanced performance and functionality. Advanced packaging solutions, such as Flip-Chip, Embedded-Die, Fan-Out WLP, and FO WLP, are essential for the proliferation of Analog and Mixed ICs in communication, consumer electronics, automotive, and other industries. These packaging types address the challenges of interconnection lengths, signal delays, and high-speed applications, including 5G technology, interactive gaming elements, and high-frequency applications. Advanced packaging also supports miniaturization of devices, enabling the integration of RFID, MEMS, Power devices, AI, Machine Learning, and Deep Learning in various sectors, including the Industrial sector. Chip packaging innovations, such as Thin Wafers and Wafer-Level Packaging (WLP), are crucial for semiconductor IC manufacturing, enabling the production of advanced components for various applications.

Analyst Review

The Semiconductor Advanced Packaging Market is experiencing significant growth due to the increasing demand for compact, high-performance, and high-speed technologies in various sectors. Key technologies driving this market include Flip-chip CSP (Chip Scale Packaging), Wafer-level CSP (Chip Scale Packaging), and Fan-Out WLP (Wafer-Level Packaging). These advanced packaging solutions enable miniaturization, enhanced reliability, and improved thermal management for power devices and computing components. The IoT (Internet of Things) and AI (Artificial Intelligence) technologies, including Machine Learning and Deep Learning, are major contributors to this market’s expansion in the industrial sector. Advanced packaging industry innovations, such as process nodes and energy-efficient solutions, are essential for delivering high computing power and high-speed signals. Power devices and programmable logic controllers also benefit from these advancements, ensuring optimal performance and energy efficiency.

Market Overview

The Semiconductor Advanced Packaging Market is experiencing significant growth due to the increasing demand for miniaturization, higher performance, and lower power consumption in electronic devices. The market consists of various packaging technologies such as Flip Chip, Wafer Level Packaging, and 3D Packaging. These technologies enable semiconductor devices to be more compact, efficient, and reliable. The market is driven by the consumer electronics industry, automotive, and industrial sectors. The use of advanced packaging in applications like AI, IoT, and 5G is also fueling market growth. Companies like Intel, Samsung, and Micron are major players in the Semiconductor Advanced Packaging Market. The market is expected to continue its upward trend due to the ongoing miniaturization trend and the increasing adoption of advanced technologies in various industries.

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 Key Topics Covered:

1 Executive Summary
 2 Market Landscape
 3 Market Sizing
 4 Historic Market Size
 5 Five Forces Analysis
 6 Market Segmentation
 7 Customer Landscape
 8 Geographic Landscape
 9 Drivers, Challenges, and Trends
10 Venodr Landscape
11 Vendor Analysis
12 Appendix

About Technavio

Technavio is a leading global technology research and advisory company. Their research and analysis focuses on emerging market trends and provides actionable insights to help businesses identify market opportunities and develop effective strategies to optimize their market positions.

With over 500 specialized analysts, Technavio’s report library consists of more than 17,000 reports and counting, covering 800 technologies, spanning across 50 countries. Their client base consists of enterprises of all sizes, including more than 100 Fortune 500 companies. This growing client base relies on Technavio’s comprehensive coverage, extensive research, and actionable market insights to identify opportunities in existing and potential markets and assess their competitive positions within changing market scenarios.

Contacts

Technavio Research
Jesse Maida
Media & Marketing Executive
US: +1 844 364 1100
UK: +44 203 893 3200
Email: media@technavio.com
Website: www.technavio.com/

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SOURCE Technavio

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The Building & Furniture Category Highlights Sustainable and Human‑Centric Design at the 139th Canton Fair

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GUANGZHOU, China, April 26, 2026 /PRNewswire/ — Phase 2 of the 139th Canton Fair has seen the Building & Furniture category emphasize green Infrastructure and human-centric design.

A major highlight of the building and decorative materials section is the introduction of photovoltaic marble-textured cladding. This innovative surfacing material bridges the gap between high-end aesthetics and renewable energy. Unlike traditional solar panels that rely on glass, this non-opaque cladding uses precise microscopic structures to guide light to internal PV cells.

This technology offers 60% higher efficiency than traditional transparent solar systems while reducing carbon emissions by over 50%. Its ability to reproduce stone, wood, or brick‑like 3D textures allows architects to integrate power generation into a wide range of building styles without the industrial appearance of traditional solar panels.

Indoor environments are also becoming smarter and safer. Manufacturers are showcasing high-efficiency antibacterial surfacing, utilizing visible light catalysis to provide 24-hour protection against mold and bacteria. These advanced decorative papers and panels are becoming the new standard for high-end interior decoration, prioritizing long-term hygiene in residential and commercial spaces.

The sanitary ware sector is increasingly focused on the aging global population and those with limited mobility. A standout innovation is the electric lift-and-rotate shower chair. Designed for the dry-wet separation bathroom layout, it allows users to sit in a dry area and be safely rotated and lifted into the shower via remote control. This waterproof, low-voltage system provides dignity and independence for the elderly while reducing the physical strain on caregivers.

Hygiene and ease of maintenance have also seen a breakthrough with wall-mounted toilets. By moving the lid connection to the tank wall and adopting a mortise‑and‑tenon structure, the design eliminates the hard‑to‑clean areas where bacteria typically accumulate. Many of these units also incorporate ergonomic grab bars directly into the frame, blending safety with a minimalist aesthetic.

In the sports and leisure industry, the shift toward sustainability is seen in non-infill synthetic turf. This next-generation football grass eliminates the need for rubber granules or sand, providing a natural touch and superior shock absorption while significantly reducing maintenance costs and microplastic pollution.

All these innovations demonstrate how the Building & Furniture sector is advancing toward greener materials, smarter functionality, and more human‑centered design, setting new benchmarks for the future of living spaces.

For pre-registration, please click: https://buyer.cantonfair.org.cn/register/buyer/email?source_type=16

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Nexteer’s Global First Steer-by-Wire Goes into Production

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BEIJING, April 26, 2026 /PRNewswire/ — Nexteer Automotive helped a leading Chinese new energy vehicle (NEV) manufacturer bring the world’s first production passenger vehicle with a full drive‑by‑wire chassis to market. The vehicle features Nexteer’s steer‑by‑wire (SbW) system as a key enabler.

The SbW featured in this vehicle marks Nexteer’s first SbW system in mass production, representing a major step forward for the technology — moving from development and validation to full-scale production. Certified in late 2025, this system achieved the world’s first ASIL D functional safety approval from DAkkS (German Accreditation Body) through close collaboration with the OEM. This certification reflects global top-tier performance in fault diagnosis, redundancy, and safety monitoring. Key features include:

Multi-layered redundancy design: Dual controllers, dual power supplies, multiple communication links, and dual actuation paths — achieving redundancy at system, hardware, and software levels. This ensures that in the event of a single fault, the backup path takes over within milliseconds with no loss of steering function.Full‑scenario functional safety mechanism: Multi‑level monitoring and fault handling strategies covering sensors, controllers, actuators, and communication links.Variable steering ratio: Automatically adjusts steering angle and effort based on vehicle speed and driving mode, balancing agility and comfort.Intuitive road‑feel simulation technology: Software‑defined steering feedback delivers a more responsive and precise driving experience, adaptable to a wide range of driving scenarios.Open interface for autonomous driving: As a key actuation layer for ADAS and autonomous driving systems, it provides real‑time, precise control capabilities, supporting the development of intelligent transportation systems.

Steer-by-Wire: Electronic Signals Replace Mechanical Links, Flexible Configurations for Diverse Needs

By decoupling the mechanical link between the hand wheel and the road wheels, steer-by-wire replaces conventional mechanical connections with electronic signals and actuators — and is quickly becoming a foundational technology for next-generation intelligent chassis and autonomous driving platforms. As a motion control technology company with 120 years of engineering heritage, Nexteer offers a flexible, off-the-shelf portfolio of steering feel simulators and road wheel actuators. This modular approach allows us to meet the diverse needs of different vehicle models and driving scenarios efficiently and cost-effectively.

From Steering to Braking: Expanding Full-Stack Motion Control Capabilities

Building on its deep expertise in steering systems, Nexteer has expanded into braking with its Brake-by-Wire solution, the Electro-Mechanical Brake (EMB). EMB has completed full development and rigorous validation and is ready for mass production. Together with SbW, Brake-by-Wire (EMB), Rear-Wheel Steering, and the MotionIQ™ Software Suite make up Nexteer’s broader Motion-by-Wire™ portfolio.

With Nexteer, OEMs get more than steer-by-wire and brake-by-wire components: they get a complete, proven, production-ready and cost-effective drive-by-wire chassis motion control solution that’s shaping the future of the software-defined chassis and enabling faster development, lower costs and safter, smarter and more exciting driving experiences.

During Auto China 2026, we cordially invite you to visit Nexteer at Booth W1B03, Hall W1, China International Exhibition Center (Shunyi) in Beijing, to experience firsthand the breakthrough innovations of steer-by-wire and Motion-by-Wire™ technologies.

ABOUT NEXTEER AUTOMOTIVE

Nexteer Automotive (HK 1316) is a global leading motion control technology company accelerating mobility to be safe, green and exciting. Our innovative portfolio supports Motion-by-Wire™ chassis control, including electric and hydraulic power steering systems, steer-by-wire and rear-wheel steering systems, steering columns and intermediate shafts, driveline systems, software solutions and brake-by-wire. Celebrating 120 years of automotive innovation in 2026, Nexteer builds on a strong legacy of engineering excellence while continuing to shape the future of mobility. The company solves motion control challenges across all megatrends – including electrification, software/connectivity, ADAS/automated driving and shared mobility – for global and domestic OEMs around the world including BMW, Ford, GM, RNM, Stellantis, Toyota and VW, as well as automakers in India and China including BYD, Xiaomi, ChangAn, Li Auto, Chery, Great Wall, Geely, Xpeng and others. www.nexteer.com  

Links to Nexteer Media Center

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World IP Day 2026: PitchMark launches Ideas.Exchange to help creators safeguard and license ideas in the age of AI

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SINGAPORE, April 26, 2026 /PRNewswire/ — To mark World IP Day 2026, PitchMark® today launched Ideas.Exchange, a first‑of‑its‑kind platform designed to help creators assert intellectual property rights, license ideas, and formalise creative conversations in an increasingly AI‑driven economy.

Unveiled at Safeguard Your IP in the Age of AI, a media briefing hosted by CNBC’s Sri Jegarajah, the platform responds to growing concern that ideas are routinely used, reused or absorbed without attribution, consent or compensation—often with limited legal or commercial recourse.

“AI has amplified both the reach and the risk for creators,” said Mark Laudi, Managing Partner of PitchMark LLP. “Ideas.Exchange gives creators a way to protect themselves while still participating confidently in the market for ideas.”

At its core, the platform focuses on three interventions for creators:

Asserting IP rights by establishing proof of authorship and precedenceLicensing ideas without giving them away for freeFormalising conversations so pitches and evaluations are governed rather than informal

Ideas.Exchange is powered by three proprietary resources developed by PitchMark. These include a blockchain‑driven clearing house where ideas and creative works can be listed and licensed; smart contracts that automate usage terms and reduce disputes; and an IP Governance Certification Program designed to signal responsible handling of ideas, particularly in enterprise and AI contexts.

The result, PitchMark says, is three concrete outcomes: deterrence of idea theft, new ways to monetise ideas through structured licensing and price discovery, and a more level playing field that allows creators to pitch to clients and platforms on equal terms.

The launch comes amid renewed scrutiny of how intellectual property is treated in the AI era. While idea theft is rarely reported, its impact is significant. Beyond visible financial losses, organisations and creators often absorb hidden costs through talent attrition, innovation suppression and abandoned market opportunities.

“Most idea theft occurs informally and never reaches the courts,” said Prof David Llewelyn, Professor Emeritus of Law at Singapore Management University. “Introducing governance, traceability and standards is a meaningful step toward addressing that gap.”

Spokespeople including Prof Llewelyn, technology lawyer Bryan Ghows, and Mark Laudi are available for interview.

About PitchMark

PitchMark® deters idea theft and enables creatives to get paid by providing a trusted way to share and license ideas with prospects and clients.

 

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SOURCE PitchMark

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