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Printed Circuit Board (PCB) Market to Grow by USD 26.8 Billion (2025-2029), Driven by Smartphone Adoption, Report Highlights AI’s Redefining Role – Technavio

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NEW YORK, Jan. 27, 2025 /PRNewswire/ — Report with market evolution powered by AI – The global printed circuit board (PCB) market size is estimated to grow by USD 26.8 billion from 2025-2029, according to Technavio. The market is estimated to grow at a CAGR of over 6.2%  during the forecast period. Rising adoption of smartphones is driving market growth, with a trend towards increasing inclination toward flexibility and industry automation. However, environmental concerns regarding PCBs poses a challenge. Key market players include APCT, China Circuit Technology Shantou Corp., Compeq Manufacturing Co. Ltd., Daedeok Electronics Co. Ltd., Dynamic Electronics Co. Ltd., Ibiden Co. Ltd., Jabil Inc., Korea Circuit Co. Ltd., NOK Corp., RAYMING TECHNOLOGY, Shenzhen Kinwong Electronic Co. Ltd, Shenzhen SenYan Circuit Co. Ltd., ShenZhen Wonderful Technology Co. Ltd, Shenzhen Zhongxinhua Electronics Co. Ltd., Sumitomo Electric Industries Ltd., TTM Technologies Inc., Victory Giant Technology (Huizhou) Co. Ltd., Vishal International, and Zhen Ding Technology Holding Ltd..

Key insights into market evolution with AI-powered analysis. Explore trends, segmentation, and growth drivers- View Free Sample PDF

Printed Circuit Board (PCB) Market Scope

Report Coverage

Details

Base year

2024

Historic period

2019 – 2023

Forecast period

2025-2029

Growth momentum & CAGR

Accelerate at a CAGR of 6.2%

Market growth 2025-2029

USD 26.8 billion

Market structure

Fragmented

YoY growth 2022-2023 (%)

5.8

Regional analysis

APAC, North America, Europe, Middle East and Africa, and South America

Performing market contribution

APAC at 88%

Key countries

China, Taiwan, South Korea, Japan, and India

Key companies profiled

APCT, China Circuit Technology Shantou Corp., Compeq Manufacturing Co. Ltd., Daedeok Electronics Co. Ltd., Dynamic Electronics Co. Ltd., Ibiden Co. Ltd., Jabil Inc., Korea Circuit Co. Ltd., NOK Corp., RAYMING TECHNOLOGY, Shenzhen Kinwong Electronic Co. Ltd, Shenzhen SenYan Circuit Co. Ltd., ShenZhen Wonderful Technology Co. Ltd, Shenzhen Zhongxinhua Electronics Co. Ltd., Sumitomo Electric Industries Ltd., TTM Technologies Inc., Victory Giant Technology (Huizhou) Co. Ltd., Vishal International, and Zhen Ding Technology Holding Ltd.

Market Driver

The Printed Circuit Board (PCB) market is experiencing significant growth due to the increasing demand for electronic devices, particularly those related to 5G, Internet of Things (IoT), Internet of Vehicles, and artificial intelligence. Consumer electronics, including smartphones, cameras, PCs, tablets, and smart devices, are major consumers of PCBs. Semiconductor plants and IC substrate manufacturers are key players in the market, supplying components such as integrated circuits, resistors, electrolytic capacitors, PLCs, transistors, and composite epoxy materials. Automobile applications, including battery control systems, engine timing systems, digital displays, audio systems, power relays, antilock brake systems, and smart devices, are also driving demand for PCBs. PCBs are essential in various industries, including communications, industrial automation, medical devices, and government institutions. The market is shifting towards flexible circuits, rigid-flex, and high-temperature performance PCBs, made of materials like glass fabric, FR-4, epoxy resin, and fiberglass. Environmental concerns, including electronic waste, lead, mercury, cadmium, brominated flame retardants, and other hazardous substances, are prompting the development of more sustainable PCB production methods. 3D printing and high-reliability PCBs are emerging trends in the market. The market’s future looks bright, with major players like Quanta Computer and Apple supplier continuing to drive demand for rigid PCBs. 

The automation of industries is a growing trend as businesses seek to enhance productivity and control costs. To maintain competitiveness, companies are adopting computers and machines for efficient control systems. Power consumption is a significant concern with the increasing power density of electric equipment. PCBs are essential in optimizing power usage within compact applications. Furthermore, the expanding use of cobots, industrial robots, and drones in automation will add value to this trend. PCBs enable optimal power consumption, contributing to overall efficiency and cost savings. 

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 Market Challenges

•         The Printed Circuit Board (PCB) market faces significant challenges as the demand for electronic devices continues to grow in sectors like 5G, Internet of Things (IoT), Internet of Vehicles, and consumer electronics. The integration of artificial intelligence and semiconductor plants in manufacturing processes increases the need for PCBs in various applications. However, concerns over electronic waste, lead, mercury, cadmium, and brominated flame retardants pose environmental challenges. PCBs are essential components in industries like communications, computers, and consumer electronics, including smartphones, cameras, and tablets. The automotive sector also relies on PCBs for battery control systems, engine timing systems, digital displays, audio systems, power relays, antilock brake systems, and smart devices. Manufacturers of PCBs must ensure their products meet the demands of various industries while addressing challenges such as high temperatures, mechanical stress, and thermal stability. PCBs are used in industrial automation, medical devices, and military applications, requiring high structural integrity and flame-retardant nature. Government institutions and industries like Quanta Computer, an Apple supplier, require rigid PCBs made of materials like glass fabric, FR-4, and epoxy resin. The glass transition temperature, dielectric strength, dimensional stability, and electrical insulating qualities are crucial factors in PCB production. The emergence of 3D printing and flexible circuits, such as Rigid Flex, presents opportunities for innovation and growth in the PCB market. However, ensuring PCB reliability and addressing electrical property degradation remains a challenge.

•         The Printed Circuit Board (PCB) market involves the production and disposal of boards made primarily of metal, plastic, ceramic, and copper. These components, particularly epoxy resins containing chlorine, can pose environmental concerns due to their non-biodegradable nature. The industry has shifted from lead solders to lead-free alternatives to minimize toxicity. Proper dismantling of components is necessary before disposing of PCBs. Recycling presents challenges such as temperature rises, mechanical shocks, and delamination. A standard PCB comprises 40% metal, 30% plastic, and 30% ceramic, with the board itself consisting of 28% copper, 33% resins, and 40% other materials.

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Segment Overview 

This printed circuit board (pcb) market report extensively covers market segmentation by  

Type 1.1 Multi-layer1.2 HDI1.3 Single sided1.4 Double sidedEnd-user 2.1 Communication network infrastructure2.2 IT and peripherals2.3 Automotive2.4 Consumer electronics2.5 OthersGeography 3.1 APAC3.2 North America3.3 Europe3.4 Middle East and Africa3.5 South America

1.1 Multi-layer-  Multi-layer Printed Circuit Boards (PCBs) hold a dominant position in the global market in 2024 due to their versatility and complexity. These boards consist of multiple layers of substrate material, interconnected by conductive channels. The rising demand for compact and high-performance electronic devices in sectors like telecommunications, automotive, and consumer electronics fuels the need for multi-layer PCBs. Notable applications include smartphones, which require space optimization and sophisticated electronics. Advanced networking equipment, such as routers and servers, also heavily utilize multi-layer PCBs to enhance functionality. Automotive Electronic Control Units (ECUs) benefit from their compact design, ensuring efficient performance in confined spaces. As technology advances, the demand for multi-layer PCBs is anticipated to escalate, solidifying their role as a key product in the PCB industry. Consequently, the multi-layer product segment is poised for growth, driving the expansion of the global PCB market throughout the forecast period.

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Research Analysis

The Printed Circuit Board (PCB) market is experiencing significant growth due to the increasing demand for electronic devices in various industries. The advent of 5G technology and the Internet of Things (IoT) are driving the market, with PCBs playing a crucial role in the development of telecommunication infrastructure. The IoT and Internet of Vehicles are also fueling the demand for PCBs in consumer electronics, including smartphones, cameras, and tripods. PCBs are essential components in the production of integrated circuits, resistors, electrolytic capacitors, PLCs, transistors, and composite epoxy, among others. Flexible circuits and rigid-flex PCBs are gaining popularity due to their ability to provide greater design flexibility and improved reliability. Fiberglass and other materials are used in the manufacturing of PCBs to ensure their durability and strength. Overall, the PCB market is poised for continued growth as the demand for electronic devices and advanced technologies continues to soar.

Market Research Overview

The Printed Circuit Board (PCB) market is witnessing substantial growth driven by the rising demand for electronic devices across multiple industries. With the rollout of 5G technology and the expansion of the Internet of Things (IoT), IoT gadgets, smartphones, cameras, PCs, tablets, and consumer electronics are becoming more advanced and sophisticated, driving up the need for high-quality PCBs. However, the production of PCBs involves the use of materials like lead, mercury, cadmium, brominated flame retardants, and semiconductor plants, which raise environmental concerns. PCBs are essential components in various industries, including automotive applications, where they are used in battery control systems, engine timing systems, digital displays, audio systems, power relays, antilock brake systems, and smart devices. In industrial automation, PCBs are used in computer communications, PLCs, transistors, and other electronic equipment, ensuring structural integrity and mechanical strength, even under high temperatures and mechanical stress. PCBs are also used in medical devices, industrial robots, and automation machinery, making them indispensable in various sectors. The market for PCBs is expected to grow further as millennials’ demand for advanced technology continues to rise. The PCB foundation material, including composite epoxy, fiberglass, and FR-4 materials, is crucial in ensuring electrical insulating qualities, dimensional stability, and thermal insulation properties. The use of 3D printing technology in PCB production is also gaining popularity, offering benefits like reduced production time and cost. However, the reliability of PCBs is crucial, and electrical property degradation can lead to significant issues. Government institutions play a vital role in regulating the production and disposal of electronic waste, ensuring the safe disposal of materials like lead, mercury, cadmium, and brominated flame retardants.

Table of Contents:

1 Executive Summary
2 Market Landscape
3 Market Sizing
4 Historic Market Size
5 Five Forces Analysis
6 Market Segmentation

TypeMulti-layerHDISingle SidedDouble SidedEnd-userCommunication Network InfrastructureIT And PeripheralsAutomotiveConsumer ElectronicsOthersGeographyAPACNorth AmericaEuropeMiddle East And AfricaSouth America

7 Customer Landscape
8 Geographic Landscape
9 Drivers, Challenges, and Trends
10 Company Landscape
11 Company Analysis
12 Appendix

About Technavio

Technavio is a leading global technology research and advisory company. Their research and analysis focuses on emerging market trends and provides actionable insights to help businesses identify market opportunities and develop effective strategies to optimize their market positions.

With over 500 specialized analysts, Technavio’s report library consists of more than 17,000 reports and counting, covering 800 technologies, spanning across 50 countries. Their client base consists of enterprises of all sizes, including more than 100 Fortune 500 companies. This growing client base relies on Technavio’s comprehensive coverage, extensive research, and actionable market insights to identify opportunities in existing and potential markets and assess their competitive positions within changing market scenarios.

Contacts

Technavio Research
Jesse Maida
Media & Marketing Executive
US: +1 844 364 1100
UK: +44 203 893 3200
Email: media@technavio.com
Website: www.technavio.com/

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SOURCE Technavio

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Lianlian DigiTech Returns to Money20/20 Asia to Expand Partnerships, Share Industry Trends, and Explore AI-Enabled Global Financial Infrastructure

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BANGKOK, April 26, 2026 /PRNewswire/ — Lianlian DigiTech, a leading global provider of digital payment services, was once again invited to participate in Money20/20 Asia, one of the world’s most influential fintech gatherings, held in Bangkok, Thailand from April 21 to 23. At the event, the company presented its latest developments in cross-border payment infrastructure, technology innovation, and ecosystem collaboration, offering a comprehensive view of its work enhancing global cross-border payment capabilities.

During the conference, Lianlian DigiTech announced a strategic partnership with UK-based fintech company USI Money to further strengthen its global cross-border payment network, delivering more efficient and reliable fund flows for merchants worldwide. Shen Enguang, Co-President of Lianlian DigiTech; Mark Ma, Head of Global Banking Partnership at LianLian Global; and Bryan Jiang, General Manager Hong Kong of LianLian Global, attended the event and engaged with representatives from international financial institutions. They shared perspectives on fintech trends and global payment innovation, offering industry insight into the continued evolution of a more integrated and interoperable cross-border payments ecosystem.

Building a Borderless Payment Network with Global Partners Including USI Money

At the event, Lianlian DigiTech formalized a strategic collaboration with London-headquartered USI Money to further develop its global payment infrastructure.

The partnership will focus on cross-border remittance and foreign exchange services, combining both companies’ technological capabilities and resources to deliver a one-stop payment and collection solution for global businesses. The offering is built to be efficient, secure, and cost-effective, improving overall fund flow efficiency and streamlining foreign exchange execution.

Syed Bukhari, Group Chief Business and Operating Officer at USI Money, said: “Our partnership with Lianlian will strengthen our remittance capabilities, creating greater value for our customers through broader network coverage and improved transaction performance.”

Bryan Jiang, General Manager Hong Kong of LianLian Global, said: “By leveraging the complementary strengths of our ecosystem partners in technology and compliance, Lianlian will continue to scale its global payment network and improve transaction efficiency. We remain committed to enhancing financial connectivity across global financial markets and delivering more efficient and reliable cross-border payment solutions for our customers.”

Founded in 2009 and listed on the Main Board of the Hong Kong Stock Exchange in 2024 (2598.HK), Lianlian DigiTech is a China-based, globally focused digital payment company with increasingly integrated AI capabilities across its platform. Guided by its mission of “Connecting the world, Empowering global commerce,” the company focuses on developing a trusted and scalable financial infrastructure. As of the end of 2025, Lianlian DigiTech has built a cross-border payment network covering more than 100 countries and regions, serving over 10.4 million customers worldwide.

USI Money is a foreign exchange and international remittance service provider offering tailored cross-border financial solutions for businesses and individuals. With competitive real-time exchange rates and efficient execution as its core strengths, the company delivers fast, secure, and reliable global fund transfers.

In addition, Lianlian DigiTech co-hosted a networking session with Unlimit during the event, providing a forum for industry dialogue. The session brought together a broad group of fintech partners to explore collaborative models and help foster a more connected ecosystem.

Industry Roundtables: Unlocking Layered Collaboration in AI-Driven Cross-Border Payments and Advancing Financial Inclusion in Emerging Markets

At the same time, Mark Ma and Bryan Jiang were invited to the themed roundtable discussions, where they shared insights drawn from industry practice and outlined new approaches to aligning fintech innovation with the global financial system.

At the roundtable on “Fintech and Banks,” Mark Ma noted that the global payment system is rapidly shifting from isolated capabilities to a layered, collaborative model. Banks continue to serve as the foundational infrastructure, responsible for clearing networks and liquidity management. Fintech firms like Lianlian, meanwhile, build on top of this foundation to deliver application-layer services for businesses, transforming complex cross-border payment channels into more accessible solutions that support a wider range of practical business scenarios. He also emphasized fintech’s growing role in compliance and value creation. By embedding risk controls and verification processes into technology workflows, fintech companies can act as compliance intermediaries, improving efficiency while filtering risk and enabling banks to operate more effectively at scale. Meanwhile, insights derived from transaction data and business flows allow for more precise evaluation of small and medium-sized businesses, shifting capital allocation from experience-based decisions to data-driven approaches and improving access to financial services.

At the roundtable titled “Different Worlds, Shared Challenges: Bridging Emerging Markets,” Bryan Jiang pointed out that the core of financial inclusion is shifting from scale of coverage to practical usability in everyday financial activity. The ability to serve underserved segments such as small and micro merchants and overseas workers in a sustained and reliable manner ultimately depends on continuous improvements in product design and operational capabilities. Using emerging markets as an example, Jiang explained that small and medium-sized businesses in these regions often face challenges such as difficult account setup, complex cross-border collections, high foreign exchange costs, and multi-layered tax requirements. Many existing solutions still follow traditional business-focused models, resulting in cumbersome KYB processes and lengthy review cycles that are misaligned with the asset-light, high-frequency, fast-turnover nature of these businesses. In response, Lianlian has lowered barriers to fund flows by offering local collection accounts, optimizing foreign exchange mechanisms, and improving settlement efficiency. The company has also restructured account architecture, streamlined review processes, and enhanced fund visibility, creating a more seamless and intuitive user experience that better aligns financial services with its clients’ business operations and day-to-day activities.

As digital technologies increasingly integrate with the real economy, innovations in AI and blockchain are reshaping the foundations of global financial services. Lianlian DigiTech has long invested in AI capabilities, global compliance, and the growth of its international service network. Its broad licensing coverage, regulatory track record, localized service capabilities, and technical reliability have earned the trust of regulators, customers, and partners worldwide.

Looking ahead, Lianlian DigiTech will continue to build on its cross-border expertise and compliance experience to further develop its AI capabilities and deepen collaboration with global partners. The company aims to extend its role beyond payment network services into more integrated financial infrastructure solutions. Lianlian DigiTech remains committed to serving as a trusted platform for global financial transactions in an increasingly digital environment, enabling businesses and individuals worldwide to access faster, more efficient, and more seamless cross-border financial services.

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SOURCE LianLian Global

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The Building & Furniture Category Highlights Sustainable and Human‑Centric Design at the 139th Canton Fair

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GUANGZHOU, China, April 26, 2026 /PRNewswire/ — Phase 2 of the 139th Canton Fair has seen the Building & Furniture category emphasize green Infrastructure and human-centric design.

A major highlight of the building and decorative materials section is the introduction of photovoltaic marble-textured cladding. This innovative surfacing material bridges the gap between high-end aesthetics and renewable energy. Unlike traditional solar panels that rely on glass, this non-opaque cladding uses precise microscopic structures to guide light to internal PV cells.

This technology offers 60% higher efficiency than traditional transparent solar systems while reducing carbon emissions by over 50%. Its ability to reproduce stone, wood, or brick‑like 3D textures allows architects to integrate power generation into a wide range of building styles without the industrial appearance of traditional solar panels.

Indoor environments are also becoming smarter and safer. Manufacturers are showcasing high-efficiency antibacterial surfacing, utilizing visible light catalysis to provide 24-hour protection against mold and bacteria. These advanced decorative papers and panels are becoming the new standard for high-end interior decoration, prioritizing long-term hygiene in residential and commercial spaces.

The sanitary ware sector is increasingly focused on the aging global population and those with limited mobility. A standout innovation is the electric lift-and-rotate shower chair. Designed for the dry-wet separation bathroom layout, it allows users to sit in a dry area and be safely rotated and lifted into the shower via remote control. This waterproof, low-voltage system provides dignity and independence for the elderly while reducing the physical strain on caregivers.

Hygiene and ease of maintenance have also seen a breakthrough with wall-mounted toilets. By moving the lid connection to the tank wall and adopting a mortise‑and‑tenon structure, the design eliminates the hard‑to‑clean areas where bacteria typically accumulate. Many of these units also incorporate ergonomic grab bars directly into the frame, blending safety with a minimalist aesthetic.

In the sports and leisure industry, the shift toward sustainability is seen in non-infill synthetic turf. This next-generation football grass eliminates the need for rubber granules or sand, providing a natural touch and superior shock absorption while significantly reducing maintenance costs and microplastic pollution.

All these innovations demonstrate how the Building & Furniture sector is advancing toward greener materials, smarter functionality, and more human‑centered design, setting new benchmarks for the future of living spaces.

For pre-registration, please click: https://buyer.cantonfair.org.cn/register/buyer/email?source_type=16

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Nexteer’s Global First Steer-by-Wire Goes into Production

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BEIJING, April 26, 2026 /PRNewswire/ — Nexteer Automotive helped a leading Chinese new energy vehicle (NEV) manufacturer bring the world’s first production passenger vehicle with a full drive‑by‑wire chassis to market. The vehicle features Nexteer’s steer‑by‑wire (SbW) system as a key enabler.

The SbW featured in this vehicle marks Nexteer’s first SbW system in mass production, representing a major step forward for the technology — moving from development and validation to full-scale production. Certified in late 2025, this system achieved the world’s first ASIL D functional safety approval from DAkkS (German Accreditation Body) through close collaboration with the OEM. This certification reflects global top-tier performance in fault diagnosis, redundancy, and safety monitoring. Key features include:

Multi-layered redundancy design: Dual controllers, dual power supplies, multiple communication links, and dual actuation paths — achieving redundancy at system, hardware, and software levels. This ensures that in the event of a single fault, the backup path takes over within milliseconds with no loss of steering function.Full‑scenario functional safety mechanism: Multi‑level monitoring and fault handling strategies covering sensors, controllers, actuators, and communication links.Variable steering ratio: Automatically adjusts steering angle and effort based on vehicle speed and driving mode, balancing agility and comfort.Intuitive road‑feel simulation technology: Software‑defined steering feedback delivers a more responsive and precise driving experience, adaptable to a wide range of driving scenarios.Open interface for autonomous driving: As a key actuation layer for ADAS and autonomous driving systems, it provides real‑time, precise control capabilities, supporting the development of intelligent transportation systems.

Steer-by-Wire: Electronic Signals Replace Mechanical Links, Flexible Configurations for Diverse Needs

By decoupling the mechanical link between the hand wheel and the road wheels, steer-by-wire replaces conventional mechanical connections with electronic signals and actuators — and is quickly becoming a foundational technology for next-generation intelligent chassis and autonomous driving platforms. As a motion control technology company with 120 years of engineering heritage, Nexteer offers a flexible, off-the-shelf portfolio of steering feel simulators and road wheel actuators. This modular approach allows us to meet the diverse needs of different vehicle models and driving scenarios efficiently and cost-effectively.

From Steering to Braking: Expanding Full-Stack Motion Control Capabilities

Building on its deep expertise in steering systems, Nexteer has expanded into braking with its Brake-by-Wire solution, the Electro-Mechanical Brake (EMB). EMB has completed full development and rigorous validation and is ready for mass production. Together with SbW, Brake-by-Wire (EMB), Rear-Wheel Steering, and the MotionIQ™ Software Suite make up Nexteer’s broader Motion-by-Wire™ portfolio.

With Nexteer, OEMs get more than steer-by-wire and brake-by-wire components: they get a complete, proven, production-ready and cost-effective drive-by-wire chassis motion control solution that’s shaping the future of the software-defined chassis and enabling faster development, lower costs and safter, smarter and more exciting driving experiences.

During Auto China 2026, we cordially invite you to visit Nexteer at Booth W1B03, Hall W1, China International Exhibition Center (Shunyi) in Beijing, to experience firsthand the breakthrough innovations of steer-by-wire and Motion-by-Wire™ technologies.

ABOUT NEXTEER AUTOMOTIVE

Nexteer Automotive (HK 1316) is a global leading motion control technology company accelerating mobility to be safe, green and exciting. Our innovative portfolio supports Motion-by-Wire™ chassis control, including electric and hydraulic power steering systems, steer-by-wire and rear-wheel steering systems, steering columns and intermediate shafts, driveline systems, software solutions and brake-by-wire. Celebrating 120 years of automotive innovation in 2026, Nexteer builds on a strong legacy of engineering excellence while continuing to shape the future of mobility. The company solves motion control challenges across all megatrends – including electrification, software/connectivity, ADAS/automated driving and shared mobility – for global and domestic OEMs around the world including BMW, Ford, GM, RNM, Stellantis, Toyota and VW, as well as automakers in India and China including BYD, Xiaomi, ChangAn, Li Auto, Chery, Great Wall, Geely, Xpeng and others. www.nexteer.com  

Links to Nexteer Media Center

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