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Printed Circuit Board (PCB) Market to Grow by USD 26.8 Billion by 2029, Rising Smartphone Adoption Boosts Market, Report on AI Impact on Market Trends – Technavio

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NEW YORK, Feb. 5, 2025 /PRNewswire/ — Report on how AI is redefining market landscape – The global Printed circuit board (PCB) market size is estimated to grow by USD 26.8 billion from 2025-2029, according to Technavio. The market is estimated to grow at a CAGR of over 6.2%  during the forecast period. Rising adoption of smartphones is driving market growth, with a trend towards increasing inclination toward flexibility and industry automation. However, environmental concerns regarding pcbs  poses a challenge. Key market players include APCT, China Circuit Technology Shantou Corp., Compeq Manufacturing Co. Ltd., Daedeok Electronics Co. Ltd., Dynamic Electronics Co. Ltd., Ibiden Co. Ltd., Jabil Inc., Korea Circuit Co. Ltd., NOK Corp., RAYMING TECHNOLOGY, Shenzhen Kinwong Electronic Co. Ltd, Shenzhen SenYan Circuit Co. Ltd., ShenZhen Wonderful Technology Co. Ltd, Shenzhen Zhongxinhua Electronics Co. Ltd., Sumitomo Electric Industries Ltd., TTM Technologies Inc., Victory Giant Technology (Huizhou) Co. Ltd., Vishal International, and Zhen Ding Technology Holding Ltd..

Key insights into market evolution with AI-powered analysis. Explore trends, segmentation, and growth drivers- View Free Sample PDF

Printed Circuit Board (PCB) Market Scope

Report Coverage

Details

Base year

2024

Historic period

2019 – 2023

Forecast period

2025-2029

Growth momentum & CAGR

Accelerate at a CAGR of 6.2%

Market growth 2025-2029

USD 26.8 billion

Market structure

Fragmented

YoY growth 2022-2023 (%)

5.8

Regional analysis

APAC, North America, Europe, Middle East and Africa, and South America

Performing market contribution

APAC at 88%

Key countries

China, Taiwan, South Korea, Japan, and India

Key companies profiled

APCT, China Circuit Technology Shantou Corp., Compeq Manufacturing Co. Ltd., Daedeok Electronics Co. Ltd., Dynamic Electronics Co. Ltd., Ibiden Co. Ltd., Jabil Inc., Korea Circuit Co. Ltd., NOK Corp., RAYMING TECHNOLOGY, Shenzhen Kinwong Electronic Co. Ltd, Shenzhen SenYan Circuit Co. Ltd., ShenZhen Wonderful Technology Co. Ltd, Shenzhen Zhongxinhua Electronics Co. Ltd., Sumitomo Electric Industries Ltd., TTM Technologies Inc., Victory Giant Technology (Huizhou) Co. Ltd., Vishal International, and Zhen Ding Technology Holding Ltd.

Market Driver

The Printed Circuit Board (PCB) market is experiencing significant growth due to the increasing demand for electronic devices, particularly in sectors like 5G, Internet of Things (IoT), Internet of Vehicles, and consumer electronics. Key trends include the use of PCBs in smartphones, cameras, PCs, tablets, and consumer gadgets. However, environmental concerns surrounding electronic waste and the use of hazardous materials like lead, mercury, cadmium, and brominated flame retardants are driving the industry towards greener alternatives. Semiconductor plants and IC substrate manufacturers are investing in Rigid PCBs, Flexible Circuits, and Rigid Flex to meet the demands of automobile applications, battery control systems, engine timing systems, digital displays, audio systems, power relays, and antilock brake systems. The market is also witnessing in demand from smart devices and IoT gadgets, with companies like Quanta Computer and Apple being major suppliers. The PCB foundation material market is evolving, with a shift towards composite epoxy, fiberglass, and FR-4 materials. New technologies like 3D printing and industrial automation are transforming PCB production processes. Government institutions and industrial robots are also major consumers of PCBs for their high-temperature performance, structural integrity, and mechanical stress resistance. The PCB market is expected to continue growing, driven by the increasing demand for electronic equipment and the reliability of PCBs in various applications. However, challenges such as electrical property degradation and thermal stability must be addressed to ensure PCB reliability. 

The automation of industries is a growing trend as companies integrate computers and machines for improved control systems. To remain competitive, businesses must adopt automation, enabling optimal efficiency in productivity, operation costs, product quality, and safety. With the rising power density of electrical equipment, efficient power consumption is crucial. PCBs are essential in ensuring power efficiency within compact applications. Furthermore, the increasing adoption of cobots, industrial robots, and drones will enhance industrial automation, contributing to overall industry advancement. 

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Market Challenges

The Printed Circuit Board (PCB) market faces significant challenges as the demand for electronic devices, particularly those integrating 5G, Internet of Things (IoT), Internet of Vehicles, and artificial intelligence. PCBs are essential components in consumer electronics, including smartphones, cameras, PCs, tablets, and more. However, the production of PCBs involves the use of materials like lead, mercury, cadmium, and brominated flame retardants, which pose environmental concerns and regulatory challenges. Semiconductor plants and IC substrate manufacturers must address these issues while ensuring high-quality PCBs for industries such as communications, computer, and automobile applications. Flexible circuits, rigid flex, and composite epoxy materials like fiberglass and FR-4 are used in various applications, from digital displays and audio systems to battery control systems and engine timing systems. As the market evolves, new technologies like 3D printing and industrial automation emerge, offering potential solutions to the challenges of PCB production and reliability. Companies like Quanta Computer, an Apple supplier, and automobile manufacturers rely on rigid PCBs for their structural integrity and high-temperature performance. Government institutions and industries focusing on industrial robots and automation machinery also depend on PCBs for their electrical property degradation and thermal stability. In conclusion, the PCB market faces numerous challenges, including environmental concerns, regulatory pressures, and the need for high-performance materials. To meet these challenges, companies must focus on developing sustainable manufacturing processes and innovative materials, such as glass fabric, epoxy resin, and advanced fiberglass composites, to ensure the reliability and structural integrity of PCBs in various applications.The Printed Circuit Board (PCB) market involves the production and disposal of boards made up of hazardous components, primarily metal, plastic, ceramic, and copper, with epoxy resins containing a significant amount of chlorine. Previously, lead solders were used in PCBs, but the industry has shifted towards lead-free alternatives due to environmental concerns. Proper dismantling of components is necessary before disposing of the PCB. Recycling efforts face challenges such as temperature rises, mechanical shocks, and delamination. A standard PCB consists of 40% metal, 30% plastic, and 30% ceramic, with the PCB itself comprising 28% of these materials. The industry is continually seeking sustainable solutions to minimize environmental impact.

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Segment Overview 

This printed circuit board (pcb) market report extensively covers market segmentation by  

TypeMulti-layerHDISingle SidedDouble SidedEnd-userCommunication Network InfrastructureIT And PeripheralsAutomotiveConsumer ElectronicsOthersGeographyAPACNorth AmericaEuropeMiddle East And AfricaSouth America

1.1 Multi-layer-  Multi-layer Printed Circuit Boards (PCBs) continue to dominate the global market in 2024 due to their versatility and intricacy. These boards consist of multiple layers of substrate material interconnected by conductive pathways. The surging demand for compact and high-performance electronic devices in sectors like telecommunications, automotive, and consumer electronics fuels the need for multi-layer PCBs. Smartphones and advanced networking equipment, such as routers and servers, are prime applications. In the automotive industry, electronic control units (ECUs) benefit from the compact design of multi-layer PCBs, enabling efficient functionality in confined spaces. With technological advancements, the demand for multi-layer PCBs is projected to escalate, solidifying their role as a key product and driving the expansion of the global PCB market.

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Research Analysis

The Printed Circuit Board (PCB) market is experiencing significant growth due to the increasing demand for electronic devices in various sectors. The advent of 5G technology and the Internet of Things (IoT) are driving the market, with applications extending to the Internet of Vehicles (IoV), artificial intelligence (AI), and consumer electronics. Smartphones, cameras, and tripods are some of the consumer electronics that rely heavily on PCBs. In the industrial sector, PCBs are used in telecommunication infrastructure, PLCs, and transistors. PCBs come in various forms, including rigid, flexible, and rigid-flex, made from materials like composite epoxy and fiberglass. Integrated circuits, resistors, electrolytic capacitors, and transistors are essential components of PCBs. Shennan Circuits and IC Substrate are notable manufacturers of PCBs and IC substrates, respectively.

Market Research Overview

The Printed Circuit Board (PCB) market is witnessing significant growth due to the increasing demand for electronic devices in various sectors such as 5G, Internet of Things (IoT), Internet of Vehicles, artificial intelligence, consumer electronics, and more. PCBs are essential components in these devices, including smartphones, cameras, PCs, tablets, and more. However, the production of PCBs involves the use of materials like lead, mercury, cadmium, and brominated flame retardants, which have environmental concerns. Semiconductor plants, IC substrate manufacturers, and flexible circuits producers are key players in the PCB industry. PCBs are used in various applications, including communications equipment, industrial automation, medical devices, automobile applications, and more. PCBs are made of composite epoxy and fiberglass, with high dielectric strength, dimensional stability, electrical insulating qualities, mechanical strength, flame-retardant nature, thermal insulation properties, and high-temperature performance. PCB production involves various processes, including 3D printing, and the foundation material used can affect the reliability and electrical property degradation of the PCB. Government institutions and industrial robots are significant consumers of PCBs, and the market is expected to grow further due to the increasing demand for smart devices and IoT gadgets. Millennials’ preference for advanced technology is also driving the market’s growth. PCBs are essential for the structural integrity and mechanical stress resistance of electronic equipment, making them a critical component in various industries.

Table of Contents:

1 Executive Summary
2 Market Landscape
3 Market Sizing
4 Historic Market Size
5 Five Forces Analysis
6 Market Segmentation

TypeMulti-layerHDISingle SidedDouble SidedEnd-userCommunication Network InfrastructureIT And PeripheralsAutomotiveConsumer ElectronicsOthersGeographyAPACNorth AmericaEuropeMiddle East And AfricaSouth America

7 Customer Landscape
8 Geographic Landscape
9 Drivers, Challenges, and Trends
10 Company Landscape
11 Company Analysis
12 Appendix

About Technavio

Technavio is a leading global technology research and advisory company. Their research and analysis focuses on emerging market trends and provides actionable insights to help businesses identify market opportunities and develop effective strategies to optimize their market positions.

With over 500 specialized analysts, Technavio’s report library consists of more than 17,000 reports and counting, covering 800 technologies, spanning across 50 countries. Their client base consists of enterprises of all sizes, including more than 100 Fortune 500 companies. This growing client base relies on Technavio’s comprehensive coverage, extensive research, and actionable market insights to identify opportunities in existing and potential markets and assess their competitive positions within changing market scenarios.

Contacts

Technavio Research
Jesse Maida
Media & Marketing Executive
US: +1 844 364 1100
UK: +44 203 893 3200
Email: media@technavio.com
Website: www.technavio.com/

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Greater San Diego Science and Engineering Fair Students Win Big at the 75th California Science and Engineering Fair

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SAN DIEGO, April 26, 2026 /PRNewswire/ — The 75th California Science and Engineering Fair (CSEF) took place April 11–12 at California Lutheran University in Thousand Oaks, bringing together 900 of the best of 1st place winners from regional competitions covering 58 counties across the state, including the Greater San Diego Science and Engineering Fair (GSDSEF). GSDSEF students earned 40 awards at the event, including two of only six highly coveted spots to the prestigious Regeneron International Science and Engineering Fair (ISEF). Seven students earned 1st Place awards in the categories of Biochemistry and Molecular Biology, Chemistry, Cognitive Science, Microbiology, Physics and Astronomy, and Zoology. In addition, one student won the Saban Family Foundation Scholar Prize, while another won the South Coast AQMD Air Quality Award and A&WMA Environmental Leadership Award. CSEF is the oldest science fair west of the Mississippi River and the highest level competition in the state.

Top winners were:

Arya Bhatt, Grade 7, Oak Valley Middle School, South Coast AQMD Air Quality Award, A&WMA Environmental Leadership Award, “Context Aware Real Time Air Quality Prediction Using Machine Learning”.

Joie Green, Grade 8, Muirlands Middle School, 1st Place, “Soon I will be Invisible: How to Direct Energy with Topological Metamaterials”.

Maggie Hao, Grade 10, The Bishop’s School, 1st Place, “Harnessing Tardigrade Genes to Enhance Bacterial Biosensors for Heavy Metal Pollutant Detection”.

Uma Kattamuri, Grade 7, Oak Valley Middle School, 1st Place, “Elevated CO2 During Kalanchoe pinnata Growth Reveals Enhanced Antiproliferative and Synergistic Therapies”.

Sonika Dhenuva Konda, Grade 11, Del Norte High School, Saban Family Foundation Scholar Prize, “Adaptive Swarm Coordination for Wildfire Control via Q-Learning Tuned PSO with Quantum-Inspired Coupling”.

Emma Liu, Grade 11, The Bishop’s School, ISEF Finalist, 1st Place, “Defining 3D Phenotypic Cell States of Polymorphonuclear Neutrophils via Novel Computational Pipeline”.

Sharvi Mahajan, Grade 8, Bernardo Heights Middle School, 1st Place, “Evaluating Predictive EEG Theta/Beta Features in Adult ADHD via Machine Learning”.

Sydney O’Donnell, Grade 8, The Rhoades School, 1st Place, TFJIC, “Effects of Marigold Versus Chlorella Supplementation on Yolk Lutein Content”.

Ihan Sung, Grade 11, Eastlake High School, ISEF Finalist, 1st Place, “Renewable Ammonia Electrochemical Synthesis by Glow Discharge with an Iron Based Catalyst”.

Full results and project showcase available online.

About the GSDSEF

Since 1955, the Greater San Diego Science and Engineering Fair (GSDSEF) has provided an inspiring experience in science and engineering for tens of thousands of San Diego and Imperial County students, motivating them to pursue careers in science, technology, engineering, and mathematics. This regional competition challenges students to go beyond classroom studies to do independent research – to ask compelling questions, to design and implement innovative solutions, and to present and defend results to judges who are professionals in their fields. The GSDSEF brings together 800 of the best middle and high school students, 400+ judges who are professionals in their fields and over 60 professional societies and organizations, with $40k in prizes awarded.

The GSDSEF fosters creativity and innovation through inquiry, celebrates students’ STEM achievements, and showcases how young minds can make an impact in the present and future. Many of these student scientists are conducting world-class research and conducting groundbreaking experiments in fields ranging from Astronomy to Zoology, such as the discovery of cures for diseases, formulations of new vaccines, cancer research, applying AI to enhance medical diagnoses, using biomimicry for water conservation, novel drone technology, advances in micro robotics and autonomous driving technology. The GSDSEF is the highest-level STEM competition in the region and one of the oldest, most respected and competitive in the world. The GSDSEF is a 501(c)(3) organization. Learn more at gsdsef.org and follow us on LinkedIn and Instagram.

Copyright © 2026 Greater San Diego Science and Engineering Fair. All rights reserved.

Media Contact:
Sany Zakharia
sany.zakharia@gsdsef.org

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Innowise Named to 2026 CRN Tech Elite 250 List By The Channel Company

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WARSAW, Poland, April 26, 2026 /PRNewswire-PRWeb/ — Innowise has officially secured a position on CRN’s 2026 Tech Elite 250. This annual ranking identifies IT solution providers across the US and Canada that have achieved top-tier status within the partner programs of the industry’s leading technology vendors. The inclusion follows a period of verified growth in technical proficiency and a focus on high-impact engineering.

“Innowise concentrates on creating scalable, resilient architectures that produce measurable benefits for our clients. The honor of being recognized by CRN highlights the commitment of our experts to maintain high standards in highly competitive markets,” said Dmitry Nazarevich, CTO at Innowise.

About the Tech Elite 250

The Tech Elite 250 is a directory of companies recognized as having the highest level of partnership and certifications within the global IT ecosystem. In order to reach the final list, the provider must hold the most advanced technical credentials from vendors like AWS, Cisco, Dell, HPE, IBM, Intel, Nutanix, and Nvidia.

This directory serves as a verified ledger for enterprise clients who need to orchestrate complex hardware and software stacks without letting legacy environments rot. Holding these certifications is mandatory to stop the cash bleed caused by inefficient infrastructure and unoptimized cloud usage.

About Innowise

Founded in 2007, Innowise is a global software engineering and IT consulting center. The company is focused on developing high-value technologies, including artificial intelligence, data engineering, and cloud computing. Innowise crafts technological solutions for companies across 40+ domains in order to assist them in updating, creating, and modernizing their digital ecosystems.

Innowise specializes in using established technologies and modular approaches to enable organizations to expand or shift their operations while retaining complete control over all their physical and intangible assets.

Media Contact

Lizaveta Piaskova, Innowise, 48 48 787 027 706, lizaveta.piaskova@innowise.com, innowise.com

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Neusoft Showcases Full-Stack & Global Innovations at Auto China 2026

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BEIJING, April 26, 2026 /PRNewswire/ — At Auto China 2026, Neusoft Corporation hosted a press conference on April 25th and announced three key strategic moves: the iteration of Neusoft OneCoreGo® Global In-Vehicle Intelligent Mobility Solution 7.0, the launch of Neusoft NAGIC.AI Cockpit Software Platform, and the strategic upgrade of its subsidiary, Neusoft Smart Go. By leveraging full-stack technology and a global ecosystem to drive innovation and empowerment, Neusoft is transforming vehicles into proactive, connected and collaborative mobile intelligent spaces.

OneCoreGo® Global In-Vehicle Intelligent Mobility Solution 7.0: An Evolved AI Companion for Global Intelligent Mobility

Intelligent mobility requires proactive perception, scenario integration, and global connectivity to meet personalized user needs and complex driving scenarios. Neusoft, whose products cover over 130 countries and regions worldwide, addresses these challenges with its OneCoreGo® Global In-Vehicle Intelligent Mobility Solution 7.0 through AI-driven innovation and global ecosystem collaboration. Powered by One Mate’s cross-agent collaboration and a sub-product matrix including One Map, One Sight, One Cloud, One Pay, One Store, One Link, and One Guard, the solution delivers full-link global mobility services spanning navigation, in-cabin AR, payment, app ecosystem services, connectivity and security. By breaking down functional silos, it streamlines multi-step operations into a single “depart” command, leveraging full-stack AI technology across perception, decision-making, interaction, and execution processes.

Guan Xin, Vice President of Neusoft and General Manager of Neusoft Automotive Innovative Solutions Division, said, “Adhering to the core principles of AI and globalization, OneCoreGo® 7.0 keeps innovating, evolving into a globally intelligent mobility companion that truly understands user needs.”

To enhance driving safety and mobility efficiency, OneCoreGo® 7.0 has also comprehensively upgraded its sub-products: One Map Global Navigation newly introduces 3D city effects, 3D lane-level maps, and traffic light guidance, offering dedicated solutions for two-wheelers and commercial vehicles as well. One Sight AR For Car improves navigation display effects, reducing instances of taking wrong routes. One Pay In-Vehicle Payment achieves over 90% payment coverage for parking services across core European cities. Combined with One Cloud’s global compliance cloud monitoring platform and One Guard’s full-stack vehicle networking security services, it creates a truly comprehensive OneCoreGo® Global In-Vehicle Intelligent Mobility Solution.

Neusoft NAGIC.AI Cockpit Software Platform: Dual-track Architecture for AI Integration in Every Vehicle

Amid the AI-driven transformation of the automotive industry, the market faces two challenges: limited computing power in legacy vehicles and high adaptation difficulties for next-gen models. Neusoft’s NAGIC.AI Cockpit Software Platform adopts a flexible “distributed + centralized” dual-track architecture approach. For existing vehicle models, it introduces the AI BOX solution, rapidly boosting computing power via external AI computing units, significantly reducing upgrade costs and timelines. For new vehicle models built on next-gen central computing platforms, Neusoft provides a full-stack AI cockpit software product suite, meeting automakers’ stringent requirements for system stability, reliability, and full-domain control.

Pang Hongyan, Vice President of Neusoft and General Manager of the Automotive Intelligent Software Division, said, “Our dual-track architecture enables every vehicle to embrace AI and enjoy an intelligent future. Both existing models and new-generation vehicles can find the most suitable path to intelligentization.”

Moreover, Neusoft’s NAGIC.AI Cockpit Software Platform features scenario-based, human-centric AI Agents seamlessly integrating driving safety, occupant care services, intelligent assisted driving and in-cabin entertainment. Neusoft also collaborates with global ecosystem partners to drive intelligent upgrades of in-cabin interaction products, fostering a more open and dynamic intelligent cockpit ecosystem.

Strategic Upgrade of Neusoft Smart Go: A World-leading Provider of Full-Domain Upper-Body Electronics Solutions for Intelligent Vehicles

Aligning with the trend of E/E architecture evolution from distributed control to “central computing + zonal control”, Neusoft Smart Go, a subsidiary of Neusoft in the field of intelligent vehicle connectivity, has completed a strategic upgrade, aiming to become a global leader in full-domain upper-body electronics solutions for intelligent vehicles.

This strategic upgrade positions Neusoft Smart Go to focus on full-domain scenarios in upper-body electronics, building a product matrix covering full-category in-vehicle electronics solutions, including central computing platforms, cockpit-driving-parking integration, intelligent cockpits, intelligent communications, intelligent audio systems, and zonal control units, and pioneering the integration of large model algorithms.

Jian Guodong, Senior Vice President of Neusoft and CEO of Neusoft Smart Go, said, “This strategic upgrade represents a significant leap from partial focus to comprehensive layout. Through our dual-track strategy of high-end cutting-edge solutions and mature standardized products, we can flexibly meet the mass production needs of vehicle models across different regions and price segments worldwide.” Neusoft Smart Go will provide mass-producible, adaptable hardware-software integrated solutions, empowering global automakers in achieving intelligent transformation.

Neusoft’s President, Mr.Gai Longjia stated, “In the future, Neusoft Smart Go will create stronger synergy with Neusoft Corporation by sharing internal technologies and capabilities while responding jointly to external demands. This specialized yet collaborative model will preserve business unit’s agility and expertise while enhancing Neusoft’s full-stack technological advantages.”

As a trusted partner in a smarter world, Neusoft is committed to collaborating with global automakers and ecosystem partners to build an open and inclusive intelligent automotive community together for the future of global mobility.

For more information about Neusoft, please visit www.neusoft.com.

 

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