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GIGABYTE EVENT Unveils Comprehensive AI Solutions with “LEADING EDGE” at COMPUTEX 2025

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TAIPEI, May 9, 2025 /PRNewswire/ — GIGABYTE, the world’s leading computer brand, today unveiled a series of brand-new AI solutions under the theme, “LEADING EDGE,” at the GIGABYTE EVENT, aiming to redefine what’s possible in gaming, creation, and AI. These solutions include the debut of AI devices, AI software, and advanced AI-enhanced performance technology. Through these cutting-edge innovations, GIGABYTE reaffirms its commitment to delivering accessible AI at the edge.

AI Devices Bring Supercomputing to the Edge

Leading the AI devices showcase is the AORUS RTX™ 5090 AI BOX, the world’s first and fastest eGPU, designed to boost laptop performance for gaming, creation, and AI inferences. The AORUS RTX™ 5090 AI BOX redefines portable performance with versatile connectivity and next-gen GPU capability, delivering 1.5 times the gaming power and up to 10 times the AI application performance compared to the previous-gen RTX™ 4090 GAMING BOX, providing unprecedented flexibility and speed.

AI TOP ATOM, a personal AI supercomputer powered by the NVIDIA GB10 Grace Blackwell Superchip, features a tightly integrated CPU-GPU platform purpose-built for large-scale AI workloads. It supports fine-tuning and inference of AI models with up to 70B and 200B parameters, and can even scale through clustering to run models up to 405B parameters, ensuring data privacy and security.

AI Software Transforms Gaming, Creation, and Productivity

To fully unlock the AI device’s potential, GIGABYTE unveiled its next-gen software suite. AI TOP Utility 4.0 enables machine learning with core capabilities like image classification, object detection, segmentation, and optical character recognition, supporting various industrial applications. It also handles local inference for models with up to 685B parameters, while its built-in Model Converter streamlines deployment to the edge devices, ensuring flexibility and scalability across different hardware configurations.

GiMATE, a built-in AI agent on AORUS MASTER, GIGABYTE AERO, and GIGABYTE GAMING Series AI gaming laptops, enhances productivity under various scenarios through a Press and Speak feature with numerous AI capabilities and the GiMATE Creator. Now, the newly introduced feature GiMATE Coder, which makes coding accessible to beginners with intuitive, prompt-based code generation, debuted alongside two AI gaming laptop models, GIGABYTE GAMING A16 PRO and GAMING A18, and an all-rounder choice, GIGABYTE AERO X16, for optimal performance and superior functionality on the go.

GIGABYTE extends its AI innovation to gaming monitors with AI Tactical Features, AI-optimized Visuals, and AI Protection, delivering faster reactions, sharper visuals, and smarter tools. New models include the 4K 160Hz M27UP and M27UP ICE, which can switch to FHD 320Hz with flexible resolution options, the 280Hz MO27Q28G featuring the latest Meta 3.0 WOLED panel, the smart M27QS, and various models offering refresh rates from 200Hz up to an incredible 500Hz.

AI Redefines Design to Deliver the Optimal Performance

The all-new AORUS X870 X3D Series motherboards, X870E AORUS MASTER, PRO, and ELITE X3D ICE, come in both iconic black and pure-white ICE finishes and feature the AI-enhanced X3D Turbo Mode 2, delivering a market-leading 35% performance boost by intelligently adapting to real-time workloads, all without the need for manual overclocking or interruption. For Intel platforms, Z890 motherboards with Ultra Turbo Mode, a performance enhancement BIOS feature, unlock up to 38% more performance compared to factory settings to boost memory performance and system efficiency across diverse applications.

Furthermore, blending performance and aesthetics, the Z890 AORUS TACHYON ICE achieved a world-record memory speed through AI-enhanced overclocking, while the STEALTH ICE Series, featuring X870 AORUS STEALTH ICE and B850 AORUS STEALTH ICE motherboards, AORUS GeForce RTX™ 5090 STEALTH ICE graphics card, and the C500 PANORAMIC STEALTH ICE chassis, offers a reverse-connector layout for cleaner cable management, seamless compatibility, and pure-white minimalist builds.

These innovations underscore GIGABYTE’s dedication to providing AI solutions across its product lines, empowering both individual users and enterprises to unlock new levels of productivity and creativity in the AI era. GIGABYTE will further elaborate on these technologies and showcase its full LEADING EDGE vision at COMPUTEX 2025: GIGABYTE EVENT.

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View original content:https://www.prnewswire.co.uk/news-releases/gigabyte-event-unveils-comprehensive-ai-solutions-with-leading-edge-at-computex-2025-302450826.html

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Chef Robotics Physical AI Models Can Now Automate Baked Goods Packing

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SAN FRANCISCO, April 29, 2026 /PRNewswire/ — Chef Robotics, a leader in physical AI for the food industry, today announced that Chef robots can now automate tray assembly for baked goods packing. The application places baked products, such as burger buns, chocolate chip cookies, biscotti, butter cookies, biscuits, fortune cookies, granola bars, rusks, and shortbreads into trays and packaging containers before sealing.

Watch Chef robots in action.

Baked goods packing has historically been difficult to automate for high-mix production. Each item behaves differently on the production line—a granola bar compresses under the wrong grip, while a biscotti or rusk can crack if placed at the wrong angle. Surface textures range from glazed and smooth to crumbly and irregular, and strict presentation requirements leave little room for error. This variability has made it challenging for automation systems to reliably handle baked goods at production speeds, leaving food manufacturers dependent on manual labor and traditional bakery equipment.

To address this, Chef built its baked goods packing application on its existing piece-picking capability, which uses Chef’s AI-powered computer vision and physical AI models trained across diverse real-world production environments. This allows Chef robots to assess each item’s position, shape, and orientation in real time and determine how to pick the items from the pan and place them quickly and precisely without damaging them.

The baked goods packing application supports four distinct placement capabilities.

First, Chef’s vision system detects the angle at which each item sits in the pan and reorients it after picking, placing it on the tray at the exact angle required, regardless of its original position, enabling retail-ready presentation for SKUs that require precise angular placement.

Second, Chef robots can place multiple baked goods into the same packaging container in a single automated pass, completing full tray assembly without manual intervention.

Third, for packaging containers with multiple small compartments, Chef robots can precisely place items into each designated section, including multiple items in the same compartment, using Chef’s AI vision model to detect compartment positions and orientations in real time.

Fourth, Chef’s vision system identifies the exact center of each tray and places every item at a predefined offset from that center, ensuring a uniform, consistent arrangement across every pack regardless of how trays arrive on the conveyor.

For food manufacturers evaluating bakery systems and baked goods packaging automation, the application offers higher throughput, reduced labor dependency, and consistent presentation across shifts. The capability runs on Chef’s existing robotic hardware and software, allowing manufacturers to deploy it without requiring any changes to their production lines.

Chef’s baked goods packing application is available in the U.S., Canada, Germany, and the UK and is included as part of Chef’s robotics-as-a-service (RaaS) pricing model.

About Chef Robotics
Chef is the first company to have commercialized a scalable AI-driven food robotics solution. With over 104 million servings made in production, Chef leverages ChefOS, an AI platform for food manipulation, to offer a Robotics-as-a-Service solution that helps industry-leading food companies increase production volume and meet demand. Headquartered in San Francisco, CA, Chef aims to empower humans to do what humans do best by accelerating the advent of intelligent machines. Visit https://chefrobotics.ai to learn more.

View original content:https://www.prnewswire.com/news-releases/chef-robotics-physical-ai-models-can-now-automate-baked-goods-packing-302756923.html

SOURCE Chef Robotics

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Chef Robotics Physical AI Models Can Now Automate Baked Goods Packing

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SAN FRANCISCO, April 29, 2026 /PRNewswire/ — Chef Robotics, a leader in physical AI for the food industry, today announced that Chef robots can now automate tray assembly for baked goods packing. The application places baked products, such as burger buns, chocolate chip cookies, biscotti, butter cookies, biscuits, fortune cookies, granola bars, rusks, and shortbreads into trays and packaging containers before sealing.

Watch Chef robots in action.

Baked goods packing has historically been difficult to automate for high-mix production. Each item behaves differently on the production line—a granola bar compresses under the wrong grip, while a biscotti or rusk can crack if placed at the wrong angle. Surface textures range from glazed and smooth to crumbly and irregular, and strict presentation requirements leave little room for error. This variability has made it challenging for automation systems to reliably handle baked goods at production speeds, leaving food manufacturers dependent on manual labor and traditional bakery equipment.

To address this, Chef built its baked goods packing application on its existing piece-picking capability, which uses Chef’s AI-powered computer vision and physical AI models trained across diverse real-world production environments. This allows Chef robots to assess each item’s position, shape, and orientation in real time and determine how to pick the items from the pan and place them quickly and precisely without damaging them.

The baked goods packing application supports four distinct placement capabilities.

First, Chef’s vision system detects the angle at which each item sits in the pan and reorients it after picking, placing it on the tray at the exact angle required, regardless of its original position, enabling retail-ready presentation for SKUs that require precise angular placement.

Second, Chef robots can place multiple baked goods into the same packaging container in a single automated pass, completing full tray assembly without manual intervention.

Third, for packaging containers with multiple small compartments, Chef robots can precisely place items into each designated section, including multiple items in the same compartment, using Chef’s AI vision model to detect compartment positions and orientations in real time.

Fourth, Chef’s vision system identifies the exact center of each tray and places every item at a predefined offset from that center, ensuring a uniform, consistent arrangement across every pack regardless of how trays arrive on the conveyor.

For food manufacturers evaluating bakery systems and baked goods packaging automation, the application offers higher throughput, reduced labor dependency, and consistent presentation across shifts. The capability runs on Chef’s existing robotic hardware and software, allowing manufacturers to deploy it without requiring any changes to their production lines.

Chef’s baked goods packing application is available in the U.S., Canada, Germany, and the UK and is included as part of Chef’s robotics-as-a-service (RaaS) pricing model.

About Chef Robotics
Chef is the first company to have commercialized a scalable AI-driven food robotics solution. With over 104 million servings made in production, Chef leverages ChefOS, an AI platform for food manipulation, to offer a Robotics-as-a-Service solution that helps industry-leading food companies increase production volume and meet demand. Headquartered in San Francisco, CA, Chef aims to empower humans to do what humans do best by accelerating the advent of intelligent machines. Visit https://chefrobotics.ai to learn more.

View original content:https://www.prnewswire.com/news-releases/chef-robotics-physical-ai-models-can-now-automate-baked-goods-packing-302756923.html

SOURCE Chef Robotics

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Air Products to Expand Industrial Gas Supply for Samsung Electronics’ Next-Generation Semiconductor Fab in South Korea

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New investment underscores the company’s long-term commitment to Korea and its leading role in the global semiconductor industry 

LEHIGH VALLEY, Pa., April 29, 2026 /PRNewswire/ — Air Products (NYSE:APD), a world-leading industrial gases company and serving Samsung globally, today announced it has been selected by Samsung to supply industrial gases for its new advanced semiconductor fab in Pyeongtaek, Gyeonggi Province, South Korea.

Under the agreement, Air Products will build, own and operate multiple state-of-the-art production facilities and a bulk specialty gas supply system to supply nitrogen, oxygen, argon, and hydrogen for Samsung’s new semiconductor fab. The new facilities are expected to come onstream in multiple phases from 2028 through 2030.

Air Products has a long track record of executing multiple phase expansions in Pyeongtaek to support Samsung’s growing manufacturing needs. This latest project represents Air Products’ largest investment to date in the semiconductor industry and will establish Pyeongtaek as the company’s single largest operations site globally supporting the electronics industry. 

“Air Products is honored to be selected once again by Samsung and to have their continued confidence as a trusted partner supporting their strategic growth plans,” said SR Kim, President, Air Products Korea. “This significant investment reinforces Air Products’ role as a leading global supplier to the semiconductor industry and underscores our long-standing commitment to supporting our strategic customers with safety, reliability, efficiency and excellent service.”

Air Products has served the global electronics industry for more than 40 years, supplying industrial gases safely and reliably to many of the world’s leading technology companies. The company has operated in Korea for more than 50 years and has established a strong position in electronics and manufacturing sectors.

About Air Products

Air Products (NYSE: APD) is a world-leading industrial gases company in operation for over 85 years focused on serving energy, environmental, and emerging markets and generating a cleaner future. The Company supplies essential industrial gases, related equipment and applications expertise to customers in dozens of industries, including refining, chemicals, metals, electronics, manufacturing, medical and food. As the leading global supplier of hydrogen, Air Products also develops, engineers, builds, owns and operates some of the world’s largest clean hydrogen projects, supporting the transition to low- and zero-carbon energy in the industrial and heavy-duty transportation sectors. Through its sale of equipment businesses, the Company also provides turbomachinery, membrane systems and cryogenic containers globally.

Air Products had fiscal 2025 sales of $12 billion from operations in approximately 50 countries. For more information, visit airproducts.com or follow us on LinkedInXFacebook or Instagram.

This release contains “forward-looking statements” within the safe harbor provisions of the Private Securities Litigation Reform Act of 1995. These forward-looking statements are based on management’s expectations and assumptions as of the date of this release and are not guarantees of future performance. While forward-looking statements are made in good faith and based on assumptions, expectations and projections that management believes are reasonable based on currently available information, actual performance and financial results may differ materially from projections and estimates expressed in the forward-looking statements because of many factors, including the risk factors described in our Annual Report on Form 10-K for the fiscal year ended September 30, 2025 and other factors disclosed in our filings with the Securities and Exchange Commission. Except as required by law, we disclaim any obligation or undertaking to update or revise any forward-looking statements contained herein to reflect any change in the assumptions, beliefs or expectations or any change in events, conditions or circumstances upon which any such forward-looking statements are based.

View original content to download multimedia:https://www.prnewswire.com/news-releases/air-products-to-expand-industrial-gas-supply-for-samsung-electronics-next-generation-semiconductor-fab-in-south-korea-302757497.html

SOURCE Air Products

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