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Advanced Semiconductor Packaging Market Forecast to Grow at 7.5% CAGR Through 2031 – Find Out Why | Valuates Reports

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BANGALORE, India, April 24, 2025 /PRNewswire/ — Advanced Semiconductor Packaging Market is Segmented by Type (Fan-Out Wafer-Level Packaging (FO WLP), Fan-In Wafer-Level Packaging (FI WLP), Flip Chip (FC), 2.5D/3D), by Application (Telecommunications, Automotive, Aerospace and Defense, Medical Devices, Consumer Electronics).

The Advanced Semiconductor Packaging Market was valued at USD 18090 Million in the year 2024 and is projected to reach a revised size of USD 29800 Million by 2031, growing at a CAGR of 7.5% during the forecast period.

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Major Factors Driving the Growth of Advanced Semiconductor Packaging Market:

The advanced semiconductor packaging market is poised for robust, double digit growth through 2030 as value creation shifts decisively from front end scaling to back end integration. Demand for heterogeneous chiplet architectures, high bandwidth memory stacks, ultra thin fan out modules, and automotive grade power packages is expanding. Continuous 5 G densification, cloud AI acceleration, and electric vehicle adoption keep volumes rising and average selling prices escalating, even as substrate and equipment supply tightens.

With sustainability goals favouring yield efficient known good die assembly and governments underwriting regional resiliency, the market is set to outpace the broader semiconductor industry, cementing advanced packaging as the chief engine of performance and profitability in the silicon value chain.

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TRENDS INFLUENCING THE GROWTH OF THE ADVANCED SEMICONDUCTOR PACKAGING MARKET:

Flip chip packaging energises the advanced semiconductor packaging landscape by eliminating long wire bonds and replacing them with dense arrays of solder bumps that connect the die face down to the substrate. The ultra short electrical path lowers inductance, cuts signal latency, and boosts bandwidth—precisely the performance mix demanded by AI accelerators, high end mobile SoCs, and data centre GPUs. FC’s excellent thermal profile distributes heat efficiently across copper pillars, enabling higher power envelopes without throttling. Yield learning on 3 nm and 2 nm nodes has driven down bump pitch variability, making FC the default choice for heterogeneously integrated chiplets as well as monolithic dies. As fabless giants push multi die systems, FC capacity expansion directly converts into market wide revenue uplift.

Fan out WLP sidesteps the substrate entirely, redistributing I/O in epoxy mould compound and delivering ultra thin packages ideal for space constrained devices. By decoupling die size from I/O count, FO WLP unlocks high pin count connectivity for wearables, true wireless earbuds, RF front ends, and millimetre wave 5 G modules. The ability to singulate multiple known good dies on a reconstituted wafer trims test time and boosts overall yield. Simpler stack ups translate to fewer materials and lower assembly cost relative to FC substrates, extending advanced packaging economics to mid range handsets and IoT sensors. As panel level fan out lines ramp in Korea, Taiwan, and China, the technology’s keen cost per area advantage is widening its addressable market and fuelling sustained revenue growth.

Automotive electrification and autonomy require rugged, high reliability packaging that survives extreme temperature cycles, vibration, and humidity over 15 plus year lifetimes. ADAS domain controllers, radar, LiDAR, battery management ICs, and power inverters now employ advanced packaging—embedded die, FC CSP, and molded array packages—to meet stringent AEC Q100 Grade 0 standards. Meanwhile, zonal E/E architectures multiply the number of high speed SerDes links in a vehicle, driving demand for advanced substrates with sub 10 µm line width/spacing. Automakers’ push for over the air update capability places server class processors under the hood, intensifying the need for high density interposers and chiplet based designs. As electric vehicle volumes climb, long term supply agreements between tier one OSATs and OEMs lock in robust, multi year growth for advanced semiconductor packaging.

The shift from monolithic scaling to heterogeneous integration is propelling demand for advanced packaging as the primary vehicle for combining logic, memory, analog, and photonics dies in a single system in package. High density interposers, hybrid bonding, and through silicon vias allow designers to mix process nodes cost effectively, squeezing more functionality into smaller footprints while sidestepping reticle limits and yield cliff risks. The move brings architectural freedom that conventional wire bond could never match, positioning advanced packaging as a critical enabler of continued silicon centric innovation despite slowing Moore’s law node progression.

Ubiquitous 5 G base stations, open RAN radios, and edge AI gateways rely on RF front end modules and high performance baseband processors that can only meet thermal and signal integrity targets through advanced fan out, FC BGA, or system in package approaches. Carrier aggregation, beam forming, and ultra low latency requirements all drive higher bandwidth density, tighter phase noise, and harsher heat loads—parameters that modern packaging resolves far better than legacy solutions. As telcos spread mmWave and sub 6 GHz coverage, orders for multi chip, antenna in package modules scale in lock step with network densification.

Large language model training, graph analytics, and computational lithography require massive chip to chip bandwidth inside servers. Silicon interposers with micro bump pitches under 40 µm deliver terabytes per second of parallel throughput between logic tiles and HBM stacks, slashing energy per bit and shrinking board level congestion. Hyperscalers’ appetite for AI accelerators forces OSATs to develop bigger organic substrates, advanced underfills, and multi bridge configurations, translating directly into higher ASPs and multi year capacity investments.

Power electronics for traction inverters and fast chargers call for wide bandgap GaN and SiC dies co packaged with control ICs on high thermal conductivity substrates such as AlN or SiN. Advanced packaging enables epoxy mould compound alterations to withstand 500 A per phase, while integrated heat spreaders lower junction temperatures. Sensor fusion ECUs and domain controllers likewise consolidate into high pin count packages, further expanding automotive share of the total addressable market.

Demand for sleeker smartphones, AR glasses, and health monitoring wearables compresses z height budgets, pushing OEMs toward fan in WLP, FO PLP, and moulded core embedded packages. The reduction in discrete components per board frees up battery space, enhances water resistance, and shortens design cycles. As brands fight for feature differentiation within pocket size constraints, advanced packaging’s ability to co integrate MEMS, PMICs, and RF circuits sustains its growth momentum.

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ADVANCED SEMICONDUCTOR PACKAGING MARKET SHARE:

Asia Pacific dominates volume with Taiwan and South Korea housing the world’s largest OSATs and foundry adjacent packaging lines, but mainland China’s accelerated investment is narrowing the gap. North America leads in advanced interposer R&D thanks to hyperscaler co development, while Europe’s automotive strength sustains steady demand for rugged packages. Emerging hubs in India and Southeast Asia benefit from supply chain diversification, collectively creating a vibrant, geographically stratified demand profile.

Key Companies:

IMF GmbHAmkorSPILIntel Corp.JCETASETFMETSMCHuatianPowertech Technology IncUTACNepesWalton Advanced EngineeringKyoceraChipbondChipMOS

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Semiconductor Advanced Packaging Market was estimated to be worth USD 15670 Million in 2023 and is forecast to a readjusted size of USD 26270 Million by 2030 with a CAGR of 7.5% during the forecast period 2024-2030.Semiconductor Advanced Packaging Materials Market was valued at USD 13610 Million in the year 2024 and is projected to reach a revised size of USD 28050 Million by 2031, growing at a CAGR of 10.2% during the forecast period.Advanced Packaging Inspection and Metrology Equipment Market was valued at USD 817 Million in the year 2024 and is projected to reach a revised size of USD 1530 Million by 2031, growing at a CAGR of 9.5% during the forecast period.Semiconductor Packaging and Test Systems Market was valued at USD 14540 Million in the year 2024 and is projected to reach a revised size of USD 21780 Million by 2031, growing at a CAGR of 6.0% during the forecast period.Advanced Packaging Inspection Systems market is projected to grow from USD 419.7 Million in 2024 to USD 723.5 Million by 2030, at a Compound Annual Growth Rate (CAGR) of 9.5% during the forecast period.Mold Release Film for Semiconductor Packaging MarketAdvanced Packaging Lithography Equipment MarketAdvanced Packaging Interconnect Electroplating Solution MarketTin Plating Solution for Semiconductor Packaging Market3D-IC Packaging Market was valued at USD 18470 Million in the year 2024 and is projected to reach a revised size of USD 29850 Million by 2031, growing at a CAGR of 7.2% during the forecast period.Advanced Packaging for Automotive Chips market was valued at USD 463 Million in 2023 and is anticipated to reach USD 969.1 Million by 2030, witnessing a CAGR of 11.7% during the forecast period 2024-2030.

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Technology

BC Token Hits $0.02, Setting a New All-Time High

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July 23, 2026

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$BC has risen nearly 70% since April as BC Engine continues to expand the token‘s utility across the BC.GAME ecosystem

BELIZE CITY, Belize, July 22, 2026 /PRNewswire/ — BC Token ($BC), the ecosystem token of BC.GAME, reached $0.02 on July 23, setting a new all-time high and extending its recent upward price movement.

According to CoinGecko, $BC reached the $0.02 milestone after moving steadily into a higher price range over the past several weeks. The token previously recorded a high of around $0.01561 on July 17 before continuing its upward movement.

Compared with its price of approximately $0.01181 on April 12, $BC has increased by nearly 70%. The latest milestone is also part of a series of new price records reached by the token since the launch of BC Engine in April.

Alongside the price growth, BC.GAME has continued to expand the practical use of $BC across its platform ecosystem.

Through BC Engine, users can allocate eligible $BC to the platform’s reward system and receive BCD rewards distributed on an hourly basis. Users can also view their allocated tokens, accumulated rewards and participation data directly through the BC Engine interface.

The system is designed to connect $BC participation with activity generated by products and partners across the wider BC.GAME ecosystem.

BC Originals, Croco Gaming and sports betting technology provider BETBY have already been integrated as Engine Nodes. Contributions from participating products and partners help support the BC Engine reward pool, creating a direct connection between platform activity, user participation and token utility.

“Reaching $0.02 is an important milestone for $BC, but price is only one part of the ecosystem’s continued development,” a BC.GAME spokesperson said. “Our focus remains on expanding the token‘s practical uses and connecting it more closely with products, rewards and user participation across the platform.”

The $BC ecosystem also includes separate buyback and token-burning mechanisms.

A portion of the tokens acquired through BC.GAME’s ongoing buyback activity may be redistributed to eligible active users through features such as Instant Bonus. The buyback programme operates separately from the token-burning mechanism.

Token burning is primarily connected to the BC Engine unlocking process. When users unlock $BC less than seven days after allocating it to BC Engine, 1% of the unlocked amount is permanently burned. Users who wait at least seven days can unlock the full amount without triggering a burn.

BC.GAME plans to introduce additional products and Engine Nodes while continuing to improve the visibility of reward distributions, token burns and other related on-chain activity.

The platform will also explore further uses for $BC across original games, sports betting and digital-asset reward experiences as the ecosystem continues to develop.

More information about BC Engine and the $BC ecosystem is available at bc.game/bc.

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Technology

BinBase Enhances 2026 USA BIN Intelligence for Durbin Compliance, Debit Network Routing, and Level 2/3 Interchange Savings

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July 23, 2026

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BinBase updates its US payment dataset with advanced Durbin Regulation flags, ATM/Debit network routing indicators, and Level 2/3 commercial card markers to help merchants significantly reduce processing fees.

MIAMI, July 22, 2026 /PRNewswire-PRWeb/ — BinBase, a leading provider of card issuing and payment analytics data, has announced major US-focused updates to its 2026 BIN Database. Designed specifically for payment facilitators (PayFacs), US acquiring banks, and enterprise e-commerce merchants, the updated dataset targets one of the largest operational costs in payment processing: transaction interchange fees.

In the competitive US payment ecosystem, a fraction of a percent in interchange savings translates to millions of dollars for merchants. BinBase provides the exact data needed for dynamic cost-optimizing routing.

Processing credit and debit cards in the United States requires navigating complex regulatory framework and network rules. A critical element is the Durbin Amendment, which caps interchange fees on debit cards issued by regulated US banks (institutions with $10 billion or more in assets). Without precise, updated BIN-level data, payment gateways frequently misidentify unregulated cards, leading to suboptimal routing and higher processing fees.

The updated BinBase dataset addresses this challenge by providing dedicated attributes for US processing optimization:

Durbin Regulation Identification: Instant Y/N status markers allowing payment gateways to dynamically detect US regulated debit cards and apply appropriate cost structures.US Debit & ATM Network Routing: Granular routing indicators for major US PIN-debit and PINless networks, including STAR, NYCE, Pulse, and Accel, empowering payment routing engines to choose the most cost-effective path.Commercial Data Eligibility (Level 2 / Level 3): Precise identification of corporate, business, and purchasing cards eligible for Level 2/3 line-item processing, helping B2B merchants lower interchange rates on corporate transactions.Personal vs. Commercial Usage Classification: Clear distinction between consumer and corporate card ranges to prevent fee misclassification at checkout.

“In the competitive US payment ecosystem, a fraction of a percent in interchange savings translates to millions of dollars annually for high-volume merchants,” said a spokesperson for Damiko Inc. “By combining Durbin status with US debit network data and extended 8-to-11-digit precision, BinBase provides payment engineers with the exact surgical data needed to build smart, cost-optimizing routing engines.”

To evaluate the US-specific data attributes and test integration compatibility, developers can inspect the schema and download the free 2026 sample dataset on GitHub.

For complete commercial licensing, custom data exports, and enterprise integration details, visit BinBase at https://binbase.com.

About Damiko Inc

Damiko Inc is a US-based fintech data provider specializing in card issuer analytics, payment routing data, and global BIN database solutions. Operating through its flagship product, BinBase.com, the company supplies high-precision transaction intelligence to help merchants and payment facilitators worldwide optimize approval rates and mitigate processing fees.

Media Contact
Fedor Lavrikoff, BinBase, 1 7866133333, sales@binbase.com, www.binbase.com

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Technology

InfiMotion Technology Makes Public Debut, Showcasing Full-Stack E‑Drive Capabilities at Wuxi Event

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July 23, 2026

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WUXI, China, July 22, 2026 /PRNewswire/ — InfiMotion Technology (InfiMotion), a global innovator in intelligent e‑drive systems, hosted a technology showcase event in Wuxi on July 16, marking its first public appearance as an independent supplier to the global automotive industry. The event demonstrated the company’s end‑to‑end capabilities spanning global R&D, extreme validation, and micron‑precision manufacturing – solidifying its position as a rising force in the new‑energy vehicle (NEV) drivetrain sector.

“Let the world know InfiMotion” said Joe Lin, CEO of InfiMotion Technology. “We have spent years perfecting our e‑drive technology for leading global automakers, and we are now ready to stand on our own as a trusted partner for the wider market.”

Cloud-Synced Global R&D: Engineering Without Borders

InfiMotion’s R&D network spans Wuxi, Shanghai, Ningbo, Hangzhou, and Gothenburg, with over 1,000 engineers – including a Swedish team of over 100 people – collaborating in real time via the cloud. This global footprint is built around real-world extremes: high-load endurance on European autobahns, Nordic cold starts, and tropical full-load operation in Southeast Asia – scenarios that directly shape InfiMotion’s globalization DNA.

A Track Record of Industry “Firsts”

InfiMotion’s technical pedigree speaks for itself:

2021: Pioneered China’s first self-developed 400V SiC EDU for ZEEKR 001.2024: Launched the world’s first 11-in-1 domain-controlled EDU, achieving over 90% CLTC efficiency on a 400V IGBT platform.2025: Released the world’s first mass-produced magnesium-aluminum alloy dual-motor EDU and the world’s first 900V high-performance magnesium-alloy coaxial EDU – delivering 5,200 Nm peak torque at just 77 kg net weight.

The company has also pioneered Umini-pin winding, 0.2mm ultra-thin silicon steel laminations, embedded and three-level PCM technologies, and is leading the formulation of industry standards for amorphous alloy materials.

Tested to the Extreme – Certified for Global Trust

InfiMotion adheres to ASPICE Level 3 processes and ASIL-D (ISO 26262) certification. Its validation system includes temperature cycling from -60°C to 140°C, 1,500-hour salt-spray tests, and 2,500-hour comprehensive endurance runs – with over 9,000 individual test items required for one European premium brand. The company’s CNAS-accredited testing center houses the world’s first 30,000 rpm motor test bench.

Manufacturing at Micron-Level Precision

InfiMotion operates five smart manufacturing bases across China (Wuxi, Hangzhou, Ningbo, Quzhou, and Jiaxing), with motor line automation reaching 95%. SMT accuracy is held to ±25μm, measurement instruments resolve down to 0.1μm, and an AI-driven visual inspection system detects defects as small as 20μm.

From Wuxi to the World

Today, InfiMotion supplies e-drive systems across the full voltage spectrum (400V–900V) for all vehicle classes, from A0 to supercars. Its global network spans China, Europe, and Malaysia, with vertical integration from key components to complete system. In the first half of 2026, the company ranked among China’s top three suppliers for both motor and inverter shipments, with volume production already serving Geely, Volvo, and JLR.

The InfiMotion Era Has Just Begun

As the global NEV industry undergoes profound transformation, InfiMotion remains committed to full-stack in-house R&D, global collaborative synergy, and open-win partnerships – delivering proven, traceable, and mass-producible Chinese e-drive solutions to the world.

About InfiMotion Technology

InfiMotion Technology is a global leader in the R&D and manufacturing of advanced electric drive systems and components for new energy vehicles. Committed to innovation, performance, and sustainability, InfiMotion provides comprehensive solutions empowering automakers to create the next generation of efficient, powerful, and intelligent electric vehicles.

For more information, please visit: www.infimotion.com

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