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IDTechEx Discusses Advanced Semiconductor Packaging Trends in AI and HPC

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BOSTON, Feb. 23, 2024 /PRNewswire/ — Advanced semiconductor packaging technologies like 2.5D and 3D hybrid bonding, along with emerging solutions like silicon photonics, are critical in optimizing system performance and fostering the next wave of AI and HPC chip innovation. The “Advanced Semiconductor Packaging 2024-2034: Forecasts, Technologies, Applications” report recently published by IDTechEx explores the evolving landscape of semiconductor packaging, with a focus on 2.5D and 3D hybrid bonding packaging. It covers technology trends, industry challenges, and the advancements made by key players while forecasting market trends in the semiconductor packaging sector.

 

 

Large Language Models (LLM) challenges:

The emergence of large language models (LLMs) marks a milestone in AI, revolutionizing natural language processing (NLP) and related fields. Models like OpenAI’s GPT series demonstrate high accuracy in understanding, generating, and translating human language. While they find diverse applications, they also present challenges.

LLMs have seen exponential growth in the model size, from 340 million parameters in BERT-L in 2019 to 1.76 trillion parameters in the upcoming GPT-4. This expansion results in high computational complexity, with GPT-4 requiring over 1010 petaFLOPS. Compared to other neural networks, LLMs demand significantly more computational resources; for instance, training GPT-3 takes 3841 GPU hours versus 11 hours for a ResNet-60 (a convolutional neural network used for image classification). LLMs have low operational intensity, meaning they rely heavily on matrix-vector operations. This requires moving more data to perform the same number of arithmetic operations. Memory bandwidth is thus critical for their performance.

Ways to improve system bandwidth:

In recent years, there’s been a gap between the rapid rise in processor compute density and the slower increase in memory bandwidth. This “memory wall” issue results in processors frequently waiting for data, leading to underutilization and posing a substantial challenge to future performance improvements.

NVIDIA and AMD have introduced NVLink and Infinity Fabric technology, respectively, to enhance CPU-GPU interconnectivity, which is crucial for improving bandwidth between logic components.

The incorporation of next-generation High Bandwidth Memories (HBMs), which consist of multiple vertically stacked DRAM dies connected by through-silicon vias (TSVs), into architectures offers a substantial boost in logic-to-memory bandwidth. While previously confined to GPUs, HBMs are now being integrated with CPUs, bridging the bandwidth gap between CPU and traditional DRAM. AMD’s Instinct MI300 exemplifies this trend by integrating advanced HBMs with both CPU and GPU in a single package. 2.5D semiconductor packaging technologies like TSMC’s Chip on Wafer on Substrate (CoWoS) play a crucial role in increasing the number of I/O (Input/Output) points while reducing interconnect length between logic and memory components, enhancing performance and reducing latency. However, emerging HPC workloads, particularly those related to AI training, demand even higher memory bandwidth (over 45x) due to frequent memory accesses. Increasing I/O speed can indeed enhance HBM’s bandwidth, but it’s limited due to increased power consumption.

To address this, new processor designs have focused on increasing on-chip SRAM capacity, as it’s situated near the processing chips, enabling higher bandwidth with denser interconnects and lower latency. Initial implementations used 3D hybrid bonding packaging technology to bond an SRAM die over a logic die at a 9 μm pitch, tripling SRAM capacity. Further bandwidth improvements involve continuously decreasing the hybrid bonding pitch from 9 μm to 0.4 μm, leading to a substantial over 300-fold increase in bandwidth density.

Co-packaged optics is another approach that is gaining significant momentum in recent years. Optical communication offers several advantages over traditional electrical signal transmission. It boasts lower transmission loss, reducing signal degradation over distances. Furthermore, optical communication is less susceptible to crosstalk, which occurs when signals interfere with each other, leading to data errors. Additionally, optical signals can achieve higher bandwidth compared to their electrical counterparts, making them ideal for data-intensive applications.

To summarize, for the next generation AI compute system, high logic-to-logic and logic-to-memory bandwidth are crucial development trends. Advanced semiconductor packaging technologies like 2.5D and 3D hybrid bonding, alongside emerging solutions like optical communication, are pivotal for enabling this growth and overcoming computational challenges.

IDTechEx’s new report, “Advanced Semiconductor Packaging 2024-2034: Forecasts, Technologies, Applications“, delves into the dynamic landscape of 2.5D and 3D packaging, analyzing technology trends, industry barriers, key player’s technology roadmap, and market forecasts. Gain invaluable insights into not just AI and HPC applications but also 5G/6G, autonomous vehicles, and consumer electronics sectors, understanding how advanced packaging shapes their trajectory. With unbiased analysis and detailed market evaluations, this report provides a comprehensive understanding of the industry’s future, making it essential reading for stakeholders navigating the evolving semiconductor landscape.

To find out more about this IDTechEx report, including downloadable sample pages, please visit www.IDTechEx.com/ASP.

About IDTechEx

IDTechEx guides your strategic business decisions through its Research, Subscription and Consultancy products, helping you profit from emerging technologies. For more information, contact research@IDTechEx.com or visit www.IDTechEx.com.

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Sales and Marketing Administrator
press@IDTechEx.com
+44(0)1223 812300

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TiTE x IHT 2026: The Definitive Hub for Taiwan’s Hardware Manufacturing Excellence

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TAICHUNG, May 6, 2026 /PRNewswire/ — When sourcing from Taiwan, location is the ultimate strategic advantage. Don’t be misled by smaller, general trade shows held in city centers like Taipei. To truly connect with the source, you must go where the products are born. TiTE x IHT (Oct 20-22, 2026) in Taichung is the undisputed largest and most vital hardware industrial expo on the island. Hosted directly in the heart of Taiwan’s precision manufacturing cluster, this event features 1,000+ booths and 500+ top-tier manufacturers, offering a scale and industrial depth that no other exhibition can replicate.

Why Global Buyers Choose the Taichung Source Over Urban Trade Shows:

The Revolutionary “Exhibition as Factory” Model: Taichung is the global epicenter for hardware, home to 70% of Taiwan’s industry output. Our unique location enables the “30-Minute Sourcing Circle.” This allows you to verify high-end samples on the show floor in the morning and audit world-class production lines by the afternoon. By eliminating the travel gap between the booth and the factory, we reduce traditional procurement cycles from weeks to hours, providing unmatched transparency for R&D, capacity assessment, and quality control.ESG & CBAM Compliance for Western Markets: As the EU’s Carbon Border Adjustment Mechanism (CBAM) and global ESG mandates reshape trade, our exhibitors are already ahead of the curve. Discover CBAM-ready solutions and green manufacturing processes specifically designed to meet the strict sustainability requirements of the European and American markets. We provide more than just tools; we provide carbon-footprint-managed resilience for your brand.AI-Driven Smart Manufacturing: Address global labor shortages and rising costs with Taiwan’s latest innovations. The 2026 expo focuses on “AI Empowerment,” showcasing collaborative robotics, automated digital inspection, and data-driven supply chain management. These technologies ensure lead-time stability and high-precision consistency for premium global brand owners.Direct Sourcing & Global Matchmaking: Skip the middlemen and trading agencies. Our “Global Buyer Day” offers exclusive, pre-arranged matchmaking with the actual OEMs/ODMs. This is the primary decision-making platform for major distributors seeking resilient, direct-to-factory partnerships that guarantee the best pricing and priority production slots.

Experience the synergy of smart manufacturing and global trade. Stop at the source—where the world’s hardware is actually built. Secure your competitive edge in the true heart of the industry.

【TiTE x IHT】

Date: October 20-22, 2026Venue: TICEC, Taichung, TaiwanRegister Now: https://accu.ps/g8MZ1SHousing Subsidy: https://forms.gle/34VHVxSrEw7g8GxDAOfficial Website: https://www.hardwareexpotw.com

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SOURCE TiTE x IHT

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KIST Accelerates U.S. Expansion of Quantum Deep-Tech Startups Through SelectUSA 2026

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SEOUL, South Korea, May 5, 2026 /PRNewswire/ — The Korea Institute of Science and Technology (KIST) President Oh Sang-rok announced that it will participate in the SelectUSA Investment Summit 2026 as part of a Korean delegation, together with quantum technology startups supported by the Ministry of SMEs and Startups under the Deeptech Project (DIPS).

The initiative, supported by South Korea’s Ministry of SMEs and Startups (MSS), is part of the government’s “Deeptech Incubator Project for Startups” (DIPS) initiative, which aims to nurture globally competitive deep-tech ventures.

KIST, which serves as the lead institution for the quantum technology sector under the program, said it will oversee the global commercialization efforts of participating firms. In particular, the “Global Bridge Program,” jointly developed with the U.S. Embassy in Korea in September 2025, is an official program designed to generate tangible overseas expansion outcomes by linking investment attraction with local market entry through diplomatic channels.

Organized by the U.S. Department of Commerce, the SelectUSA Investment Summit is the largest investment promotion event in the US, connecting international startups with venture capital firms, corporate investors and state-level economic development agencies.

It serves as an execution-oriented platform that extends to investment, corporate establishment, site selection, and tax incentives, and is considered a key entry gateway for deep-tech companies, including those in quantum technology.

KIST said participation in the summit is particularly significant for deep-tech sectors such as quantum technology, where access to the US innovation ecosystem is seen as key to growth.

The program is conducted in two stages. From April 30 to May 1, companies took part in a spin-off program hosted by the State of Maryland, which included visits to research institutions and tours of the regional quantum technology ecosystem.

During this period, the delegation also conducted localized activities with the Maryland state government and its economic development agencies, focusing on investment attraction, corporate collaboration, and joint R&D. In addition, on May 5, the delegation held discussions with U.S. Department of Commerce Deputy Secretary William Kimmitt on potential areas of cooperation.

The delegation will also meet officials from Fairfax County Government to explore collaboration and investment opportunities.

The main summit, currently ongoing from May 3 to May 6, features exhibitions, pitching sessions and meetings with US state representatives, with participating firms expected to engage in discussions on investment and market entry.

The delegation is structured to encompass the entire quantum industry rather than a single technology domain.

The Korean delegation comprises five startups, alongside Kyung Hee University Department of Future Science & Technology Commercialization Policy and Entrepreneurship, with approximately 20 participants forming an integrated ecosystem that combines research institutes, academia, and startups, enabling a full-cycle support system from technology validation to commercialization and global expansion.

One of the firms, OptiQ-Labs, was selected for an official pitching session on May 4, where it presented its laser-based optical modules designed for ion-trap quantum computing systems.

This highly competitive program selects only around 100 companies from more than 20,000 applicants worldwide. If selected as the winner of the pitching session, the company will receive follow-up meetings with U.S. state governments and economic development agencies, access to global investor networks, support for local entity establishment, and connections to site selection and tax incentive programs.

Other participating companies include QUAD, which develops single-photon detection technology; SLEEX, focused on underwater sensing; Elixir (StatUp AI), which works on quantum-classical hybrid algorithms for healthcare; and SQK (QMEDIC), specializing in physics-based imaging solutions.

KIST Project Director, Kang Sunjoon, said, “This program represents a critical milestone for Korean quantum startups to directly connect with global investors and industry ecosystems. Via the DIPS program, we are actively promoting the global commercialization of quantum technologies.”

Through its participation in SelectUSA, KIST has established a package-type global expansion model that integrates technology validation, investment attraction, and U.S. market entry.

The summit serves as a turning point for South Korea’s quantum sector, enabling startups to move into the next phase of validation, investment, and overseas expansion.

For more information, visit https://eng.kist.re.kr/.

About KIST 

KIST was established in 1966 as the first government-funded research institute in South Korea. KIST now strives to solve national and social challenges and secure growth engines through leading and innovative research.

About Participating Quantum Startups

QUAD, led by Chief Executive Officer, Oh Byung-doo, develops quantum sensing technologies based on superconducting nanowire single-photon detectors (SNSPDs), offering high sensitivity and precision with applications spanning quantum communication, quantum computing, semiconductor inspection, and defense.

SLEEX is developing an advanced perception technology that combines quantum LiDAR and electric field sensing to overcome limitations of existing underwater sensors, particularly by eliminating blind zones within the 0–2 meter range, with strong potential in autonomous navigation, maritime security, and defense, with Lee Jeho at the helm as Chief Executive Officer.  (https://www.thesleex.com)

Elixir, headed by Chief Executive Officer Jang Jung-kwon, develops a drug discovery and biomarker analysis platform based on quantum-classical hybrid algorithms, targeting the precision medicine market through the integration of bioinformatics and quantum machine learning. (statupai.com)

SQK develops medical imaging AI based on quantum-physics constraints, addressing the hallucination issues of conventional AI by ensuring physical consistency in CT and MRI reconstruction. Under the leadership of Chief Executive Officer Kim Yoon-hak, SQK is improving reliability and reducing the need for re-scans in clinical settings. (www.sqkcloud.com)

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SOURCE The Korea Institute of Science and Technology (KIST)

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Former Visa Asia Pacific Executive David Tay Joins YeahPay as Global Vice President

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SINGAPORE, May 6, 2026 /PRNewswire/ — YeahPay, the international payment brand under YEAHKA (9923.HK), has appointed David Tay, a former senior executive at Visa Asia Pacific, as Global Vice President, tasking him with overseeing the strategic direction and product ecosystem development of YEAHKA’s overseas payment business. The appointment comes as global digital trade enters a new phase defined by ecosystem integration, with payment infrastructure undergoing a generational shift in acceleration.

David Tay, a Singaporean national, is a rising leader in the payments industry. During his career at Visa, David played a key role in driving business growth across multiple Southeast Asian markets, demonstrating early promise in commercial insight and innovation. He subsequently moved into Visa’s Innovation division, where he rose to serve as Head of Innovation, leading Visa Pacific’s product innovation and new business.

In that capacity, David led the commercialization of cutting-edge payment paradigms including Visa Flex Credential and Pay by Palm. He was also involved in the evaluation and governance of strategic partners across the region, accumulating deep expertise in collaborating with banks, fintechs, and large-scale enterprise merchants.

David’s track record spans the full go-to-market lifecycle, from concept to pilot to scale, as well as deep capabilities in cross-institutional partnerships and ecosystem development. His appointment comes at an inflection point for YEAHKA’s international expansion. According to YEAHKA’s 2025 annual report, its overseas business delivered full-year Gross Payment Volume (GPV) surpassing RMB 5 billion, representing a 323.3% year-on-year surge from RMB 1.1 billion in 2024.

View original content:https://www.prnewswire.com/apac/news-releases/former-visa-asia-pacific-executive-david-tay-joins-yeahpay-as-global-vice-president-302763652.html

SOURCE Yeahka

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