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Synopsys Partners with TSMC to Power Next-Generation AI Systems with Silicon Proven IP and Certified EDA Flows

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AI-powered digital, analog and verification flows and broad IP solutions deliver exceptional quality of results for TSMC advanced technologies

Successful silicon bring-up of industry’s first low-power M-PHY v6.0 IP on TSMC N2P, tape-out of 64G UCIe IP, and 224G IP speeds development of next-generation AI systemsOngoing collaboration on AI-powered digital, analog, and verification flows and power integrity platforms across TSMC advanced nodes to deliver optimized quality of resultsCollaboration on agentic run assistance in Synopsys Fusion Compiler improves PPA and design productivity on TSMC A14 using TSMC NanoFlex™ Pro architectureSynopsys 3DIC Compiler platform delivers productivity improvement for TSMC’s CoWoS® technology at 5.5x reticle interposer sizes, enabling efficient 3D multi-die designsMultiphysics design enablement for COUPE supports next-generation co-packaged optics

SUNNYVALE, Calif., April 22, 2026 /PRNewswire/ — Synopsys, Inc. (Nasdaq: SNPS) announced today major advances in silicon-proven IP, AI-powered EDA flows, and system-level enablement across TSMC’s most advanced processes and packaging technology nodes, including the TSMC 3nm and 2nm families, as well as A16™ with Super Power Rail and A14.

By unifying intelligent digital, analog, and verification flows, advanced 3D multi-die design, and optical-to-electrical design capabilities, Synopsys helps engineers improve quality of multiphysics results and accelerate development cycles from silicon to systems for increasingly complex AI and high-performance computing designs.

“TSMC’s most advanced process and packaging technologies are opening new frontiers for performance, bandwidth, and energy efficiency in AI and autonomous systems,” said Michael Buehler-Garcia, Senior Vice President at Synopsys. “Through our deep collaboration, Synopsys is delivering AI-driven design flows, advanced multiphysics signoff, and a comprehensive portfolio of proven interface and foundation IP that help customers accelerate innovation and achieve outstanding quality of results.”

“Our collaboration with Open Innovation Platform® (OIP) ecosystem partners like Synopsys continues to expand across TSMC’s advanced nodes and 3DFabric® technologies to meet the rapidly growing demands of AI and high-performance computing,” said Aveek Sarkar, Director of the Ecosystem and Alliance Management Division at TSMC. “By combining Synopsys’ certified EDA solutions and IP portfolio with our latest process and packaging innovations, we are enabling customers to push the boundaries of performance, integration, and energy efficiency—driving leadership silicon for the next-generation of AI systems.”

Advancing 3DFabric with Integrated Analysis and Signoff Flows for Optical, Electrical, and Thermal
To support the growing scale and complexity of multi-die designs, Synopsys and TSMC have enhanced enablement across TSMC’s 3DFabric technologies, including TSMC-SoIC® and CoWoS® for 5.5x reticle interposer sizes. Synopsys3DIC Compiler, a unified exploration-to-signoff platform, enables designs using TSMC’s 3DFabric technologies with automation capabilities for productivity gains. Synopsys‘ 3DIC Compiler integrates with RedHawk-SC™, RedHawk-SC Electrothermal™, and Ansys HFSS™ software to deliver multiphysics analysis for thermal, power, and high-speed signal integrity.

Collaboration with Synopsys RedHawk-SC™ for digital power integrity, Synopsys Totem™ for analog power integrity, and HFSS-IC Pro for electromagnetic extraction expands from TSMC A16™ to A14. Synopsys Totem-SC™ provides analog power integrity signoff at ultrahigh-capacity for large N2-based designs and embedded memories, while Synopsys PathFinder-SC™ extends multi-die electrostatic discharge (ESD) signoff coverage to N2. Cloud-based multiprocessor and GPU acceleration further shortens turnaround time, enabling multiphysics design teams to iterate rapidly across complex, thermally constrained 3D assemblies.

Expanded multiphysics simulation and analysis capabilities strengthen coverage across photonic, electrical, and thermal domains. Enablement for COUPE spans Ansys Zemax OpticStudio® for optical path simulation, Ansys Lumerical™ for photonic device simulation, HFSS-IC Pro for electromagnetic extraction, and RedHawk-SC Electrothermal for thermal and electrical co-simulation. Together, these tools support the design of co-packaged optical solutions for high-bandwidth datacenter connectivity.

Accelerating Design Productivity and Time-to-Results
Synopsys is collaborating with TSMC on agentic run assistance in Synopsys Fusion Compiler™ on TSMC’s A14 process using NanoFlex Pro architecture identifying timing improvement opportunities at different stages of the design flow for better quality of results. In addition, enablement of AI-assisted physical verification in Synopsys IC Validator™ is on-going, aiming to accelerate the identification and resolution of DRC violations for faster tapeout quality results.

Extensive IP Portfolio on Advanced, Specialty, and Automotive TSMC Nodes
This year, Synopsys advanced its IP portfolio with significant innovations that strengthened its leadership in high-performance connectivity for AI, data center, edge, and automotive markets. Through a key photonics collaboration, the company introduced a 224G IP solution that enables co-packaged optical Ethernet and UALink to address the bandwidth demands of next-generation electro-optical systems. Synopsys also achieved multiple first-silicon milestones on TSMC’s N5, N3P, and N2P processes— including PCIe 7.0, HBM4, 224G, DDR5 MRDIMM Gen2, LPDDR6/5X/5, UCIe 64G, and M-PHY v6.0 IP — establishing new levels in performance, power efficiency, and scalability.

Synopsys expanded its industry leading, silicon proven Foundation IP portfolio for TSMC’s N3P and N2P processes, offering embedded memories, logic libraries, and IOs that enable low power data centers, AI accelerators, mobile networks, and advanced cloud computing platforms. With strong market traction, industry leading PPA, and a robust roadmap across compact “C” nodes from N6 to N3, Synopsys Foundation IP is ready to power the next wave of semiconductor innovation.

Additionally, Synopsys strengthened its automotive leadership with the launch of a complete UCIe IP ASILB solution on N5A, complementing its high reliability Interface and Foundation IP offerings on TSMC’s N5A and N3A nodes for next-generation vehicle SoCs and reinforcing its momentum in the fast-growing automotive chiplet ecosystem.

Additional Resources

Blog: Learn about Synopsys’ silicon bring-up of M-PHY v6.0 IP on TSMC’s N2P process.Blog: Learn how Synopsys is delivering LPDDR6 Read/Write Eyes at 10.67 Gb/s on TSMC’s N2P process.Webinar: Gain executive-level insights from Synopsys, TSMC and others, into silicon and system engineering for AI hardware from experts at the forefront of these groundbreaking AI innovationsSynopsys is also hosting several demonstrations at Booth #302 in TSMC 2026 Technology Symposium in North America. For more information, visit Synopsys TSMC Technology Symposium page.

About Synopsys
Synopsys, Inc. (Nasdaq: SNPS) is the leader in engineering solutions from silicon to systems, enabling customers to rapidly innovate AI-powered products. We deliver industry-leading silicon design, IP, simulation and analysis solutions, and design services. We partner closely with our customers across a wide range of industries to maximize their R&D capability and productivity, powering innovation today that ignites the ingenuity of tomorrow. Learn more at www.synopsys.com.

© 2026 Synopsys, Inc. All rights reserved. Synopsys, Ansys, the Synopsys and Ansys logos, and other Synopsys trademarks are available at https://www.synopsys.com/company/legal/trademarks-brands.html. Other company or product names may be trademarks of their respective owners.

Contacts
Media   
Kelli Wheeler
Synopsys, Inc.
corp-pr@synopsys.com 

 

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Submarine Networks World x Subsea Security World 2026 – enacting GUIDE starts here!

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Submarine Networks World x Subsea Security World 2026: the flagship annual event for the global subsea industry returns to Singapore

SINGAPORE, Sept. 10, 2026 /PRNewswire/ — Submarine Networks World 2026 (organised by Terrapinn), steps up another level and will be welcoming over 1,500 subsea fibre leaders and 150+ industry speakers from across the globe to Sands EXPO & Convention Centre in Singapore on September 23rd and 24th.

The introduction of the new Subsea Security World theatre, focused on the biggest talking point of the last twelve months, increases attendance and participation from security sector specialists, national and regional government entities, navy, coastguard, policymakers and academics from the Americas, Europe, Asia, Oceania.

“Subsea cables connect the world and protecting them has never mattered more. With the launch of Subsea Security World alongside our flagship event, 2026 brings together the commercial and security sides of the industry in one place for the first time. We’re thrilled to welcome back the global subsea community, as well as the policy makers and defence specialists shaping its future, to Singapore for what will be the largest edition yet, and the edition the industry has been waiting for”, Paul Clark, Managing Director (Asia), Terrapinn.

Everyone from cable owners/operators, consortium members, technology providers, innovators, consultants, service partners, government entities, financiers, surveying companies – the whole industry – will be onsite at the true ‘one-stop shop’ for any subsea cable project.

Meet with more than 80 sponsors, exhibitors and partners, including Title Sponsor – Nokia, Diamond Sponsors – Ciena and HMN Tech and Gold Sponsors ASN, APTelecom, BAE Systems, Center3, Digital Realty, EXFO, FiberHome, Fibersense, Huawei, Prysmian, ShinewayTech, SMD, Solwake, Starboard Maritime Intelligence and Telecom Egypt.

Attendees will hear from 150+ influential speakers from every inhabited continent around the world. Both mornings begin with the daily Keynote sessions, followed by 4 specialist theatres each day – Strategy, Cable, Data Centres & CLS, Network, O&M and Subsea Security World.

Keynote Speakers include:

Alan Mauldin, Research Director, TeleGeography Andy Palmer-Felgate, Submarine Cable Engineer, MetaGiuseppe Valentino, VP Product Management, Backbone & Infrastructure Solutions, SparkleNelson McMillan, Royal Navy Maritime Domain Awareness Adviser, Southeast Asia, UK Ministry of DefenceKent Bressie, Partner – HWG LLP / Legal Advisor, ICPC Nadia Krivetz, Director, Cable Resilience & Connectivity Centre, DFAT AustraliaCaptain Brett Dawe, Chief of Navy Liaison Officer to the Republic of Singapore Navy, Royal Australian NavySean Bergin, President & Co-Founder, APTelecomBevan Slattery, Founder, SUBCOMark Procter, Deputy CEO, Stavian HighTech InfrastructureAmbrogio Michetti, Chief Corporate & Revenue Officer, SparkleAmajit Gupta, Group CEO and MD, LightstormJim Fagan, Chief Executive Officer, EXA InfrastructureSasha Pearson, Policy Analyst, European Centre for Development Policy Management (ECDPM)Woon Sien Loh, Senior Director, Infrastructure Planning & Market Development, Info-Communications Media Development Authority (IMDA)Emily Kiernan, Head of Strategy and Investments, Telstra Digital InfrastructureRobert Pepper, Senior Fellow, Global Digital Inclusion PartnershipWalid Wakim, Chief Technology Officer of Systems, NokiaSavy Wei, Senior Network Solution Manager, HMN TechAmit Malik, Vice President, APJI Sales, Ciena

For event information and the full conference agenda, visit https://www.terrapinn.com/ExperienceSNW2026

PRNewswire is the Official Media Partner of Submarine Networks World x Subsea Security World 2026.

Press attendance is complimentary. Enquiries should be directed to:
Jessica Foong
Terrapinn Pte Ltd
Jessica.foong@terrapinn.com

About Submarine Networks World x Subsea Security World 2026:
Submarine Networks World x Subsea Security World 2026 will take place on 23-24 September 2026 at Sands Expo & Convention Centre in Singapore. Firmly established as the world’s largest annual gathering of the global subsea communications community, Submarine Networks World is the dedicated platform to exchange knowledge, explore the latest projects, develop strategies and form lucrative new partnerships to drive the industry forward. For 2026, Subsea Security World joins the event for the first time, bringing together the public, private and policy-making stakeholders shaping the future of cable security and protection.

About Terrapinn: 
Terrapinn has been sparking ideas, innovations and relationships that transform business for over 30 years. Using our global footprint, we bring innovators, disrupters and change agents together, discussing and demonstrating the technology, strategies and personalities that are changing the way the world does business. Whether you’re looking to make new connections, introduce a product or inspire change in your industry, we invite you to join us as agitators of change. Terrapinn – spark something.

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SOURCE Terrapinn Pte Ltd

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Iyuno’s Strategic Approach: Multi-Agent AI, Built Around Context

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Specialized AI agents are becoming an industry-wide shift. Iyuno applied that approach to one of media’s hardest problems: giving AI a memory that holds up across scenes, episodes, and seasons.

BURBANK, Calif., Sept. 10, 2026 /PRNewswire/ — Iyuno, the world’s largest media localization company, today detailed the multi-agent engineering behind CLOE’s Contextual Memory, built on the belief that applying specialized AI agents to a narrow, well-defined problem outperforms brute-force scale.

Most enterprise AI deployments chase scale — bigger models, bigger context windows, bigger compute bills — and still lose narrative continuity across long-form video. CLOE takes a different approach, built on three principles:

Vertical Multi-Agent Orchestration. Instead of one monolithic model, a network of hyper-specialized micro-agents each performs a specific function, such as character relationship mapping, emotional intent, prosodic matching, or brand compliance, instead of relying on a single system to perform every task.High-Density, Low-Token Prompting. Raw video, audio, and script are synthesized into a structured knowledge graph first; agents work from compressed, high-signal context vectors instead of massive raw inputs, cutting token consumption and inference cost per title.Persistent Graph Memory. Agent outputs converge into one persistent ontology graph instead of being discarded after each task, so understanding compounds across a title, season, or franchise without compounding inference cost.

“Our focus was never building the biggest AI system—it was building the right one for media,” said David Lee, Founder & CEO of Iyuno. “For a broad, general-purpose problem, bigger models and more compute make sense. For a specialized domain like entertainment, that scale doesn’t buy you the thing that actually matters: narrative continuity. Specialized agents working off precise, high-density context get us state-of-the-art understanding at a fraction of the footprint, and that footprint doesn’t grow with catalog size the way monolithic approaches do. Every title we process makes the graph more capable, not more expensive to run.”

This architecture already runs Iyuno’s commercial suite: CLOE Enterprise (SaaS), CLOE Sub, CLOE Script, CLOE Dub, and CLOE Live — in live studio and streaming production today. Future announcements will detail how it extends into CLOE Skills across accessibility, marketing, and additional workflows.

About Iyuno

Iyuno (www.iyuno.com) is a leading provider of localization services for the media and entertainment industry. Trusted by top entertainment brands and creators worldwide, Iyuno offers comprehensive end-to-end localization services from 40 offices across 29 countries. Backed by a team of exceptional creative and technical talent, state-of-the-art facilities, and cutting-edge technologies, Iyuno proudly boasts the largest global footprint amplifying its dubbing, subtitling and media services offerings. The company is also the creator of CLOE, a contextual intelligence platform that transforms content into structured understanding, enabling AI-powered workflows across localization, accessibility, marketing, and emerging content experiences.

 

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SOURCE Iyuno

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Nel ASA: Enters framework agreement with Hydrasun as a European integration partner for PEM electrolyser solutions

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OSLO, Norway, Sept. 10, 2026 /PRNewswire/ — Nel ASA (Nel) (OSE: NEL) has entered into a framework agreement with Hydrasun to establish dedicated assembly and integration capabilities for the MC Series, Nel’s modular and scalable PEM technology platform. With this partnership, Nel gains an experienced integration partner in Europe, complementing its existing integration setup in the US and widening its delivery capabilities for the European market. Nel’s PEM stack production will continue at Nel’s Wallingford, Connecticut facility in the US.

Under the agreement, Hydrasun will develop production capabilities for the assembly and integration of Nel’s containerized PEM technology platform. Hydrasun will procure, integrate, and manufacture the balance of plant systems surrounding the electrolyser stack, enabling delivery of a fully integrated, modular, and containerized electrolyser offering, while stack production continues to be done by Nel from its Wallingford facility. The collaboration gives Nel an experienced integration partner in Europe at a time of growing demand for standardized, modular electrolyser solutions. It will expand Nel’s manufacturing flexibility and strengthen supply chain resilience, while bringing production capabilities closer to key growth markets. Hydrasun’s initiative is supported by the Scottish Government’s Just Transition Fund and will see Hydrasun invest in and upgrade its Aberdeen facilities to support clean technology manufacturing.

“This agreement marks a defining moment in Hydrasun’s evolution. For 50 years we’ve supported the energy industry in the areas of fluid transfer, power and control solutions, and clean energy, this investment builds directly on that industrial capability,” says James Gaskell, Chief Executive at Hydrasun. “Establishing Scotland’s first electrolyser assembly and integration facility is a proud milestone for the company and an important step forward for Aberdeen’s energy sector more broadly, ensuring the city has genuine clean energy manufacturing capability.”

The project is expected to contribute to the development of Scotland’s clean energy manufacturing sector by building on existing industrial competence in Aberdeen, supporting skills development, supply chain activity, and high-value employment. Hydrasun has stated that the initiative has the potential to create up to 12 new jobs while safeguarding a further 11 existing roles.

“We are pleased to be working with Hydrasun to establish an experienced European integration partner for our standardized PEM electrolyser solutions, the MC Series. As demand for standardized, modular systems grows, this collaboration enhances our ability to serve key markets while creating greater flexibility and scalability across our production network,” says Tushar Ghuwalewala, SVP PEM Operations at Nel.

For additional information, please contact:

Kjell Christian Bjørnsen, CFO, +47 917 02 097
Wilhelm Flinder, Head of IR, Communications and Marketing, +47 936 11 350

About Nel ASA | www.nelhydrogen.com 

Nel has a history tracing back to 1927 and is today a leading pure play hydrogen technology company with a global presence. The company specializes in PEM and Alkaline electrolyser technology for production of renewable hydrogen. Nel’s product offerings are key enablers for a green hydrogen economy, making it possible to decarbonize various industries such as transportation, refining, steel, and ammonia.

This information was brought to you by Cision http://news.cision.com

https://news.cision.com/nel-asa/r/nel-asa–enters-framework-agreement-with-hydrasun-as-a-european-integration-partner-for-pem-electrol,c4392033

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