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Supermicro Unveils New X14 AI, Rackmount, Multi-Node, and Edge Server Families Based on Intel® Xeon® 6 Processors with E-cores and Soon, P-cores Systems With Liquid Cooling

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Supermicro’s Expanded, Proven Portfolio Includes Systems Designed for Maximum Performance-Per-Watt on Cloud-Native, Storage Optimized, and Scale-Out Workloads, and Air and Liquid- Cooled Systems for AI and HPC Environments

SAN JOSE, Calif. and TAIPEI, June 4, 2024 /PRNewswire/ — Computex 2024 — Supermicro, Inc. (NASDAQ: SMCI), a Total IT Solution Provider for AI, Cloud, Storage, and 5G/Edge, is launching its X14 server portfolio with support for Intel® Xeon® 6700-series processors with E-cores, and will provide future support of Intel Xeon 6900 series processors with P-cores. Based on platforms proven over several generations, the new Supermicro X14 servers support the latest Intel Xeon 6 processors, starting with a family of rackmount servers supporting enterprise, cloud service provider, mid-range, and entry models, including the Hyper, CloudDC, and WIO platforms. Also, the density and efficiency-optimized multi-node servers, the SuperBlade®, with up to 34,560 cores per rack, BigTwin®, and GrandTwin®, will incorporate this new processor. Supermicro’s Petascale storage systems and Edge and Telco-optimized servers, such as the Hyper-E and short-depth compact systems, will also be available. In the future, high-performance systems will soon be available with Intel Xeon 6900-series processors with P-cores. Systems with Intel Xeon 6 processors with P-cores will deliver 2-3X* better performance for AI workloads and 2.8X* higher memory bandwidth. Future systems using the Intel Xeon 6 processors with E-cores are expected to deliver 2.5X* higher rack density than previous generations and a 2.4X* performance per watt improvement, resulting in reduced PUE of a data center to as low as 1.05.

“Supermicro is an industry leader in designing, building, and delivering workload-optimized solutions at scale, including data center scale liquid cooling. The new X14 servers will provide even greater flexibility and customization options to our customers,” said Charles Liang, president and CEO of Supermicro. “The Supermicro X14 product families are our most powerful and flexible systems we have ever designed and are optimized for a wide range of applications, from the data center to the edge. We see that up to 20% of data centers will need to be liquid cooled in the future, and Supermicro is uniquely positioned to offer an entire solution, from cold plates to cooling towers.”

For greater efficiency and lower TCO, Supermicro offers liquid cooling solutions that can be added to any deployment, including CPU and GPU cold plates, a cooling distribution unit, manifold, tubing, and a cooling tower, with all components developed and manufactured in-house for a complete solution.

The new Intel Xeon 6 processors with E-cores feature a single thread per core. They are optimized for workloads that benefit from a more significant number of energy-efficient cores to run more simultaneous instances at once using less power, such as cloud-native CDNs, network microservices, cloud-native applications such as Kubernetes, application DevOps, unstructured databases, and scale-out analytics.

Supermicro X14 systems powered by the new Intel Xeon 6 processors feature pin compatibility between E-core and P-core variants. Current and future Supermicro systems will feature up to 576 cores per node, DDR5-6400 and MCR DIMMs with up to 8800 MT/s, CXL 2.0, wider E1.S and E3.S support, and up to 400G networking. The new Intel Xeon 6 processors will be available in the 6700-series, an upgraded version of previous generation Intel Xeon processors, and the 6900-series, an all-new class of processors to maximize performance. Intel Xeon 6900-series processors will feature more cores, higher TDP, increased memory channels, and support for MCR DIMMs. The Supermicro X14 platform is also the first Supermicro platform to support the OCP Data Center Modular Hardware System (DC-MHS), which reduces complexity and simplifies maintenance for large cloud service providers and hyperscalers.

“Intel is executing on its roadmap to deliver ‘4 nodes in 5 years’, and with Xeon 6, we are introducing revolutionary new processor features including our first ever enterprise-class Efficient-core products for cloud-native and scale-out workloads ,” said Ryan Tabrah, VP and GM of Xeon 6 E-Core Products at Intel. “These new processors are enabling our partners such as Supermicro to develop new Xeon systems which are denser and more efficient than ever before, helping customers to achieve their business goals while lowering TCO.”

The Supermicro portfolio of X14 systems is performance-optimized and energy-efficient, incorporates improved manageability and security, supports open industry standards, and is rack-scale optimized. With a global production capacity of 5,000 racks per month, including 1,350 liquid-cooled racks, Supermicro’s expert engineers can design, build, validate, and deliver complete systems with industry-leading time-to-market.  

Launching today with Intel Xeon 6700-series processors with E-cores:

SuperBlade® – Supermicro’s high-performance, density-optimized, and energy-efficient multi-node platform optimized for AI, Data Analytics, HPC, Cloud, and Enterprise workloads. With these new blade systems, one rack can feature up to 34,560 Xeon compute cores.

Hyper – Flagship performance rackmount servers designed for scale-out cloud workloads, with storage & I/O flexibility that provides a custom fit for a wide range of application needs.

CloudDC – All-in-one platform for cloud data centers, based on the OCP Data Center Modular Hardware System (DC-MHS) with flexible I/O and storage configurations and dual AIOM slots (PCIe 5.0; OCP 3.0 compliant) for maximum data throughput.

WIO – Offers flexible I/O configurations in a cost-effective architecture to deliver truly optimized systems for specific enterprise requirements.

BigTwin® – 2U 2-Node or 2U 4-Node platform providing superior density, performance, and serviceability with dual processors per node and hot-swappable tool-less design. These systems are ideal for cloud, storage, and media workloads with new models, including E3.S drive support for superior density and throughput.

GrandTwin® – Purpose-built for single-processor performance and memory density, featuring front (cold aisle) hot-swappable nodes and front or rear I/O for easier serviceability. Now available with E1.S drives for better storage density and throughput.

Hyper-E – Delivers the power and flexibility of our flagship Hyper family optimized for deployment in edge environments. Edge-friendly features include a short-depth chassis and front I/O, making Hyper-E suitable for edge data centers and telco cabinets. These short-depth systems support up to 3 high-performance GPU or FPGA cards.

Edge/Telco – High-density processing power in compact form factors optimized for telco cabinet and Edge data center installation. Optional DC power configurations and enhanced operating temperatures up to 55° C (131° F).

Petascale Storage – Industry-leading storage density and performance with EDSFF E1.S and E3.S drives, allowing unprecedented capacity and performance in a single 1U or 2U chassis.

Coming Soon with upcoming Intel Xeon 6 6900-series processors with P-cores:

GPU Servers with PCIe GPUs – Systems supporting advanced accelerators to deliver dramatic performance gains and cost savings. These systems are designed for HPC, AI training, rendering, and VDI workloads.

Universal GPU Servers – These are the most powerful servers for large-scale AI training and large language models. Open, modular, standards-based servers that provide superior performance and serviceability with GPU options, including the latest PCIe, OAM, and NVIDIA SXM technologies.

New Multi-node Servers  – High-density 2U4N systems optimized for HPC, data center, financial services, manufacturing, and scientific research applications. Front-accessible service design allows cold-aisle serviceability with flexible I/O and drive configurations.

* Compared to 4th Gen Intel Xeon Scalable Processors. Based on architectural projections as of August 21, 2023, relative to the prior generation. Your results may vary.

About Super Micro Computer, Inc.

Supermicro (NASDAQ: SMCI) is a global leader in Application-Optimized Total IT Solutions. Founded and operating in San Jose, California, Supermicro is committed to delivering first to market innovation for Enterprise, Cloud, AI, and 5G Telco/Edge IT Infrastructure. We are a Total IT Solutions manufacturer with server, AI, storage, IoT, switch systems, software, and support services. Supermicro’s motherboard, power, and chassis design expertise further enable our development and production, enabling next generation innovation from cloud to edge for our global customers. Our products are designed and manufactured in-house (in the US, Taiwan, and the Netherlands), leveraging global operations for scale and efficiency and optimized to improve TCO and reduce environmental impact (Green Computing). The award-winning portfolio of Server Building Block Solutions® allows customers to optimize for their exact workload and application by selecting from a broad family of systems built from our flexible and reusable building blocks that support a comprehensive set of form factors, processors, memory, GPUs, storage, networking, power, and cooling solutions (air-conditioned, free air cooling or liquid cooling).

Supermicro, Server Building Block Solutions, and We Keep IT Green are trademarks and/or registered trademarks of Super Micro Computer, Inc.

All other brands, names, and trademarks are the property of their respective owners.

SMCI-F

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Japan’s first DJI and Hasselblad Dual-Concept Flagship Store: “DJI | Hasselblad Authorized Concept Store Tokyo Omotesando” to Grand Open in Late October 2026!

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Offering an unprecedented creative experience with hands-on latest drones and medium-format cameras, an indoor drone flight cage, and 1-on-1 support from multilingual dedicated specialists

TOKYO, Oct. 22, 2026 /PRNewswire/ — DJI, the global leader in innovative aerial and imaging technology, will announce that SEKIDO Co., Ltd., an authorized domestic distributor, will hold the grand opening of the “DJI | Hasselblad Authorized Concept Store Tokyo Omotesando” in the Omotesando area of Tokyo on Saturday, October 31, 2026. This dual-concept store allows visitors to experience the combined worlds of DJI and Hasselblad, the Swedish premium camera brand boasting over 180 years of history as the pinnacle of medium-format photography.

The store consists of two floors, the first and second floors above ground, bringing together the world’s finest imaging technologies, from DJI’s latest drones, handheld gimbals, and action cameras to Hasselblad’s flagship medium-format digital camera systems. The store features a permanent indoor “Drone Flight Cage” for actual flight and operational experiences. It also offers 1-on-1 personalized consulting by expert staff and a multilingual support system (Japanese, English, and Chinese), strongly backing the expressive activities of all creators from Japan and abroad.

Background and Aim of Opening: A Permanent Flagship Hub to Meet the Growing Demand for “Real-World Experience and Expert Consultation”

The use of DJI products has been rapidly expanding in the Japanese market across a wide range of fields, including aerial photography, film and commercial production, still photography, and even industrial applications such as surveying and infrastructure inspection.

In recent years, while the demand for high-performance imaging equipment for creators has further increased, many customers have voiced their desire for real-world experiential value, stating, “I want to check the actual operational feel, image quality, and holding grip before purchasing,” and “I want to consult professionals to select the optimal equipment for my specific production needs and shooting environments.” For highly advanced equipment like drones in particular, it is extremely crucial to verify the intuitive operability and shooting sensation, which are difficult to convey solely through spec sheets and online information.

In response to these changing market dynamics, we decided to open a store in “Tokyo Omotesando,” an epicenter of trends and culture. This permanent flagship hub integrates “product experience,” “expert consulting,” and “experiencing the brand’s world view,” which cannot be fully covered by online sales and short-term events alone. We aim to create an open creative community space for all visual expressers, from highly sensitive top creators domestically and internationally to entry-level enthusiasts aspiring to begin serious content creation.

4 Key Highlights of “DJI Hasselblad Authorized Concept Store Tokyo Omotesando”

1. [Brand Convergence] A Dual-Concept Store to Experience the Worlds of DJI and Hasselblad

“DJI,” which develops innovative imaging technologies, and “Hasselblad,” which continues to support photographic expression as a historic medium-format camera brand. This is a new, dual-concept official store where the craftsmanship and cutting-edge technology of both brands intersect in a single space. From still images to motion pictures, and from the ground to the sky, we offer an equipment lineup that supports diverse creative activities.

2. [Real Experience] Indoor Drone Flight Cage & Product Touch & Try

On the 1st floor, a dedicated “Drone Flight Cage” is permanently installed, allowing visitors to safely fly and pilot drones. Without worrying about weather conditions or restricted flight areas, you can directly experience the hovering stability, camera operation, and control responsiveness of the latest drones on the spot. In addition, handheld cameras and gimbals such as the Osmo series led by the latest Osmo 360 II and Osmo Pocket 4P, as well as the Hasselblad medium-format cameras on the 2nd floor, are all displayed fully powered on, allowing you to freely pick them up and experience shooting.

3. [Expert Consultation] 1-on-1 Personalized Support System by Dedicated Specialists

Expert staff who are thoroughly familiar with product knowledge and on-site shooting know-how are permanently stationed at the store. We propose the optimal equipment configuration and peripheral accessories tailored to each customer’s shooting style, application, and business implementation goals. From comparing products to lectures on initial setup and consultation after introduction, we politely address all questions before and after purchase on a 1-on-1 basis.

4. [Global] Trilingual Support (Japanese, English, Chinese) to Fully Accommodate Inbound Demand

Tailored to the internationally diverse location of Omotesando, not only Japanese but also English and Chinese communication will be supported at the store. We have established a hospitable environment where international tourists and overseas business visitors can experience, purchase, and process tax exemptions for high-end equipment with peace of mind, without feeling any language barriers.

Floor Guide and Overview of Each Area

Each of the two floors offers independent themes and experiential value.

Floor

Main Exhibits and Services

1F
DJI Area

[DJI Touch & Try, Sales, and Flight Cage]
Latest aerial drones (Mavic series, Air series, Mini series, etc.)
Handheld gimbals and action cameras (Osmo Pocket, Osmo 360, Osmo Action, etc.)
Indoor drone flight cage (Actual piloting experience)
Product consultation by dedicated staff

2F
Hasselblad Area

[Hasselblad Touch & Try, Sales, and Gallery]
Medium-format mirrorless digital cameras (X2D II 100C, 907X series, etc.) and XCD lenses
Hasselblad art gallery (Exhibiting the overwhelming gradation and details captured by medium-format cameras)
Premium lounge and consulting booths for in-depth discussions in a relaxed atmosphere

Future Outlook: Regular Events and Workshops to Foster a Creator Community

This store will play a role not merely as an equipment sales hub, but as a communication hub where creators can connect, learn, and collaborate.

Following the grand opening, we plan to regularly host shooting workshops led by front-line professional photographers and video creators, drone flight experience seminars, and advance hands-on preview events for new products. Through the enthusiasm and learning opportunities unique to a physical store, we will contribute to the advancement of Japan’s creative culture.

Store Overview

Item

Store Basic Information

Store Name (Japanese)

DJI | Hasselblad Authorized Concept Store 東京表参道

Store Name (English)

DJI | Hasselblad Authorized Concept Store Tokyo Omotesando

Scheduled Opening Date & Time

Saturday, October 31, 2026 (Grand Opening)

Location

1F & 2F, La Porte Aoyama, 5-51-8 Jingumae, Shibuya-ku, Tokyo 150-0001

Access

4-minute walk from Exit B2 of Omotesando Station on the Tokyo Metro Ginza, Chiyoda,
and Hanzomon Lines

Business Hours / Holidays

11:00 – 20:00 (Planned) / Irregular holidays

Phone Number

03-6803-8400

Official Instagram

https://www.instagram.com/djihasselblad_tokyo_omotesando/

For details regarding the opening day and related campaigns, please check the store’s official Instagram or DJI’s official social media accounts.
We sincerely look forward to welcoming you to our store.

*Please note that all store images featured in this press release are computer-generated (CG) conceptual renderings. The actual design, layout, and specifications are subject to change without prior notice.

About DJI
Since its founding in 2006, DJI has pioneered the civilian drone industry, driving innovation while empowering individuals to take flight for the first time, turning imagination into reality, and continuously revolutionizing professional video production. Today, DJI strives every day with the goal of promoting human advancement and building a better world. With a solution-oriented mindset and genuine curiosity, DJI has expanded its business into fields such as renewable energy, agriculture, public safety, surveying and mapping, and infrastructure inspection. In each of these areas, DJI products create new value and bring unprecedented, fundamental changes to the lives of people around the world.

www.dji.com/jp  |  facebook.com/dji.jp  |  twitter.com/djijapan  |  youtube.com/DJIJapan  |  instagram.com/dji_japan  |  www.linkedin.com/company/dji

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SOURCE DJI JAPAN

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Shareholder Proposal Support Nudges Up as Proposal Volume Falls, Broadridge ProxyPulse™ Report Finds

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2026 proxy season sees a sharp decline in environmental and social proposals, a 10-year high in say-on-pay support and expanded opportunities for investor participation

NEW YORK, Oct. 22, 2026 /PRNewswire/ — Shareholder support for proposals increased in the 2026 proxy season even as the number of proposals continued to decline, according to the latest ProxyPulse™ report from global Fintech leader Broadridge (NYSE: BR).  Average support for shareholder proposals rose to 27.9% from 24.3% in 2025 with increases in both retail and institutional investor segments.

“The number of environmental and social proposals that were voted on declined by 47% between the 2025 and 2026 proxy seasons,” said Chuck Callan, Senior Vice President of Regulatory Affairs at Broadridge. “At the same time, shareholder support for proposals on disclosing political spending, at 42% on average, rose to a new high. Backing for directors and say-on-pay remained strong, with say-on-pay support hitting a 10-year high.”

Retail Investors Vote More Shares as Participation Options Expand

Retail investors owned 6 billion more shares this season than last and voted 2 billion more of the shares they own. The report also highlights the continued expansion of “voting choice” and digital governance capabilities to expand the options that shareholders have to make their voices heard. More than 900 funds offered pass-through voting in the 12 months ended June 30, 2026, up from approximately 400 a year earlier, with more than 400,000 shareholders enrolled. Companies held a record 2,542 virtual shareholder meetings between July 2025 and June 2026, including more than 200 first-time adopters.

About ProxyPulse™

The 2026 Broadridge ProxyPulse report examines ownership and voting trends across the past five proxy seasons and explores developments shaping corporate governance, including standing voting instructions, voting choice and support for tokenized equities.

ProxyPulse™ is based on Broadridge’s processing of shares held in street name at the 1,000+ broker-dealers and custodian banks it services. Accounts are classified as either “retail” or “institutional” based on the delivery channels and voting platforms they utilize. All data is reported in the aggregate. Comparative information covers annual meetings between January 1 and June 30 in each of the past five years.

About Broadridge

Broadridge (NYSE: BR) is a global technology leader with trusted expertise and transformative technology, helping clients and the financial services industry operate, innovate, and grow. We power investing, governance, and communications for our clients – driving operational resiliency, elevating business performance, and transforming investor experiences.

Broadridge’s technology and operations platforms process and generate over 8 billion communications annually and underpin the daily average trading of over $18 trillion in tokenized and traditional securities globally. A certified Great Place to Work®, Broadridge is part of the S&P 500® Index, employing approximately 16,000 associates in 28 countries. For more information about us, please visit www.broadridge.com.

Broadridge Contacts:

Investors: broadridgeir@broadridge.com

Media: Gregg.Rosenberg@broadridge.com

 

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SOURCE Broadridge Financial Solutions, Inc.

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UMC and AP Memory Collaborate to Enable Advanced Power Delivery Solutions for AI and HPC Systems

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HSINCHU, Oct. 22, 2026 /PRNewswire/ — United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) (“UMC”) and AP Memory (TWSE: 6531) today announced a technology and manufacturing collaboration to advance power delivery solutions for AI and high-performance computing (HPC) systems. This partnership combines UMC’s deep trench capacitor (DTC) foundry technology and scalable wafer manufacturing with AP Memory’s silicon capacitor designs and system-level integration to address the power efficiency challenges of next-generation data centers.

Rapid scaling of AI workloads is placing unprecedented demands on power delivery within computing systems, driving an architecture shift in data center design from placing power stabilization components on the circuit board to embedding capacitors directly in the interposer or substrate. This innovative approach shortens the power delivery path, improves power integrity, and supports more efficient voltage regulation within advanced packages.

The collaboration reached a significant milestone in the third quarter of 2026, with AP Memory’s S-SiCap™ Gen2D discrete silicon capacitor designs completing tape-out and initial functional validation. The next step is to proceed to comprehensive system-level performance and reliability testing of capacitors in substrate packages, targeting support for a range of capacitance and operating voltage requirements. UMC and AP Memory are also exploring opportunities to extend the collaboration to other product lines including capacitor-embedded interposers and landside capacitors to address diverse system designs.

GC Hung, Senior Vice President of UMC, said: “The growth of AI and HPC is driving a fundamental shift in power delivery – from board-level towards increasingly vertical power integration on the chip-level. UMC is offering robust power delivery solutions, including our DTC technology, which enables high-density capacitance to be placed closer to the computing die for more stable power delivery. By partnering with AP Memory, we are helping to bring scalable solutions to the market to solve the critical power bottleneck challenges as AI infrastructure continues to evolve.”

Ivan Hong, President of AP Memory, said: “The successful tape-out and initial wafer validation of our customized S-SiCap™ products using DTC technology represents an important milestone in demonstrating the flexibility and manufacturability of AP Memory’s S-SiCap™ design. By working with UMC, we are providing our customers a total solution, from product design to wafer manufacturing.”

UMC’s power delivery solutions roadmap covers both discrete and embedded silicon capacitors that can be applied to different system architectures, and extends to active components such as internal voltage regulators. UMC is also leveraging its advanced packaging capabilities to enable higher-density integration of power components to meet the higher voltage and capacitance requirements of next-generation data centers. In parallel, UMC is further investing in new manufacturing capacity to support both power delivery and heterogeneous integration solutions.

About UMC

UMC (NYSE: UMC, TWSE: 2303) is a leading global semiconductor foundry company. The company provides high-quality IC fabrication services, focusing on logic and various specialty technologies to serve all major sectors of the electronics industry. UMC’s comprehensive IC processing technologies and manufacturing solutions include Logic/Mixed-Signal, embedded High-Voltage, embedded Non-Volatile-Memory, RFSOI, BCD etc. Most of UMC’s 12-in and 8-in fabs with its core R&D are located in Taiwan, with additional ones throughout Asia. UMC has a total of 12 fabs in production with combined capacity of more than 400,000 wafers per month (12-in equivalent), and all of them are certified with IATF 16949 automotive quality standard. UMC is headquartered in Hsinchu, Taiwan, plus local offices in United States, Europe, China, Japan, Korea & Singapore, with a worldwide total of 20,000 employees. For more information, please visit: http://www.umc.com.

Note from UMC Concerning Forward-Looking Statements

Some of the statements in the foregoing announcement are forward-looking within the meaning of the U.S. Federal Securities laws, including statements about introduction of new services and technologies, future outsourcing, competition, wafer capacity, business relationships and market conditions. Investors are cautioned that actual events and results could differ materially from these statements as a result of a variety of factors, including conditions in the overall semiconductor market and economy; acceptance and demand for products from UMC; and technological and development risks. Further information regarding these and other risks is included in UMC’s filings with the U.S. Securities and Exchange Commission. UMC does not undertake any obligation to update any forward-looking statement as a result of new information, future events or otherwise, except as required under applicable law.

About AP Memory

AP Memory (TWSE: 6531) is a global fabless design semiconductor company specializing in customized memory design and IP solutions. Products include IoT memory (IoTRAM™), AI memory solutions (VHM™), and silicon capacitors (S-SiCap™). With strong R&D capabilities, AP Memory is committed to providing high performance, low-power and innovative customized products and solutions for applications such as mobile communication, wearable, IoT, high-end mobile application, high-performance computing, and edge computing.

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SOURCE United Microelectronics Corporation; AP Memory Technology Corp.

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