KUALA LUMPUR, Malaysia, Aug. 19, 2026 /PRNewswire/ — Intrinsic SEA was recently featured by The Edge Malaysia, one of Malaysia’s leading business and financial publications, highlighting the company’s work in technology localisation, cross-border industry collaboration and innovation ecosystem development. The feature reflects a broader shift in how global technology companies approach Southeast Asia — moving beyond conventional market entry towards deeper integration with local industries, talent, research capabilities and capital.

As global supply chains evolve and technological innovation accelerates, Intrinsic SEA believes successful internationalisation requires more than bringing products or technologies into a new market. It requires building the local capabilities that enable those technologies to grow, commercialise and create sustainable value over the long term.

This philosophy underpins Intrinsic SEA’s approach to technology localisation.

Rather than focusing solely on market access, the company works with international technology companies to develop pathways encompassing technology transfer, local partnerships, joint research and development, industry collaboration, investment facilitation and regional expansion. The objective is to enable global technologies to become meaningfully embedded within Malaysia’s industrial and innovation ecosystem, while using the country as a strategic platform for broader ASEAN growth.

Intrinsic SEA continues to connect innovation resources from China, Canada, Japan and other international markets with opportunities across Southeast Asia. Its areas of focus include artificial intelligence, advanced manufacturing, biotechnology and life sciences, clean energy, smart agriculture and other emerging technologies with the potential to address real industrial and societal needs.

A growing number of these collaborations are progressing from initial market engagement towards more substantive localisation. Intrinsic SEA is currently facilitating international technology projects across areas including AI-enabled agriculture, next-generation biotechnology, advanced manufacturing, intelligent mining and renewable energy. These initiatives explore opportunities ranging from commercial deployment and joint R&D to regional innovation centres and longer-term investment partnerships.

A central part of this strategy is the development of platforms that bring together government, industry, research institutions, investors and technology companies.

Intrinsic SEA serves as the Secretariat of the ASEAN Technology Cooperation and Development Summit (ATCDS), a regional platform designed to facilitate practical technology cooperation and connect global innovation with ASEAN’s industrial priorities.

The Summit brings together policymakers, international organisations, research institutions, technology leaders, corporations and investors to explore collaboration across key areas including artificial intelligence, future mobility, advanced manufacturing, healthcare and biotechnology, the digital economy, clean energy and other emerging sectors.

Beyond dialogue, the ASEAN Technology Cooperation and Development Summit is designed to facilitate tangible outcomes — from technology partnerships and investment opportunities to cross-border R&D, commercialisation and industry deployment. By connecting international technologies with real regional demand, the platform seeks to contribute to a more integrated and globally connected ASEAN innovation ecosystem.

“The next phase of global technology competition will not be determined by technology alone. It will increasingly depend on the strength of innovation ecosystems, international collaboration and the ability to translate innovation into real industrial value,” said Ravenna Chen, CEO of Intrinsic SEA.

“Our role is to connect global innovation with local opportunity — helping technologies establish meaningful roots in Malaysia, develop alongside local partners and ultimately create value across ASEAN. We believe localisation should not simply be about entering a market; it should be about building capabilities and growing together with that market.”

Malaysia’s established industrial base, international connectivity, talent pool and position at the heart of Southeast Asia make it well placed to serve as a bridge between global innovation and ASEAN’s growing technology economy. Intrinsic SEA sees this position not simply as a gateway to the region, but as an opportunity for Malaysia to play a more active role in shaping how emerging technologies are developed, adapted and commercialised for ASEAN.

Looking ahead, Intrinsic SEA will continue to deepen its work across international technology cooperation, technology transfer, industry development and investment collaboration. Through its own initiatives and platforms including the ASEAN Technology Cooperation and Development Summit, the company aims to work alongside governments, corporations, research institutions, investors and international partners to translate global innovation into sustainable commercial and societal value across Southeast Asia.

About Intrinsic SEA

Intrinsic SEA is an international technology cooperation and innovation platform headquartered in Kuala Lumpur, Malaysia. The company focuses on strategic advisory, technology transfer, industry collaboration and investment facilitation, connecting innovation resources across China, Canada, Japan, Southeast Asia and other global markets.

With a focus on sectors including artificial intelligence, advanced manufacturing, biotechnology, clean energy and emerging technologies, Intrinsic SEA supports international companies in building sustainable local capabilities and developing long-term opportunities across ASEAN. The company also serves as the Secretariat of the ASEAN Technology Cooperation and Development Summit, supporting cross-border collaboration among governments, industry, capital and research institutions.

View original content to download multimedia:https://www.prnewswire.com/apac/news-releases/intrinsic-sea-advances-technology-localisation-to-strengthen-aseans-innovation-ecosystem-302854755.html

SOURCE Intrinsic SEA

Smart Manufacturing and Advanced Packaging Emerge as Key Growth Areas

HSINCHU, Aug 19, 2026 /PRNewswire/ — AI is reshaping semiconductor manufacturing. SEMI projects that 300mm fab equipment spending will exceed US$150 billion in 2027, driven by demand for AI chips, advanced capacity, and supply chain resilience. Against this backdrop, SEMI announced 15 key industry themes for SEMICON Taiwan 2026. Under the theme “Transform Tomorrow”, the exhibition will bring together leaders to explore technologies and partnerships shaping the industry’s next decade.

As the industry moves from process scaling toward system-level innovation, AI-driven smart manufacturing and advanced packaging are areas of focus. SEMICON Taiwan 2026 will debut the Smart Fab Zone.

Advanced Process Strengths Extend into Smart Manufacturing and Advanced Packaging

“AI-era competition is advancing on two fronts: AI-powered smart manufacturing that upgrades production systems, and advanced packaging that enables higher levels of performance integration,” said Terry Tsao, Global Chief Marketing Officer and President of Taiwan, SEMI. “Taiwan’s strengths in advanced process technologies provide a strong foundation for both. This year, the Smart Manufacturing Pavilion has grown 20% year over year, becoming the largest and fastest-growing exhibition area, while the Packaging Technology Area has grown 6% to become the second largest. Together with advanced processes, quantum, sustainability, cybersecurity, and other key themes, these areas form the blueprint for SEMICON Taiwan 2026. The next decade of semiconductors will be shaped by ecosystem-wide collaboration, and that is how we Transform Tomorrow.”

AI Powers the Next Stage of Smart Manufacturing

AI-enabled manufacturing is becoming central to semiconductor production as fabs adopt AI inspection, industrial IoT, robotics, and autonomous decision-making to improve precision and efficiency.

SEMICON Taiwan 2026 will feature the Smart Manufacturing Pavilion and Smart Fab Zone.

Advanced Packaging Drives System-Level Integration

As scaling approaches limits, competition is shifting toward system-level integration. SEMI reports that packaging and assembly equipment sales grew 19.6% in 2025 to a record US$6 billion, with 9.2% growth expected in 2026. SEMI has worked with TSMC and ASE to launch the SEMI 3DIC Advanced Manufacturing Alliance (3DICAMA), strengthening collaboration and Taiwan’s role in the advanced packaging.

The Packaging Technology Area will feature four zones: 3DIC Advanced Packaging Pavilion, FOPLP Pavilion, Semiconductor Packaging Pavilion, and Chiplet Pavilion.

Registration

Registration for SEMICON Taiwan 2026 is now open. For registration details and information, visit the official website.

About SEMI

SEMI® is the global industry association connecting more than 4,000 member companies and 1.5 million professionals across the semiconductor and electronics design and manufacturing supply chain. SEMI helps members address critical industry challenges through advocacy, workforce development, sustainability, supply chain management and other programs. SEMICON® Taiwan events, technology communities, standards and market intelligence support business growth and innovation across design, devices, equipment, materials, services and software – advancing smarter, faster and safer electronics. Learn more at www.semi.org or follow SEMI on Facebook, LinkedIn and LINE.

View original content:https://www.prnewswire.com/apac/news-releases/semicon-taiwan-2026-highlights-ai-driven-manufacturing-transformation-302853886.html

SOURCE SEMI

SEOUL, South Korea, Aug. 18, 2026 /PRNewswire/ — LG Display, the world’s leading innovator of display technologies, announced today that it has successfully developed a dream OLED patterning method that is free from the conventional fine metal mask (FMM) process, using its own proprietary technology. Its groundbreaking FMM-less method delivers much greater flexibility in mass production as well as brighter panels with longer lifespan and lower power consumption.

The company will unveil FLiPP (FMM-Less innovative Pixel Patterning) for the first time in the world at the International Meeting on Information Display (IMID) 2026 in Busan, where LG Display will host a dedicated exhibition hall for three days from Aug. 19.

Compared with panels produced using FMMs under identical conditions, FLiPP enables displays to increase brightness by 1.6 times, extend lifespan by 2.4 times, and reduce power consumption by 13%. This is because FLiPP improves the aperture ratio — the proportion of the total display area occupied by RGB pixels — by approximately 55%.

The FMM method adds to manufacturing costs as expensive new FMMs must be produced whenever the panel size or resolution changes. In addition, due to the inherent properties of metal, large masks tend to sag in the center under their own weight, causing misalignment and sometimes resulting in color-mixing defects.

FLiPP eliminates the disadvantages associated with the metal plates used in the FMM process that has been the mainstream OLED manufacturing method for over a decade. The FMM process requires large mother glass substrates, such as 8.6th-generation or other 8th-generation (2,200 × 2,500 mm) substrates, to be divided and processed as half-cut substrates due to the limited size of FMM sticks.

After a year of concentrated R&D, LG Display came up with FLiPP as a new OLED manufacturing paradigm. Unlike the FMM method, which may be compared to a stencil art technique where red, green, and blue (RGB) organic materials are evaporated through tiny holes in metal plates, FLiPP coats RGB pixels in order, secures them in precise positions, and incorporates photolithography — employing precision UV light etching to erase unnecessary areas during OLED pixel patterning.

Leveraging its existing large-sized Tandem WOLED production infrastructure and technical expertise, FLiPP has allowed LG Display to become the first display company to manufacture FMM-less OLEDs using 8.5th-generation mother glass as a single whole piece. Compared to the production of OLED laptop panels of the same size made using FMMs or other FMM-less methods that require divided substrates, FLiPP delivers up to 64% higher mother glass utilization efficiency. As a result, less substrate material is wasted and FLiPP directly translates into higher productivity and lower manufacturing costs.

As the world’s only FMM-less manufacturing process for 8.5th-generation OLED panels, LG Display has filed trademark applications for FLiPP in Korea and key global markets.

The company is strengthening its OLED technology leadership by combining RGB OLED, widely regarded as the most advanced OLED technology available today, with FLiPP, its next-generation innovative manufacturing process, to maximize production flexibility and efficiency.

One of FLiPP’s greatest advantages is that it is free from panel size and resolution constraints. In theory, it can be used to produce displays ranging from 1 inch to 100 inches and can be applied not only to conventional panels but also to VR and AR displays, making it a virtually universal, “ultimate technology.”

Starting with IT applications such as tablets and monitors, it will expand its range of FLiPP-manufactured panels to cover a range of products from 1-inch wearable devices to ultra-large TVs — tailoring products to customer needs.

“We were able to successfully realize FLiPP, a next-generation OLED patterning technology referred to as a ‘dream technology,’ by bringing together our proprietary WOLED technologies and know-how,” said Choi Young-seok, CTO at LG Display. “Through our participation in IMID, we will lead next-generation OLED technologies and accelerate market differentiation.”

Meanwhile, LG Display’s next-generation OLED TV panel driving technology, Hyper Double Scanning (HDS), has been recognized for its technological excellence by winning the IMID “Display of the Year Award.” The award is presented to the most outstanding product among those commercialized each year. LG Display is currently mass-producing its entire lineup of OLED TV panels with HDS and plans to continue leading the global premium TV panel market. 

About LG Display

LG Display Co., Ltd. [NYSE: LPL, KRX: 034220] is the world’s leading innovator of display technologies, including thin-film transistor liquid crystal and OLED displays. The company manufactures display panels in a broad range of sizes and specifications primarily for use in TVs, notebook computers, desktop monitors, automobiles, and various other applications, including tablets and mobile devices. LG Display currently operates manufacturing facilities in Korea and China, and back-end assembly facilities in Korea, China, and Vietnam. The company has approximately 53,049 employees operating worldwide. For more news and information about LG Display, please visit www.lgdisplay.com.

Media Contact:

Joo Yeon Jennifer Ha, Team Leader, Communication Team

Email: hjy05@lgdisplay.com

View original content to download multimedia:https://www.prnewswire.com/news-releases/lg-display-unveils-flipp-achieving-dream-next-generation-oled-302854625.html

SOURCE LG Display