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Kyvos Joins Apache Ossie Ecosystem, Bringing Speed and Context to Enterprise AI

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Kyvos brings its high-performance semantic layer to the open ecosystem, helping enterprises make governed business context available to AI agents and applications—fast, accurately and at scale.

LOS GATOS, Calif., Aug. 12, 2026 /PRNewswire/ — Kyvos, a leader in semantic intelligence and high-performance analytics, today announced that it has joined the Apache Ossie, formerly known as the Open Semantic Interchange (OSI) ecosystem, reinforcing its commitment to open, universal standard for semantic data.

Apache Ossie is a vendor-neutral initiative that standardizes business semantics—including metrics, dimensions, relationships and business definitions—represented and exchanged across data, analytics and AI platforms. This enables organizations to define business meaning once and use it consistently across their technology ecosystem.

For agentic AI, context alone is not enough. It needs trusted business definitions, governed data and the ability to retrieve answers at enterprise scale with predictable performance.

Kyvos adds a critical dimension: speed.

“Enterprise AI needs two things from the data foundation: the right context and the ability to access enterprise data, to implement AI that works at the speed of enterprise,” said Rajesh Murthy, COO Kyvos. “Our participation in the Apache Ossie ecosystem reflects our belief that semantic definitions should be open and interoperable, while the underlying semantic layer must deliver the performance, governance and accuracy enterprises require.”

Bringing Business Context to AI—at Enterprise Speed

Kyvos provides a governed semantic layer between enterprise data and the applications, BI tools, AI assistants and agents that consume it.

By combining semantic understanding with performance, Kyvos enables organizations to:

Standardize business meaning across data, BI and AI applications.Provide trusted context to AI agents, enabling them to understand enterprise metrics, dimensions, relationships and business rules.Deliver fast answers at enterprise scale across large and complex data environments.Maintain consistent KPIs across dashboards, reports, analytics and conversational AI.Improve AI efficiency by providing relevant, structured context rather than requiring AI applications to repeatedly discover meaning from raw data.Preserve governance and security as data becomes accessible to an expanding ecosystem of AI applications and agents.

An Open Semantic Foundation for Agentic AI

As AI agents increasingly become consumers of enterprise data, semantic interoperability is becoming foundational.

Traditional analytics architectures were designed for people interacting with dashboards and reports. Agentic architectures introduce more consumers—AI agents, copilots, applications and automated workflows—that need to understand enterprise data and business rules programmatically.

Kyvos extends the semantic layer from defining business metrics to providing the trusted, high-performance foundation through which AI can access and understand enterprise data.

“Open semantic standards can eliminate one of the biggest barriers to enterprise AI: fragmented definitions of business meaning,” said Murthy. “Kyvos complements that openness with an execution layer designed for enterprise scale, where complex models, large datasets, security requirements and concurrent workloads cannot be an afterthought.”

Advancing Interoperability Without Sacrificing Performance

Kyvos supports an open ecosystem spanning cloud data platforms, BI applications, AI applications and agentic interfaces. Its semantic architecture centralizes business logic while making governed insights accessible across channels.

Participation in the Open Semantic Interchange ecosystem advances Kyvos’ vision of a semantic foundation that is open at the interface, governed at the enterprise level and performant at scale.

Open semantics provides context. Kyvos provides speed. Together, they make enterprise AI more accurate, trusted and actionable.

About Kyvos

Kyvos is a semantic layer platform that enables enterprises to build a governed, high-performance semantic foundation for analytics and AI. Kyvos connects enterprise data to BI, reporting, conversational analytics, AI applications and agentic workflows, providing consistent business context and fast access to trusted insights at scale.

Media Contact:
Shefali Deshwali
Shefali.deshwali@kyvos.io

 

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SOURCE Kyvos Insights

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Technology

InventHelp Inventors Develop Anti Theft Wire Device for Railroads (LOS-634)

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August 12, 2026

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PITTSBURGH, Aug. 12, 2026 /PRNewswire/ — “We wanted to create a secure box that would prevent access to copper wires along railroad tracks,” said one of three inventors, from Etiwanda, Calif., “so we invented the ANTI THEFT WIRE DEVICE. Our design deters copper wire theft, and it prevents delays and problems associated with missing signal wires.”

The invention provides an effective way to contain and protect copper wires on railroad tracks. In doing so, it prevents access to the wires. As a result, it helps prevent copper wire theft. It also helps maintain proper use of train traffic signals. The invention features a secure and protective design that is easy to install and use so it is ideal for the railroad industry.

The original design was submitted to the Los Angeles sales office of InventHelp. It is currently available for licensing or sale to manufacturers or marketers. For more information, write Dept. 25-LOS-634, InventHelp, 100 Beecham Drive, Suite 110, Pittsburgh, PA 15205-9801, or call (412) 288-1300 ext. 1368. Learn more about InventHelp’s Invention Submission Services at http://www.InventHelp.com.

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SOURCE InventHelp

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Spigen’s New Pixel 11 Collection: Protect the Design. Make It Yours.

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August 12, 2026

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IRVINE, Calif., Aug. 12, 2026 /PRNewswire/ — Following today’s announcement of Google’s Pixel 11 series, Spigen unveiled its latest collection of cases, screen protectors, and MagFit accessories, all available now on Amazon.

With new colors, slimmer bezels, and the new HiLight feature, the Pixel 11 was made to stand out. Spigen’s collection is designed to complement that vision by protecting the device while giving users more ways to personalize how it looks, feels, and functions.

One Pixel, Multiple Ways to Personalize

Spigen’s Pixel 11 case lineup offers options for different styles, routines, and protection needs. Each case is designed to complement the device while providing a distinct user experience.

Ultra Hybrid MagFit: A minimalistic clear case designed to showcase the Pixel 11’s original color and design while adding everyday protection and MagFit compatibility.Tough Armor MagFit: Delivers rugged protection and practical functionality in a streamlined design for users who seek maximum coverage without the bulk.Nano Pop MagFit: Combines vibrant colors with dependable everyday protection to complement the Pixel’s playful aesthetic.Slim Armor Pro MagFit: A streamlined foldable case for the Pixel 11 Pro Fold, featuring SecuLink technology and a spring-loaded hinge cover for secure, continuous protection.

Complete the Pixel 11 Setup

The case is only the starting point. From essential screen protection to accessories built for the Pixelsnap ecosystem Google introduced last year, Spigen brings together protection, convenience, and personal style to complete the Pixel 11 setup.

EZ Fit Screen Protector: A must-have for any Pixel device. Makes screen protection simple with an included alignment tray and bubble-removal squeegee for fast, precise installation.O-Mag Grip: Crafted from CNC-machined aluminum, this premium phone grip features a rotating ring that doubles as a stand and securely attaches to any metal surface.Valentinus MagFit+: Ditch the bulky wallet with this slim, magnetic card holder that snaps securely onto MagFit cases, providing quick access while keeping pockets light.Athlex Air Band: Making its Pixel Watch debut, this lightweight, breathable band is designed for comfortable everyday wear and active routines.

A Personal Pixel Experience

Google designed the Pixel 11 to be expressive and recognizable. Spigen’s latest collection protects that identity while giving users more control over how their devices fit into their personal style and everyday routines.

Spigen’s full Pixel 11 lineup is available now on Amazon, alongside new accessories for the Pixel 11 Pro Fold and Pixel Watch 5.

About Spigen

For over 17 years, Spigen has delivered high-quality mobile accessories designed to enhance everyday tech. From cases and screen protectors, to car accessories and daily essentials, Spigen strives to be “Something You Want.” For more information about Spigen, please visit spigen.com.

Media Contact
Chad Sasaki
949-502-5121
420644@email4pr.com 

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SOURCE Spigen Inc.

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Technology

BAE Systems advances to Phase 2 of DARPA’s THREADS program

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August 12, 2026

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THREADS program seeks to address temperature limitations in advanced RF electronics

NASHUA, N.H., Aug. 12, 2026 /PRNewswire/ — BAE Systems’ (LON: BA) FAST Labs™ research, development and production organization has successfully completed Phase 1 of the Defense Advanced Research Projects Agency’s (DARPA) Technologies for Heat Removal in Electronics at the Device Scale (THREADS) program and has been awarded continued support to move into Phase 2.

The THREADS program aims to overcome temperature limitations in high-performance radio frequency (RF) electronics, specifically in gallium nitride (GaN) devices. Overcoming these limitations will significantly increase the power and range of vital military systems.

“We look forward to advancing to Phase 2 of the THREADS program,” said Isaac Wildeson, principal investigator at BAE Systems’ FAST Labs. “The progress we’ve made during Phase 1 validates our approach to material and process enhancements and brings us closer to unlocking the full potential of RF-based systems for our warfighters.”

Successful thermal management developed through this program will nearly triple the range of RF systems, enhancing the safety and engagement distances for military personnel. BAE Systems’ work on THREADS is being conducted at its Microelectronics Center (MEC) in Nashua, New Hampshire, a DoW Category 1A Trusted Supplier, leveraging its established expertise in the development and manufacturing of advanced GaN and gallium arsenide integrated circuits.

To accelerate the development of this critical technology, BAE Systems’ work on the THREADS program includes collaboration with Modern Microsystems, Penn State University, Stanford University, the University of Notre Dame, and the University of Texas at Dallas.

For more information, please contact:

Paul Roberts, BAE Systems
Mobile: 603-521-2381
paul.a.roberts@baesystems.us

www.baesystems.com/en-us
@BAESystemsInc

View original content to download multimedia:https://www.prnewswire.com/news-releases/bae-systems-advances-to-phase-2-of-darpas-threads-program-302849917.html

SOURCE BAE Systems, Inc.

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