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Tuya Smart and Industry Leaders Create Opportunities for the Development of Southeast Asia’s Digital Economy at the Global Telecom AIoT Summit 2025

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NEW YORK, May 26, 2025 /PRNewswire/ — On May 23, 2025, global AI Cloud platform service provider Tuya Smart (NYSE: TUYA, HKEX: 2391), T3 Technology, and Skyworth successfully co-hosted the Global Telecom AIoT Summit 2025 in Bangkok, Thailand. Under the theme “New Era of Intelligence for All Industries”, the summit aimed to deliver cutting-edge smart solutions across industries, accelerate Southeast Asia’s digital transformation, and create new market opportunities for global developers.

Deputy Prime Minister of Thailand and Minister of Digital Economy and Society, H.E. Prasert Jantararuangtong, delivered the opening speech. “Thailand has been actively advancing its digital economy and social development. Through this summit, we aim to attract leading global technology enterprises to jointly explore emerging technological frontiers and co-create an intelligent and promising future,” he stated.

Leo Chen, Co-Chairman and President of Tuya Smart, delivered a welcome speech: “Over the past decade, Tuya has remained dedicated to the AIoT sector, building a globally leading AIoT developer platform that empowers device manufacturers, brands, and service providers to rapidly develop and launch smart products and services. Thailand’s ‘Digital Thailand’ initiative aligns closely with Tuya’s vision of advancing global intelligence. Looking ahead, we will continue to work closely with our customers to create greater value for partners, clients, and society.”

Nick Wang, Chairman and Founder of T3 Technology, remarked, “T3 Technology has always been committed to driving innovation across the industry. We look forward to using this opportunity to strengthen trust with our global partners, explore new models of collaborative innovation, and contribute to building a smarter future for all.”

Dr. Chaichana Mitrpant, Executive Director of Electronic Transactions Development Agency, stated, “Thailand is accelerating the formulation of smart development policies to create a more business-friendly environment for global tech companies. We aim to assess the impact of existing policies on technology enterprises through open dialogue and exchange, ensuring that the benefits of digital transformation truly reach the Thai people.”

Pratompong Srinuan, Ph.D., Executive Director of Telecommunications Policy and Resource Management Bureau of the National Broadcasting and Telecommunications Commission of Thailand, emphasized, “We are actively promoting the adoption of advanced technologies such as 5G and AIoT to enhance productivity. We are also working diligently to strengthen cybersecurity measures and ensure the stable operation of intelligent systems.”

Suebsak Suebpakdee, Executive Director and Secretary General of the Telecommunications Association of Thailand, shared, “AIoT is a key driver of growth for Thailand’s telecommunications industry. This summit provides a valuable opportunity to deepen cooperation with leading tech companies such as Tuya and Skyworth.”

Ross Luo, General Manager of Asia Pacific Region at Tuya Smart, pointed out, “Tuya’s platform ecosystem and AI technologies can empower telecom operators to transform both residential and enterprise business models. Its AI-driven solutions significantly enhance user experience, serving as a core enabler for the digital upgrade of diverse application scenarios.”

Eason Wang, Chief Technology Officer of T3 Technology, shared: “To unleash the full potential of AI productivity, we have established our ‘Own the Household 2.0’ initiative. In the public sector, T3 Technology leverages AI to enhance urban governance; in business scenarios, AI empowers enterprises to operate with greater efficiency.”

Srithar Bala, Chief Product Officer of Skyworth, stated: “Skyworth is actively collaborating with leading AI innovators like Tuya to launch a new generation of intelligent solutions. These solutions not only enable smart coordination and autonomous learning among devices, but also truly cater to personalized user needs.”

Will Yu, Chief Scientist of AI of Tuya Smart, said: “Tuya can upgrade every household device into an autonomous AI Agent. This technology also empowers the telecommunications industry by helping operators enhance service efficiency and unlock greater value.”

Apirut Vancha-am, Head of the Digital Home Division at True Digital Group, emphasized: “We are leveraging Tuya’s AI technology to integrate our home systems, with a strong focus on advancing generative AI and multimodal interaction. Our goal is to shift devices from passive execution to proactive care.”

Teerawat Issariyakul, Ph.D., Vice President of Platform Technology and Solution Standards at National Telecom Public Company Limited, said: “As cybersecurity threats become increasingly severe, we are actively collaborating with companies like Tuya to leverage AI technologies in optimizing network services and operational processes. We place great emphasis on cultivating a new generation of cybersecurity talent.”

Wasit Wattanasap, Head of Nationwide Operations and Support Business unit of AIS, said: “Through AI, AIS has built an intelligent ecosystem that not only significantly optimizes resource allocation and decision-making efficiency, but also redefines the collaboration between people, machines, and the environment.”

Chinh Ly Quoc, Vice President of Technology at VNPT Technology, shared: “VNPT is fully committed to advancing the development of the AIoT ecosystem. Through collaboration with companies like Tuya, we have built an intelligent network that enables seamless device coordination.”

Sheire NG, Managing Director of Converge Global Business Group, said: “By integrating AIoT technology, we are able to conduct precise monitoring and optimized management of industrial production processes, which not only improves production efficiency and reduces costs but also significantly reduces resource wastage and environmental pollution.”

Saroj Punyapatthanakul, CTO, Google Cloud Thailand, remarked: “The IoT isn’t just about connecting devices; it’s about connecting intelligence. We’re sitting on a goldmine of data, but without AI, it’s just noise. That’s why Google’s strategy to infuse Google AI Platform and Gemini 2.5 Foundation Model into enterprise IoT is a game-changer. It’s not just an evolution; it’s a paradigm shift. This is how we unlock true growth, supercharge our operations, and build the truly smart IoT solutions our future demands.”

Jeffrey Hue, CTO of Alphabet Capital, remarked, “IoT not only enhances the load capacity and complexity of communication networks but also further promotes the telecommunications industry’s shift from traditional voice and data services to more intelligent and personalized services.”

During the summit, Tuya launched the Southeast Asia Digital and AI Transformation Joint Initiative. The initiative aims to encourage deeper collaboration among governments, enterprises, and research institutions across Southeast Asia to expand AI industry deployment and jointly build a more prosperous future.

A roundtable forum was also held under the theme “AIoT Service Expansion and Insights: From Smart Home to Smart Government and Enterprises.” Representatives from companies such as Konec and LumBinaire shared real-world applications of AI technologies, highlighting how these solutions can significantly enhance the commercial value of developers’ projects.

The successful summit marked a new wave of growth opportunities brought by AIoT technologies to the global digital economy. Tuya will take this milestone as a catalyst to further expand into emerging AI markets such as Thailand, and continue to collaborate with developers worldwide.

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SOURCE Tuya Smart

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PhotonPay Recognized as Global FinTech Trailblazer with Dual Prestigious Service Awards

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PhotonPay has earned dual industry honors from EqualOcean and Jiemian Cailian Intelligence Institute for its next-generation financial operating system powered by stablecoin.

HONG KONG, June 15, 2026 /PRNewswire/ — PhotonPay today announced its recognition as “EqualOcean 2026 GoGlobal FinTech Service Enablers Top 10”, and its selection as “New-Quality Service Provider of the Year” by Jiemian Cailian Intelligence Institute. Conferred during major industry summits in Shanghai, these dual honors underscore PhotonPay’s pivotal role in accelerating the next generation of global commerce and systemic economic enablement.

The selections were finalized through exhaustive, multi-month evaluation frameworks — incorporating the data-and-expert review of Jiemian Cailian Intelligence Institute, alongside EqualOcean’s rigorous screening of over 500 international applicants. By assessing candidates on deep structural capability, regulatory adaptability, and systemic empowerment, these evaluations validate PhotonPay’s position as a foundational layer of global financial orchestration.

Globalization has evolved. Instead of just shipping goods via linear supply chains, businesses now operate complex, multi-market ecosystems. Navigating fragmented regional regulations and shifting trade patterns introduces significant operational friction. To scale effectively, enterprises require global financial networks that are resilient, compliant, and deeply integrated.

PhotonPay delivers this agility through a unified financial operating system powered by stablecoins, which has served over 200,000 enterprises globally. Whether managing digital ads spend, global logistics payout, e-commerce collection, or global payroll, businesses use PhotonPay to consolidate fragmented capital workflows. By combining traditional clearing networks with emerging stablecoin rails, the platform reduces conventional banking friction, mitigating FX volatility and accelerating fund velocity.

Underpinning this operational efficiency is a robust global compliance architecture, fortified by over 15 critical financial and payment licenses across key jurisdictions. PhotonPay leverages AI to automate risk management. By acting as an intelligent layer over the core infrastructure, these AI tools scan shifting local regulatory matrices, handle high-frequency AML/CFT screening, and detect fraud in real time — allowing businesses to transact globally with confidence and security.

“Global commerce thrives when financial friction disappears,” said Lewison Chen, Founder and CEO of PhotonPay. “We don’t view payments as isolated transactions, but as the essential infrastructure that drives business scale. This recognition reinforces our commitment to building an intelligent financial operating platform that helps enterprises navigate global markets with agility.”

Moving forward, PhotonPay will continue deepening its global compliance network and scaling its digital financial infrastructure. By bridging TradFi with emerging technologies like stablecoins and agentic commerce, the company aims to simplify international liquidity and empower more businesses to achieve borderless growth.

About PhotonPay

PhotonPay is a stablecoin-powered financial operating system built for the stablecoin era. Designed for modern enterprises, PhotonPay enables businesses to send, receive, convert, and settle funds across both fiat and stablecoin rails through a single, compliance-first integration, spanning 200+ countries and territories.

For more information, visit [www.photonpay.com].

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SOURCE PhotonPay

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Manz Asia Successfully Delivers World’s First 310mm × 310mm Panel-Level Packaging ECD Production System

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World’s first 310mm × 310mm panel-level packaging (PLP) Electrochemical Deposition (ECD) production system delivered to customer lineOmni x-series covering 310mm, 510mm, and 700mm platforms, enabling a broad range of panel-level manufacturing applications.Supports FOPLP, CoPoS, and TGV applications for AI, HPC, and advanced memory markets

TAOYUAN, June 15, 2026 /PRNewswire/ — A leading semiconductor advanced packaging equipment manufacturer, Manz Asia, has successfully delivered the world’s first 310mm × 310mm panel-level packaging (PLP) Electrochemical Deposition (ECD) mass production system. The system expands Manz Asia’s advanced packaging portfolio and showcases its integrated in-house expertise in process innovation, equipment engineering, and high-volume manufacturing.

The new ECD platform is designed with high flexibility to support both glass and metal square carriers and integrates wet chemical process modules for Redistribution Layer (RDL) fabrication. It is engineered for FOPLP-, CoPoS-, and TGV-based advanced packaging architectures. The 310mm × 310mm format offers advantages in scalability, panel utilization, and production yield, positioning it as a key enabling technology for panel-level packaging to support AI, high-performance computing (HPC), high-bandwidth memory (HBM), and high-speed interconnect applications.

Advanced packaging is increasingly converging with leading-edge semiconductor process technologies, with manufacturing capacity progressively concentrated in Taiwan. This shift is accelerating integration across process nodes and packaging architectures in the global semiconductor supply chain. Leveraging strong in-house R&D capabilities and close collaboration with leading IDM and packaging customers, Manz Asia continues to accelerate technology iteration and volume production deployment, strengthening its position in the global panel-level packaging equipment ecosystem.

The ECD system seamlessly integrates a full suite of wet chemical process modules, including cleaning, developing, etching, and stripping, and supports both spin and spray processing modes, creating a comprehensive 310mm × 310mm panel-level RDL manufacturing solution under the “Omni 310x” platform.

The Omni x-series now spans Omni 310x (310mm × 310mm), Omni 510x (510mm × 515mm), and Omni 700x (700mm × 700mm), forming a scalable platform architecture for panel-level mass production. The modular system design enables flexible configuration across different device architectures, process flows, and production capacity requirements, supporting development, qualification, pilot production, and high-volume manufacturing. It strengthens Manz Asia’s competitiveness in the global advanced packaging equipment market.

Robert Lin, CEO of Manz Asia, said the successful deployment of the Omni 310x into customer production lines reflects growing market demand for advanced packaging platforms that combine flexibility with production readiness. “As advanced packaging becomes increasingly central to AI and high-performance computing (HPC) architectures, capabilities such as process control, scalability, and seamless integration into high-volume manufacturing environments have become key competitive differentiators,” he said.

He added that Manz Asia will continue to advance its technology roadmap as a global-class equipment supplier, further strengthening its integration of ECD and wet chemical process technologies to improve manufacturing efficiency, yield stability, and production ramp-up. “We aim to accelerate the deployment of next-generation packaging technologies in FOPLP, CoPoS, and TGV, while reinforcing supply chain resilience across the semiconductor ecosystem,” he said. “Through a multi-platform strategy spanning 310mm, 510mm, and 700mm, we provide a consistent technology pathway from process development to high-volume manufacturing, enabling customers to scale efficiently and predictably. The Omni x-series roadmap is designed to support sustainable and scalable capacity expansion for next-generation semiconductor packaging applications.”

About Manz Asia

Manz Asia delivers semiconductor equipment and solutions built on core technologies in Electrochemical Deposition (ECD), wet chemistry, digital printing, automation, and software integration. Our expertise covers advanced packaging (FOPLP / CoPoS) and IC substrate processing (glass and organic core), supporting customers from R&D to high-volume manufacturing. Through system solutions, contract manufacturing, and sales representation, we help customers accelerate time-to-market, boost yield, and stay competitive in the fast-evolving semiconductor industry.

www.manz.com.tw/en

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SOURCE Manz Asia

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Midea Launches “Agentic Factory Overseas Expansion Solution,” Marking a New Stage for Chinese Enterprises Going Global

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FOSHAN, China, June 15, 2026 /PRNewswire/ — On June 9, 2026, Midea Group launched its “Agentic Factory Overseas Expansion Solution”.Building on the transformation of its Jingzhou washing machine factory, which received the world’s first WRCA Agentic Factory certification in August 2025, Midea has launched a modular, standardized, and field-validated solution. It includes cross-cultural employee training and cross-border supply chain traceability, and has been deconstructed into 12 rapidly replicable modules for global factory deployment.

According to Deloitte, 55% of Chinese enterprises hope to seek growth through overseas expansion. Midea has identified three persistent challenges: long-distance cross-border supply chains, inconsistent quality standards across export markets, and multinational workforce management difficulties caused by differences in language, culture, and labor regulations.

The solution has been validated at Midea Thailand Refrigeration Plant. Through 72 AI applications and 13 major agents across 25 scenarios, the factory reduced end-to-end order lead time by 43%, lowered customer complaint rates by 32%, and shortened employee training and certification cycles by 62%, demonstrating that China’s intelligent manufacturing capabilities can be replicated globally.

For workforce training, Midea introduced an AIGC + VR multilingual training system, reducing new employee training from eight days to three days. For quality control, Midea launched a VOC-to-VOP seven-step quality solution powered by an expert knowledge base of more than 12 million quality-related cases, enabling customer complaints to be traced to production lines and root causes within seconds.

For supply chain resilience, Midea developed a cross-border supply chain AI agent that monitors 35 core nodes in real time, reducing exception-handling response time from 48 hours to within 12 hours and keeping raw material on-time arrival rates above 96%. Together with Annto’s integrated KD logistics solution, the material kitting rate can exceed 99%.

At the Thailand factory, the finished product defect rate has been reduced by 50%. Midea Cloud,KUKA, Annto, Hiconics, CLOU Electronics, and Midea Building Technologies further support cost reduction and efficiency improvement through automated production, reusable packaging, and integrated energy-saving solutions.

Midea also introduced the “Midea Go-Global Partner Program.” According to Simon Zhang, Vice President and Chief Digital Officer of Midea Group, the program is not merely about standardized equipment, but about turning Midea’s accumulated experience into practical guidance and implementation support.

This co-building model has already delivered results. Wuhan Honghai Technology completed its 2024 Thailand capacity expansion from infrastructure construction to production launch in five months with Midea’s support, and its Thailand business volume increased by 1.6 times in 2025. Xiamen Hexing Packaging, an 18-year Midea partner, has expanded from a domestic supplier into a global partner, establishing factories in Southeast Asia and North America and joining Midea’s global strategic partner whitelist in 2025.

View original content to download multimedia:https://www.prnewswire.com/news-releases/midea-launches-agentic-factory-overseas-expansion-solution-marking-a-new-stage-for-chinese-enterprises-going-global-302800087.html

SOURCE Midea Group Co., Ltd

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