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SIGGRAPH 2026 Announces Sponsored Keynote Presentations Showcasing the Future of Graphics, AI, and Simulation

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Breakthroughs in Neural Rendering, GPU Innovation, and Generative AI Take Center Stage With Speakers From NVIDIA, Bolt Graphics, and Tripo AI.

LOS ANGELES, July 6, 2026 /PRNewswire/ — SIGGRAPH 2026, the world’s premier conference on computer graphics and interactive techniques, is proud to announce its lineup of sponsored keynote presentations, highlighting pioneering advancements in computer graphics, artificial intelligence, neural rendering, and next-generation hardware. Industry leaders from NVIDIA, Bolt Graphics, and Tripo AI will take the stage to share breakthrough innovations that are reshaping how digital worlds are created, simulated, and experienced.

Taking place during the 53rd annual conference, 19–23 July in Los Angeles, these sponsored keynote sessions will explore transformative technologies across research, production, and infrastructure — offering attendees a front-row seat to the future of digital environments and interactive media.

“SIGGRAPH continues to be the premier stage for unveiling the ideas and technologies that define the future of computer graphics and interactive techniques,” said Chris Redmann, SIGGRAPH 2026 Conference Chair. “This year’s sponsored keynotes reflect not only the rapid evolution of AI-driven content creation, but also the deep collaboration between industry and research that drives innovation forward.”

This year’s sponsored keynote presentations include:

NVIDIA | Next Era of Graphics — Neural Rendering, World Models, and Simulation

Presented by: Neil Ashton, Ming-Yu Liu, and Edward Liu
Monday, 20 July 2026 | 3:45 pm PDT

Neil Ashton, Ming-Yu Liu, and Edward Liu of NVIDIA Research and Engineering will explore the latest breakthroughs shaping computer graphics and simulation. Their keynote highlights advances in neural rendering, world models, and AI-driven simulation, demonstrating how these technologies are transforming the creation and use of digital environments across industries — from creative tools and industrial design to robotics and autonomous systems.

Neil Ashton, a distinguished engineer at NVIDIA, focuses on AI physics and agentic AI for computational engineering. Ming-Yu Liu, an IEEE fellow and leader of the NVIDIA Cosmos Lab, advances world foundation models and generative AI technologies for physical AI. Edward Liu, director of applied deep learning research, leads innovations in AI-powered real-time graphics, including advances across NVIDIA’s DLSS technology suite and neural rendering research.

Bolt Graphics | Building a GPU for the Future of Computer Graphics

Presented by: Darwesh Singh
Tuesday, 21 July 2026 | 2:30 pm PDT

Darwesh Singh, founder and CEO/CTO of Bolt Graphics, will explore a new approach to GPU design built for real-time path tracing and physics simulation. His keynote examines how moving beyond traditional rasterization architectures enables new possibilities for rendering and simulation, and how Bolt’s Zeus GPU is being developed to meet the demands of creators and researchers pushing toward photorealistic, physically accurate experiences.

Singh leads Bolt Graphics with a focus on rethinking GPU performance for next-generation graphics workloads, emphasizing efficiency and scalability for advanced rendering and simulation applications.

Tripo AI | Building the Interactive Future: The Full-Stack Evolution of 3D Generative AI and World Models

Presented by: Dr. Yanpei Cao, Dr. Yuanchen Guo, Dr. Zixin Zou, Dr. Yingtian Liu, and Dr. Biao Zhang
Wednesday, 22 July 2026 | 2:30 pm PDT

Dr. Yanpei Cao and the Tripo AI research team will explore the fundamental shift from static appearance generation to functional, interactive 3D intelligence. The keynote unpacks the underlying complexities of building a full-stack generative ecosystem, demonstrating how Tripo’s foundational research is actively deployed across demanding industrial pipelines, including gaming, 3D printing, and robotics simulation. Looking forward, the talk will share their outlook on the field’s trajectory. The team will discuss how massive-scale architectures, emergent intelligence, and multimodal integration are driving the leap from isolated asset generation to dynamic environments, agentic systems, and world modeling.

Cao, Tripo AI’s chief scientist, leads research advancing generative AI for interactive content creation, alongside a team focused on bridging foundational AI research with production-ready infrastructure for millions of creators.

These sessions underscore the collaborative innovation driving the future of graphics and interactive storytelling. Join the global community of researchers, artists, and technologists at SIGGRAPH 2026 to experience these advances firsthand. Register today at s2026.siggraph.org.

About ACM, ACM SIGGRAPH, and SIGGRAPH 2026
 ACM, the Association for Computing Machinery, is the world’s largest educational and scientific computing society, uniting educators, researchers, and professionals to inspire dialogue, share resources, and address the field’s challenges. ACM SIGGRAPH is a special interest group within ACM that serves as an interdisciplinary community for members in research, technology, and applications in computer graphics and interactive techniques. The SIGGRAPH conference is the world’s leading annual interdisciplinary educational experience showcasing the latest in computer graphics and interactive techniques. SIGGRAPH 2026, the 53rd annual conference hosted by ACM SIGGRAPH, will take place live 19–23 July at the Los Angeles Convention Center.

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Firmable breaks into G2’s global top five for momentum in Sales Intelligence

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Firmable earned 17 badges in G2’s Fall 2026 reports and improved its ranking in 28 of the 32 reports it featured in last season, holding its position in the other four.

MELBOURNE, Australia and SAN FRANCISCO, Oct. 27, 2026 /PRNewswire/ — Firmable, the AI-native B2B sales platform, has climbed from #8 to #4 on G2’s global Momentum Grid for Sales Intelligence, which ranks the fastest-rising products in the category worldwide. It also ranked #1 for SMB sales intelligence in both Australia and ANZ and moved into the top 10 across Asia-Pacific.

The results span regional, segment and global reports in both the Sales Intelligence and Lead Intelligence categories. They are based on verified reviews from Firmable customers, alongside G2’s measures of market presence and growth.

Global momentum as Firmable scales in North America

Firmable is now one of the fastest-rising sales intelligence products worldwide. Its jump to #4 on G2’s global Momentum Grid for Sales Intelligence was matched by strong gains in G2’s global satisfaction indexes:

Relationship Index for Sales Intelligence: #3, up from #24Implementation Index for Sales Intelligence: #3, up from #17Results Index for Sales Intelligence: #4, up from #16

The results arrive as Firmable expands across the US and Canada, following its $14 million Series A in March and the launch of the Firmable MCP in July. They were followed by the launch of Tech Intelligence earlier in October.

“G2 rankings come straight from customers, and that’s why these results matter to us,” said Leigh Jasper, co-founder and co-CEO of Firmable. “Customers are telling the market three things: Firmable is easy to work with, fast to roll out, and it delivers results. Those scores climbed the most this season. That’s exactly the proof point sales leaders look for when they evaluate a new platform. We built Firmable as an AI-native product from day one, and teams in North America and elsewhere are responding. Breaking into the global top five for momentum is a strong signal of where we’re headed.”

#1 in Australia and in ANZ

Firmable took the top spot for small-business sales intelligence in both of its home markets. It rose from #2 to #1 on G2’s Small-Business Australia Regional Grid for Sales Intelligence, and from #3 to #1 on the Small-Business ANZ Regional Grid. Firmable also held #1 overall in both Australia and ANZ for Lead Intelligence.

“Ranking top in Australia and ANZ and climbing across Asia-Pacific comes down to one thing: our customers are booking more meetings with less effort,” said Paul Perrett, co-founder and co-CEO of Firmable. “Growing sales teams can’t afford to waste a rep’s day on bad data or cold accounts. We give them verified contacts and buying signals that tell them who to call and when. These results show that approach is working for teams in every market we serve. And with the launch of Tech Intelligence last week, we’re not slowing down.”

Top 10 across Asia-Pacific

Firmable moved into the top 10 for small-business sales intelligence across Asia-Pacific. It climbed from #13 to #10 on G2’s Small-Business Asia Pacific Regional Grid for Sales Intelligence. It also rose from #14 to #9 on the matching Lead Intelligence grid.

Firmable debuted on G2’s Mid-Market Asia Pacific Regional Grid for Sales Intelligence at #13. That reflects growing adoption among larger revenue teams in the region. On the overall Asia Pacific grid for Sales Intelligence, Firmable moved from #18 to #15.

About G2

G2 is the world’s largest and most trusted software marketplace. More than 90 million people annually use G2 to make smarter software decisions based on authentic peer reviews.

About Firmable

Firmable is an AI-native B2B sales platform, your AI sales teammate, that helps revenue teams find, understand and connect with the right buyers at the right time. Combining verified company and contact data with technology intelligence, CRM context, buyer intent and agentic AI, Firmable powers go-to-market teams across the US, Canada and Asia-Pacific. Firmable is ISO 27001 certified. Learn more at firmable.ai.

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KLEVV UNVEILS ALL-NEW CRAS V RGB PRIME DDR5 GAMING/OC MEMORY

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SUPPORTS AMD EXPO™ Technology: Featuring Ultra Low Latency
WITH AWARD-WINNING FLAGSHIP DESIGN

HONG KONG, Oct. 27, 2026 /PRNewswire/ — KLEVV, the leading consumer memory and storage brand introduced by Essencore, unveils the all-new CRAS V RGB PRIME DDR5 Gaming/OC Memory. Purpose-built for elite gaming rigs and demanding creative workloads, this new premium memory unleashes ultra-low CAS latency down to CL26 at 6000 MT/s and blazing overclocking speeds of up to 8000 MT/s at CL38, dressed in a striking black-and-gold finish and armed with dual-platform overclocking support for gamers, PC builders, and performance enthusiasts who demand nothing but the best. 

Refined Flagship Design and Craftsmanship
Building on the aluminum heat spreader design of the flagship CRAS V RGB, winner of both the Red Dot and iF Design Awards, the CRAS V RGB PRIME introduces a striking new black-and-gold interpretation of the series’ signature look.

An advanced hard-anodizing process, combined with a specialized surface treatment, gives the modules a smooth, piano-lacquer-like sheen that adds depth and sophistication from every angle. The result is an understated yet luxurious aesthetic that offers users a fresh, premium design choice while preserving the refined craftsmanship of the original CRAS V RGB.

High-Speed Performance with Lower Latency
The CRAS V RGB PRIME further advances KLEVV’s DDR5 overclocking memory lineup with tested speeds of 6000, 6400, and 8000 MT/s and CAS latencies of CL26, CL28, and CL38, respectively.

The 6000 MT/s configuration features tested timings of 26-36-36-76, while the 6400 MT/s configuration delivers timings of 28-38-38-78. For users seeking extreme frequencies, the 8000 MT/s models operate at tested timings of 38-48-48-128. All configurations are tested at 1.4V.

The 6000 and 6400 MT/s configurations are available in dual-channel kits ranging from 32GB (16GBx2), 64GB (32GBx2), to 128GB (64GBx2), while the 8000 MT/s models are offered in both 32GB (16GBx2) and 48GB (24GBx2) kits. This diverse range gives users greater flexibility to select the ideal balance of speed, latency, and capacity for their systems.

Next-Generation AMD EXPO™ Technology: Featuring Ultra Low Latency
“AMD EXPO™ Technology: Featuring Ultra Low Latency” is the latest evolution of AMD’s established memory overclocking technology. The new AMD EXPO ULL profile incorporates optimized memory sub-timing settings designed to reduce latency and improve overall performance on compatible AMD platforms. As the first product in KLEVV’s overclocking memory lineup to adopt this technology, the CRAS V RGB PRIME delivers a more responsive gaming and overclocking experience.

The 6000 MT/s and 6400 MT/s 32GB (16GBx2) configurations are certified for AMD EXPO Ultra Low Latency. According to AMD, certified Ultra Low Latency memory can deliver an average 4% improvement in FPS compared with non-ULL AMD EXPO memory on compatible systems.*

Broad Intel and AMD Platform Support
Offering broad support across the latest desktop platforms, the CRAS V RGB PRIME is compatible with AMD Ryzen™ processors on the AM5 platform and Intel® Core™ Ultra 200S Plus processors.

Each kit comes preloaded with both Intel® Extreme Memory Profile and AMD EXPO™ Technology overclocking profiles, allowing users to unlock high-speed performance through a simple BIOS setting on compatible motherboards with supported BIOS versions. With both profiles included, users can confidently choose their preferred speed and capacity without the hassle of selecting separate Intel- or AMD-specific models.

Premium Components for Uncompromising Stability
The CRAS V RGB PRIME features rigorously screened, high-quality memory ICs from a leading Korean manufacturer, ensuring consistent high-speed performance and exceptional stability under demanding workloads.

Paired with a high-density 10-layer PCB, the modules deliver enhanced signal integrity and greater resistance to interference during high-speed operation. Integrated PMIC and on-die ECC technologies further support stable power management and long-term reliability, creating a robust foundation for gaming and overclocking performance.

To ensure broad compatibility, the CRAS V RGB PRIME has also been validated on the QVLs (Qualified Vendor Lists) of four major motherboard manufacturers. Its RGB lighting supports ASUS Aura Sync, GIGABYTE RGB Fusion, MSI Mystic Light Sync, and ASRock Polychrome Sync, allowing users to seamlessly coordinate lighting across compatible components and systems.

A Complete DDR5 Gaming/OC Memory Lineup
The introduction of the CRAS V RGB PRIME further expands KLEVV’s comprehensive DDR5 Gaming/OC memory portfolio.

With the CRAS, URBANE, BOLT, and FIT series available across a wide range of designs and specifications, KLEVV continues to provide flexible memory choices for different performance requirements, system configurations, and aesthetic preferences.

Warranty and Availability
The CRAS V RGB PRIME DDR5 comes with a limited lifetime peace of mind warranty and will be available from November 2026. Please visit the KLEVV website to check product availability across online and offline retail channels. 

ABOUT KLEVV
KLEVV is a premium brand of Essencore, a major vendor of memory modules and NAND flash application products. The KLEVV range focuses on high-performance gaming memory modules and solid-state drives, engineered for enthusiasts who demand world-class quality and reliability. KLEVV memory and SSD products have been recognized with Germany’s Red Dot Design Award and iF Design Award for their innovative design. For more information, please visit www.klevv.com.

ABOUT ESSENCORE
Established in 2014, Essencore Limited aims to become the world’s top vendor of DRAM modules and NAND flash application products. The company started with one goal: to “Change the world and be a leader in semiconductor distribution.” The business strategies of Essencore are to adopt the newest technologies to differentiate themselves from competitors, deliver dedicated Memory products, and offer various product portfolios for customers’ competition readiness. For more information, please visit www.essencore.com.

*Based on AMD testing. Actual performance may vary depending on processor, motherboard, BIOS version, memory configuration, and application workload.

Overclocking and/or Undervolting AMD processors and memory, including without limitation, altering clock frequencies / multipliers or memory timing / voltage, to operate outside of AMD’s published specifications will void any applicable AMD product warranty, even when enabled via AMD hardware and/or software. This may also void warranties offered by the system manufacturer or retailer. Users assume all risks and liabilities that may arise out of overclocking / undervolting AMD processors, including, without limitation, failure of or damage to hardware, reduced system performance and/or data loss, corruption or vulnerability. GD-106.

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CDNetworks’ Cybersecurity Capabilities in APAC Recognized in IDC China’s 2026 Assessment

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Combining global network reach, AI-powered security, and local expertise, CDNetworks helps enterprises protect critical applications and operate securely across diverse APAC markets.

SINGAPORE, Oct. 28, 2026 /PRNewswire/ — CDNetworks, the APAC-leading network to deliver edge as a service, has been recognized in IDC China’s 2026 assessment of cybersecurity product and service capabilities across Asia-Pacific markets. CDNetworks received the highest ratings of five stars in six markets: Hong Kong SAR, Vietnam, Singapore, Japan, Malaysia, and South Korea, highlighting its cybersecurity expertise, extensive regional presence, and ability to address diverse security needs across APAC.

The assessment examines providers’ security offerings, regional operations, and service delivery across APAC. It highlights CDNetworks’ strengths in:

Extensive Global Infrastructure: With over 3,000 global Points of Presence and China CDN capabilities, CDNetworks supports secure, high-performance digital delivery across APAC, including cross-border acceleration for businesses serving users in mainland China.Strong APAC Presence and Local Expertise: Established local service teams in key APAC markets, including Singapore, Malaysia, Vietnam, Japan, South Korea, and China, provide multilingual consultation, solution design, deployment, and 24/7 technical support tailored to local business needs.Advanced WAAP and AI-Powered Security: CDNetworks delivers comprehensive Web Application and API Protection (WAAP), combining DDoS protection, intelligent WAF, bot management, API security, and AI-powered security operations to safeguard business-critical applications, detect emerging threats, and accelerate incident response.Adaptability to Diverse APAC Markets: CDNetworks adapts its services to different network environments, industry-specific requirements, and applicable data protection regulations, including PDPA and GDPR, helping enterprises address local market needs while maintaining consistent security standards.

“IDC’s recognition is an encouraging acknowledgment of our ongoing efforts to advance cybersecurity across APAC,” said Antony Li, APAC Head of Sales at CDNetworks. “As AI creates new opportunities and security challenges, businesses across APAC need protection that works consistently across markets while adapting to local requirements. We will continue investing in intelligent security and local expertise to help our customers innovate securely and build long-term digital resilience.”

About CDNetworks

As the APAC-leading network with over 3,000 global Points of Presence and more than 20 years of technology experience, CDNetworks delivers the fastest and most secure digital experiences to end users. Our diverse products and services include web performance, media delivery, cloud security, edge computing, zero-trust security, and colocation services, all designed to spur business innovation.

To learn more, visit cdnetworks.com and follow us on LinkedIn.

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