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Synopsys Partners with TSMC to Power Next-Generation AI Systems with Silicon Proven IP and Certified EDA Flows

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AI-powered digital, analog and verification flows and broad IP solutions deliver exceptional quality of results for TSMC advanced technologies

Successful silicon bring-up of industry’s first low-power M-PHY v6.0 IP on TSMC N2P, tape-out of 64G UCIe IP, and 224G IP speeds development of next-generation AI systemsOngoing collaboration on AI-powered digital, analog, and verification flows and power integrity platforms across TSMC advanced nodes to deliver optimized quality of resultsCollaboration on agentic run assistance in Synopsys Fusion Compiler improves PPA and design productivity on TSMC A14 using TSMC NanoFlex™ Pro architectureSynopsys 3DIC Compiler platform delivers productivity improvement for TSMC’s CoWoS® technology at 5.5x reticle interposer sizes, enabling efficient 3D multi-die designsMultiphysics design enablement for COUPE supports next-generation co-packaged optics

SUNNYVALE, Calif., April 22, 2026 /PRNewswire/ — Synopsys, Inc. (Nasdaq: SNPS) announced today major advances in silicon-proven IP, AI-powered EDA flows, and system-level enablement across TSMC’s most advanced processes and packaging technology nodes, including the TSMC 3nm and 2nm families, as well as A16™ with Super Power Rail and A14.

By unifying intelligent digital, analog, and verification flows, advanced 3D multi-die design, and optical-to-electrical design capabilities, Synopsys helps engineers improve quality of multiphysics results and accelerate development cycles from silicon to systems for increasingly complex AI and high-performance computing designs.

“TSMC’s most advanced process and packaging technologies are opening new frontiers for performance, bandwidth, and energy efficiency in AI and autonomous systems,” said Michael Buehler-Garcia, Senior Vice President at Synopsys. “Through our deep collaboration, Synopsys is delivering AI-driven design flows, advanced multiphysics signoff, and a comprehensive portfolio of proven interface and foundation IP that help customers accelerate innovation and achieve outstanding quality of results.”

“Our collaboration with Open Innovation Platform® (OIP) ecosystem partners like Synopsys continues to expand across TSMC’s advanced nodes and 3DFabric® technologies to meet the rapidly growing demands of AI and high-performance computing,” said Aveek Sarkar, Director of the Ecosystem and Alliance Management Division at TSMC. “By combining Synopsys’ certified EDA solutions and IP portfolio with our latest process and packaging innovations, we are enabling customers to push the boundaries of performance, integration, and energy efficiency—driving leadership silicon for the next-generation of AI systems.”

Advancing 3DFabric with Integrated Analysis and Signoff Flows for Optical, Electrical, and Thermal
To support the growing scale and complexity of multi-die designs, Synopsys and TSMC have enhanced enablement across TSMC’s 3DFabric technologies, including TSMC-SoIC® and CoWoS® for 5.5x reticle interposer sizes. Synopsys3DIC Compiler, a unified exploration-to-signoff platform, enables designs using TSMC’s 3DFabric technologies with automation capabilities for productivity gains. Synopsys‘ 3DIC Compiler integrates with RedHawk-SC™, RedHawk-SC Electrothermal™, and Ansys HFSS™ software to deliver multiphysics analysis for thermal, power, and high-speed signal integrity.

Collaboration with Synopsys RedHawk-SC™ for digital power integrity, Synopsys Totem™ for analog power integrity, and HFSS-IC Pro for electromagnetic extraction expands from TSMC A16™ to A14. Synopsys Totem-SC™ provides analog power integrity signoff at ultrahigh-capacity for large N2-based designs and embedded memories, while Synopsys PathFinder-SC™ extends multi-die electrostatic discharge (ESD) signoff coverage to N2. Cloud-based multiprocessor and GPU acceleration further shortens turnaround time, enabling multiphysics design teams to iterate rapidly across complex, thermally constrained 3D assemblies.

Expanded multiphysics simulation and analysis capabilities strengthen coverage across photonic, electrical, and thermal domains. Enablement for COUPE spans Ansys Zemax OpticStudio® for optical path simulation, Ansys Lumerical™ for photonic device simulation, HFSS-IC Pro for electromagnetic extraction, and RedHawk-SC Electrothermal for thermal and electrical co-simulation. Together, these tools support the design of co-packaged optical solutions for high-bandwidth datacenter connectivity.

Accelerating Design Productivity and Time-to-Results
Synopsys is collaborating with TSMC on agentic run assistance in Synopsys Fusion Compiler™ on TSMC’s A14 process using NanoFlex Pro architecture identifying timing improvement opportunities at different stages of the design flow for better quality of results. In addition, enablement of AI-assisted physical verification in Synopsys IC Validator™ is on-going, aiming to accelerate the identification and resolution of DRC violations for faster tapeout quality results.

Extensive IP Portfolio on Advanced, Specialty, and Automotive TSMC Nodes
This year, Synopsys advanced its IP portfolio with significant innovations that strengthened its leadership in high-performance connectivity for AI, data center, edge, and automotive markets. Through a key photonics collaboration, the company introduced a 224G IP solution that enables co-packaged optical Ethernet and UALink to address the bandwidth demands of next-generation electro-optical systems. Synopsys also achieved multiple first-silicon milestones on TSMC’s N5, N3P, and N2P processes— including PCIe 7.0, HBM4, 224G, DDR5 MRDIMM Gen2, LPDDR6/5X/5, UCIe 64G, and M-PHY v6.0 IP — establishing new levels in performance, power efficiency, and scalability.

Synopsys expanded its industry leading, silicon proven Foundation IP portfolio for TSMC’s N3P and N2P processes, offering embedded memories, logic libraries, and IOs that enable low power data centers, AI accelerators, mobile networks, and advanced cloud computing platforms. With strong market traction, industry leading PPA, and a robust roadmap across compact “C” nodes from N6 to N3, Synopsys Foundation IP is ready to power the next wave of semiconductor innovation.

Additionally, Synopsys strengthened its automotive leadership with the launch of a complete UCIe IP ASILB solution on N5A, complementing its high reliability Interface and Foundation IP offerings on TSMC’s N5A and N3A nodes for next-generation vehicle SoCs and reinforcing its momentum in the fast-growing automotive chiplet ecosystem.

Additional Resources

Blog: Learn about Synopsys’ silicon bring-up of M-PHY v6.0 IP on TSMC’s N2P process.Blog: Learn how Synopsys is delivering LPDDR6 Read/Write Eyes at 10.67 Gb/s on TSMC’s N2P process.Webinar: Gain executive-level insights from Synopsys, TSMC and others, into silicon and system engineering for AI hardware from experts at the forefront of these groundbreaking AI innovationsSynopsys is also hosting several demonstrations at Booth #302 in TSMC 2026 Technology Symposium in North America. For more information, visit Synopsys TSMC Technology Symposium page.

About Synopsys
Synopsys, Inc. (Nasdaq: SNPS) is the leader in engineering solutions from silicon to systems, enabling customers to rapidly innovate AI-powered products. We deliver industry-leading silicon design, IP, simulation and analysis solutions, and design services. We partner closely with our customers across a wide range of industries to maximize their R&D capability and productivity, powering innovation today that ignites the ingenuity of tomorrow. Learn more at www.synopsys.com.

© 2026 Synopsys, Inc. All rights reserved. Synopsys, Ansys, the Synopsys and Ansys logos, and other Synopsys trademarks are available at https://www.synopsys.com/company/legal/trademarks-brands.html. Other company or product names may be trademarks of their respective owners.

Contacts
Media   
Kelli Wheeler
Synopsys, Inc.
corp-pr@synopsys.com 

 

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SOURCE Synopsys, Inc.

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Chaberton Energy RFP Seeks Farming Partners for two Maryland Agrivoltaics Projects

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Agrivoltaics co-locates solar facilities and agricultural activity while creating access to lower-cost energy for community members during a time of spiking prices.

Chaberton is partnering with Okovate Sustainable Energy to select farmers for the Montgomery County, Md., projects.

ROCKVILLE, Md., April 23, 2026 /PRNewswire/ — Chaberton Energy invites Maryland farmers to respond to two requests for proposal (RFPs) to farm up to 27 acres of land in Montgomery County as part of an agrivoltaics initiative. Agrivoltaics is the practice of co-locating solar power projects with farming activities.

This opportunity will provide selected farmers with access to land at no cost as well as compensation for vegetation management at the site. Chaberton is working with Okovate Sustainable Energy to solicit and evaluate proposals from farmers interested in using the land under and between the projects’ rows of solar panels for crop farming and/or animal grazing.

The RFPs come at a time when Maryland imports more than 40% of its electricity, leaving ratepayers exposed to volatile wholesale prices. These projects bring distributed solar closer to the communities that need it most, providing lower-cost energy to nearly 1,000 local households while supporting agricultural businesses in the area.

“These projects are among Montgomery County’s first agrivoltaics projects,” said Ryan Boswell, vice president of development for Chaberton Energy. “Everybody benefits when farmers, communities, local governments and energy developers work together toward a shared set of goals.”

The solar projects align with Maryland’s renewable energy and agricultural sustainability goals. Selected farmers will develop tailored farming plans for each site and seek the required review from the Montgomery County Office of Agriculture.

“Together we’re building out the energy network we need while keeping agricultural land productive,” said Miles Braxton, CEO and co-founder of Okovate. “This is an opportunity to provide land access to local farmers looking to expand or start their operations, while also leasing land for solar that helps meet the growing energy demand.”

Chaberton Solar Sugarloaf in Dickerson, Md., will have a generating capacity of 5.23 megawatts. It spans 19 acres, with 16 acres covered by the solar array and a 3-acre buffer zone. Approximately 10 acres of land in between solar panel rows and a total of 13 acres are available for agricultural use.

Chaberton Solar Ramiere in Poolesville, Md., is a 3.88 megawatt project spanning 11 acres, with approximately 8 acres covered by the solar array and a 2-acre buffer zone. Approximately 5 acres of land in between solar panel rows and a total of 7 acres are available for agricultural use.

Farmers or agricultural operators responding to the RFPs must submit a proposal that provides a clear vision for how they will utilize one or both agrivoltaics sites and outlines their approach to vegetation management, agricultural production and sustainable practices. Complete information as well as application forms are available at chaberton.com/RFP26.

About Chaberton Energy
Chaberton Energy is a public benefit corporation developing community-scale energy projects, with a focus on distributed solar and battery energy storage. A national developer with roots in the communities it serves, Chaberton is a two-time Inc. 5000 awardee, ranking in 2025 as the No. 53 fastest-growing private company in America and the No. 2 energy company on the list. With a commitment to creativity, excellence, and humanity, Chaberton’s team develops distributed solar and battery energy storage projects that improve grid reliability and resilience while lowering electricity costs for community members and businesses.

Media Contact
Lia Morrison 
lia.morrison@chaberton.com 
412-573-9095

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SOURCE Chaberton Energy

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Empire Asset Finance Adds Katharine Rudzitis as Vice President, Direct Originations

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Empire Asset Finance, LLC (“Empire”) has added Katharine Rudzitis as Vice President, Direct Originations, further expanding the firm’s direct origination capabilities as it continues to scale its equipment finance platform serving middle-market, private equity-sponsored, and non-sponsored companies.

NEW YORK, April 23, 2026 /PRNewswire-PRWeb/ — Empire Asset Finance, LLC (“Empire”) has added Katharine Rudzitis as Vice President, Direct Originations, further expanding the firm’s direct origination capabilities as it continues to scale its equipment finance platform serving middle-market, private equity-sponsored, and non-sponsored companies.

Rudzitis brings more than a decade of experience originating and executing asset-backed transactions for North American businesses. She partners closely with corporate borrowers, private equity sponsors, and advisors to deliver flexible, tailored equipment financing solutions across a wide range of company stages and credit profiles.

Prior to joining Empire, Rudzitis spent ten years at Macquarie Group, where she focused on providing equipment finance solutions for clients across the manufacturing, industrial, commodity, and technology sectors.

“Katharine brings deep experience navigating complex equipment and asset-backed transactions and a thoughtful, solutions-oriented approach to serving middle-market clients,” said Rick Rockhold, CEO of Empire. “She understands how to deliver flexible capital solutions that align with sponsor and borrower objectives, and we are excited to have her join Empire as we continue to grow our direct origination platform.”

“Her institutional background and disciplined approach to sourcing and executing transactions are highly aligned with how we operate,” said Mike Miroshnikov, Chief Operating Officer and Chief Credit Officer of Empire. “Katharine brings a strong ability to navigate complex situations, combined with a structured, process-driven mindset that supports consistency and high-quality outcomes across a wide range of client needs.”

In her role, Rudzitis will focus on expanding Empire’s direct origination efforts and deepening relationships with private equity sponsors, corporate borrowers, and advisors.

Rudzitis holds a BA in Mathematics, English, and Classics from Amherst College.

About Empire Asset Finance, LLC

Empire Asset Finance, LLC is a direct private credit lender focused on mid-to large-ticket equipment financing solutions for underserved middle-market companies. Backed by Arena Investors LP, Empire delivers flexible capital structures, white-glove service, and technology-driven execution that empowers businesses to grow while preserving liquidity.

About Arena Investors, LP

Arena Investors, LP is a global institutional asset manager founded in 2015 by Daniel Zwirn, a veteran investor with over two decades of experience building alternative asset platforms. Arena is a global multi-strategy investment firm with approximately $4.6 billion of assets under management and programmatic capital as of June 30, 2025. The firm is a subsidiary of Arena Investors Group Holdings (“AIGH”). AIGH, along with its affiliate, Ceres Life Insurance, comprises the Westaim Corporation (TSXV: “WED”), an integrated asset management and life insurance and annuity provider.

Media Contact

Rick Rockhold, Empire Asset Finance, LLC, 1 7189643439, rrockhold@empireassetfinance.com, http://www.empireassetfinance.com/ 

View original content:https://www.prweb.com/releases/empire-asset-finance-adds-katharine-rudzitis-as-vice-president-direct-originations-302751354.html

SOURCE Empire Asset Finance, LLC

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OverActive Media to Host Fourth Quarter 2025 Conference Call

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TORONTO, April 23, 2026 /CNW/ – OverActive Media Corp. (“OverActive” or the “Company”) (TSXV: OAM) (OTC: OAMCF) (WKN: A3CSPU) (FSE: 0RB), a global digital media, esports and entertainment company for today’s generation of fans will report its fourth quarter 2025 results after market close on Tuesday, April 28, 2026. The Company will hold a conference call the following day, call hosted by Adam Adamou, CEO and Co-Founder.

WHAT: Q4 2025 Earnings Conference Call

WHEN: Wednesday, April 29, 2026, at 9:00 a.m. ET
Please connect at least 15 minutes before the conference call.

PARTICIPANT INFORMATION

To join the conference call without operator assistance, you may register and enter your phone number at https://emportal.ink/4tu24C0 to receive an instant automated callback. 

You can also dial directly to be entered into the call by an operator.

Call Details: 416-945-7677 or 1-888-699-1199

The conference call will be webcast live in its entirety at 9:00 a.m. ET at https://app.webinar.net/lqrNZlWd29V, and it will be archived for three months.

Links to SEDAR filings and press releases are available on the investor website at https://overactivemedia.com/pages/filings

TELEPHONIC REPLAY

Call Details: 289-819-1450 or 1-888-660-6345
Encore Replay Entry Code: 96797 #
Encore Replay Expiration Date: Wednesday, May 6, 2026

About OverActive Media

OverActive Media Corp. (TSXV: OAM) (OTC:OAMCF) (WKN:A3CSPU) (FSE:0RB) is headquartered in Toronto, Ontario, with operations in Madrid, Spain and Berlin, Germany, is a premier global esports and entertainment company for today’s generation of fan. OverActive Media owns team franchises in professional esports leagues, including the Call of Duty League, operating as the Toronto KOI, the League of Legends EMEA Championship (LEC), operating as Movistar KOI, operating as Movistar KOI in other professional esports leagues and competitions. OverActive also operates ActiveVoices, an AI-driven content localization and monetization platform that enables creators and brands to expand their audiences globally and unlock new revenue streams through automated translation, dubbing, and distribution.

Neither the TSXV nor its Regulation Services Provider (as that term is defined in the policies of the TSXV) accepts responsibility for the adequacy or accuracy of this release.

SOURCE Overactive Media Corp.

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