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Processing in-Memory AI Chips Market Set to Skyrocket from $231M in 2025 to $44B by 2032 at 112.4% CAGR | Valuates Reports

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6 hours ago

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What is the Market Size of Processing in-Memory AI Chips?

BANGALORE, India, April 29, 2026 /PRNewswire/ — The global Processing in-memory AI Chips market was valued at USD 231 Million in 2025 and is anticipated to reach USD 44335 Million by 2032, at a CAGR of 112.4% from 2026 to 2032.

 

 

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What are the key factors driving the growth of the Processing in-Memory AI Chips Market?

The processing in-memory AI chips market is expanding due to growing pressures on compute architectures from data movement inefficiency, latency constraints, rising power sensitivity, and deployment cost control across AI workloads.Demand is shifting toward chip designs that minimize the distance between memory and computation, enabling faster inference execution and better throughput under constrained thermal and energy conditions.This trend is especially relevant for workloads where bandwidth pressure, response time, and local processing efficiency directly determine system value.The market benefits from broader interest in architectures supporting both edge and data center AI tasks, without full reliance on conventional processor-memory separation.These factors create a strong commercial foundation for processing in-memory adoption.

Source from Valuates Reports: https://reports.valuates.com/market-reports/QYRE-Auto-15O17238/global-processing-in-memory-ai-chips

TRENDS INFLUENCING THE GROWTH OF THE PROCESSING IN-MEMORY AI CHIPS MARKET:

DRAM-PIM is driving growth in the processing in-memory AI chips market by addressing one of the most persistent bottlenecks in AI computing, which is the heavy cost of transferring data between memory and logic. By embedding compute capability closer to high-capacity memory structures, DRAM-PIM improves efficiency in bandwidth-intensive inference and parallel data handling environments. This makes it highly relevant for larger models and workloads that require sustained access to large datasets with lower latency overhead. Its role in improving throughput while reducing external data shuttling is strengthening its position in advanced AI infrastructure, particularly where performance scaling must happen without proportionate increases in power draw or board-level complexity.

SRAM-PIM is supporting market growth by serving AI use cases that prioritize low latency, fast local access, and power-efficient computation in compact environments. Its architectural suitability for tightly coupled memory and processing enables faster execution of inference tasks where response speed is critical and repeated memory access patterns are concentrated. This makes SRAM-PIM especially attractive in edge AI systems, embedded intelligence platforms, and applications where energy budgets and footprint limitations are decisive purchase factors. As device-side intelligence becomes more valuable across industrial, consumer, and autonomous systems, SRAM-PIM is gaining traction as a practical route to delivering on-chip efficiency without the penalties associated with conventional memory-transfer-heavy architectures.

In-memory processing chips are driving the growth of the processing in-memory AI chips market by creating a more application-aligned hardware approach for modern AI inference. Their appeal lies in improving usable performance per watt, reducing system bottlenecks, and enabling more scalable deployment economics across both small and large computing power environments. These chips are increasingly viewed as a structural response to the limitations of traditional architectures in handling AI workloads efficiently. As buyers seek solutions that can balance throughput, heat, latency, and integration flexibility, in-memory processing chips are moving from niche experimentation toward broader commercial adoption, supporting a market that is increasingly defined by workload efficiency rather than raw compute expansion alone.

A major factor supporting the market is the growing need to reduce the cost of data movement inside AI systems. In conventional architectures, moving data back and forth between memory and processors consumes time, power, and system resources. Processing in-memory chips directly address this problem by bringing computation closer to stored data. This improves execution efficiency and makes the architecture attractive for inference-heavy environments where repetitive data access creates performance drag. As buyers increasingly evaluate compute systems based on usable efficiency rather than nominal processing strength, demand for architectures that minimize data transport overhead continues to strengthen the market.

Power efficiency is emerging as a decisive growth factor for the processing in-memory AI chips market. AI deployment is no longer limited to environments where power availability is secondary. Enterprises, edge operators, and embedded system developers now require hardware that can support meaningful intelligence under tight energy and thermal budgets. Processing in-memory designs improve energy utilization by reducing unnecessary memory access traffic and enabling more efficient task execution. This gives them strong relevance in a market where lower operating cost, thermal manageability, and sustained performance matter as much as raw computational output, especially across continuously running inference systems and distributed AI infrastructure.

The expansion of edge AI is supporting market growth by increasing demand for chips that can perform inference closer to the source of data. Edge systems need fast decision-making, low energy consumption, and compact integration, all of which align well with processing in-memory designs. As intelligence moves into cameras, sensors, industrial devices, and smart endpoints, conventional architectures often face efficiency tradeoffs that reduce suitability in such environments. Processing in-memory chips help overcome these limitations by supporting local computation with lower latency and reduced data transfer dependency. This makes the technology increasingly relevant as edge intelligence shifts from optional capability to essential product differentiation.

The growing complexity of AI inference workloads is creating favorable conditions for processing in-memory adoption. As models become more memory-intensive and inference demand spreads across commercial applications, the limitations of traditional compute-memory separation become harder to ignore. Buyers are looking for architectures that can handle repeated memory access more efficiently and sustain performance under real deployment conditions. Processing in-memory chips respond to this need by improving memory interaction efficiency, which is particularly valuable in workloads where bandwidth and latency determine real-world usefulness. This shift is helping the market as hardware decisions become increasingly shaped by inference practicality rather than theoretical compute scale.

The market is also benefiting from a growing emphasis on cost-per-inference rather than simple peak performance comparisons. Buyers increasingly want AI hardware that can deliver consistent workload execution with better efficiency, lower supporting infrastructure requirements, and more practical deployment economics. Processing in-memory chips are well positioned in this context because they help reduce some of the overhead traditionally associated with memory bottlenecks, energy consumption, and system complexity. Their value proposition becomes stronger when purchasing decisions are based on long-term operating efficiency and scalable deployment. This cost discipline is pushing interest toward architectures that offer more balanced performance across real commercial use cases.

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What are the major product types in the Processing in-memory AI Chips Market?

DRAM-PIMSRAM-PIM

What are the main applications of the Processing in-memory AI Chips Market?

Near-Memory Computing (PNM) ChipIn-Memory Processing (PIM) ChipIn-Memory Computing (CIM) Chip

Key Players in the Processing in-memory AI Chips Market:

MyhticSyntiantD-MatrixHangzhou Zhicun (Witmem) TechnologyBeijing Pingxin TechnologyAistarTekSAMSUNGSK HynixShenzhen Reexen TechnologyGraphcoreAxelera AISuzhou Yizhu Intelligent TechnologyBeijing Houmo TechnologyEnCharge AI

Which region dominates the Processing in-memory AI chips market?

Asia-Pacific remains the most dynamic region due to its deep semiconductor ecosystem, expanding edge device manufacturing base, strong memory technology orientation, and increasing integration of AI into consumer and industrial electronics. China is supporting market formation through locally aligned compute architecture development, while South Korea, Japan, and Taiwan provide supply-side depth through memory and advanced chip ecosystem capabilities. Other regions are adopting more gradually, mainly through selective edge AI and infrastructure modernization use cases.

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What are some related markets to the Processing in-memory ai chips market?

Computing in Memory Technology Market was valued at USD 268 Million in the year 2024 and is projected to reach a revised size of USD 175260 Million by 2031, growing at a CAGR of 154.7% during the forecast period.In-memory Computing Chips for AI market was valued at USD 231 Million in 2025 and is anticipated to reach USD 44335 Million by 2032, at a CAGR of 112.4% from 2026 to 2032.HTAP-Enabling In-Memory Computing Technologies MarketIMDG (In-Memory Data Grid) Software Market Research ReportEmbedded Ai Chips Market Research ReportUltra-low Power AI Chips Market Research ReportHigh-Bandwidth Memory Chips Market was valued at USD 3816 Million in the year 2024 and is projected to reach a revised size of USD 139450 Million by 2031, growing at a CAGR of 68.2% during the forecast period.LPDDR Chips Market was valued at USD 6891 Million in the year 2024 and is projected to reach a revised size of USD 10870 Million by 2031, growing at a CAGR of 6.8% during the forecast period.Semiconductor Memory Market was valued at USD 125890 Million in the year 2024 and is projected to reach a revised size of USD 232900 Million by 2031, growing at a CAGR of 9.3% during the forecast period.AI Calculus Chips Market was valued at USD 46520 Million in the year 2024 and is projected to reach a revised size of USD 269300 Million by 2031, growing at a CAGR of 25.1% during the forecast period.Military Chips Market was valued at USD 1168 Million in the year 2024 and is projected to reach a revised size of USD 1583 Million by 2031, growing at a CAGR of 4.5% during the forecast period.

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Technology

DEFSEC Ships New BLISS (“Battlespace Laser Identification Sensor System”) To U.S. Army Yuma Test Center

Published

23 minutes ago

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April 29, 2026

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OTTAWA, ON, April 29, 2026 /PRNewswire/ – DEFSEC Technologies Inc. (TSXV: DFSC) (TSXV: DFSC.WT.U) (NASDAQ: DFSC) (NASDAQ: DFSCW) (“DEFSEC” or the “Company”) today confirmed that it has now shipped two new networked BLISSTM systems to the United States Army Yuma Test Center (US Army YTC) for test and evaluation.

The BLISSTM shipment today to the US Army YTC follows delivery of an earlier version, called BLDS (Battlefield Laser Detection System) to the U.S. Army last year for testing and trial activity.  BLISSTM is an enhanced, networked version of BLDS as the next step in the evolution of the Company’s technology roadmap for battlespace laser detection and intelligence.

The patent-pending BLISSTM system alerts operators to laser activity across the battlespace, providing critical early warning and valuable seconds to assess, evade, defend, and deploy countermeasures. Miniaturized BLISSTM sensors can be mounted on vehicles and fixed infrastructure, or worn on personnel, to affordably blanket a battlespace with sensors for enhanced survivability and situational awareness and battlespace intelligence in contested environments.  It transforms laser warning into shared, actionable battlespace information.

Beyond real-time detection, BLISSTM incorporates enhanced laser pulse signature capture and analysis to help identify the source, intent, and affiliation of detected emissions.  By enabling users to distinguish among known signatures, the system supports faster, more informed tactical decisions.

“The BLISSTM system shipped today to Yuma for US Army testing represents a major step forward in tactical-edge force protection and actionable battlespace intelligence for commanders,” said Sean Homuth, President and CEO. “This capability will provide operators with critical time, better information, and a meaningful operational advantage against laser-enabled threats, including those seen in current Middle East conflicts.”

DEFSEC expects to brief domestic and foreign delegations on its BLISS product at Canada’s upcoming annual defence and security show, “CANSEC”, May 27 and 28, 2026, in Ottawa.

About DEFSEC

DEFSEC (TSXV: DFSC) (TSXV: DFSC.WT.U) (NASDAQ: DFSC) (NASDAQ: DFSCSW) (FSE: 62UA) develops and commercializes breakthrough next-generation tactical systems for military and security forces. The company’s current portfolio of offerings includes digitization of tactical forces for real-time shared situational awareness and targeting information from any source (including drones) streamed directly to users’ smart devices and weapons. Other DEFSEC products include countermeasures against threats such as electronic detection, lasers and drones. These systems can operate stand-alone or integrate seamlessly with OEM products and battlefield management systems, and all come integrated with TAK. The company also has a new proprietary less-lethal product line branded PARA SHOTTM with applications across all segments of the non-lethal market, including law enforcement. The Company is headquartered in Ottawa, Canada.

For more information, please visit https://www.defsectec.com

Forward-Looking Statements

This news release contains “forward-looking statements” and “forward-looking information” within the meaning of Canadian and United States securities laws (collectively, “forward-looking statements”), which may be identified by the use of terms and phrases such as “may”, “would”, “should”, “could”, “expect”, “intend”, “estimate”, “anticipate”, “plan”, “foresee”, “have sight of”, “believe”, or “continue”, the description of “optimism”, ” momentum” or “interest”,  the negative of these terms and similar terminology, including references to assumptions, although not all forward-looking statements contain these terms and phrases. Forward-looking statements are provided for the purpose of assisting the reader in understanding us, our business, operations, prospects and risks at a point in time in the context of historical and possible future developments and therefore the reader is cautioned that such information may not be appropriate for other purposes. Such forward-looking statements are based on the current expectations of DEFSEC’s management and are based on assumptions and subject to risks and uncertainties that are documented in detail in the Company’s public filings. Forward-looking statements included in this include, but are not limited to: management’s belief of sufficiency of available financial resources to support forecasted activities in 2026 based on cash on hand, anticipated revenue streams and planned expenditures in the fiscal year, subject to execution of the Company’s operating plan and other risks and factors described  in its public filings; interest in DEFSEC LightningTM, BLISSTM or other products and services as well as timing of full implementation or commercial release thereof; the Company’s estimates of increases to annualized gross margin on a go-forward basis and extent thereof, if any; the stage of scaled production for the PARA SHOTTM technology into new training cartridges and timing of release thereof; and management’s belief that its extensive customer base of law enforcement agencies for ARWEN throughout North America is a ready market for its new products like PARA SHOTTM as well as DEFSEC LightningTM.

Although DEFSEC’s management believes that the assumptions underlying such forward-looking statements are reasonable, they may prove to be incorrect. The forward-looking statements discussed in this news release may not occur by certain specified dates or at all and could differ materially as a result of known and unknown risk factors and uncertainties affecting DEFSEC, including DEFSEC’s inability to execute on its current operating plan and/or fiscal 2026 forecasted activities, DEFSEC’s inability to secure contracts and subcontracts (on the timelines, size and scale expected or at all), statements of work and orders for its products in fiscal 2026 and onwards for reasons beyond its control, the renewal or extension of agreements beyond their original term, the granting of patents applied for by DEFSEC, inability to finance the scale up to full commercial production levels for its physical products, inability to secure key partnership agreements to facilitate the outsourcing and logistics for its ARWEN® and PARA SHOTTM products, inability to commercialize DEFSEC’s Battlespace Laser Identification Sensor System (BLISS), inability to secure or complete the execution of government contracts, inability to drive growth in DEFSEC’s ARWEN® product line, inability to advance the commercialization of DEFSEC’s PARA SHOTTM products, delay or inability to launch DEFSEC’s Lightning SaaS offering, lower than expected or delayed demand for DEFSEC’s BLISS, overall interest in DEFSEC’s products being lower than anticipated or expected; general economic and stock market conditions; a stagnation or decrease in North American defense and public safety spending, adverse industry events; future legislative and regulatory developments in Canada, the United States and elsewhere; the inability of DEFSEC to implement and execute its business strategies; risks and uncertainties detailed from time to time in DEFSEC’s filings with the Canadian Security Administrators and the United States Securities and Exchange Commission, and many other factors beyond the control of DEFSEC. Although DEFSEC has attempted to identify important factors that could cause actual actions, events or results to differ materially from those described in forward-looking statements, there may be other factors that cause actions, events or results to differ from those anticipated, estimated or intended. Except as required by applicable securities laws, forward-looking statements speak only as of the date on which they are made and DEFSEC undertakes no obligation to publicly update or revise any forward-looking statements, whether as a result of new information, future events or otherwise.

Neither the TSX Venture Exchange nor its respective Regulation Services Provider (as that term is defined in the policies of the TSX Venture Exchange) accepts responsibility for the adequacy or accuracy of this news release.

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SOURCE DEFSEC Technologies Inc

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Technology

SPX Cooling Tech Unveils the Marley® OlympusMAX™ Fluid Cooler

Published

24 minutes ago

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April 29, 2026

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Maximum Capacity. Trusted Performance.

OVERLAND PARK, Kan., April 29, 2026 /PRNewswire/ — SPX Cooling Tech, LLC announced the launch of the Marley® OlympusMAX™ Fluid Cooler, engineered to deliver unmatched performance, efficiency and design flexibility for mission-critical facilities. Designed to meet the evolving demands of data centers, industrial plants and high-density cooling applications, the OlympusMAX Fluid Cooler sets a new benchmark in dry and adiabatic cooling technology.

Built on a century of heat rejection expertise, the OlympusMAX Fluid Cooler brings a new level of performance in dry and adiabatic cooling.  It is available in both adiabatic and dry configurations. The bolt-on adiabatic module can be factory or field installed—or even installed after the equipment is operational in order to provide maximum flexibility in response to changing conditions and site demands.

As global data center density continues to expand, operators are increasingly seeking cooling solutions that balance performance, energy use, water use and operational flexibility. “OlympusMAX reflects our commitment to advancing cooling technology to support the evolving demands of mission-critical facilities,” said Dustan Atkinson, Director of Product Management for SPX Cooling Tech. “By offering scalable dry and adiabatic performance, engineered flexibility and streamlined installation, we’re helping facilities meet increasingly challenging demands while maintaining efficiency and long-term reliability.”

At the heart of the OlympusMAX adiabatic module is a patent-pending recirculating adiabatic design that significantly reduces blowdown, minimizing unnecessary water discharge while improving system efficiency. Unlike traditional once-through or spray systems, the unit’s recirculation technology delivers more uniform water flow across the pad – improving saturation efficiency, extending pad life and reducing mineral accumulation on critical components. The result is more predictable energy and water consumption – a critical advantage for performance-sensitive environments such as hyperscale data centers.

Engineered for uptime, the OlympusMAX features high-efficiency Marley Geareducer® gear drives, robust construction materials and integrated component redundancy, including mission-critical fan and VFD systems. With unit options ranging from 120 to 240 horsepower, the design maximizes cooling capacity per square foot, delivering industry-leading heat rejection density.

Installation and serviceability were key priorities in the system’s development. Each unit ships with a factory-assembled electrical access platform, single-point wiring connection, VFDs and PLC controls pre-installed, and full-size access doors with internal walkways. These features streamline installation while enabling safer operation and easier maintenance.

The launch underscores SPX Cooling Tech’s mission to provide flexible, high-efficiency heat rejection solutions across its full portfolio including dry coolers, adiabatic coolers, evaporative coolers, and cooling towers, ensuring customers have a single-supplier solution tailored to their operational strategy.

About SPX Cooling Tech, LLC
SPX Cooling Tech is a leading global manufacturer of cooling towers, fluid coolers, adiabatic and dry cooling systems, evaporative condensers, industrial evaporators and OEM aftermarket parts from brands that include Marley®, Recold® and SGS Refrigeration. Since 1922, our brands’ cooling systems, components and technical services have supported applications in heating, ventilation and air conditioning (HVAC), refrigeration, and industrial process cooling. SPX Cooling Tech and its product brands are part of SPX Technologies, Inc. For more information see www.spxcooling.com.

About SPX Corporation
SPX Technologies is a supplier of highly engineered products and technologies, holding leadership positions in the HVAC and detection and measurement markets. Based in Charlotte, North Carolina, SPX Technologies has approximately 4,700 employees in 16 countries and is listed on the New York Stock Exchange under the ticker symbol “SPXC.” For more information, please visit www.spx.com.

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SOURCE SPX Cooling Technologies

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AMTD’s TGE Reports Full Year Results with 27.7% Increase in Revenue, with 25.5% Increase in Total Assets and 9.1% Increase in Net Assets

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1 hour ago

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April 29, 2026

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PARIS and LONDON and NEW YORK, April 29, 2026 /PRNewswire/ — The Generation Essentials Group (“TGE” or the “Company”) (NYSE: TGE, LSE; TGE), a NYSE and LSE dual-listed company and a subsidiary of AMTD Group Inc., today announced the filing of its annual report on Form 20-F for the fiscal year ended December 31, 2025 with the Securities and Exchange Commission, with summary highlights below:

Total Revenue increased by 27.7% from US$77.0 million to US$98.3 millionTotal non-GAAP Net Income increased by 3.2% from US$44.7 million to US$46.2 million Total Assets amounted to US$1,464.1 million (US$30.2/share)Net asset value amounted to US$839.1 million (US$17.3/share)

The annual report is available on the Company’s investor relations website at  http://thegenerationalessentials.com. The Company will provide a hard copy of its annual report containing the audited consolidated financial statements, free of charge, to its shareholders upon request. Requests should be directed to Investor Relations Office at ir@tge.media.

About The Generation Essentials Group

The Generation Essentials Group (NYSE: TGE; LSE: TGE), jointly established by AMTD Group, AMTD IDEA Group (NYSE: AMTD; SGX: HKB) and AMTD Digital Inc. (NYSE: HKD), is headquartered in France and focuses on global strategies and developments in multi-media, entertainment, and cultural affairs worldwide as well as hospitality and VIP services. TGE comprises L’Officiel, The Art Newspaper, movie and entertainment projects. Collectively, TGE is a diversified portfolio of media and entertainment businesses, and a global portfolio of premium properties. Also, TGE is a special purpose acquisition company (SPAC) sponsor manager, with its first SPAC successfully raised and priced on December 18, 2025.

For The Generation Essentials Group:
IR Office
The Generation Essentials Group
EMAIL: ir@tge.media

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SOURCE The Generation Essentials Group

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Processing in-Memory AI Chips Market Set to Skyrocket from $231M in 2025 to $44B by 2032 at 112.4% CAGR | Valuates Reports

Published

6 hours ago

on

What is the Market Size of Processing in-Memory AI Chips?

BANGALORE, India, April 29, 2026 /PRNewswire/ — The global Processing in-memory AI Chips market was valued at USD 231 Million in 2025 and is anticipated to reach USD 44335 Million by 2032, at a CAGR of 112.4% from 2026 to 2032.

 

 

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What are the key factors driving the growth of the Processing in-Memory AI Chips Market?

The processing in-memory AI chips market is expanding due to growing pressures on compute architectures from data movement inefficiency, latency constraints, rising power sensitivity, and deployment cost control across AI workloads.Demand is shifting toward chip designs that minimize the distance between memory and computation, enabling faster inference execution and better throughput under constrained thermal and energy conditions.This trend is especially relevant for workloads where bandwidth pressure, response time, and local processing efficiency directly determine system value.The market benefits from broader interest in architectures supporting both edge and data center AI tasks, without full reliance on conventional processor-memory separation.These factors create a strong commercial foundation for processing in-memory adoption.

Source from Valuates Reports: https://reports.valuates.com/market-reports/QYRE-Auto-15O17238/global-processing-in-memory-ai-chips

TRENDS INFLUENCING THE GROWTH OF THE PROCESSING IN-MEMORY AI CHIPS MARKET:

DRAM-PIM is driving growth in the processing in-memory AI chips market by addressing one of the most persistent bottlenecks in AI computing, which is the heavy cost of transferring data between memory and logic. By embedding compute capability closer to high-capacity memory structures, DRAM-PIM improves efficiency in bandwidth-intensive inference and parallel data handling environments. This makes it highly relevant for larger models and workloads that require sustained access to large datasets with lower latency overhead. Its role in improving throughput while reducing external data shuttling is strengthening its position in advanced AI infrastructure, particularly where performance scaling must happen without proportionate increases in power draw or board-level complexity.

SRAM-PIM is supporting market growth by serving AI use cases that prioritize low latency, fast local access, and power-efficient computation in compact environments. Its architectural suitability for tightly coupled memory and processing enables faster execution of inference tasks where response speed is critical and repeated memory access patterns are concentrated. This makes SRAM-PIM especially attractive in edge AI systems, embedded intelligence platforms, and applications where energy budgets and footprint limitations are decisive purchase factors. As device-side intelligence becomes more valuable across industrial, consumer, and autonomous systems, SRAM-PIM is gaining traction as a practical route to delivering on-chip efficiency without the penalties associated with conventional memory-transfer-heavy architectures.

In-memory processing chips are driving the growth of the processing in-memory AI chips market by creating a more application-aligned hardware approach for modern AI inference. Their appeal lies in improving usable performance per watt, reducing system bottlenecks, and enabling more scalable deployment economics across both small and large computing power environments. These chips are increasingly viewed as a structural response to the limitations of traditional architectures in handling AI workloads efficiently. As buyers seek solutions that can balance throughput, heat, latency, and integration flexibility, in-memory processing chips are moving from niche experimentation toward broader commercial adoption, supporting a market that is increasingly defined by workload efficiency rather than raw compute expansion alone.

A major factor supporting the market is the growing need to reduce the cost of data movement inside AI systems. In conventional architectures, moving data back and forth between memory and processors consumes time, power, and system resources. Processing in-memory chips directly address this problem by bringing computation closer to stored data. This improves execution efficiency and makes the architecture attractive for inference-heavy environments where repetitive data access creates performance drag. As buyers increasingly evaluate compute systems based on usable efficiency rather than nominal processing strength, demand for architectures that minimize data transport overhead continues to strengthen the market.

Power efficiency is emerging as a decisive growth factor for the processing in-memory AI chips market. AI deployment is no longer limited to environments where power availability is secondary. Enterprises, edge operators, and embedded system developers now require hardware that can support meaningful intelligence under tight energy and thermal budgets. Processing in-memory designs improve energy utilization by reducing unnecessary memory access traffic and enabling more efficient task execution. This gives them strong relevance in a market where lower operating cost, thermal manageability, and sustained performance matter as much as raw computational output, especially across continuously running inference systems and distributed AI infrastructure.

The expansion of edge AI is supporting market growth by increasing demand for chips that can perform inference closer to the source of data. Edge systems need fast decision-making, low energy consumption, and compact integration, all of which align well with processing in-memory designs. As intelligence moves into cameras, sensors, industrial devices, and smart endpoints, conventional architectures often face efficiency tradeoffs that reduce suitability in such environments. Processing in-memory chips help overcome these limitations by supporting local computation with lower latency and reduced data transfer dependency. This makes the technology increasingly relevant as edge intelligence shifts from optional capability to essential product differentiation.

The growing complexity of AI inference workloads is creating favorable conditions for processing in-memory adoption. As models become more memory-intensive and inference demand spreads across commercial applications, the limitations of traditional compute-memory separation become harder to ignore. Buyers are looking for architectures that can handle repeated memory access more efficiently and sustain performance under real deployment conditions. Processing in-memory chips respond to this need by improving memory interaction efficiency, which is particularly valuable in workloads where bandwidth and latency determine real-world usefulness. This shift is helping the market as hardware decisions become increasingly shaped by inference practicality rather than theoretical compute scale.

The market is also benefiting from a growing emphasis on cost-per-inference rather than simple peak performance comparisons. Buyers increasingly want AI hardware that can deliver consistent workload execution with better efficiency, lower supporting infrastructure requirements, and more practical deployment economics. Processing in-memory chips are well positioned in this context because they help reduce some of the overhead traditionally associated with memory bottlenecks, energy consumption, and system complexity. Their value proposition becomes stronger when purchasing decisions are based on long-term operating efficiency and scalable deployment. This cost discipline is pushing interest toward architectures that offer more balanced performance across real commercial use cases.

Claim Yours Now! https://reports.valuates.com/api/directpaytoken?rcode=QYRE-Auto-15O17238&lic=single-user

What are the major product types in the Processing in-memory AI Chips Market?

DRAM-PIMSRAM-PIM

What are the main applications of the Processing in-memory AI Chips Market?

Near-Memory Computing (PNM) ChipIn-Memory Processing (PIM) ChipIn-Memory Computing (CIM) Chip

Key Players in the Processing in-memory AI Chips Market:

MyhticSyntiantD-MatrixHangzhou Zhicun (Witmem) TechnologyBeijing Pingxin TechnologyAistarTekSAMSUNGSK HynixShenzhen Reexen TechnologyGraphcoreAxelera AISuzhou Yizhu Intelligent TechnologyBeijing Houmo TechnologyEnCharge AI

Which region dominates the Processing in-memory AI chips market?

Asia-Pacific remains the most dynamic region due to its deep semiconductor ecosystem, expanding edge device manufacturing base, strong memory technology orientation, and increasing integration of AI into consumer and industrial electronics. China is supporting market formation through locally aligned compute architecture development, while South Korea, Japan, and Taiwan provide supply-side depth through memory and advanced chip ecosystem capabilities. Other regions are adopting more gradually, mainly through selective edge AI and infrastructure modernization use cases.

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What are some related markets to the Processing in-memory ai chips market?

Computing in Memory Technology Market was valued at USD 268 Million in the year 2024 and is projected to reach a revised size of USD 175260 Million by 2031, growing at a CAGR of 154.7% during the forecast period.In-memory Computing Chips for AI market was valued at USD 231 Million in 2025 and is anticipated to reach USD 44335 Million by 2032, at a CAGR of 112.4% from 2026 to 2032.HTAP-Enabling In-Memory Computing Technologies MarketIMDG (In-Memory Data Grid) Software Market Research ReportEmbedded Ai Chips Market Research ReportUltra-low Power AI Chips Market Research ReportHigh-Bandwidth Memory Chips Market was valued at USD 3816 Million in the year 2024 and is projected to reach a revised size of USD 139450 Million by 2031, growing at a CAGR of 68.2% during the forecast period.LPDDR Chips Market was valued at USD 6891 Million in the year 2024 and is projected to reach a revised size of USD 10870 Million by 2031, growing at a CAGR of 6.8% during the forecast period.Semiconductor Memory Market was valued at USD 125890 Million in the year 2024 and is projected to reach a revised size of USD 232900 Million by 2031, growing at a CAGR of 9.3% during the forecast period.AI Calculus Chips Market was valued at USD 46520 Million in the year 2024 and is projected to reach a revised size of USD 269300 Million by 2031, growing at a CAGR of 25.1% during the forecast period.Military Chips Market was valued at USD 1168 Million in the year 2024 and is projected to reach a revised size of USD 1583 Million by 2031, growing at a CAGR of 4.5% during the forecast period.

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Technology

DEFSEC Ships New BLISS (“Battlespace Laser Identification Sensor System”) To U.S. Army Yuma Test Center

Published

24 minutes ago

on

April 29, 2026

By

OTTAWA, ON, April 29, 2026 /PRNewswire/ – DEFSEC Technologies Inc. (TSXV: DFSC) (TSXV: DFSC.WT.U) (NASDAQ: DFSC) (NASDAQ: DFSCW) (“DEFSEC” or the “Company”) today confirmed that it has now shipped two new networked BLISSTM systems to the United States Army Yuma Test Center (US Army YTC) for test and evaluation.

The BLISSTM shipment today to the US Army YTC follows delivery of an earlier version, called BLDS (Battlefield Laser Detection System) to the U.S. Army last year for testing and trial activity.  BLISSTM is an enhanced, networked version of BLDS as the next step in the evolution of the Company’s technology roadmap for battlespace laser detection and intelligence.

The patent-pending BLISSTM system alerts operators to laser activity across the battlespace, providing critical early warning and valuable seconds to assess, evade, defend, and deploy countermeasures. Miniaturized BLISSTM sensors can be mounted on vehicles and fixed infrastructure, or worn on personnel, to affordably blanket a battlespace with sensors for enhanced survivability and situational awareness and battlespace intelligence in contested environments.  It transforms laser warning into shared, actionable battlespace information.

Beyond real-time detection, BLISSTM incorporates enhanced laser pulse signature capture and analysis to help identify the source, intent, and affiliation of detected emissions.  By enabling users to distinguish among known signatures, the system supports faster, more informed tactical decisions.

“The BLISSTM system shipped today to Yuma for US Army testing represents a major step forward in tactical-edge force protection and actionable battlespace intelligence for commanders,” said Sean Homuth, President and CEO. “This capability will provide operators with critical time, better information, and a meaningful operational advantage against laser-enabled threats, including those seen in current Middle East conflicts.”

DEFSEC expects to brief domestic and foreign delegations on its BLISS product at Canada’s upcoming annual defence and security show, “CANSEC”, May 27 and 28, 2026, in Ottawa.

About DEFSEC

DEFSEC (TSXV: DFSC) (TSXV: DFSC.WT.U) (NASDAQ: DFSC) (NASDAQ: DFSCSW) (FSE: 62UA) develops and commercializes breakthrough next-generation tactical systems for military and security forces. The company’s current portfolio of offerings includes digitization of tactical forces for real-time shared situational awareness and targeting information from any source (including drones) streamed directly to users’ smart devices and weapons. Other DEFSEC products include countermeasures against threats such as electronic detection, lasers and drones. These systems can operate stand-alone or integrate seamlessly with OEM products and battlefield management systems, and all come integrated with TAK. The company also has a new proprietary less-lethal product line branded PARA SHOTTM with applications across all segments of the non-lethal market, including law enforcement. The Company is headquartered in Ottawa, Canada.

For more information, please visit https://www.defsectec.com

Forward-Looking Statements

This news release contains “forward-looking statements” and “forward-looking information” within the meaning of Canadian and United States securities laws (collectively, “forward-looking statements”), which may be identified by the use of terms and phrases such as “may”, “would”, “should”, “could”, “expect”, “intend”, “estimate”, “anticipate”, “plan”, “foresee”, “have sight of”, “believe”, or “continue”, the description of “optimism”, ” momentum” or “interest”,  the negative of these terms and similar terminology, including references to assumptions, although not all forward-looking statements contain these terms and phrases. Forward-looking statements are provided for the purpose of assisting the reader in understanding us, our business, operations, prospects and risks at a point in time in the context of historical and possible future developments and therefore the reader is cautioned that such information may not be appropriate for other purposes. Such forward-looking statements are based on the current expectations of DEFSEC’s management and are based on assumptions and subject to risks and uncertainties that are documented in detail in the Company’s public filings. Forward-looking statements included in this include, but are not limited to: management’s belief of sufficiency of available financial resources to support forecasted activities in 2026 based on cash on hand, anticipated revenue streams and planned expenditures in the fiscal year, subject to execution of the Company’s operating plan and other risks and factors described  in its public filings; interest in DEFSEC LightningTM, BLISSTM or other products and services as well as timing of full implementation or commercial release thereof; the Company’s estimates of increases to annualized gross margin on a go-forward basis and extent thereof, if any; the stage of scaled production for the PARA SHOTTM technology into new training cartridges and timing of release thereof; and management’s belief that its extensive customer base of law enforcement agencies for ARWEN throughout North America is a ready market for its new products like PARA SHOTTM as well as DEFSEC LightningTM.

Although DEFSEC’s management believes that the assumptions underlying such forward-looking statements are reasonable, they may prove to be incorrect. The forward-looking statements discussed in this news release may not occur by certain specified dates or at all and could differ materially as a result of known and unknown risk factors and uncertainties affecting DEFSEC, including DEFSEC’s inability to execute on its current operating plan and/or fiscal 2026 forecasted activities, DEFSEC’s inability to secure contracts and subcontracts (on the timelines, size and scale expected or at all), statements of work and orders for its products in fiscal 2026 and onwards for reasons beyond its control, the renewal or extension of agreements beyond their original term, the granting of patents applied for by DEFSEC, inability to finance the scale up to full commercial production levels for its physical products, inability to secure key partnership agreements to facilitate the outsourcing and logistics for its ARWEN® and PARA SHOTTM products, inability to commercialize DEFSEC’s Battlespace Laser Identification Sensor System (BLISS), inability to secure or complete the execution of government contracts, inability to drive growth in DEFSEC’s ARWEN® product line, inability to advance the commercialization of DEFSEC’s PARA SHOTTM products, delay or inability to launch DEFSEC’s Lightning SaaS offering, lower than expected or delayed demand for DEFSEC’s BLISS, overall interest in DEFSEC’s products being lower than anticipated or expected; general economic and stock market conditions; a stagnation or decrease in North American defense and public safety spending, adverse industry events; future legislative and regulatory developments in Canada, the United States and elsewhere; the inability of DEFSEC to implement and execute its business strategies; risks and uncertainties detailed from time to time in DEFSEC’s filings with the Canadian Security Administrators and the United States Securities and Exchange Commission, and many other factors beyond the control of DEFSEC. Although DEFSEC has attempted to identify important factors that could cause actual actions, events or results to differ materially from those described in forward-looking statements, there may be other factors that cause actions, events or results to differ from those anticipated, estimated or intended. Except as required by applicable securities laws, forward-looking statements speak only as of the date on which they are made and DEFSEC undertakes no obligation to publicly update or revise any forward-looking statements, whether as a result of new information, future events or otherwise.

Neither the TSX Venture Exchange nor its respective Regulation Services Provider (as that term is defined in the policies of the TSX Venture Exchange) accepts responsibility for the adequacy or accuracy of this news release.

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SOURCE DEFSEC Technologies Inc

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Technology

SPX Cooling Tech Unveils the Marley® OlympusMAX™ Fluid Cooler

Published

24 minutes ago

on

April 29, 2026

By

Maximum Capacity. Trusted Performance.

OVERLAND PARK, Kan., April 29, 2026 /PRNewswire/ — SPX Cooling Tech, LLC announced the launch of the Marley® OlympusMAX™ Fluid Cooler, engineered to deliver unmatched performance, efficiency and design flexibility for mission-critical facilities. Designed to meet the evolving demands of data centers, industrial plants and high-density cooling applications, the OlympusMAX Fluid Cooler sets a new benchmark in dry and adiabatic cooling technology.

Built on a century of heat rejection expertise, the OlympusMAX Fluid Cooler brings a new level of performance in dry and adiabatic cooling.  It is available in both adiabatic and dry configurations. The bolt-on adiabatic module can be factory or field installed—or even installed after the equipment is operational in order to provide maximum flexibility in response to changing conditions and site demands.

As global data center density continues to expand, operators are increasingly seeking cooling solutions that balance performance, energy use, water use and operational flexibility. “OlympusMAX reflects our commitment to advancing cooling technology to support the evolving demands of mission-critical facilities,” said Dustan Atkinson, Director of Product Management for SPX Cooling Tech. “By offering scalable dry and adiabatic performance, engineered flexibility and streamlined installation, we’re helping facilities meet increasingly challenging demands while maintaining efficiency and long-term reliability.”

At the heart of the OlympusMAX adiabatic module is a patent-pending recirculating adiabatic design that significantly reduces blowdown, minimizing unnecessary water discharge while improving system efficiency. Unlike traditional once-through or spray systems, the unit’s recirculation technology delivers more uniform water flow across the pad – improving saturation efficiency, extending pad life and reducing mineral accumulation on critical components. The result is more predictable energy and water consumption – a critical advantage for performance-sensitive environments such as hyperscale data centers.

Engineered for uptime, the OlympusMAX features high-efficiency Marley Geareducer® gear drives, robust construction materials and integrated component redundancy, including mission-critical fan and VFD systems. With unit options ranging from 120 to 240 horsepower, the design maximizes cooling capacity per square foot, delivering industry-leading heat rejection density.

Installation and serviceability were key priorities in the system’s development. Each unit ships with a factory-assembled electrical access platform, single-point wiring connection, VFDs and PLC controls pre-installed, and full-size access doors with internal walkways. These features streamline installation while enabling safer operation and easier maintenance.

The launch underscores SPX Cooling Tech’s mission to provide flexible, high-efficiency heat rejection solutions across its full portfolio including dry coolers, adiabatic coolers, evaporative coolers, and cooling towers, ensuring customers have a single-supplier solution tailored to their operational strategy.

About SPX Cooling Tech, LLC
SPX Cooling Tech is a leading global manufacturer of cooling towers, fluid coolers, adiabatic and dry cooling systems, evaporative condensers, industrial evaporators and OEM aftermarket parts from brands that include Marley®, Recold® and SGS Refrigeration. Since 1922, our brands’ cooling systems, components and technical services have supported applications in heating, ventilation and air conditioning (HVAC), refrigeration, and industrial process cooling. SPX Cooling Tech and its product brands are part of SPX Technologies, Inc. For more information see www.spxcooling.com.

About SPX Corporation
SPX Technologies is a supplier of highly engineered products and technologies, holding leadership positions in the HVAC and detection and measurement markets. Based in Charlotte, North Carolina, SPX Technologies has approximately 4,700 employees in 16 countries and is listed on the New York Stock Exchange under the ticker symbol “SPXC.” For more information, please visit www.spx.com.

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SOURCE SPX Cooling Technologies

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Technology

AMTD’s TGE Reports Full Year Results with 27.7% Increase in Revenue, with 25.5% Increase in Total Assets and 9.1% Increase in Net Assets

Published

1 hour ago

on

April 29, 2026

By

PARIS and LONDON and NEW YORK, April 29, 2026 /PRNewswire/ — The Generation Essentials Group (“TGE” or the “Company”) (NYSE: TGE, LSE; TGE), a NYSE and LSE dual-listed company and a subsidiary of AMTD Group Inc., today announced the filing of its annual report on Form 20-F for the fiscal year ended December 31, 2025 with the Securities and Exchange Commission, with summary highlights below:

Total Revenue increased by 27.7% from US$77.0 million to US$98.3 millionTotal non-GAAP Net Income increased by 3.2% from US$44.7 million to US$46.2 million Total Assets amounted to US$1,464.1 million (US$30.2/share)Net asset value amounted to US$839.1 million (US$17.3/share)

The annual report is available on the Company’s investor relations website at  http://thegenerationalessentials.com. The Company will provide a hard copy of its annual report containing the audited consolidated financial statements, free of charge, to its shareholders upon request. Requests should be directed to Investor Relations Office at ir@tge.media.

About The Generation Essentials Group

The Generation Essentials Group (NYSE: TGE; LSE: TGE), jointly established by AMTD Group, AMTD IDEA Group (NYSE: AMTD; SGX: HKB) and AMTD Digital Inc. (NYSE: HKD), is headquartered in France and focuses on global strategies and developments in multi-media, entertainment, and cultural affairs worldwide as well as hospitality and VIP services. TGE comprises L’Officiel, The Art Newspaper, movie and entertainment projects. Collectively, TGE is a diversified portfolio of media and entertainment businesses, and a global portfolio of premium properties. Also, TGE is a special purpose acquisition company (SPAC) sponsor manager, with its first SPAC successfully raised and priced on December 18, 2025.

For The Generation Essentials Group:
IR Office
The Generation Essentials Group
EMAIL: ir@tge.media

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SOURCE The Generation Essentials Group

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