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Driving the Agentic AI Era: MiTAC Computing Showcases Comprehensive AI Infrastructure at WAIC

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SHANGHAI, July 17, 2026 /PRNewswire/ — MiTAC Computing Technology Corporation, a global leader in high-performance and energy-efficient server solutions, and a subsidiary of MiTAC Holdings Corporation (TWSE:3706), officially showcased today at the World Artificial Intelligence Conference (WAIC) 2026, under the core theme “Liquid Cooling. Infinite Compute. Sustainable Future,” MiTAC Computing is presenting its comprehensive server portfolio and ultra-high-density liquid-cooled rack solutions at booth H2-C1327.

Four Air/Liquid-Cooled Racks Supporting Diverse Computing Needs

To address the enterprise shift from Generative AI to Agentic AI, MiTAC Computing introduced four rack-scale solutions featuring air and liquid cooling, high performance computing power, and high-density storage, demonstrating its full-stack rack delivery and ecosystem integration:

52U High-Density AI Liquid-Cooled Rack

Integrates 12 G4826Z5 liquid-cooled AI servers, packing up to 96 AMD Instinct™ MI355X GPUs and dual AMD EPYC™ processors. This 52U high density rack configuration boosts GPU density by 50% compared to standard 48U racks. Equipped with advanced cold plates and CDU, it scales extreme compute vertically while reducing power consumption from fans and air conditioning to optimize PUE.

G8825Z5 AI GPU Air-Cooled Rack

Tailored for AI training and inference, this full rack houses 4 G8825Z5 units, hardware-configured with up to 32 AMD Instinct™ MI350X GPUs, delivering high-density computing power.

OCP ORv3 Standard Liquid-Cooled Rack

C2811Z5 system complies with OCP ORv3 standards, designed for standardized internet data centers, hyperscale public clouds, and HPC applications. Its modularized power, networking, and thermal designs maximize deployment flexibility and reduce maintenance costs.

TS70A-B8056 High-Density Storage Rack Integrated with DDN Solution

Engineered for massive data storage capacities, this rack integrates the DDN Infinia Intelligent AI Data Platform. The hardware-software synergy eliminates end-to-end data bottlenecks, maximizing compute efficiency while accelerating model inference, RAG, and agentic AI workflows.

Advanced Server Platforms | Powering Diversified AI Infrastructure and Enterprise Workloads

Beyond rack-scale solutions, MiTAC Computing highlights a robust server portfolio meticulously engineered for GPU acceleration, multi-node OCP architectures, and high-density data infrastructure. These high-performance platforms deliver the ultimate capability required to fuel next-generation data centers.

G4520G6 AI PCIe GPU Server

Powered by the Intel® Xeon® 6 processors and supporting up to 8,192GB of DDR5-6400 memory and 8 dual-slot GPUs. Combined with PCIe 5.0 connectivity, extreme thermal management, and a 9,600W Titanium redundant power supply. This model offers superior performance-per-watt for cloud and HPC workloads, enabling scalable performance for generative AI, analytics, and enterprise applications.

C2811Z5 Multi-node OCP Liquid-Cooled Server

Built on AMD EPYC™ 9005 series processors, C2811Z5 is designed for maximum energy efficiency and sustained high-performance computing. Each node supports up to 12 DDR5-6400 memory slots, featuring NVMe E1.S interfaces and NVMe SSDs. This platform is purpose-built for intensive HPC scenarios, including scientific simulations, engineering design, and weather modeling.

R2520G6 Enterprise Server

A 2U dual-socket server optimized for storage density, supporting 32 hot-swappable NVMe E3.S drive bays. With PCIe Gen5 bandwidth and 1+1 redundant 2,000W power supplies. This optimized configuration provides the perfect balance of massive data retention and high-speed throughput, ensuring peak efficiency for AI data preprocessing, big data analytics, and enterprise-scale workloads.

Discover our complete lineup, featuring our latest high-reliability, server-grade motherboards. We cordially invite you to visit Booth H2-C1327 in Hall 2 at the Shanghai World Expo Exhibition and Convention Center to experience our sustainable, high-efficiency AI infrastructure firsthand.

About MiTAC Computing

MiTAC Computing delivers comprehensive, energy-efficient server solutions backed by industry expertise dating back to the 1990s. Specializing in AI, HPC, cloud, and edge computing, MiTAC Computing employs rigorous methodologies to ensure uncompromising quality—across barebones, systems, racks, and cluster levels—achieving performance and integration. This commitment to quality at every level sets MiTAC Computing apart.

With a worldwide presence and end-to-end capabilities—from R&D and manufacturing to global support—MiTAC Computing provides agile, customized platforms for hyperscale data centers, HPC, and AI applications, ensuring optimal performance and scalability to meet unique business needs. Leveraging the latest advancements in AI and liquid cooling, and unifying the MiTAC brand with Intel DSG and TYAN server products, MiTAC Computing stands out for its innovative, efficient, and reliable server technology and its hardware and software integrated solutions—empowering businesses to meet future challenges

Website: https://www.mitaccomputing.com/

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Chandigarh University Uttar Pradesh Signs MoUs with 36 Top Global Universities; to provide global exposure for students

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Students to get an opportunity to study at top ranked Universities across 19 countries

LUCKNOW, India, July 17, 2026 /PRNewswire/ — Chandigarh University Uttar Pradesh, India’s first AI-Augmented Multidisciplinary University, has signed a Memorandums of Understanding (MoUs) with 36 top ranked universities in 19 countries to provide its students global learning through student exchange programs, dual degree programs, internships and joint research opportunities in the institutions abroad.

Divulging details of the MoUs, Jai Inder Singh Sandhu, Managing Director, Chandigarh University Uttar Pradesh said, “The university has built a globally diverse and academically strong network of international partners with global standing for connecting its students to world-class education.”

“The partner universities of Chandigarh University Uttar Pradesh are top ranked in the QS World University Rankings. While one of these 36 universities is ranked among the world’s top 100, seven universities feature in the top 200 globally, 12 are ranked between 201 and 500, and eight are placed among the world’s top 1,000 universities in the QS World University Rankings 2027.”

“The partner network of Chandigarh University Uttar Pradesh spans across the world with 7 universities in USA, 4 in United Kingdom, 3 in Malaysia, 2 each in Canada, Italy, Nepal, and South Africa and one each in Australia, Czech Republic, Germany, Macao SAR, New Zealand, South Korea, Argentina, Brazil, Croatia, Hungary, Indonesia, Malaysia, Mauritius signing MoUs to nurture young minds into global visionaries, enabling them to explore new cultures, expand their academic knowledge, and unlock exciting career growth opportunities,” he added.

Sandhu said, “The prestigious universities, both in the government and private sector, who have forged partnership with the Chandigarh University Uttar Pradesh include Borough of Manhattan Community College of the City University of New York, Northeastern University, Washington Adventist University, Illinois Institute of Technology, American University, Wishington DC, University of Maryland, Baltimore County, and Kent State University in the United States.”

“In the UK, Chandigarh University Uttar Pradesh’s partner universities include De Montfort University, Royal Holloway, University of London, and University of St Andrews from the United Kingdom, along with Queen’s University Belfast from Northern Ireland (UK). Chandigarh University Uttar Pradesh’s partner universities in Australia include RMIT, Western Sydney University and The University of Newcastle. The universities in Canada which have established partnership with Chandigarh University Uttar Pradesh include Brock University and The University of Western Ontario London, Ontario, Canada (Western),” he said.

Jai Inder Singh Sandhu, Managing Director, Chandigarh University Uttar Pradesh said, “Other universities which have signed MoU with Chandigarh University Uttar Pradesh include Universiti Sains Malaysia (School of Industrial Technology), Sunway University, and Asia Pacific University of Technology & Innovation (APU) in Malaysia; Università Cattolica del Sacro Cuore and Sapienza University of Rome in Italy, Pokhara University and Mid-West University, Surkhet in Nepal, University of Cape Town and Vaal University of Technology (VUT) in South Africa.”

“This apart, University of Macau in Macao, University of Zagreb (Faculty of Economics and Business) in Croatia; Palacký University in Czech Republic, Friedrich Schiller University Jena in Germany; University of Szeged in Hungary and Universitas Airlangga in Indonesia, The University of Auckland (Faculty of Education and Social Work) in New Zealand, UNICAMP Universidade Estadual de Campinas in Brazil, Middlesex University in Mauritius and Jeonbuk National University in South Korea,” he added.

Sandhu said, “These MoUs have paved the way for the students of Chandigarh University Uttar Pradesh to get international exposure with the access to top universities in the world’s popular higher education destinations across North America, Europe, Oceania, Asia and Africa, creating a rich educational ecosystem through semester abroad or dual degree programs, student exchange programs and joint research projects.”

“Under these MoUs, Chandigarh University Uttar Pradesh will offer a wide range of student exchange programs with its partner universities around the world on a semestral or academic-year basis. In semester exchange programs to Europe, Asia, South Africa, South America under these MoUs, students of Chandigarh University Uttar Pradesh will get the opportunity to spend a semester in partner universities to make their academic journey international. Chandigarh University Uttar Pradesh students who intend to do a degree from a University abroad with also get the opportunity for the same under these MoUs. Our students will have the distinct advantages to build-up their professional career,” he added.

Sandhu said, “Chandigarh University Uttar Pradesh’s Master Degree programs under these MoUs will help students get into some of the top-ranked Universities to pursue your higher degrees and avail institutional and government scholarships for the same. Chandigarh University Uttar Pradesh’s ‘Short Term Programs’ under the MoUs with the universities across the world will provide its students with a unique opportunity to gain practical international exposure. Through short-term Immersion Programs, Industry Immersion Programs, Profile Building Programs, Summer School Programs and Winter School Programs, Chandigarh University Uttar Pradesh students will engage with diverse communities, broaden their global perspective and develop valuable skills. Such programs are especially useful for students who want international exposure but may not be looking for a full long-term relocation. For many students, these shorter formats can be the first meaningful step into global learning.” 

Jai Inder Singh Sandhu said, “Students of Chandigarh University Uttar Pradesh will get ‘study-abroad’ opportunities under which they will spend a defined period at a partner university and experience an international classroom, new pedagogical methods and a different academic culture.”

“Chandigarh University Uttar Pradesh’s research-linked collaborations will also lead to creation of opportunities for scholarly engagement, academic exchange and knowledge creation. Such academic relationships will shape future projects, faculty interaction and interdisciplinary learning The MoUs with global universities will focus on several key areas in subject-specific key areas including AI and Cybersecurity in order to prepare students for careers in emerging technologies and improve their employability. In a higher education environment where credibility matters as much as visibility, Chandigarh University Uttar Pradesh is standing out for building global opportunities that are measurable, practical and relevant to student success,” he added.

About Chandigarh University Uttar Pradesh (Lucknow)

Envisioned to foster a culture of sustainability and empower future global leaders, Chandigarh University, Uttar Pradesh, immerses 21st-century learners in a personalised and experiential learning experience, integrating an AI-powered academic model and a multidimensional, futuristic perspective on education. Our Uttar Pradesh campus carries forward the venerable legacy of more than a decade of Chandigarh University, Punjab, which has established itself as India’s No. 1 Private University and a torchbearer of groundbreaking pedagogy and research-driven innovation. The AI-augmented new campus offers a broad spectrum of industry-driven futuristic academic programs encompassing data-driven insights, virtual reality experiences, real-world simulations, corporate mentorship, international perspective, interdisciplinary research, cultivation of entrepreneurial spirit, and professional competencies.

https://www.culko.in/

 

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Skanska builds high-tech fabrication facility in Boise, Idaho, USA, for USD 390M, about SEK 3.6 billion

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STOCKHOLM, July 17, 2026 /PRNewswire/ — Skanska has signed a contract with a new confidential high-tech client for the construction of a fabrication facility in Boise, Idaho, USA. The contract is worth USD 390M, about SEK 3.6 billion, which will be included in the US order bookings for the third quarter of 2026.

Work is for a new fabrication facility, a dedicated Central Utility Plant, and associated site infrastructure.

Work has begun and is scheduled for completion in the first quarter of 2028.

For further information please contact:
Daniela Arellano, Communications Director, Skanska USA, tel +1  213 317 4977
Andreas Joons, Press Officer, Skanska AB, tel +46 76 870 75 51
Direct line for media, tel +46 (0)10 448 88 99

This and previous releases can also be found at www.skanska.com.

This information was brought to you by Cision http://news.cision.com

https://news.cision.com/skanska/r/skanska-builds-high-tech-fabrication-facility-in-boise–idaho–usa–for-usd-390m–about-sek-3-6-bill,c4375621

The following files are available for download:

https://mb.cision.com/Main/95/4375621/4197368.pdf

20260717 US high-tech fabrication facility

 

 

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Akko Launches New U1 Switch Series, Debuting with Creamy Yellow U1

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SHENZHEN, China, July 17, 2026 /PRNewswire/ — As Akko approaches its 10th anniversary, the brand introduces U1 Series mechanical keyboard switches. As Akko’s next-generation switch lineup, the U1 Series is built around material innovation, structural refinement, and acoustic tuning, aiming to deliver a polished typing experience.

Across the series, U1 switches feature a newly engineered POM-blend material. While retaining the self-lubricating properties of POM, the material improves smoothness and consistency, bringing a cleaner sound profile and a refined typing feel. A redesigned cylindrical stem and optimized rail structure help each keystroke sound more focused and lower-pitched, with a thocky character, while reducing rail contact area. Paired with an upgraded POM top housing, the design suppresses spring ping and unwanted resonance. Each switch is precision factory-lubed to reduce dry friction out of the box, allowing users to enjoy a smooth, stable feel without manual lubrication.

Creamy Yellow U1 also receives dedicated internal structural upgrades. This U1 version combines the crisp character of the V3 version with the deeper sound of the V5 version, balancing different preferences for switch acoustics. Its optimized structure delivers more stable performance across keyboard configurations, making it suitable for entry-level users exploring custom keyboards while improving compatibility. Through a specially designed light-guiding column for diffusion, the switch reduces light loss and dark areas, creating brighter, more even RGB effects across compatible PCBs. Packaging has also been upgraded to a standard 100-switch box, making it more convenient for switch replacement, spare use, storage, and bulk assembly across mainstream keyboard layouts, while improving efficiency and reducing packaging waste.

More U1 Series upgrades include Creamy Purple U1, which optimizes stem stability and noise control for a clearer tactile feel and purer sound; Piano U1, an upgraded version of the V3 Pro Piano switch with improved smoothness and stability for linear-switch users; and Crystal Silver U1, a new linear switch designed for fast actuation and responsive rebound in gaming scenarios.

According to Akko’s product team, an excellent switch is shaped by materials, structure, sound, and feel working together. Creamy Yellow U1 marks the beginning of the U1 ecosystem. Akko also plans to introduce silent-oriented products and will apply U1 switches to upcoming keyboards, including 5075 V5 and more V5 Series products.

The U1 Series switches are available through Akko’s global sales channels. For more information, please visit akkogear.eu and akkogear.de.

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