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EV Group Brings Digital Lithography to Heterogeneous Integration HVM Applications with LITHOSCALE® XT

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LITHOSCALE XT provides up to five-fold increase in throughput versus previous industry benchmark LITHOSCALE system; EVG maskless exposure technology to be highlighted at ECTC 2025

ST. FLORIAN, Austria, May 26, 2025 /PRNewswire/ — EV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today introduced the LITHOSCALE® XT maskless exposure (MLE™) system, the industry’s first true high-throughput/high-resolution digital lithography solution for high-volume-manufacturing (HVM) heterogeneous integration applications.

With a new dual-stage design, up to six exposure units, a dual-wavelength direct laser source as well as additional hardware and software enhancements, the LITHOSCALE XT offers up to a five-fold increase in throughput compared to EVG’s current-generation LITHOSCALE solution, which previously was the highest-throughput maskless lithography system at comparable resolution. The LITHOSCALE XT is ideally suited for applications involving multi-die patterning, fan-out wafer-level packaging (FoWLP) for AI and high-performance computing (HPC) devices, panel-level packaging, MEMS, advanced imaging sensors, and die traceability for security and automotive applications.

Maskless Exposure Technology – Ideal Patterning Solution for Heterogeneous Integration
Heterogeneous integration—the manufacturing, vertical assembly and packaging of multiple different dies into a single package—has led to greater package complexity, as well as a greater number of package options available. This in turn is driving the need for greater design flexibility and the ability to adopt both die-level and wafer-level designs simultaneously in back-end lithography. Accurate reconstitution of wafers is a key parameter in integrating dies from various wafer fabs or fab lines in multi-die solutions. Steppers and other mask-based patterning systems struggle to cope with inaccuracies from die-placement and die-shift variations caused by over-molding. In addition, the reticle size and optics dimensions of static exposure systems limit the exposure area. This is particularly challenging in large die interposer fabrications, where stitch-lines and/or mismatches overlap regions of the reticle exposure field, which can affect the electrical properties within the redistribution layer (RDL). The ability to generate a homogenous pattern for interposers that exceed current reticle size is crucial for devices with complex designs, such as those used in advanced graphic processing, 5G, AI and HPC.

EVG MLE Technology Advantages
LITHOSCALE XT tackles legacy bottlenecks associated with steppers by combining powerful digital processing that enables real-time data transfer and immediate exposure, with high structuring resolution and high throughput. Key features include:

Up to six exposure heads to cover a 300-mm wafer or 300-mm x 300-mm panel substrate in a parallel exposure processHigh-resolution (down to sub-2-micron lines/spaces), stitch-free, full-wafer patterning with no field-exposure or die-size limitationsSimple switching between mask layouts, supporting multi-die patterning without the associated high cost of ownership for having many masksReal-time wafer-level distortion and die-shift compensation for bowed or warped wafers, enabling improved die-placement accuracy and patterning yield without impact on throughputSupports a wide range of exposure applications thanks to a dual-wavelength laser source (e.g., thin and thick photoresists, <1 micron up to >100 microns in thickness, chemically amplified resists, positive and negative tone, dielectrics, high-aspect-ratio patterning, etc.)

According to Dr. Bernhard Thallner, pathfinding and optics director at EV Group, “The adoption and evolution of heterogeneous integration is driving tighter performance requirements for back-end lithography that can no longer be fully met with traditional mask-based solutions like steppers and mask aligners. While the technical advantages of MLE technology are abundantly clear, throughput has been a barrier to HVM adoption until now. Our newest MLE platform, LITHOSCALE XT, supports our customers’ unique patterning needs in HVM, not only for advanced packaging but also numerous other applications that can benefit from its combination of high versatility, resolution and throughput. We are ready to engage with customers and partners to help them leverage the myriad benefits of our MLE technology for their respective unique manufacturing needs.”

Automotive, Security and Imaging Benefits from EVG MLE Technology
In addition to advanced packaging, LITHOSCALE XT is also ideal for use in the manufacture of advanced image sensors—which involve complex shapes and highly functional optical materials that present challenges to stepper technologies—thanks to its high resolution and excellent sidewall profile performance on structures with complex shapes and/or high aspect ratios. LITHOSCALE XT’s Dynamic Die Annotation capability also enables on-the-fly generation of unique die identifiers for each individual wafer, supporting industry standards for individual die identification and traceability—such as SEMI E142 and SEMI T23—that are designed to meet the needs of the highly demanding security and automotive markets.

See EVG at ECTC 2025
Attendees at the 2025 IEEE 75th Electronic Components and Technology Conference (ECTC) interested in learning more about the LITHOSCALE XT and other innovative process solutions from EVG that are enabling advances in AI, HPC, advanced packaging, and sustainable semiconductor manufacturing, are invited to visit EVG at Booth #330 on May 27-30 in Dallas, Texas. In addition, Dr. Ksenija Varga, business development manager for EV Group, will unveil the latest results from EVG’s MLE technology in her oral presentation “Advanced FO PLP Digital Lithography Patterning Development for AI Devices” (co-authored with Fujifilm Electronic Materials) in Session 21 on Thursday, May 29 at 2:40pm in Room Texas 4-6.

Product Availability
EVG is now accepting orders for the LITHOSCALE XT maskless exposure system, and is offering product demonstrations at EVG’s headquarters. For more information, please visit https://www.evgroup.com/products/lithography/lithoscale-maskless-exposure-lithography-systems/lithoscale-xt

About EV Group (EVG)
EV Group (EVG) provides innovative process solutions and expertise that serve leading-edge and future semiconductor designs and chip integration schemes. The company’s vision of being the first in exploring new techniques and supporting next-generation applications of micro- and nanofabrication technologies enables customers to successfully commercialize new product ideas. EVG’s high-volume-manufacturing-ready products, which include wafer bonding, lithography, thin-wafer processing and metrology equipment, enable advances in semiconductor front-end scaling, 3D integration and advanced packaging, as well as in other electronics and photonics applications. More information about EVG is available at www.EVGroup.com.

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SOURCE EV Group

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InfoComm Asia Returns to Bangkok as the Region’s Pro AV Super Connector Event from 15-17 July 2026

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10 minutes ago

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April 29, 2026

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Exclusive 15th May Sneak Peek: Smart Workplace & Education Environments Event to be held in Kuala Lumpur, Malaysia

BANGKOK, April 29, 2026 /PRNewswire/ — Now in its 6th edition, InfoComm Asia 2026 returns to Bangkok, Thailand, 15-17 July at Queen Sirikit National Convention Center (QSNCC). As the region’s Professional Audiovisual (Pro AV) industry super connector event, InfoComm Asia brings together exhibition, conference, and high-level networking into one powerful platform for the Pro AV and technology solutions ecosystem.

Designed as the central meeting point for solution providers, manufacturers, system integrators, consultants, and Pro AV and technology end users, InfoComm Asia enables meaningful connections across the entire value chain while providing an immersive stage to showcase fully integrated, real-world Pro AV applications.

Over 200 global brands are expected to participate in this year’s event, with prominent audio giants such as Yamaha, Soundking, SHURE, Audio Technica and leading visual, display and lighting brands including COLORLIGHT, LUMENS, VITEC, Fabulux, to networking and Pro AV integration stalwarts NETGEAR, Extron, AVCIT, and many more. New to join this year include Hemona (N-Labs) from India, Transtech from China, Yo-Tronics Technology, and Aimiciot Electronics, to name a few.  

InfoComm Asia also serves as the annual flagship gathering for AVIXA–the global Audiovisual and Integrated Experience Association–chapters in Asia. The event hosts additional comprehensive AVIXA-led activities, including industry presentations, roundtables, AVIXA Xchange Live, experiential technology tours, networking sessions, mixers, and fireside chats. Combined with InfoComm Asia’s main stage summit conference hosting renowned Pro AV innovators and experts, networking events, and experiential activities, the InfoComm Asia experience fosters professional development, thought leadership, and peer-to-peer engagement, positioning it as the region’s most influential knowledge and relationship-building platform for Pro AV professionals.

Past testimonials and visitors to InfoComm Asia note:

“InfoComm Asia is the place to be! If you are in the AV industry, you must be here, and you cannot afford to miss it. We met with many consultants and integrators who help guide their end-user customers to make the right decisions on the choice of products, and lots of end-user customers who came with ready budgets.” 

Anand Hariharan, Director, Solutions Engineer from Cisco

“We see a good influx of visitors at InfoComm Asia. We met with buyers from the Philippines, Vietnam, Indonesia, Singapore, Malaysia, and even those from China. We also attended to customers from Australia, South Korea and about ten times more customers from Japan.” 

Marthesh Nagendra, Senior Director, Enterprise APAC from Netgear

“InfoComm Asia has a unique regional flavor you don’t get elsewhere. It’s a great place to reconnect with familiar faces and explore what’s ahead for the Pro AV industry.”

Mitera Tsuyoshi, Director, Cerevo Inc.

“We came to check new products and new technologies that we can incorporate to our system and bring back to our projects and distribution in the Philippines. The technology we see here is advanced, such as the ultra-thin LED screens that can be installed on glass. That’s one of the many advanced technologies we are looking for at the show.”

Jeffrey Beloro, AV Technical Manager from AV Beyond Innovations, The Philippines

“This is a great place to see what the new technologies are and learn about them. I was pleasantly surprised by how expansive and well-represented the show was. It’s a fantastic platform to explore the latest AV technologies relevant to our projects in the region.”

Bruce Crompton, Director, Crompton Manufacturing Consultants Vietnam

“As creative technologists, we rely on both our artistic instincts and technology. Things are evolving at bullet-train speed — that’s why events like InfoComm Asia are so important. They help us keep up, connect, and stay ahead.”

Linda Lim, CEO & Co-Founder, Studio X Beyond Thailand

“I came here for better ideas and to source for devices. I was lucky to find at least seven matching products, and that has already exceeded my expectations.”

Tuan Khoi Nguyen, Founder and Director of AK Technologies, Vietnam

Regional Momentum: Sneak Peek in Kuala Lumpur, Malaysia
Pro AV professionals can get a sneak peek of what is to come by attending the 15th May 2026 InfoComm Asia Pro AV Connect: Malaysia event. This roadshow themed “Rearchitecting Smart Workplace and Education Environments for the Next Decade” will present keynotes on Designing Intelligent Workplace and Learning Ecosystems, From Classrooms to Campuses and Offices: Converged Platforms in Action, and a panel discussion on AI, Data, and the Future of Collaboration and Learning Experiences. Participating Pro AV market leaders include Crestron.

Event Date: Friday, 15 May 2026

Time: 1:30pm – 5:30pm

Venue: Ballroom A, Level 2, Aloft Kuala Lumpur Sentral  

Address: 5, Jalan Stesen Sentral, Kuala Lumpur Sentral, 50470, Kuala Lumpur

Complimentary Registration Details

By uniting innovation, collaboration, and strategic business development, InfoComm Asia empowers participants to demonstrate impact, discover opportunities, and accelerate growth across the region’s diverse industries.

Online pre-registration is now open via the InfoComm Asia’s Online Registration System

Remaining stand and sponsorship opportunities are available via our opportunities page

Inquiry and application to our invited guest program can be found here

About InfoCommAsia
InfoCommAsia Pte Ltd. extends its influence through three marquee shows: InfoComm Asia; InfoComm China, Beijing; and InfoComm India. Each show features an exhibition that showcases the world’s most cutting-edge and in-demand professional audiovisual and integrated experience technology solutions and a summit that presents learning opportunities. The shows bring together professional audiovisual industry players and top-level decision-makers from across different markets to tap into the vast potential presented by pro AV solutions.

For more information, visit:

infocomm-asia.com | infocomm-china.com | infocomm-india.com 

Global Media Enquiries:

Angie Eng
Director, Marketing, InfoCommAsia Pte Ltd
T: +65 8163 2109
E: media@infocommasia.com; angieeng@infocommasia.com

View original content to download multimedia:https://www.prnewswire.com/apac/news-releases/infocomm-asia-returns-to-bangkok-as-the-regions-pro-av-super-connector-event-from-15-17-july-2026-302756523.html

SOURCE InfoComm Asia

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Bonree Retains No.1 Position in China’s APMO Market Share, IDC Reports

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April 29, 2026

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HONG KONG, SINGAPORE and BEIJING, April 29, 2026 /PRNewswire/ — Recently, International Data Corporation (IDC) released its China IT Intelligent Operations Software Market Tracking Report, H2 2025 (the “Report”). According to the report, Bonree Data Technology Co., Ltd. (stock code: 688229) ranked first in China’s Application Performance Management and Observability (APMO) market, with a 17.6% market share in the second half of 2025. For the full year, the company achieved a 19.8% market share, further strengthening its position in the market. This performance reflects strong market recognition of Bonree’s product capabilities, technological innovation, and service quality, as well as sustained demand for intelligent observability and operations solutions across industries. It also underscores the company’s long-term commitment to the observability and intelligent operations space, built over more than 18 years of continuous innovation and customer-focused development.

As the first publicly listed company in China’s Application Performance Management (APM) and observability market, Bonree is advancing its globalisation strategy with established operations in Hong Kong SAR, Singapore, and Malaysia. The company has already secured multi-million deals across Hong Kong SAR and Malaysia. Bonree complies with internationally recognised standards, including SOC 2 Type II and CMMI Level 5. Its self-developed LLM-powered observability platform has been selected for Huawei Cloud’s international baseline solution library, reflecting recognition from global cloud ecosystems and supporting its expansion with a “global deployment, local compliance” approach.

Bonree serves over 1,000 leading clients worldwide with system monitoring, performance optimisation, and intelligent operations solutions. Leveraging proprietary unsupervised knowledge graph root cause analysis technology and AI-driven intelligent analytics, Bonree delivers plug-and-play monitoring and fully managed adaptive alerting systems that detect anomalies quickly and accurately with minimal noise. Bonree holds 56 authorised invention patents and 135 software copyrights, and reports an NPS of 79 and a client satisfaction rate of 95%, reflecting strong customer trust across global markets. With these core strengths, Bonree continues to lead in global fintech and digital operations, helping clients ensure business continuity and digital transformation while striving to become a leading global player in APM and observability.

CONTACT: Xiaohan Yao, yaoxiaohan@bonree.com, +8618210189324

View original content to download multimedia:https://www.prnewswire.com/apac/news-releases/bonree-retains-no1-position-in-chinas-apmo-market-share-idc-reports-302756538.html

SOURCE Bonree Data Technology Co., Ltd.

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KuCoin and Lightnet Explore Collaboration to Advance Digital Asset and Payment Infrastructure Across Southeast Asia

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April 29, 2026

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PROVIDENCIALES, Turks and Caicos Islands, April 28, 2026 /PRNewswire/ — KuCoin, a leading global crypto platform built on trust, announced it is exploring potential collaboration with Southeast Asia-based fintech company Lightnet. By combining KuCoin’s global digital asset trading ecosystem with Lightnet’s cross-border payment infrastructure and fintech expertise, the two parties aim to explore long-term opportunities in the digital asset space across Southeast Asia.

The collaboration is dedicated to exploring potential synergies in the region. It is designed to integrate both parties’ capabilities to establish a forward-looking ecosystem for digital financial services, and to enhance digital asset infrastructure development across the region. It also reflects a shared vision to support the broader adoption of blockchain-based solutions in emerging markets.

Lightnet is a fintech company operating a licensed global settlement network and global payment infrastructure, leveraging blockchain technology to improve the efficiency and transparency of cross-border transactions.

BC Wong, CEO of KuCoin, commented:

“Southeast Asia represents one of the most dynamic regions for digital financial innovation. Through our collaboration with Lightnet, we aim to combine our respective strengths in digital asset trading and cross-border payments to explore more efficient and sustainable financial solutions. This partnership reflects KuCoin’s continued commitment to advancing trusted and compliant infrastructure on a global scale.”

Tridbodi Arunanondchai, Group CEO, Lightnet, added:

“We see strong synergies between Lightnet’s cross-border payment infrastructure and KuCoin’s global ecosystem. This collaboration reflects our shared commitment to expanding access to efficient financial solutions across Southeast Asia. We look forward to exploring opportunities together within appropriate regulatory frameworks.”

Both parties stated that they will continue to explore collaboration opportunities within appropriate regulatory frameworks, contributing to the development of a more accessible, efficient, and inclusive digital financial ecosystem in the regions.

About KuCoin

Founded in 2017, KuCoin is a leading global crypto platform built on trust, serving over 40 million users across 200+ countries and regions. Known for its reliability and user-first approach, the platform combines advanced technology, deep liquidity, and strong security safeguards to deliver a seamless trading experience. KuCoin provides access to 1,500+ digital assets through a broad product suite and remains committed to building transparent, compliant, and user-centric digital asset infrastructure for the future of finance, backed by SOC 2 Type II, ISO/IEC 27001:2022, and ISO/IEC 27701:2019 Certifications. In recent years, we have built a strong global compliance foundation, marked by key milestones including AUSTRAC registration in Australia, a MiCA license in Europe, and regulatory progress in other markets.

Learn more at www.kucoin.com.

About Lightnet

Lightnet is a Southeast Asia-based fintech company operating under a multi-jurisdiction regulatory framework. It has operations across over 150 countries with deep local partnerships throughout Asia and expanding globally. Lightnet provides fast cross-border settlement, on/off ramps and liquidity services for both fiats and digital assets to banks, fintechs and web 3 businesses.

View original content to download multimedia:https://www.prnewswire.com/news-releases/kucoin-and-lightnet-explore-collaboration-to-advance-digital-asset-and-payment-infrastructure-across-southeast-asia-302755541.html

SOURCE KuCoin

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