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Quobly secures €115 million Series A to bring silicon-based quantum computers to market

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GRENOBLE, France, June 3, 2026 /CNW/ — Quobly, a French quantum computing company, today announced the closing of a €115 million Series A financing to accelerate the industrialization of its silicon-based quantum computers and bring its first commercial product to market by the end of 2026.

The round is led by Bpifrance, SEALSQ and STMicroelectronics, with participation from the European Innovation Council (EIC Fund), Blast, ALIAD (Air Liquide Venture Capital) and existing investor Innovacom, bringing together leading industrial, sovereign and deeptech investors. Existing shareholders also include the CEA, CNRS, Quantonation and Supernova Invest. 
Long-time investor Bpifrance is participating through the Deep Tech 2030 fund, managed on behalf of the French government as part of the France 2030 initiative.This financing will support continued R&D, industrialization efforts and international commercial expansion.Quobly, bringing semiconductor-grade manufacturing and industrialization to quantum computing, plans to deploy its first commercial quantum computer through the cloud by the end of 2026 under its Alloy product line.

From technology validation to commercial deployment at scale

This Series A marks a key step in Quobly’s roadmap to industrial-scale quantum computing, transitioning from early validation to the production of its first commercial systems.

Alloy Pioneer, the first computer in Quobly’s Alloy product line, is designed for early adopters in high-performance computing and research environments. The system will be accessible through the cloud in 2026, before deployment within HPC infrastructures in 2027.

Quobly’s quantum computers are designed to integrate into existing HPC and data-center infrastructures, with a compatible footprint, power supply and utility requirements, enabling straightforward deployment. 
Alloy Pioneer is accessible through Alloy Forge, Quobly’s quantum application development environment, enabling users to develop and validate applications under realistic hardware constraints.

The company will in particular:

Increase the performance and scalability of its quantum computer product line,Accelerate the industrialization and scaling of its silicon quantum processors,Deploy its first Alloy systems into customer cloud and HPC environments.

These efforts will be supported by the continued expansion of Quobly’s hardware, control electronics and software stack, in line with its system-level co-design approach.

This Series A follows Quobly’s €19 million seed phase (2023-2025), during which the company demonstrated the feasibility of developing silicon qubits within semiconductor manufacturing processes, and established a system-level architecture integrating device, control and software layers.

Scaling quantum computing through semiconductor manufacturing

Quobly’s approach is based on the use of FD-SOI technology on 300 mm wafers, leveraging established semiconductor manufacturing processes to address key challenges in scalability, yield and reproducibility. The company develops silicon qubits designed for dense integration and compatibility with industrial fabrication standards.

As part of this strategy, Quobly leverages semiconductor-grade capabilities across the broader semiconductor ecosystem through strategic partnerships with industrial leaders including STMicroelectronics, Air Liquide, Soitec and Orano. These collaborations accelerate the transfer of Quobly’s quantum technologies into advanced manufacturing environments and support the industrial integration of process control, materials engineering, cryogenics and yield optimization from the earliest stages of deployment.

This industrial-first approach sets Quobly apart by prioritizing manufacturability and technology-system co-development.

Executive commentary

Maud Vinet, CEO and co-founder, Quobly
“This financing marks a transition from technology validation to industrial execution. Over the past two years, we have demonstrated that silicon qubits can be developed within semiconductor manufacturing processes and integrated into a system architecture. With this Series A, we are accelerating the deployment of our first commercial systems and building a quantum computing platform designed to integrate into existing computing infrastructures. Our objective is to make quantum computing deployable, scalable and usable within real industrial environments.”

Investor perspectives

Laurent Malier, Executive Vice President, Global Technology R&D, STMicroelectronics
“Quantum computing will achieve the scale needed by HPC customers only if breakthrough quantum systems can be industrialized and integrated with semiconductor-grade rigor and backed by a robust ecosystem. We are leveraging years of shared expertise in FD-SOI and deep technological collaboration to accelerate the commercialization of Quobly’s products thanks to a 300mm silicon fab environment. ST’s investment in Quobly further demonstrates our commitment to support its global ambitions.”

Gwenaël Hamon, Senior Investment Director, Bpifrance
“Our second investment in Quobly is fully in line with our ambition to support the emergence of sovereign technology champions. By choosing a quantum architecture compatible with established microelectronics industry standards, Quobly paves the way for the rapid and controlled industrialization of breakthrough technologies, an essential condition to ensure Europe’s strategic autonomy in quantum computing.”

Carlos Moreira, CEO, SEALSQ
“SEALSQ is proud to participate as a lead investor in Quobly’s Series A financing. This investment builds on the technical partnership initiated in 2025. By combining Quobly’s silicon-based quantum processors with SEALSQ’s post-quantum security technologies, this collaboration contributes to the development of secure quantum computing systems. It supports the development of trusted quantum systems for industrial and critical applications.”

Philippe Delmas, Chairman of the Board, Quobly
“Quobly represents a rare combination of breakthrough scientific capability and industrial execution discipline. The company is positioning itself at the intersection of quantum computing, semiconductor manufacturing and high-performance computing infrastructure, three strategic domains that will shape the next generation of computing technologies.”

Advisors
Financial advisors to Quobly were Avolta and Rochefort & Associés. Legal advisors to Quobly were Goodwin and Kelten. 
Legal advisors to investors included Bignon Lebray, Jones Day and Rimon Law. Financial advisory support was provided by Forvis Mazars. 
Bank financing partners included BNP Paribas, Bpifrance, Caisse d’Epargne Rhône-Alpes and Société Générale.

About Quobly
Visit our website and follow us on LinkedIn.

Contact media: marie.cabrieres@quobly.io

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Logo – https://mma.prnewswire.com/media/2993517/Quobly_logo.jpg

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SOURCE Quobly

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Pillsbury Notice of Data Breach

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NEW YORK, July 18, 2026 /PRNewswire/ — Pillsbury Winthrop Shaw Pittman LLP (“Pillsbury”) was among many law firms targeted by sophisticated social engineering attempts in an incident last year. While the firm quickly detected and blocked the activity, an unauthorized actor was able to access some of the firm’s documents during a short window of time. Pillsbury notified any impacted clients last year and undertook a detailed process to review the accessed documents for personal information. Pillsbury then began notifying individuals whose personal information was affected. That process is now complete, and today, Pillsbury is publishing substitute notice as a final step.

For more information, please visit the substitute notice on our website at https://www.pillsburylaw.com/en/breach-notice.html

View original content to download multimedia:https://www.prnewswire.com/news-releases/pillsbury-notice-of-data-breach-302828892.html

SOURCE Pillsbury Winthrop Shaw Pittman LLP

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From Remote Racing to Embodied AI: Fibocom and Intedigo Bring 5G Bidirectional Data Transmission into Real-World Applications

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SHANGHAI, July 18, 2026 /PRNewswire/ — From July 17 to 20, Fibocom and Intedigo will jointly present a cross-regional, beyond-visual-line-of-sight (BVLOS) teleoperation demonstration at Booth H3-C408 during the World Artificial Intelligence Conference (WAIC) 2026. Visitors will be able to enter a remote driving cockpit and control a real race car located at HURA PARK in Jiading, Shanghai, steering, accelerating, and braking in real time while experiencing how 5G connectivity enables remote operation.

More than an immersive driving experience, the demonstration provides a live validation of 5G bidirectional data transmission for embodied AI teleoperation. The vehicle continuously sends live track video, vehicle status, and operating data to the remote cockpit, while control commands are transmitted back to the vehicle, creating a closed-loop teleoperation system. Stable, low-latency, and highly reliable connectivity is essential for high-dynamic maneuvers such as high-speed cornering, precision braking, and continuous lane changes.

Developed by Intedigo, the remote driving system connects a real race car with an immersive remote driving cockpit. It supports 1080p@60Hz video transmission, glass-to-glass (G2G) video latency of less than 80 ms, and control latency of less than 10 ms. The demanding racing environment magnifies differences in video continuity and control responsiveness, making communications performance directly perceptible, measurable, and verifiable.

At the joint demonstration, Fibocom’s FM160 5G module provides cellular connectivity for the system. Powered by the Qualcomm Snapdragon™ X62 5G Modem-RF System, the FM160 supports SA and NSA network architectures as well as 3GPP Release 16. On the downlink, it supports NR Carrier Aggregation (NR CA) with bandwidth of up to 120 MHz, delivering peak speeds of up to 3.5 Gbps in NSA mode and 2.5 Gbps in SA mode. On the uplink, it supports UL MIMO and delivers peak speeds of up to 900 Mbps in SA mode. These capabilities support the continuous transmission of HD video and vehicle status data, along with reliable delivery of control commands.

As embodied AI moves into factories, data centers, logistics operations, and industrial parks, robots are becoming increasingly capable of performing tasks autonomously. Yet complex environments, unexpected events, and edge cases still require Human-in-the-Loop (HITL) remote intervention to help ensure safe and reliable operation.

Daniel Liu, CEO of Intedigo, said:

“5G represents the pinnacle of human communications and the starting point of machine communications. In the past, communications connected people to people; in the future, they will connect people to robots and robots to robots. Remote racing is simply the easiest entry point for people to understand this concept. What we are truly validating is a communications system capable of supporting remote collaboration for embodied AI. HURA makes low-latency remote driving a tangible experience, while RoBOX extends this capability to robots and a broader range of intelligent terminals. Together with Fibocom, we hope to enable more machines to receive remote assistance whenever needed while remaining continuously connected and operating reliably.”

Simon Tao, VP of Wireless Solutions Business Group and General Manager of MBB BU at Fibocom, said:

“As embodied AI enters real-world industrial environments, reliable connectivity will become the foundation for telemetry feedback, remote control and operational management. Fibocom’s 5G solutions, represented by FM160, provide the cellular connectivity required for continuous on-site data transmission and reliable control command delivery. Fibocom will continue collaborating with ecosystem partners such as Intedigo to bring cellular connectivity to more robots, autonomous machines and mobile intelligent terminals, enabling embodied AI systems to stay continuously connected and respond reliably in real-world applications.”

From remote race cars to robots, unmanned equipment, and mobile intelligent terminals, 5G is evolving from connecting people to connecting machines. This joint demonstration makes the capabilities of 5G bidirectional data transmission directly perceptible, experiential, and verifiable, helping pave the way for embodied AI to scale across real-world applications.
 

About Fibocom

Fibocom, founded in 1999, is China’s first wireless communication module company listed on both the A-share and H-share markets (300638.SZ, 0638.HK). As a global leading provider of wireless communication modules and AI solutions, Fibocom leverages wireless communication and artificial intelligence as its core technologies to provide integrated hardware and software solutions that empower industry applications. These solutions accelerate the transformation from “Connect Everything” to “Intelligent Connectivity” across diverse industries.

Fibocom’s one-stop solutions encompass cellular communication, AI, automotive, and GNSS modules, as well as AI toolchains, supporting industry-side and mainstream large model integration, and providing AI Agent, global connectivity, and cloud services, driving the digital intelligence upgrades in industries such as robotics, consumer electronics, low-altitude economy, intelligent transportation, smart retail, and smart energy.

View original content to download multimedia:https://www.prnewswire.com/news-releases/from-remote-racing-to-embodied-ai-fibocom-and-intedigo-bring-5g-bidirectional-data-transmission-into-real-world-applications-302828996.html

SOURCE Fibocom Wireless Inc.

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DR. PHONE FIX ANNOUNCES SECOND TRANCHE CLOSING OF NON-BROKERED CONVERTIBLE DEBENTURE UNIT FINANCING

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/NOT FOR DISTRIBUTION TO U.S. NEWSWIRE SERVICES OR FOR DISSEMINATION IN THE UNITED STATES/

EDMONTON, AB, July 18, 2026 /CNW/ — Dr. Phone Fix Canada Corporation (“Dr. Phone Fix” or the “Company”) (TSXV: DPF) is pleased to announce that, further to its news release dated May 19, 2026 and June 24, 2026 (the “Prior News Releases”), it has closed the second tranche of its non-brokered private placement (the “Offering”) of convertible debenture units of the Company (each, a “Unit”). The Company issued 726 Units, at a price of $1,000 per Unit, for aggregate gross proceeds of $726,000. Each Unit is comprised of (i) one $1,000 principal amount unsecured convertible debenture of the Company (a “Convertible Debenture”) and (ii) 3,125 common share (“Common Share”) purchase warrants of the Company (each, a “Warrant”). Additional detail on the Offering, including terms of the Convertible Debentures and Warrants, is set out in the Prior News Releases.

In connection with the Offering, the Company paid a finder’s fee consisting of an aggregate cash fee of $50,820 and issued an aggregate of 317,625 common share purchase warrants of the Company (each, a “Finder’s Warrant”) to certain qualified arm’s length parties. Each Finder’s Warrant is exercisable to acquire one Common Share of the Company at an exercise price of $0.22 prior to the date that is 24 months from the date of issuance.

All securities issued pursuant to the Offering, including any Common Shares issuable upon conversion of the Convertible Debentures or exercise of the Warrants and Finder’s Warrants, are subject to a statutory hold period of four months and one day from the closing of the Offering, in accordance with applicable securities laws and TSX Venture Exchange (the “TSXV”) policies. 

The Offering remains subject to final acceptance of the TSXV.

This news release does not constitute an offer to sell or a solicitation of an offer to buy any of the securities described in this news release in the United States. Such securities have not been, and will not be, registered under the U.S. Securities Act, or any state securities laws, and, accordingly, may not be offered or sold within the United States, or to or for the account or benefit of persons in the United States or “U.S. Persons”, as such term is defined in Regulation S promulgated under the U.S. Securities Act, unless registered under the U.S. Securities Act and applicable state securities laws or pursuant to an exemption from such registration requirements.

About Dr. Phone Fix

Dr. Phone Fix is a national, award-winning, eco-friendly, and customer-centric leader in Canada’s cell phone and electronics repair and certified pre-owned device industry. Founded in 2019, the Company now operates 44 retail locations nationwide through a standardized and scalable operating platform designed to support consistent execution across multiple markets, delivering fast, reliable, and environmentally conscious repair services alongside a curated selection of certified pre-owned devices and premium accessories. Dr. Phone Fix maintains strong partnerships with OEMs and certified suppliers, ensuring consistently high-quality standards across its national footprint. With a focus on responsible device lifecycle management, customer service, and operational discipline, Dr. Phone Fix continues to set the benchmark for device care and resale in Canada.

www.docphonefix.com

NEITHER THE TSXV NOR ITS REGULATION SERVICES PROVIDER (AS THAT TERM IS DEFINED IN THE POLICIES OF THE TSXV) ACCEPTS RESPONSIBILITY FOR THE ADEQUACY OR ACCURACY OF THIS NEWS RELEASE.

Forward-Looking Information and Cautionary Statements

Certain information in this news release constitutes forward-looking statements under applicable securities laws. Any statements that are contained in this news release that are not statements of historical fact may be deemed to be forward-looking statements. Forward-looking statements are often identified by terms such as “may”, “should”, “anticipate”, “expect”, “potential”, “believe”, “intend” or the negative of these terms and similar expressions. Forward-looking statements in this news release include statements relating to: the final acceptance of the Offering by the TSXV; and the expected use of proceeds following the closing of the Offering. Forward-looking information in this news release is based on certain assumptions and expected future events, namely: the Company’s financial condition and development plans do not change as a result of unforeseen events; the TSXV will provide its final acceptance of the Offering; and the Company will be able to obtain the financing required in order to develop and continue its business and operations. These statements involve known and unknown risks, uncertainties and other factors, which may cause actual results, performance or achievements to differ materially from those expressed or implied by such statements, including but not limited to: the Company’s inability to obtain TSXV final acceptance for the Offering; the potential failure to complete the balance of the Offering or to raise the full anticipated gross proceeds; market conditions and investor demand for the Company’s securities; the Company’s inability to deploy the proceeds as currently intended; and general economic and market conditions. Readers are cautioned that the foregoing list is not exhaustive. Readers are further cautioned not to place undue reliance on forward-looking statements, as there can be no assurance that the plans, intentions or expectations upon which they are placed will occur. Such information, although considered reasonable by management at the time of preparation, may prove to be incorrect and actual results may differ materially from those anticipated. Forward-looking statements contained in this press release are expressly qualified by this cautionary statement and reflect the Company’s expectations as of the date hereof and are subject to change thereafter. The Company undertakes no obligation to update or revise any forward-looking statements, whether as a result of new information, estimates or opinions, future events or results or otherwise or to explain any material difference between subsequent actual events and such forward-looking information, except as required by applicable law.

 

SOURCE Dr. Phone Fix

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