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Breakthrough Protocol Test Solution for USB4® 120Gb/s Asymmetric Link Analysis

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Teledyne LeCroy’s Voyager M4120 sets a new benchmark for USB protocol analysis with full support for USB4® Version 2.0

MILPITAS, Calif., Aug. 12, 2026 /PRNewswire/ — Teledyne LeCroy Inc., the global leader in protocol test solutions, today announced the availability of the Voyager M4120 Protocol Analyzer/Exerciser, the world’s only solution supporting next-generation USB4® Gen 4 120Gb/s Asymmetric Link emulation and analysis. This new flagship system equips engineering teams with the visibility and capabilities needed to test, debug, analyze, and verify USB4 Gen 4 120Gb/s hosts and devices throughout the product development lifecycle. The all-new Voyager M4120 also provides numerous selectable views allowing the user to quickly and easily identify information of interest and resolve any issues that are contained in the data capture. 

The USB4 Version 2.0 specification introduces a revolutionary new feature in USB technology – Asymmetric Link configurations. In this configuration, the two directions of the connection operate at different lane rates. One direction transmits at the full 120Gb/s over three lanes while the opposite direction transmits a lower rate, such as 40Gb/s on just one lane. This enables systems and devices to dynamically provide more bandwidth for high-throughput applications, such as tunneled Ultra‑High Bit Rate (UHBR) DisplayPort 2.1 real-time video processing workloads.

“USB4 Version 2.0 represents a major step forward for the industry, delivering higher performance and more dynamic link behavior than previous generations,” said Jeff Ravencraft, President & COO of the USB Implementers Forum (USB-IF). “Tools like the Voyager M4120 give developers the visibility they need to validate Asymmetric Link characteristics and ensure robust interoperability as these advanced capabilities enter the market.”

About the Voyager M4120 Protocol Analyzer

The Voyager M4120 is engineered from the ground up to capture and decode USB Gen 4 120Gb/s Asymmetric Links, fully supporting the USB4 Version 2.0 specification. The analyzer reveals what actually happens during Asymmetric Link bring up and operation—from how devices decide lane roles and rates to how links adapt dynamically under real workloads. Powerful software features, including a hierarchical display, protocol traffic summaries, detailed error reports and an automation API enable developers to quickly visualize protocol activity and streamline troubleshooting efforts. Built on a flexible architecture, the Voyager M4120 is designed to expand with emerging workflows, including asymmetric traffic generation and USB-IF compliance test capabilities as they become available, helping early adopters accelerate development and improve interoperability for the next wave of high speed USB4 connectivity. Fully backward compatible with legacy Gen 3, Gen 2 and Gen 1 USB links, the Voyager M4120 can seamlessly address the past, present, and future of USB protocol testing.

Availability

The Teledyne LeCroy Voyager M4120 protocol analyzer can be ordered now. For additional information, contact Teledyne LeCroy at 1-800-5LeCroy (1-800-553-2769) or visit Teledyne LeCroy’s web site at https://www.teledynelecroy.com/protocolanalyzer/usb-voyager-m4120.

About Teledyne LeCroy

Teledyne LeCroy is a leading manufacturer of advanced oscilloscopes, protocol analyzers, and other test instruments that verify performance, validate compliance, and debug complex electronic systems quickly and thoroughly. Since its founding in 1964, the Company has focused on incorporating powerful tools into innovative products that enhance “Time-to-Insight”. Faster time to insight enables users to rapidly find and fix defects in complex electronic systems, dramatically improving time-to-market for a wide variety of applications and end markets. Teledyne LeCroy is based in Chestnut Ridge, N.Y. For more information, visit Teledyne LeCroy’s website at teledynelecroy.com.

© 2026 by Teledyne LeCroy. All rights reserved. Specifications are subject to change without notice. USB4®, USB Type-C®, USB-C® and USB 2.0 Type-C® are registered trademarks of the USB Implementers Forum.

Technical contact: Chetan Kopalle – Product Marketing Manager 408-273-5684
Customer contact: Teledyne LeCroy PSG Customer Care Center 800-909-7211
Website: https://www.teledynelecroy.com   

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SOURCE Teledyne LeCroy

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InventHelp Inventors Develop Anti Theft Wire Device for Railroads (LOS-634)

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PITTSBURGH, Aug. 12, 2026 /PRNewswire/ — “We wanted to create a secure box that would prevent access to copper wires along railroad tracks,” said one of three inventors, from Etiwanda, Calif., “so we invented the ANTI THEFT WIRE DEVICE. Our design deters copper wire theft, and it prevents delays and problems associated with missing signal wires.”

The invention provides an effective way to contain and protect copper wires on railroad tracks. In doing so, it prevents access to the wires. As a result, it helps prevent copper wire theft. It also helps maintain proper use of train traffic signals. The invention features a secure and protective design that is easy to install and use so it is ideal for the railroad industry.

The original design was submitted to the Los Angeles sales office of InventHelp. It is currently available for licensing or sale to manufacturers or marketers. For more information, write Dept. 25-LOS-634, InventHelp, 100 Beecham Drive, Suite 110, Pittsburgh, PA 15205-9801, or call (412) 288-1300 ext. 1368. Learn more about InventHelp’s Invention Submission Services at http://www.InventHelp.com.

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SOURCE InventHelp

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Spigen’s New Pixel 11 Collection: Protect the Design. Make It Yours.

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IRVINE, Calif., Aug. 12, 2026 /PRNewswire/ — Following today’s announcement of Google’s Pixel 11 series, Spigen unveiled its latest collection of cases, screen protectors, and MagFit accessories, all available now on Amazon.

With new colors, slimmer bezels, and the new HiLight feature, the Pixel 11 was made to stand out. Spigen’s collection is designed to complement that vision by protecting the device while giving users more ways to personalize how it looks, feels, and functions.

One Pixel, Multiple Ways to Personalize

Spigen’s Pixel 11 case lineup offers options for different styles, routines, and protection needs. Each case is designed to complement the device while providing a distinct user experience.

Ultra Hybrid MagFit: A minimalistic clear case designed to showcase the Pixel 11’s original color and design while adding everyday protection and MagFit compatibility.Tough Armor MagFit: Delivers rugged protection and practical functionality in a streamlined design for users who seek maximum coverage without the bulk.Nano Pop MagFit: Combines vibrant colors with dependable everyday protection to complement the Pixel’s playful aesthetic.Slim Armor Pro MagFit: A streamlined foldable case for the Pixel 11 Pro Fold, featuring SecuLink technology and a spring-loaded hinge cover for secure, continuous protection.

Complete the Pixel 11 Setup

The case is only the starting point. From essential screen protection to accessories built for the Pixelsnap ecosystem Google introduced last year, Spigen brings together protection, convenience, and personal style to complete the Pixel 11 setup.

EZ Fit Screen Protector: A must-have for any Pixel device. Makes screen protection simple with an included alignment tray and bubble-removal squeegee for fast, precise installation.O-Mag Grip: Crafted from CNC-machined aluminum, this premium phone grip features a rotating ring that doubles as a stand and securely attaches to any metal surface.Valentinus MagFit+: Ditch the bulky wallet with this slim, magnetic card holder that snaps securely onto MagFit cases, providing quick access while keeping pockets light.Athlex Air Band: Making its Pixel Watch debut, this lightweight, breathable band is designed for comfortable everyday wear and active routines.

A Personal Pixel Experience

Google designed the Pixel 11 to be expressive and recognizable. Spigen’s latest collection protects that identity while giving users more control over how their devices fit into their personal style and everyday routines.

Spigen’s full Pixel 11 lineup is available now on Amazon, alongside new accessories for the Pixel 11 Pro Fold and Pixel Watch 5.

About Spigen

For over 17 years, Spigen has delivered high-quality mobile accessories designed to enhance everyday tech. From cases and screen protectors, to car accessories and daily essentials, Spigen strives to be “Something You Want.” For more information about Spigen, please visit spigen.com.

Media Contact
Chad Sasaki
949-502-5121
420644@email4pr.com 

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SOURCE Spigen Inc.

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BAE Systems advances to Phase 2 of DARPA’s THREADS program

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THREADS program seeks to address temperature limitations in advanced RF electronics

NASHUA, N.H., Aug. 12, 2026 /PRNewswire/ — BAE Systems’ (LON: BA) FAST Labs™ research, development and production organization has successfully completed Phase 1 of the Defense Advanced Research Projects Agency’s (DARPA) Technologies for Heat Removal in Electronics at the Device Scale (THREADS) program and has been awarded continued support to move into Phase 2.

The THREADS program aims to overcome temperature limitations in high-performance radio frequency (RF) electronics, specifically in gallium nitride (GaN) devices. Overcoming these limitations will significantly increase the power and range of vital military systems.

“We look forward to advancing to Phase 2 of the THREADS program,” said Isaac Wildeson, principal investigator at BAE Systems’ FAST Labs. “The progress we’ve made during Phase 1 validates our approach to material and process enhancements and brings us closer to unlocking the full potential of RF-based systems for our warfighters.”

Successful thermal management developed through this program will nearly triple the range of RF systems, enhancing the safety and engagement distances for military personnel. BAE Systems’ work on THREADS is being conducted at its Microelectronics Center (MEC) in Nashua, New Hampshire, a DoW Category 1A Trusted Supplier, leveraging its established expertise in the development and manufacturing of advanced GaN and gallium arsenide integrated circuits.

To accelerate the development of this critical technology, BAE Systems’ work on the THREADS program includes collaboration with Modern Microsystems, Penn State University, Stanford University, the University of Notre Dame, and the University of Texas at Dallas.

For more information, please contact:

Paul Roberts, BAE Systems
Mobile: 603-521-2381
paul.a.roberts@baesystems.us

www.baesystems.com/en-us
@BAESystemsInc

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SOURCE BAE Systems, Inc.

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