VANCOUVER, BC, Oct. 1, 2026 /PRNewswire/ — MiniTool Software Limited has released a new version of its video converter – MiniTool Video Converter 6.0. This update brings video cutting and merging features, GPU acceleration, a new home page, UI improvements, and bug fixes.

Key Features of MiniTool Video Converter 6.0

Cut a video into segments.Merge multiple videos into one.Added GPU acceleration management.Optimized user interface.Fixed some bugs.

Cut a Video into Segments

MiniTool Video Converter 6.0 introduces a new video-cutting feature that allows you to split videos into segments and remove unwanted parts. It also enables you to trim the start or end of a video. You can export the cut video clips separately or into a combined file.

The video cutting feature supports a wide range of input formats, including AVI, 3GP, VOB, WebM, WMV, MP4, MOV, FLV, MKV, MPG, MPEG, MXF, M4V, TS, F4V, M2TS, ASF, and more.

Merge Multiple Videos into One

The latest version of MiniTool Video Converter supports merging multiple videos into one file. It also provides editing options for individual clips, including cutting, trimming, and adding transitions between clips.

The video merging feature supports various input formats, including AVI, 3GP, VOB, WebM, WMV, MP4, MOV, FLV, MKV, MPG, MXF, M4V, Xvid, OGV, DivX, and more. The merged video can be exported in MP4 format at 1080p.

Added GPU Acceleration Management

MiniTool Video Converter 6.0 uses GPU acceleration to offload video processing tasks to the GPU, improving video conversion, compression, transcription, enhancement, cutting, and merging efficiency. It makes better use of the computer’s hardware resources to increase processing speed, especially when processing large or high-resolution videos.

Optimized UI Interface

MiniTool Video Converter 6.0 adds a new Home page for quick access to its main video tools, including Convert Video, Compress Video, Cut Video, Merge Video, Video Enhancer, Intelligent Subtitle, and more.

Fixed Some Bugs

Fixed some issues to enhance the overall user experience:

Fixed software response delays in some scenarios.Fixed missing audio after video conversion on certain devices.Optimized Instagram downloads to retrieve only video content and exclude non-video items.

About MiniTool Video Converter

MiniTool Video Converter is a Windows-based multimedia tool from MiniTool Software Ltd. that brings multiple functions together in one application. It supports video and audio conversion, video compression, audio-to-text conversion, video enhancement, video cutting, and video merging features.

MiniTool Video Converter also offers AI-powered features, including Intelligent Subtitle for transcribing video or audio into text and exporting SRT or TXT files, as well as Video Enhancer for upscaling videos and reducing video grain.

About MiniTool® Software Ltd.

MiniTool® Software Ltd. is a software development company that provides customers with complete business software solutions for screen recording, audio and video format conversion, video compression, video editing, and data management.

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SOURCE MiniTool® Software Limited

Accelerates commercialization of robotics AI chip through end-to-end “Spec Hand-off” developmentIntegrates next-generation memory and interface technologies, including LPDDR6, PCIe Gen6 and UCIe-SExpands applications beyond data center, HPC and edge AI into Physical AI, diversifying business portfolio

SEOUL, South Korea, Oct. 1, 2026 /PRNewswire/ — SEMIFIVE, a leading global provider of custom AI semiconductor (ASIC) solutions, announced today that it has signed a turnkey development contract with Mobilint, a South Korean AI semiconductor company, to develop an AI chip for robotics applications.

The project is part of the “K-On-Device AI Semiconductor Technology Development” program led by Korea’s Ministry of Trade, Industry and Resources (MOTIR). The government-funded program supports collaboration between domestic AI semiconductor companies and end-user companies to develop and validate chips tailored to industry-specific products, with the core objective of carrying them through to commercialization.

Through this collaboration, the two companies aim to deliver a robotics chip capable of performing high-performance AI computation on its own, even in outdoor environments where connectivity to external servers is limited. The custom chip will be deployed in applications such as agricultural robots, processing vision and sensor data in real time across diverse operating conditions.

Notably, the project will be carried out under SEMIFIVE’s “Spec Hand-off” model, the earliest-stage engagement within its turnkey business. Unlike conventional approaches in which customers complete a substantial portion of the design before handing off downstream processes, Spec Hand-off allows customers to simply define their key performance targets and specifications, while SEMIFIVE delivers integrated services across the entire process, from detailed design to packaging, testing and mass production.

The chip will integrate a wide range of next-generation technologies, including LPDDR6, the latest low-power DRAM standard; PCIe Gen6, a high-speed interface; and UCIe-S (Universal Chiplet Interconnect Express – Standard Package), which connects multiple function-specific chiplets at high speed within a single package so they operate as a single monolithic die. These technologies will enable the chip to achieve both high power efficiency and operational stability without data bottlenecks, even in outdoor settings such as areas with limited network coverage.

The two companies expect the collaboration to contribute to building a homegrown AI semiconductor ecosystem in Korea, while securing an early lead in next-generation robotics platforms and creating new markets.

“This contract marks a pivotal moment for SEMIFIVE as we extend our proven, end-to-end ASIC capabilities from data center and edge AI into the realm of robotics AI,” said Brandon Cho, CEO and co-founder of SEMIFIVE. “As a leader in custom semiconductors, we will continue to expand our technological footprint and influence across advanced industries.”

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SOURCE SEMIFIVE

GUANGZHOU, China, Oct. 1, 2026 /PRNewswire/ — XPeng Inc. (“XPENG” or the “Company,” NYSE: XPEV and HKEX: 9868), a leading global Physical AI company, today announced its vehicle delivery results for September and the third quarter of 2026.

In September 2026, XPENG delivered 41,256 vehicles, representing a 5% increase over the prior month. Monthly deliveries of the XPENG L03 exceeded 10,000 units.

For the third quarter of 2026, XPENG delivered a total of 118,390 vehicles, marking a 15% increase over the previous quarter.

On September 17, 2026, XPENG officially launched the G9L, a premium flagship SUV featuring XPENG’s latest technologies, in China. The model’s global launch will take place in Paris, France, in October.

On September 22, 2026, XPENG began rolling out XOS 6.3.0 in China, powered by the latest version of its VLA 2.0 model.

As of September 30, 2026, XPENG’s self-operated charging network in China covered more than 430 cities and comprised over 4,000 stations, including more than 3,510 ultra-fast charging stations, with over 22,200 charging piles in total. On September 15, XPENG opened its first-ever X-Energy megawatt ultra-fast charging station in Hong Kong.

XPENG’s electric vehicles delivered from January to September 2026 are expected to reduce life-cycle greenhouse gas emissions by more than 4.14 million tons compared to internal combustion engine vehicles, equivalent to the carbon absorbed by 68.53 million young trees over 10 years.

About XPENG

XPENG is a leading global Physical AI company, dedicated to bringing artificial intelligence into the physical world to reshape future mobility and smart living. Through in-house R&D, XPENG has developed a full-stack Physical AI architecture spanning Turing AI chips, world foundation models, and highly integrated software and hardware applications. This unified technology foundation of XPENG powers an expansive product portfolio of smart EVs, robotaxis, and humanoid robots, advancing the deployment of Physical AI at scale. Headquartered in Guangzhou, China, XPENG is dual-primary listed on the New York Stock Exchange and the Hong Kong Stock Exchange. With global capabilities across R&D, manufacturing, sales, and services, XPENG drives continuous technological innovation and fosters an open Physical AI ecosystem, making life smarter, safer, and better for users worldwide. For more information, please visit https://www.xpeng.com/.

Safe Harbor Statement

This announcement contains forward-looking statements. These statements are made under the “safe harbor” provisions of the United States Private Securities Litigation Reform Act of 1995. These forward-looking statements can be identified by terminology such as “will,” “expects,” “anticipates,” “future,” “intends,” “plans,” “believes,” “estimates” and similar statements. Statements that are not historical facts, including statements about XPENG’s beliefs and expectations, are forward-looking statements. Forward-looking statements involve inherent risks and uncertainties. A number of factors could cause actual results to differ materially from those contained in any forward-looking statement, including but not limited to the following: XPENG’s goal and strategies; XPENG’s expansion plans; XPENG’s future business development, financial condition and results of operations; the trends in, and size of, China’s EV market; XPENG’s expectations regarding demand for, and market acceptance of, its products and services; XPENG’s expectations regarding its relationships with customers, suppliers, third-party service providers, strategic partners and other stakeholders; general economic and business conditions; and assumptions underlying or related to any of the foregoing. Further information regarding these and other risks is included in XPENG’s filings with the United States Securities and Exchange Commission. All information provided in this announcement is as of the date of this announcement, and XPENG does not undertake any obligation to update any forward-looking statement, except as required under applicable law.

Contacts:

For Investor Enquiries:

IR Department
XPeng Inc.
Email: ir@xiaopeng.com

Jenny Cai
Piacente Financial Communications
Tel: +1 212 481 2050 / +86 10 6508 0677
Email: xpeng@tpg-ir.com

For Media Enquiries:

PR Department
XPeng Inc.
Email: pr@xiaopeng.com

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SOURCE XPeng Inc.