Technology

Computex 2025 Highlights: Don’t Miss Etron Tech’s Booth

Published

1 year ago

May 15, 2025

Double Golden Award Winner!
Showcasing World’s First Modular, Easy-To-Deploy Designs：
“Privacy-Aware Intelligent Robotic Dog” & “Edge AI Computing Sensor System”

More Innovations：
MemorAiLink Platform/Sub-System, Built for Edge AI Applications
USB Share 4K60 A/V Processor Enabling Cross-Device Collaboration

Etron Tech Is Leading The New Era of Edge AI. Business Inquiries & Partnership Opportunities Are Welcome ‒ Let’s Create Win-Win Success Together!

SAN JOSE, Calif. and TAIPEI, May 15, 2025 /PRNewswire/ — Focused on “AI NEXT” – Highlighting Four Key Trends: AI Computing, Smart Mobility, Advanced Connectivity, and Green Sustainability. The 2025 COMPUTEX Best Choice Award was officially presented. Etron Technology (TPEx: 5351), through its strategic investment in the AI smart technology startup DeCloak Intelligences, earned top honors as its innovatively developed DeCloakBrain AipA Robotic System received the COMPUTEX 2025 Best Choice Golden Award, underscoring its global leadership in privacy-focused AI technologies.

At the same time, eYs3D Microelectronics, a subsidiary of Etron focused on 3D vision and AI-integrated applications, won the Gold Medal – First Prize in the IC Design Category at the Smart Innovation Award hosted by Taiwan’s Ministry of Economic Affairs. This recognition was awarded for its innovative and practical AI Edge Computing Sensor System, demonstrating technical breakthroughs in edge AI and intelligent sensing, and showcasing strong international competitiveness.

Etron’s extensive deployment in AI smart terminal system applications also includes its subsidiary eEver Technology’s USB Share 4K60 A/V Processor, which enables cross-device collaboration between computers ‒ ideal for smart factory applications. In addition, Etron offers diverse memory solutions, the intelligent MemorAiLink platform, and the RPC®inside G120 subsystem.

Driven by the vision of “DIVE IN EDGE AI Microsystems,” Etron aims to empower innovation at the edge, and across diverse application fields through the MemorAiLink platform and its comprehensive memory solutions. The company is committed to jointly advancing breakthroughs in smart technologies with its partners ‒ ushering in a new era of IntelligenceN Life and the 6dMVerse®. You are warmly invited to visit Etron during Computex 2025, from May 20–23, at the following locations:

Etron Main Booth: 4th Floor, Hall 1, Nangang Exhibition Center – Booth M1203aeEver @ USB Community Booth: Booth M0314

We welcome collaboration opportunities and co-design partnerships to create mutual success!

DeCloakBrain X AipA: Launching the World’s First “DeCloakBrain AipA Robotic System“ Winner of the 2025 COMPUTEX Best Choice Golden Award

The DeCloakBrain AipA Robotic System, recipient of the 2025 COMPUTEX Best Choice Golden Award, showcases exceptional capabilities in AI system integration and innovation for edge applications. This pioneering system is powered by DeCloak’s self-developed, world-first modular privacy AI platform—AipA, which emphasizes de-identified AI training and inference in compliance with international privacy regulations. This significantly reduces deployment risk and the possibility of data leakage. The system can dynamically activate different patented privacy AI modules based on application needs, supporting dual-use scenarios in smart robotics and intelligent healthcare.

The DeCloakBrain AipA Robotic System demonstrates Etron’s strength in AI edge applications and system integration. Built on DeCloak’s world-first modular privacy AI platform, AipA, it enables de-identified AI training and inference in compliance with global privacy regulations. The system supports flexible deployment across smart robotics and privacy-focused healthcare. This recognition affirms DeCloak’s leadership in privacy AI and reflects Etron’s strategic progress in advancing secure and intelligent AI solutions for global markets.

The AipA platform combines DeCloakBrain, a patented AI technology independently developed by DeCloak, to form a “privacy-enhanced AI robot brain.” It features personal data de-identification, autonomous situational awareness, real-time AI anomaly detection, and low-power computing. By integrating vision-language models (VLM) and environmental physical sensing information, it provides dynamic situational reasoning and description from perception, planning to execution, enabling robots with autonomous decision-making capabilities. It can be integrated with existing robot hardware modules for rapid deployment in various fields such as patrolling, security, and caregiving.

The leading application case of this DeCloakBrain AipA robot system is the “privacy-aware intelligent robot dog,” which can instantly recognize blacklist/whitelist identities, track and lock onto individuals, perform fixed-point patrols, and analyze abnormal behaviors, automatically triggering alarms and response procedures. This robot dog system will make its official debut at COMPUTEX 2025, showcasing the latest breakthroughs in combining privacy AI with edge computing. It is expected to become a core solution for smart factories, medical institutions, and social security inspections.

AI Edge Computing Sensor System – Xink Nano Edge AI Wins Gold at the “Smart Innovation Award”

The AI Edge Computing Sensor System ‒ Xink Nano Edge AI from eYs3D Microelectronics made a dazzling debut by winning Gold in the Smart Innovation Award. Featuring integration of multi-sensor fusion, real-time AI recognition, and edge computing architecture, the system is highly versatile and scalable, making it ideal for a wide range of applications including smart transportation, autonomous robots, drones, security surveillance, and intelligent environment sensing.

Designed for on-site real-time response and low-latency AI processing, the system delivers modular flexibility, scalability, and high privacy protection ‒ critical features for smart scenarios requiring instant decision-making.

Xink Nano Edge AI adopts an AI Hybrid Model architecture and is powered by the eCV 4 series SoC, which includes a dual-core ARM Cortex-A55 processor. It supports widely used AI models such as YOLOv8 and pose estimation, and integrates 3D RGB imaging, ToF (Time-of-Flight) depth sensors, and advanced algorithms to enable object recognition, status evaluation, and anomaly detection. Key advantages include low power consumption, minimal maintenance, and fast response times.

The system also leverages lightweight model computing and an autonomous data generation and training process, which effectively reduces dependency on high-compute resources, improves training efficiency, and enhances deployment flexibility. This allows AI models to run quickly at the edge while maintaining accuracy and data security.

As many generic AI models today are too large and compute-intensive for efficient edge deployment, eYs3D Microelectronics offers AI model customization services, specifically optimized for edge use. These services help clients prune, compress, and retrain models based on their specific application scenarios, and can also incorporate autonomous data generation to boost model precision and adaptability.

Through this service, customers can achieve compact, high-efficiency, and low-latency AI model deployment, significantly reducing reliance on cloud resources while improving system responsiveness and data privacy—truly enabling the realization of smart edge applications.

USB Share 4K60 A/V Processor (EJ535D) Enables Cross-Computer Collaboration with High-Quality Streaming, Data Transfer, and Keyboard/Mouse Control – Ideal for Education and Smart Factories

eEver Technology Inc., a subsidiary of Etron Technology, specializing in high-speed interface controller ICs, has launched the industry’s first USB Share 4K60 A/V Processor – EJ535D. This innovative processor integrates 4K60FPS high-definition video streaming, real-time data transfer, and physical keyboard and mouse control, meeting the needs of professional users for real-time, high-efficiency device integration, and setting a new benchmark for Edge AI device collaboration.

The EJ535D high-performance IC, independently developed by eEver Technology, can be embedded into USB bridges, dongles, or docking devices, enabling seamless cross-computer collaboration. It supports both Windows and macOS platforms, allowing users to move the mouse naturally between two computers as if operating a single device. The keyboard automatically maps to the current active screen, and users can copy and paste text, images, and even large files between systems—without cloud sync or network dependency.

This approach significantly reduces latency and risks, highlighting the advantages of localized transmission while eliminating potential cloud-related data security breaches or bandwidth constraints. The EJ535D is especially well-suited for industrial applications that demand high responsiveness, making it a powerful tool in environments like education and smart manufacturing where real-time collaboration and security are critical.

Etron’s Memory Solutions to Power Wi-Fi 7 and Smart Applications Showcasing Edge AI Application Design with MemorAiLink Platform and RPC® inside G120 Subsystem

At Computex 2025, Etron Technology will showcase its latest memory solutions and platform technologies, focusing on three major application scenarios: smart connectivity, smart mobility, and smart home.

In smart connectivity, Etron has been a reliable supplier of memory products for global telecom Wi-Fi devices for years, supporting technologies from Wi-Fi 5, Wi-Fi 6/6E, to the latest Wi-Fi 7. Its DDR3 2Gb, 4Gb, and 8Gb products have been widely deployed in Wi-Fi 5 and Wi-Fi 6 devices. Since 2024, DDR4 4Gb has successfully entered Wi-Fi 6E applications. Looking ahead to 2025, DDR4 4Gb and 8Gb will be fully integrated into the Wi-Fi 7 supply chain, providing stable support for next-generation high-speed, low-latency wireless communication equipment.

In smart mobility, Etron’s automotive-grade memory has passed multiple certifications from international car manufacturers, demonstrating high stability and durability. Its DDR3 4Gb and 8Gb products offer long-term supply and high reliability, making them ideal for ADAS (Advanced Driver Assistance Systems), car cameras, instrument clusters, and infotainment systems.

In the smart home segment, Etron has entered markets including smart locks, smart speakers, panoramic cameras, and IP cameras through its proprietary KGDM technology.

A key highlight at Computex 2025 is Etron’s MemorAiLink platform, specifically designed for Edge AI applications. It supports high-bandwidth and customized memory configurations, offers turnkey memory interface IP services, reduces power consumption between logic chips and memory, and shortens product design cycles. The platform also enables cost-optimized heterogeneous integration packaging, tailored to customer needs for deploying real-world edge AI devices.

On display will be the RPC® inside G120 subsystem solution, a concrete implementation of the MemorAiLink platform. This solution features Etron’s self-developed RPC DRAM®, supporting x16 data bandwidth, and utilizes the industry’s smallest and most cost-effective FI-WLCSP packaging, which simplifies wiring and packaging design compared to traditional DDR3, significantly reducing system cost. The complete subsystem integrates RPC DRAM, RPC controller, and a 3D depth image sensor chip developed by Etron’s subsidiary eYs3D, providing a comprehensive AI terminal solution for compact, low-power ASIC system designs used in specialized applications.

About DeCloak

DeCloak’s privacy computing solutions can be deployed through either software or hardware. With DeCloak’s patented corresponding AI prediction algorithm, all data processed can remain highly analyzable while preserving total privacy. The processed data is transmitted to the local server or cloud in a de-identified format, and enterprises can use the AI prediction model to run data analysis and architect big data trends.
https://de-cloak.com/

About eYs3D Microelectronics

eYs3D Microelectronics Corp.is a pioneer in 3D sensing technologies, and aims to develop semiconductor oriented technologies and products related to 3D vision-simulating computer vision technologies integrated with computer intelligence. With its strong foundation and experience in memory design and computer vision, as well as close co-operation with its parent company, Etron Technology, Inc., and ARM Holdings Plc., eYs3D strives to develop new technologies to take advantage of computer vision chips and subsystems. It targets blue-ocean markets such as smart products, intelligence of things (IoT), and industrial and consumer level automation, to become a leading brand in the market of computer vision processing. For more information, visit www.eys3d.com

About eEver Technology, Inc

eEver Technology, Inc. is a leading global USB Type-C solution design and product company, specializing in high speed transfer interface, power delivery, and audio/video streaming as core technologies, and in developing high performance USB-Type-C solutions. Its world-class track record of helping its clients succeed and develop USB Type-C system products enables systems providers to capitalize on this emerging and fast-growing market. www.eevertech.com

About Etron Technology, Inc.

Etron Technology, Inc. (TPEx: 5351. TW) is a world-class fabless and heterogeneous integration IC design company that specializes in the application-driven buffer memory, known-good die memory (KGDM), and long-retention time DRAM (RPC DRAM), and other artificial intelligence and machine learning-induced DRAM products. Etron also develops system-in-packages, including high-speed transfer interface chips of USB Type-C and 3D depth sensing computer vision and panoramic image capturing chips. www.etron.com/

For further information, please contact:
Corporate Spokesperson:
Ms. Justine Tsai
Corporate Deputy Spokesperson:
Mr. Eason Cheng
Tel: +886-3-578-2345 #8670
Email: pr@etron.com.tw

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Technology

Firmable breaks into G2’s global top five for momentum in Sales Intelligence

Published

6 minutes ago

October 28, 2026

Firmable earned 17 badges in G2’s Fall 2026 reports and improved its ranking in 28 of the 32 reports it featured in last season, holding its position in the other four.

MELBOURNE, Australia and SAN FRANCISCO, Oct. 27, 2026 /PRNewswire/ — Firmable, the AI-native B2B sales platform, has climbed from #8 to #4 on G2’s global Momentum Grid for Sales Intelligence, which ranks the fastest-rising products in the category worldwide. It also ranked #1 for SMB sales intelligence in both Australia and ANZ and moved into the top 10 across Asia-Pacific.

The results span regional, segment and global reports in both the Sales Intelligence and Lead Intelligence categories. They are based on verified reviews from Firmable customers, alongside G2’s measures of market presence and growth.

Global momentum as Firmable scales in North America

Firmable is now one of the fastest-rising sales intelligence products worldwide. Its jump to #4 on G2’s global Momentum Grid for Sales Intelligence was matched by strong gains in G2’s global satisfaction indexes:

Relationship Index for Sales Intelligence: #3, up from #24Implementation Index for Sales Intelligence: #3, up from #17Results Index for Sales Intelligence: #4, up from #16

The results arrive as Firmable expands across the US and Canada, following its $14 million Series A in March and the launch of the Firmable MCP in July. They were followed by the launch of Tech Intelligence earlier in October.

“G2 rankings come straight from customers, and that’s why these results matter to us,” said Leigh Jasper, co-founder and co-CEO of Firmable. “Customers are telling the market three things: Firmable is easy to work with, fast to roll out, and it delivers results. Those scores climbed the most this season. That’s exactly the proof point sales leaders look for when they evaluate a new platform. We built Firmable as an AI-native product from day one, and teams in North America and elsewhere are responding. Breaking into the global top five for momentum is a strong signal of where we’re headed.”

#1 in Australia and in ANZ

Firmable took the top spot for small-business sales intelligence in both of its home markets. It rose from #2 to #1 on G2’s Small-Business Australia Regional Grid for Sales Intelligence, and from #3 to #1 on the Small-Business ANZ Regional Grid. Firmable also held #1 overall in both Australia and ANZ for Lead Intelligence.

“Ranking top in Australia and ANZ and climbing across Asia-Pacific comes down to one thing: our customers are booking more meetings with less effort,” said Paul Perrett, co-founder and co-CEO of Firmable. “Growing sales teams can’t afford to waste a rep’s day on bad data or cold accounts. We give them verified contacts and buying signals that tell them who to call and when. These results show that approach is working for teams in every market we serve. And with the launch of Tech Intelligence last week, we’re not slowing down.”

Top 10 across Asia-Pacific

Firmable moved into the top 10 for small-business sales intelligence across Asia-Pacific. It climbed from #13 to #10 on G2’s Small-Business Asia Pacific Regional Grid for Sales Intelligence. It also rose from #14 to #9 on the matching Lead Intelligence grid.

Firmable debuted on G2’s Mid-Market Asia Pacific Regional Grid for Sales Intelligence at #13. That reflects growing adoption among larger revenue teams in the region. On the overall Asia Pacific grid for Sales Intelligence, Firmable moved from #18 to #15.

About G2

G2 is the world’s largest and most trusted software marketplace. More than 90 million people annually use G2 to make smarter software decisions based on authentic peer reviews.

About Firmable

Firmable is an AI-native B2B sales platform, your AI sales teammate, that helps revenue teams find, understand and connect with the right buyers at the right time. Combining verified company and contact data with technology intelligence, CRM context, buyer intent and agentic AI, Firmable powers go-to-market teams across the US, Canada and Asia-Pacific. Firmable is ISO 27001 certified. Learn more at firmable.ai.

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Technology

KLEVV UNVEILS ALL-NEW CRAS V RGB PRIME DDR5 GAMING/OC MEMORY

Published

7 minutes ago

October 28, 2026

SUPPORTS AMD EXPO™ Technology: Featuring Ultra Low Latency
WITH AWARD-WINNING FLAGSHIP DESIGN

HONG KONG, Oct. 27, 2026 /PRNewswire/ — KLEVV, the leading consumer memory and storage brand introduced by Essencore, unveils the all-new CRAS V RGB PRIME DDR5 Gaming/OC Memory. Purpose-built for elite gaming rigs and demanding creative workloads, this new premium memory unleashes ultra-low CAS latency down to CL26 at 6000 MT/s and blazing overclocking speeds of up to 8000 MT/s at CL38, dressed in a striking black-and-gold finish and armed with dual-platform overclocking support for gamers, PC builders, and performance enthusiasts who demand nothing but the best.

Refined Flagship Design and Craftsmanship
Building on the aluminum heat spreader design of the flagship CRAS V RGB, winner of both the Red Dot and iF Design Awards, the CRAS V RGB PRIME introduces a striking new black-and-gold interpretation of the series’ signature look.

An advanced hard-anodizing process, combined with a specialized surface treatment, gives the modules a smooth, piano-lacquer-like sheen that adds depth and sophistication from every angle. The result is an understated yet luxurious aesthetic that offers users a fresh, premium design choice while preserving the refined craftsmanship of the original CRAS V RGB.

High-Speed Performance with Lower Latency
The CRAS V RGB PRIME further advances KLEVV’s DDR5 overclocking memory lineup with tested speeds of 6000, 6400, and 8000 MT/s and CAS latencies of CL26, CL28, and CL38, respectively.

The 6000 MT/s configuration features tested timings of 26-36-36-76, while the 6400 MT/s configuration delivers timings of 28-38-38-78. For users seeking extreme frequencies, the 8000 MT/s models operate at tested timings of 38-48-48-128. All configurations are tested at 1.4V.

The 6000 and 6400 MT/s configurations are available in dual-channel kits ranging from 32GB (16GBx2), 64GB (32GBx2), to 128GB (64GBx2), while the 8000 MT/s models are offered in both 32GB (16GBx2) and 48GB (24GBx2) kits. This diverse range gives users greater flexibility to select the ideal balance of speed, latency, and capacity for their systems.

Next-Generation AMD EXPO™ Technology: Featuring Ultra Low Latency
“AMD EXPO™ Technology: Featuring Ultra Low Latency” is the latest evolution of AMD’s established memory overclocking technology. The new AMD EXPO ULL profile incorporates optimized memory sub-timing settings designed to reduce latency and improve overall performance on compatible AMD platforms. As the first product in KLEVV’s overclocking memory lineup to adopt this technology, the CRAS V RGB PRIME delivers a more responsive gaming and overclocking experience.

The 6000 MT/s and 6400 MT/s 32GB (16GBx2) configurations are certified for AMD EXPO Ultra Low Latency. According to AMD, certified Ultra Low Latency memory can deliver an average 4% improvement in FPS compared with non-ULL AMD EXPO memory on compatible systems.*

Broad Intel and AMD Platform Support
Offering broad support across the latest desktop platforms, the CRAS V RGB PRIME is compatible with AMD Ryzen™ processors on the AM5 platform and Intel® Core™ Ultra 200S Plus processors.

Each kit comes preloaded with both Intel® Extreme Memory Profile and AMD EXPO™ Technology overclocking profiles, allowing users to unlock high-speed performance through a simple BIOS setting on compatible motherboards with supported BIOS versions. With both profiles included, users can confidently choose their preferred speed and capacity without the hassle of selecting separate Intel- or AMD-specific models.

Premium Components for Uncompromising Stability
The CRAS V RGB PRIME features rigorously screened, high-quality memory ICs from a leading Korean manufacturer, ensuring consistent high-speed performance and exceptional stability under demanding workloads.

Paired with a high-density 10-layer PCB, the modules deliver enhanced signal integrity and greater resistance to interference during high-speed operation. Integrated PMIC and on-die ECC technologies further support stable power management and long-term reliability, creating a robust foundation for gaming and overclocking performance.

To ensure broad compatibility, the CRAS V RGB PRIME has also been validated on the QVLs (Qualified Vendor Lists) of four major motherboard manufacturers. Its RGB lighting supports ASUS Aura Sync, GIGABYTE RGB Fusion, MSI Mystic Light Sync, and ASRock Polychrome Sync, allowing users to seamlessly coordinate lighting across compatible components and systems.

A Complete DDR5 Gaming/OC Memory Lineup
The introduction of the CRAS V RGB PRIME further expands KLEVV’s comprehensive DDR5 Gaming/OC memory portfolio.

With the CRAS, URBANE, BOLT, and FIT series available across a wide range of designs and specifications, KLEVV continues to provide flexible memory choices for different performance requirements, system configurations, and aesthetic preferences.

Warranty and Availability
The CRAS V RGB PRIME DDR5 comes with a limited lifetime peace of mind warranty and will be available from November 2026. Please visit the KLEVV website to check product availability across online and offline retail channels.

ABOUT KLEVV
KLEVV is a premium brand of Essencore, a major vendor of memory modules and NAND flash application products. The KLEVV range focuses on high-performance gaming memory modules and solid-state drives, engineered for enthusiasts who demand world-class quality and reliability. KLEVV memory and SSD products have been recognized with Germany’s Red Dot Design Award and iF Design Award for their innovative design. For more information, please visit www.klevv.com.

ABOUT ESSENCORE
Established in 2014, Essencore Limited aims to become the world’s top vendor of DRAM modules and NAND flash application products. The company started with one goal: to “Change the world and be a leader in semiconductor distribution.” The business strategies of Essencore are to adopt the newest technologies to differentiate themselves from competitors, deliver dedicated Memory products, and offer various product portfolios for customers’ competition readiness. For more information, please visit www.essencore.com.

*Based on AMD testing. Actual performance may vary depending on processor, motherboard, BIOS version, memory configuration, and application workload.

Overclocking and/or Undervolting AMD processors and memory, including without limitation, altering clock frequencies / multipliers or memory timing / voltage, to operate outside of AMD’s published specifications will void any applicable AMD product warranty, even when enabled via AMD hardware and/or software. This may also void warranties offered by the system manufacturer or retailer. Users assume all risks and liabilities that may arise out of overclocking / undervolting AMD processors, including, without limitation, failure of or damage to hardware, reduced system performance and/or data loss, corruption or vulnerability. GD-106.

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Technology

CDNetworks’ Cybersecurity Capabilities in APAC Recognized in IDC China’s 2026 Assessment

Published

7 minutes ago

October 28, 2026

Combining global network reach, AI-powered security, and local expertise, CDNetworks helps enterprises protect critical applications and operate securely across diverse APAC markets.

SINGAPORE, Oct. 28, 2026 /PRNewswire/ — CDNetworks, the APAC-leading network to deliver edge as a service, has been recognized in IDC China’s 2026 assessment of cybersecurity product and service capabilities across Asia-Pacific markets. CDNetworks received the highest ratings of five stars in six markets: Hong Kong SAR, Vietnam, Singapore, Japan, Malaysia, and South Korea, highlighting its cybersecurity expertise, extensive regional presence, and ability to address diverse security needs across APAC.

The assessment examines providers’ security offerings, regional operations, and service delivery across APAC. It highlights CDNetworks’ strengths in:

Extensive Global Infrastructure: With over 3,000 global Points of Presence and China CDN capabilities, CDNetworks supports secure, high-performance digital delivery across APAC, including cross-border acceleration for businesses serving users in mainland China.Strong APAC Presence and Local Expertise: Established local service teams in key APAC markets, including Singapore, Malaysia, Vietnam, Japan, South Korea, and China, provide multilingual consultation, solution design, deployment, and 24/7 technical support tailored to local business needs.Advanced WAAP and AI-Powered Security: CDNetworks delivers comprehensive Web Application and API Protection (WAAP), combining DDoS protection, intelligent WAF, bot management, API security, and AI-powered security operations to safeguard business-critical applications, detect emerging threats, and accelerate incident response.Adaptability to Diverse APAC Markets: CDNetworks adapts its services to different network environments, industry-specific requirements, and applicable data protection regulations, including PDPA and GDPR, helping enterprises address local market needs while maintaining consistent security standards.

“IDC’s recognition is an encouraging acknowledgment of our ongoing efforts to advance cybersecurity across APAC,” said Antony Li, APAC Head of Sales at CDNetworks. “As AI creates new opportunities and security challenges, businesses across APAC need protection that works consistently across markets while adapting to local requirements. We will continue investing in intelligent security and local expertise to help our customers innovate securely and build long-term digital resilience.”

About CDNetworks

As the APAC-leading network with over 3,000 global Points of Presence and more than 20 years of technology experience, CDNetworks delivers the fastest and most secure digital experiences to end users. Our diverse products and services include web performance, media delivery, cloud security, edge computing, zero-trust security, and colocation services, all designed to spur business innovation.

To learn more, visit cdnetworks.com and follow us on LinkedIn.

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