BEIJING, Sept. 10, 2026 /PRNewswire/ — On September 10, iQIYI, China’s leading online entertainment platform, launched the Global AI Creator Challenge, the first such contest on the international version of NadouPro, its AI platform built for professional film and television production. Themed “Make Ideas Unforgettable”, the challenge upgrades NadouPro’s creative toolset and partners with Alibaba’s Wan3.0 model to enable seamless, end-to-end AI-driven film production. The partnership ensures that creators have access to top-tier AI capabilities, supporting every stage of the creative process from initial ideas to finished films. By working with advanced models like Wan3.0, NadouPro is reinforcing its position as a global hub for AI-driven filmmaking, encouraging global creators to explore new possibilities in professional video production.

The NadouPro x Wan3.0 AI Challenge

The contest is designed to identify and reward high-potential creative talent using professional-grade AI tools. It has no limitations on subject matter. Creators are invited to submit AI video works of any form and explore new possibilities of AI filmmaking. Key details include:

Submission requirements: Entries must be original videos between 30 seconds and five minutes in length, with at least 60% of the content generated by the Wan3.0 model and 80% on the NadouPro platform. Global content is encouraged. To submit, participants ought to publish their work on social media platform X with the tags #NadouPro and #wan3, tagging @nadou_pro and @Alibaba_Wan.

Timeline and participation: Submissions are open from September 10 to September 23, 2026, followed by a judging period from September 24 to September 30.

Featured awards: The challenge recognizes 156 winners across three distinct categories, including 3 winners for Masterpiece Award, 3 for People’s Choice Award, and 150 for Active Participation Award.

Prize pool: A total prize pool of over USD 10,000 is available. Following the contest, NadouPro and Alibaba’s Wan3.0 will promote outstanding entries to increase their visibility among a larger audience.

Empowering Global Workflows with Leading Technology

NadouPro unites leading global models with proprietary capabilities to support creators through the entire creative journey – from script and assets to storyboarding and the finished film. The international version now supports multiple languages, including English, Korean, Thai and Arabic, serving creators in more than 20 countries and regions worldwide.

Concurrently with the contest, NadouPro is rolling out permanent creative updates to enhance the entire platform:

3D Directing Studio: Stage 3D models and cameras to refine movement and sequencing via a timeline. This creates a spatial plan to lock in complex choreography and composition before final generation.

720° Panoramas, Multi-Angle and Multi-Grid Generation: New image nodes for panoramas and multi-angle views enable one-click reference libraries, helping improve visual and character consistency across production.

Canvas Agent & Skills Library (Coming Soon): An upcoming agent will generate creative plans from a single prompt and automate node-linking once the plan is confirmed by the user, while drawing on a specialized library of skills for professional-level tasks.

The Wan3.0 model powers the contest with advanced realism and storytelling capabilities. Its Omni-Reference feature supports multi-modal inputs including images, video, audio clips, and documents. Separately, it can generate native single-shot videos of 30 seconds. The model supports pixel-level consistency for referenced assets while providing an immersive audio-visual experience with synchronized sound. Creators also benefit from precision video editing through both instruction- and reference-based tools for greater production efficiency.

From a single idea to a work that endures, NadouPro invites creators around the world to push the boundaries of what AI video can be. As a platform committed to advancing the future of AI filmmaking, iQIYI will continue to put professional-grade capabilities and possibilities in the hands of creators everywhere. Follow nadou.ai for the latest updates and details on how to join the challenge.

Contact:
iQIYI Press, press@qiyi.com 

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SOURCE iQIYI Inc.

The new FilaDC i10 combines active dehumidification, 10-spool storage, low energy consumption and quiet operation to help maintain a stable, low-humidity environment for filament storage.

FRANKFURT, Germany, Sept. 10, 2026 /PRNewswire/ — SUNLU and INSLOGIC are introducing the FilaDC i10 Filament Dehumidifying Cabinet, a new long-term storage solution designed to help 3D printing users protect filament from moisture between prints.

Physical Adsorption + Smart Cycling

The i10 uses a molecular sieve to adsorb moisture from the air inside the cabinet. Its smart cycling system releases collected moisture and restores adsorption capacity automatically, providing continuous humidity control between 10% and 45% RH.

In testing, PETG stored in the i10 decreased from 0.34% to 0.21% moisture content after 96 hours, while PETG exposed to open air increased from 0.35% to 0.39% over the same period.

This creates a stable, low-humidity environment for long-term filament storage without relying on continuous high-temperature drying.

10-Spool Storage, Stackable Design

The i10 stores up to 10 × 1 kg filament spools and supports spool sizes from 0.25 kg to 5 kg.

Multiple i10 units can be stacked vertically to save floor space, with stacking up to three units recommended.

A sealing gasket and three strong magnets help keep the cabinet tightly closed and maintain a stable storage environment.

Built for Long-Term Storage

The i10 consumes approximately 0.23 kWh/24h* and operates below 30 dB, making it suitable for continuous use in homes, studios, workshops, and print rooms.

Its integrated design requires no complicated installation. Users can simply set it up, load the filament, and let it maintain the storage environment.

*Tested at 25°C and 60% RH in an empty chamber. Actual results may vary.

Multiple Safety Protections

For long-term operation, the i10 combines hardware temperature protection with intelligent software monitoring. If excessive temperature is detected, the system provides a real-time warning.

Beyond filament, the i10 can also provide low-humidity storage for other moisture-sensitive items, such as camera lenses, electronic components, tools, and collectibles.

Availability

The SUNLU × INSLOGIC FilaDC i10 will be available for pre-order beginning:

September 15, 2026, at 7:00 AM UTC
Pre-order: [https://bit.ly/4gGV5lb]

About SUNLU

Founded in Zhuhai in 2013, SUNLU is a global 3D printing brand specializing in filaments, resins, and accessories. With 270+ production lines, 25 million+ products sold, and 530+ intellectual property rights, SUNLU continues to advance 3D printing through product innovation, quality, and accessibility.

View original content to download multimedia:https://www.prnewswire.com/news-releases/sunlu-and-inslogic-launch-filadc-i10-filament-dehumidifying-cabinet-for-long-term-filament-storage-302873286.html

SOURCE SUNLU

– Paper Presented at IEEE ESTC 2026, International Conference on Semiconductor- and Electronic Device-packaging Technologies and Related Materials –

TOKYO, Sept. 10, 2026 /PRNewswire/ — Taiyo Holdings Co., Ltd. (Securities code: 4626; hereinafter “Taiyo Holdings”), based in Tokyo, presented a paper on September 10, 2026, at the 11th IEEE Electronics System-Integration Technology Conference (IEEE ESTC 2026), held in Helsinki, Finland, on the “FPIM Series” (hereinafter the “Material”), a next-generation semiconductor-packaging material. The FPIM Series is a fine-pitch RDL (*1) negative-tone i-line photosensitive insulating material for dual damascene processes.

This paper was co-authored with imec, one of the world’s largest semiconductor research institutes. The RDL is a key technology in advanced semiconductor-packaging structures, enabling more efficient electrical connections. Currently, RDLs are manufactured mainly using the semi-additive process (SAP) (*2). According to imec, as the industry pursues increasingly fine-pitch wiring, the dual damascene process (*3) will become essential for forming wiring with pitches of 1.6 micrometers or less. To address this, Taiyo Holdings developed the Material as a next-generation fine-pitch RDL material for dual damascene processes and began joint research with imec in October 2022. In November 2025, the two organizations presented a co-authored paper on the formation of a three-layer RDL structure with a CD (*4) of 1.6 micrometers on 12-inch wafers.

In this research, a three-layer RDL structure was formed on 12-inch wafers using the Material and evaluated. As a result, the target dimension of 700-nm CD was achieved for both interconnects and vias. The 700-nm CD metal 1 layer (M1) also demonstrated favorable electrical characteristics in terms of leakage current and resistance. Through this joint research with imec, it was confirmed that the Material offers excellent electrical characteristics and high resolution and is suitable for use with the CMP process (*5). These results represent an important achievement in interconnect technology for next-generation advanced packaging, paving the way for the future development of submicron-class RDL design rules.

Going forward, Taiyo Holdings aims to achieve RDL formation with a CD of 500 nm or less on wafers, while continuing to verify the long-term performance and reliability of the electrical characteristics. The company will continue developing materials that contribute to the growth of the semiconductor packaging field, such as by enabling further improvements in the performance of AI semiconductors. Taiyo Holdings also began shipping small-volume samples of the Material for R&D applications in 2025.

Notes:
(*1) RDL (redistribution layer) is a layer formed on the surface of a semiconductor chip to redistribute electrical wiring.
(*2) A method in which a thin seed layer is formed over the entire surface, followed by electroplating to form wiring patterns in designated areas.
(*3) A method in which wiring trenches are formed in an insulating film and then filled by sputtering, CVD, electroplating, or similar methods to form wiring patterns.
(*4) CD (critical dimension) refers to the dimensions of fine patterns.
(*5) The CMP process (chemical mechanical planarization/polishing) is a semiconductor-manufacturing process that chemically and mechanically planarizes the wafer surface.

– Conference information & presentation details
Name of conference: The 11th IEEE Electronics System-Integration Technology Conference
Location: Helsinki, Finland
Dates: From Wednesday, September 9, to Friday, September 11, 2026
Presentation session: MIP 1: Dielectric and Glass Materials for Advanced Substrates
Co-authored paper title: A Novel i-Line Photosensitive Dielectric Material Enabling 700 nm Polymer Damascene RDL for Advanced Packaging
Related Link: https://www.estc-conference.net/

– Partnership between imec and Taiyo Holdings
Headquartered in Belgium, imec is one of the world’s leading research and innovation hubs for advanced semiconductor technology. It promotes open innovation in collaboration with universities and companies around the world, contributing to the development of cutting-edge semiconductor technologies. In October 2022, imec and Taiyo Holdings began joint research on a fine-pitch RDL negative-tone photosensitive insulating material for damascene processes, a material for next-generation semiconductor packaging. Since November 2024, Taiyo Holdings has also dispatched personnel to be stationed at imec to facilitate closer collaboration, while conducting ongoing research and development of advanced semiconductor materials. In November 2025, the two organizations announced that they had achieved a wiring CD of 1.6 micrometers and a via CD of 2 micrometers on 12-inch wafers using the “FPIM Series” RDL material.

Image 1: Production of Evaluation Samples
https://cdn.kyodonewsprwire.jp/prwfile/release/M108899/202608274838/_prw_PI2fl_1SbJFiHz.png 

Image 2: Product Image
https://cdn.kyodonewsprwire.jp/prwfile/release/M108899/202608274838/_prw_PI1fl_NExAX0Q4.png 

About Taiyo Holdings Co., Ltd.: https://kyodonewsprwire.jp/attach/202608274838-O1-s1h2S4Ka.pdf 

Official website: https://www.taiyo-hd.co.jp/en/index.html 

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SOURCE Taiyo Holdings Co. Ltd.