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eFuse Market worth $737.4 million by 2030 | MarketsandMarkets™

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DELRAY BEACH, Fla., May 23, 2025 /PRNewswire/ — The global eFuse Market is anticipated to grow from estimated USD 557.0 million in 2024 to USD 737.4 million by 2030, at a CAGR of 4.9% during the forecast period. Growth in the eFuse Market is being accelerated by more challenging electronic systems and higher demands for reliable protection in automotive, data center, and consumer devices. Because advanced eFuse technologies are small, accurate in current limitation, and can diagnose themselves, more are being used. It ensures that high-power systems are safe, work efficiently, and maintain proper temperatures. By using WBG semiconductors, companies are able to develop faster and more energy-efficient supply chain solutions. Using technologies makes it easier to prevent the damage caused by circuits. Improved eFuse solutions can be added to the battery management system of electric vehicles (EVs), so overcurrent and overheating are detected and dealt with quickly. Circuit protection has improved in various sectors after the introduction of eFuses. eFuses supports real-time detection of faults and effective handling of electricity because of improved technology. As a result, the system can handle overcurrent, overvoltage, and temperature issues smoothly. This means that eFuses in automotive use can deliver exact current restriction and fast fault finding, which is suitable for electric vehicles. This helps manufacturers ensure safety, reduce moments when things break down, and reduce power consumption in important and reliable systems.

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Thin shrink small outline package, by application

Many electronics use eFuses in TSSOP packages because they are compact. It is an excellent solution for applications in automobiles, telecoms, and personal electronics, given that cooling and dependability are very important. If any issue related to fast faults is found, the system imposes a high current control and it can stop to avoid overheating. Thanks to TSSOP eFuses, the system remains safe even when it is exposed to high currents and voltages. What is more, their function supports quick fault detection, so the system responds immediately if a fault occurs within the circuit, which keeps it working well at all times. TSSOP allows manufacturers to efficiently manage power flow, and therefore, eFuses are chosen for modern, advanced electronic devices due to their ability to solve thermal issues.

Auto retry, by type

Auto Retry, by type, is anticipated to maintain strong growth momentum during the forecast period in the eFuse Market. eFuses are categorized into two types: auto retry and latched. The increasing adoption of auto retry eFuses stems from their ability to automatically reset after a fault is detected, ensuring continuous operation in critical systems. It results in less downtime and better reliability, which is why auto retry eFuses are preferred for use in automotive electronics, industrial systems, and data centers. Due to a focus on keeping systems running and tolerating faults, auto retry eFuse sales are predicted to increase a lot. Many industries are starting to use auto retry eFuse technologies to guarantee effective results and cut down on the work needed for upkeep in crucial electronics.

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Asia Pacific segment is expected to be the fastest-growing region during the forecast period.

During the forecast period, Asia Pacific is expected to be the fastest-growing region in the eFuse Market. There is strong demand for eFuses in Asia, fueled by government action and investments to update power grids to cope with huge electricity use. China, Japan, and India have begun many grid expansion efforts, helping to increase reliability and leading to more eFuses being adopted in the region.

Key Players

Some of the major players in the eFuse Market are Littelfuse, Inc. (US), TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION (Japan), Semiconductor Components Industries, LLC (US), and Texas Instruments Incorporated. (US), and Alpha and Omega Semiconductor. (US). The major strategies adopted by these players include acquisitions, product launches, agreements, partnerships, and expansions.

Littelfuse, Inc. (USA)

Littelfuse, Inc. (USA) leads in the eFuse Market by providing advanced circuit protection. Littelfuse’s presence in over 20 countries helps the company deal with the challenges in the semiconductor industry. The company’s main aim is to develop eFuse technology to produce smaller and more efficient solutions for automotive, industrial, and consumer areas. The company spends a lot on research and development to create eFuse chips, including simple Protection ICs designed for 5V through 28V, which safeguard the systems. More than half of the company’s earnings come from the electronics segment, which helps various companies with tools, servers, and telecom infrastructure. Littelfuse secures its number one ranking in the market by acquiring other companies, forming partnerships, and introducing new products, offering reliable circuit protection for electric vehicles and data centers.

Semiconductor Components Industries LLC (USA)

Semiconductor Components Industries LLC (USA) is becoming a prominent name in eFuse by delivering dependable circuit protection. Based in regions across North America, Europe, and Asia, Onsemi works to mitigate the risks in the variable semiconductor industry. The company focuses on inventing new eFuse products that are built to handle tasks in healthcare, IT, and consumer electronics, particularly in servers, hard drives, and industrial-grade relays. The company strives to enhance its eFuse technology through extensive research, enabling features that respond to today’s demands. The Power Solutions Group is a major contribution to Advanced Micro Devices’ overall income, and it provides eFuse solutions for both cars and industrial purposes. To improve its marketplace, Onsemi increases production thanks to government incentives, forms partnerships to meet global chip shortages, and grows by finding new and reliable electronic solutions in this period of change.

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Related Reports:

Automotive Fuse Market

Circuit Protection Market

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Chef Robotics Physical AI Models Can Now Automate Baked Goods Packing

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SAN FRANCISCO, April 29, 2026 /PRNewswire/ — Chef Robotics, a leader in physical AI for the food industry, today announced that Chef robots can now automate tray assembly for baked goods packing. The application places baked products, such as burger buns, chocolate chip cookies, biscotti, butter cookies, biscuits, fortune cookies, granola bars, rusks, and shortbreads into trays and packaging containers before sealing.

Watch Chef robots in action.

Baked goods packing has historically been difficult to automate for high-mix production. Each item behaves differently on the production line—a granola bar compresses under the wrong grip, while a biscotti or rusk can crack if placed at the wrong angle. Surface textures range from glazed and smooth to crumbly and irregular, and strict presentation requirements leave little room for error. This variability has made it challenging for automation systems to reliably handle baked goods at production speeds, leaving food manufacturers dependent on manual labor and traditional bakery equipment.

To address this, Chef built its baked goods packing application on its existing piece-picking capability, which uses Chef’s AI-powered computer vision and physical AI models trained across diverse real-world production environments. This allows Chef robots to assess each item’s position, shape, and orientation in real time and determine how to pick the items from the pan and place them quickly and precisely without damaging them.

The baked goods packing application supports four distinct placement capabilities.

First, Chef’s vision system detects the angle at which each item sits in the pan and reorients it after picking, placing it on the tray at the exact angle required, regardless of its original position, enabling retail-ready presentation for SKUs that require precise angular placement.

Second, Chef robots can place multiple baked goods into the same packaging container in a single automated pass, completing full tray assembly without manual intervention.

Third, for packaging containers with multiple small compartments, Chef robots can precisely place items into each designated section, including multiple items in the same compartment, using Chef’s AI vision model to detect compartment positions and orientations in real time.

Fourth, Chef’s vision system identifies the exact center of each tray and places every item at a predefined offset from that center, ensuring a uniform, consistent arrangement across every pack regardless of how trays arrive on the conveyor.

For food manufacturers evaluating bakery systems and baked goods packaging automation, the application offers higher throughput, reduced labor dependency, and consistent presentation across shifts. The capability runs on Chef’s existing robotic hardware and software, allowing manufacturers to deploy it without requiring any changes to their production lines.

Chef’s baked goods packing application is available in the U.S., Canada, Germany, and the UK and is included as part of Chef’s robotics-as-a-service (RaaS) pricing model.

About Chef Robotics
Chef is the first company to have commercialized a scalable AI-driven food robotics solution. With over 104 million servings made in production, Chef leverages ChefOS, an AI platform for food manipulation, to offer a Robotics-as-a-Service solution that helps industry-leading food companies increase production volume and meet demand. Headquartered in San Francisco, CA, Chef aims to empower humans to do what humans do best by accelerating the advent of intelligent machines. Visit https://chefrobotics.ai to learn more.

View original content:https://www.prnewswire.com/news-releases/chef-robotics-physical-ai-models-can-now-automate-baked-goods-packing-302756923.html

SOURCE Chef Robotics

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Technology

Chef Robotics Physical AI Models Can Now Automate Baked Goods Packing

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on

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SAN FRANCISCO, April 29, 2026 /PRNewswire/ — Chef Robotics, a leader in physical AI for the food industry, today announced that Chef robots can now automate tray assembly for baked goods packing. The application places baked products, such as burger buns, chocolate chip cookies, biscotti, butter cookies, biscuits, fortune cookies, granola bars, rusks, and shortbreads into trays and packaging containers before sealing.

Watch Chef robots in action.

Baked goods packing has historically been difficult to automate for high-mix production. Each item behaves differently on the production line—a granola bar compresses under the wrong grip, while a biscotti or rusk can crack if placed at the wrong angle. Surface textures range from glazed and smooth to crumbly and irregular, and strict presentation requirements leave little room for error. This variability has made it challenging for automation systems to reliably handle baked goods at production speeds, leaving food manufacturers dependent on manual labor and traditional bakery equipment.

To address this, Chef built its baked goods packing application on its existing piece-picking capability, which uses Chef’s AI-powered computer vision and physical AI models trained across diverse real-world production environments. This allows Chef robots to assess each item’s position, shape, and orientation in real time and determine how to pick the items from the pan and place them quickly and precisely without damaging them.

The baked goods packing application supports four distinct placement capabilities.

First, Chef’s vision system detects the angle at which each item sits in the pan and reorients it after picking, placing it on the tray at the exact angle required, regardless of its original position, enabling retail-ready presentation for SKUs that require precise angular placement.

Second, Chef robots can place multiple baked goods into the same packaging container in a single automated pass, completing full tray assembly without manual intervention.

Third, for packaging containers with multiple small compartments, Chef robots can precisely place items into each designated section, including multiple items in the same compartment, using Chef’s AI vision model to detect compartment positions and orientations in real time.

Fourth, Chef’s vision system identifies the exact center of each tray and places every item at a predefined offset from that center, ensuring a uniform, consistent arrangement across every pack regardless of how trays arrive on the conveyor.

For food manufacturers evaluating bakery systems and baked goods packaging automation, the application offers higher throughput, reduced labor dependency, and consistent presentation across shifts. The capability runs on Chef’s existing robotic hardware and software, allowing manufacturers to deploy it without requiring any changes to their production lines.

Chef’s baked goods packing application is available in the U.S., Canada, Germany, and the UK and is included as part of Chef’s robotics-as-a-service (RaaS) pricing model.

About Chef Robotics
Chef is the first company to have commercialized a scalable AI-driven food robotics solution. With over 104 million servings made in production, Chef leverages ChefOS, an AI platform for food manipulation, to offer a Robotics-as-a-Service solution that helps industry-leading food companies increase production volume and meet demand. Headquartered in San Francisco, CA, Chef aims to empower humans to do what humans do best by accelerating the advent of intelligent machines. Visit https://chefrobotics.ai to learn more.

View original content:https://www.prnewswire.com/news-releases/chef-robotics-physical-ai-models-can-now-automate-baked-goods-packing-302756923.html

SOURCE Chef Robotics

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Air Products to Expand Industrial Gas Supply for Samsung Electronics’ Next-Generation Semiconductor Fab in South Korea

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New investment underscores the company’s long-term commitment to Korea and its leading role in the global semiconductor industry 

LEHIGH VALLEY, Pa., April 29, 2026 /PRNewswire/ — Air Products (NYSE:APD), a world-leading industrial gases company and serving Samsung globally, today announced it has been selected by Samsung to supply industrial gases for its new advanced semiconductor fab in Pyeongtaek, Gyeonggi Province, South Korea.

Under the agreement, Air Products will build, own and operate multiple state-of-the-art production facilities and a bulk specialty gas supply system to supply nitrogen, oxygen, argon, and hydrogen for Samsung’s new semiconductor fab. The new facilities are expected to come onstream in multiple phases from 2028 through 2030.

Air Products has a long track record of executing multiple phase expansions in Pyeongtaek to support Samsung’s growing manufacturing needs. This latest project represents Air Products’ largest investment to date in the semiconductor industry and will establish Pyeongtaek as the company’s single largest operations site globally supporting the electronics industry. 

“Air Products is honored to be selected once again by Samsung and to have their continued confidence as a trusted partner supporting their strategic growth plans,” said SR Kim, President, Air Products Korea. “This significant investment reinforces Air Products’ role as a leading global supplier to the semiconductor industry and underscores our long-standing commitment to supporting our strategic customers with safety, reliability, efficiency and excellent service.”

Air Products has served the global electronics industry for more than 40 years, supplying industrial gases safely and reliably to many of the world’s leading technology companies. The company has operated in Korea for more than 50 years and has established a strong position in electronics and manufacturing sectors.

About Air Products

Air Products (NYSE: APD) is a world-leading industrial gases company in operation for over 85 years focused on serving energy, environmental, and emerging markets and generating a cleaner future. The Company supplies essential industrial gases, related equipment and applications expertise to customers in dozens of industries, including refining, chemicals, metals, electronics, manufacturing, medical and food. As the leading global supplier of hydrogen, Air Products also develops, engineers, builds, owns and operates some of the world’s largest clean hydrogen projects, supporting the transition to low- and zero-carbon energy in the industrial and heavy-duty transportation sectors. Through its sale of equipment businesses, the Company also provides turbomachinery, membrane systems and cryogenic containers globally.

Air Products had fiscal 2025 sales of $12 billion from operations in approximately 50 countries. For more information, visit airproducts.com or follow us on LinkedInXFacebook or Instagram.

This release contains “forward-looking statements” within the safe harbor provisions of the Private Securities Litigation Reform Act of 1995. These forward-looking statements are based on management’s expectations and assumptions as of the date of this release and are not guarantees of future performance. While forward-looking statements are made in good faith and based on assumptions, expectations and projections that management believes are reasonable based on currently available information, actual performance and financial results may differ materially from projections and estimates expressed in the forward-looking statements because of many factors, including the risk factors described in our Annual Report on Form 10-K for the fiscal year ended September 30, 2025 and other factors disclosed in our filings with the Securities and Exchange Commission. Except as required by law, we disclaim any obligation or undertaking to update or revise any forward-looking statements contained herein to reflect any change in the assumptions, beliefs or expectations or any change in events, conditions or circumstances upon which any such forward-looking statements are based.

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