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Semiconductor IP Market size is set to grow by USD 2.71 billion from 2024-2028, complex chip designs and use of multi-core technologies to boost the market growth, Technavio

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NEW YORK, June 18, 2024 /PRNewswire/ — The global semiconductor IP market  size is estimated to grow by USD 2.71 billion from 2024-2028, according to Technavio. The market is estimated to grow at a CAGR of over 7.47%  during the forecast period. Complex chip designs and use of multi-core technologies is driving market growth, with a trend towards emergence of nanophotonic ICs. However, reuse of semiconductor IP  poses a challenge. Key market players include Achronix Semiconductor Corp., Advanced Micro Devices Inc., Alphawave IP Group plc, Arm Ltd., Arteric Inc., Cadence Design Systems Inc., CAST Inc., CEVA Inc., Dolphin Design SAS, Dream Chip Technologies GmbH, eMemory Technology Inc., Faraday Technology Corp., Imagination Technologies Ltd., Lattice Semiconductor Corp., Perceptia Devices Australia, Rambus Inc., Siemens AG, Synopsys Inc., VeriSilicon Microelectronics Shanghai Co. Ltd., and videantis GmbH.

Get a detailed analysis on regions, market segments, customer landscape, and companies – Click for the snapshot of this report

Forecast period

2024-2028

Base Year

2023

Historic Data

2018 – 2022

Segment Covered

End-user (Fabless semiconductor companies, IDMs, and Foundries), Application (Mobile computing devices, Consumer electronics, Automotive, Industrial automation, and Others), Form Factor (Processor IP, Physical IP, and Digital IP), and Geography (North America, APAC, Europe, South America, and Middle East and Africa)

Region Covered

North America, APAC, Europe, South America, and Middle East and Africa

Key companies profiled

Achronix Semiconductor Corp., Advanced Micro Devices Inc., Alphawave IP Group plc, Arm Ltd., Arteric Inc., Cadence Design Systems Inc., CAST Inc., CEVA Inc., Dolphin Design SAS, Dream Chip Technologies GmbH, eMemory Technology Inc., Faraday Technology Corp., Imagination Technologies Ltd., Lattice Semiconductor Corp., Perceptia Devices Australia, Rambus Inc., Siemens AG, Synopsys Inc., VeriSilicon Microelectronics Shanghai Co. Ltd., and videantis GmbH

Key Market Trends Fueling Growth

The semiconductor IP market is experiencing growth due to the integration of nanophotonic structures in electronic devices. These structures enable the development of miniaturized semiconductor devices with higher integration densities, high-density optoelectronic ICs for optical fiber communication, and flexible electronics circuits. IBM is a leading vendor in this space, having developed low-cost, commercially available electronic-photonic ICs. The adoption of nanophotonic technology for transistor development, such as carbon nanotube transistors, is increasing design complexity and driving innovation in memory chip layout design. The global nanophotonic IC market is expected to reach USD79.42 million by 2021, growing at a CAGR of 14.51%. 

The Semiconductor Intellectual Property (IP) market is experiencing significant growth due to the increasing demand for advanced technologies. Chip companies require efficient and effective IP cores for their designs. Memory IP, such as SRAM and ROM, is a major segment in this market. Processors, connectivity IP, and interface IP are also key areas of focus. The trend towards miniaturization and higher performance is driving the need for new and innovative IP solutions. Companies like Intellectual Property (IP) providers offer a wide range of IP cores for various applications. These IP cores are essential for the design and development of modern electronic systems. The IP market is competitive, with many players vying for market share. However, those who can provide high-quality, reliable, and cost-effective IP solutions will thrive in this market. 

Research report provides comprehensive data on impact of trend. For more details- Download a Sample Report

Market Challenges

The semiconductor industry faces significant challenges with third-party IP usage, leading to extensive IP reuse over the past 15 years. Companies often lack proper methods to manage and track IP cores, including crucial RTL data and licensing metadata. This oversight can result in unintentional IP reuse, causing financial penalties and legal issues. Few companies prioritize IP block management, leaving many vulnerable to IP violations. Instances of unintentional IP reuse include new design teams mistakenly using third-party IP and engineers unaware of IP agreement terms. Annual IP reuse increases financial liability for companies at risk of IP violations. Proper IP management is essential to mitigate these challenges and ensure the semiconductor IP market’s growth.The semiconductor IP market faces several challenges in today’s technology landscape. Intellectual property (IP) providers must keep up with the rapid advancements in technology, such as the increasing complexity of designs and the need for smaller, more power-efficient chips. Technologies like FinFET and 7nm processes require new and innovative IP solutions. Additionally, the growing importance of security and reliability in semiconductor designs presents a challenge for IP providers. Cost and time-to-market pressures also loom large, making it essential for IP providers to offer flexible licensing models and efficient design integration. Competition from both established players and new entrants adds to the complexity of the market. Overall, the semiconductor IP market requires providers to be agile, innovative, and responsive to meet the evolving needs of the industry.

For more insights on driver and challenges – Download a Sample Report

Segment Overview 

This semiconductor ip market report extensively covers market segmentation by

End-user 1.1 Fabless semiconductor companies1.2 IDMs1.3 FoundriesApplication 2.1 Mobile computing devices2.2 Consumer electronics2.3 Automotive2.4 Industrial automation2.5 OthersForm Factor3.1 Processor IP3.2 Physical IP3.3 Digital IPGeography 4.1 North America4.2 APAC4.3 Europe4.4 South America4.5 Middle East and Africa

1.1 Fabless semiconductor companies-  In the semiconductor industry, fabless companies opt for third-party IP licenses to minimize manufacturing overheads and reduce design time. This approach saves fabless companies an average of USD90-190 million and cuts down designing time by half, compared to in-house processor development. Notable companies, including Actions Semiconductor, Allwinner Technology, Marvell, AMD, Broadcom, MediaTek, Microchip, Rambus, Qualcomm, Xilinx, and Realtek, have adopted this strategy to meet OEM requirements and bring semiconductor devices to market more efficiently. The use of third-party IPs is projected to continue growing in the forecast period.

For more information on market segmentation with geographical analysis including forecast (2024-2028) and historic data (2018 – 2022)  – Download a Sample Report

Research Analysis

The Semiconductor IP market plays a crucial role in system design, enabling the creation of various electronic devices in sectors such as telecommunications, automotive, consumer electronics, industrial devices, and emerging technologies. Chip design processes involve significant development expenses, making IP cores an essential component for operational efficiency and cost-effectiveness. SoC designs incorporate processors, memory modules, analog circuits, and interface modules from IP providers. Collaboration between semiconductor manufacturers and IP providers is essential for innovation, product launches, and time-to-market advantages. Design efficiency, chip reliability, and performance are key considerations in the selection of IP cores. Intellectual property protection is essential to prevent patent infringement and maintain a competitive edge in research and development. Market expansion in various sectors drives the demand for semiconductor IP solutions.

Market Research Overview

The Semiconductor Intellectual Property (IP) market refers to the buying and selling of pre-designed and tested semiconductor IP cores and blocks. These IP cores and blocks include digital signal processing (DSP) cores, memory interfaces, and processor cores, among others. The semiconductor IP market caters to various industries such as automotive, consumer electronics, industrial, and telecommunications. The market is driven by the increasing demand for miniaturization, cost reduction, and time-to-market considerations in semiconductor design. The semiconductor IP market also offers benefits such as reduced design risk, faster time-to-market, and lower development costs. The market is expected to grow significantly due to the increasing adoption of advanced technologies such as artificial intelligence (AI), machine learning (ML), and the Internet of Things (IoT).

Table of Contents:

1 Executive Summary
2 Market Landscape
3 Market Sizing
4 Historic Market Size
5 Five Forces Analysis
6 Market Segmentation

End-userFabless Semiconductor CompaniesIDMsFoundriesApplicationMobile Computing DevicesConsumer ElectronicsAutomotiveIndustrial AutomationOthersForm FactorProcessor IPPhysical IPDigital IPGeographyNorth AmericaAPACEuropeSouth AmericaMiddle East And Africa

7 Customer Landscape
8 Geographic Landscape
9 Drivers, Challenges, and Trends
10 Company Landscape
11 Company Analysis
12 Appendix

About Technavio

Technavio is a leading global technology research and advisory company. Their research and analysis focuses on emerging market trends and provides actionable insights to help businesses identify market opportunities and develop effective strategies to optimize their market positions.

With over 500 specialized analysts, Technavio’s report library consists of more than 17,000 reports and counting, covering 800 technologies, spanning across 50 countries. Their client base consists of enterprises of all sizes, including more than 100 Fortune 500 companies. This growing client base relies on Technavio’s comprehensive coverage, extensive research, and actionable market insights to identify opportunities in existing and potential markets and assess their competitive positions within changing market scenarios.

Contacts

Technavio Research
Jesse Maida
Media & Marketing Executive
US: +1 844 364 1100
UK: +44 203 893 3200
Email: media@technavio.com
Website: www.technavio.com/

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SOURCE Technavio

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eSign.AI Named Sole Electronic Signature Technology Provider for Hong Kong Government’s CorpID Project, Building the Foundation for Digital Signing Infrastructure in Hong Kong

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HONG KONG, May 8, 2026 /PRNewswire/ — As Hong Kong’s Digital Corporate Identity Platform (CorpID) counts down to its phased launch, eSign.AI has been appointed as the sole electronic signature vendor in the project, responsible for delivering core digital signing capabilities including digital signatures, certificate management, and signature verification services. CorpID is led by Nexify, a seasoned government systems integrator, as the prime contractor. The platform is expected to launch in phases starting late 2026, with multiple CorpID-based e-government services going live in mid-2027.

CorpID: Government-Grade Digital Identity Infrastructure for Hong Kong Enterprises

The Digital Corporate Identity Platform (CorpID) is an enterprise-level digital services platform launched by the Hong Kong SAR Government, developed under the oversight of the Digital Policy Office (DPO). It is designed to serve as the business equivalent of “iAM Smart,” providing a unified digital identity foundation for Hong Kong enterprises. CorpID’s core mission is to build an integrated digital government infrastructure — offering unified identity authentication, digital signing, form pre-filling, and e-licence storage — replacing paper-heavy, cumbersome traditional processes and enabling smart city development through seamless data connectivity.

The platform is open to companies incorporated under the Companies Ordinance (Cap. 622) and businesses registered under the Business Registration Ordinance (Cap. 310), including sole proprietorships and partnerships. The DPO requires all enterprise-related e-government services to support CorpID within 18 months of launch, and will continue expanding ecosystem coverage through sandbox initiatives, cross-industry identity standard interoperability, and fully online registration processes.

eSign.AI: The Digital Signing Engine Behind CorpID

eSign.AI is an AI-native electronic signature and contract automation platform built for enterprises worldwide, offering a complete signing framework from simple electronic signatures to the highest-level compliant digital signatures — meeting diverse regulatory requirements across industries and jurisdictions.

On the identity verification front, eSign.AI has completed integration with iAM Smart, enabling individual identity verification through Hong Kong’s citizen digital identity system, and providing legally valid digital certificate services for both enterprises and individuals.

Looking ahead, the eSign.AI SaaS platform will be deeply integrated with CorpID, providing enterprise and individual identity verification for Hong Kong businesses, and supporting both electronic and digital signing that complies with Hong Kong’s Electronic Transactions Ordinance — connecting the full digital contracting lifecycle for government and enterprise alike.

Getting Ahead of the AI Era: From eSignGlobal to eSign.AI

The electronic signature industry is undergoing a structural shift from “tooling” to “intelligence.” Market data underscores this acceleration: the AI-powered contract analysis tools market has grown from USD 3.32 billion in 2025 to USD 4.3 billion in 2026, at a CAGR of 29.6%. Signing is just one node in the contract lifecycle — document generation, workflow orchestration, compliance tracking, and post-execution management are all being transformed by AI, and the industry window is closing fast.

In April 2026, the company officially rebranded from eSignGlobal to eSign.AI, completing its strategic transformation from an e-signature tool provider to an AI-native contract automation platform. As the company’s spokesperson noted, this rebrand is not cosmetic — it is an acknowledgment of where the product actually is. Customers were already using eSign.AI to automate workflows that go far beyond the signature itself.

eSign Automation Skill was launched alongside the rebrand — an AI-powered signing automation framework for enterprise workflows that enables complete contract signing through natural language interaction, with no manual intervention required. Whether it is single-party approval, multi-party sequential signing, or large-scale parallel execution, an AI Agent can orchestrate the entire workflow in a single call. All signature initiations and status queries return structured JSON outputs, directly parseable by leading large language models and intelligent workflow systems.

eSign Automation is now available in the OpenClaw ecosystem and supports integration via Claude MCP, ChatGPT, and other leading AI platforms.

By combining AI automation capabilities with CorpID’s government-grade digital identity infrastructure, eSign.AI delivers a complete solution for Hong Kong enterprises — from identity verification to intelligent signing to full workflow automation.

About eSign.AI

eSign.AI (formerly eSignGlobal) is an AI-native electronic signature and contract automation platform built for enterprises worldwide. The platform serves over 100 countries and regions, covering core industries including financial services, manufacturing, real estate, human resources, and healthcare — with 1,500+ scenario applications and 3,000+ ecosystem partners. eSign.AI holds ISO 27001, ISO 27701, and ISO 27018 certifications and supports major regulatory frameworks including the U.S. ESIGN Act / UETA, EU eIDAS, HIPAA, GDPR, and 21 CFR Part 11. Infrastructure is anchored by independent data centers in Hong Kong, Singapore, and Frankfurt, Germany.

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SOURCE eSignGlobal

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The 9th AskGamblers Awards Finalists Announced as Voting Starts

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The highly anticipated 9th AskGamblers Awards has officially moved into the voting phase. Following a rigorous selection process, the finalists across 5 premier categories have been revealed: Best Casino, Best New Casino, Best New Slot, Best Sportsbook, Best Provider. Players are invited to cast their votes until 11 June.

BELGRADE, Serbia, May 8, 2026 /PRNewswire/ — The voting stage of the 9th annual AskGamblers Awards has officially begun. The list of finalists is announced, and the first votes are already coming in. 

Players will have a chance to vote for their favourites until 11 June, when the winners will be announced at the gala ceremony in Belgrade. There’s a total of 5 categories where popular votes are taken into consideration:

Best CasinoBest New CasinoBest SportsbookBest New SlotBest Game Provider

There aren’t any big changes to the voting process compared to last year. The votes from the prominent members of AskGamblers Forum will be counted in as well, while some award winners will be announced directly by the AskGamblers teams. 

These include: Best Crypto Casino, Best Partner, and Best Manager categories, while the AskGamblers Superstar Award is expected to be handed to the operator that illustrates the brand values best.

Dijana Radunović, General Manager at AskGamblers, is excited for voting to start: “We’re seeing some familiar contestants, but there are a lot of new names, so it will be exciting to see who comes up on top.”

“We invite players to vote for their favourites! This is a chance for you to speak your mind and support operators and games that shape this industry,” Radunović added.

Before the AskGamblers Awards Ceremony that takes place on 11 June, Charity Night is scheduled for 10 June.

About AskGamblers

AskGamblers.com strives to provide current, objective, and accurate information and guide its users towards a safe gaming experience. The way we deliver our services, from the online casino, sportsbook, slot, and bonus reviews to our trusted Complaint Service, is best described by our motto: ‘Get the truth. Then play.’

For more information about AskGamblers and AskGamblers Awards, please contact dijana.radunovic@g2m.com.

This information was brought to you by Cision http://news.cision.com

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SUNMI Wins 2026 Red Dot Design Awards with Five Products, Leading Global Commercial Industrial Design

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SINGAPORE, May 8, 2026 /PRNewswire/ — The winners of the 2026 German Red Dot Design Award were officially announced. Five of SUNMI Technology’s flagship products won awards: the CPad Business Tablet, CPad PAY, FLEX 3 Interactive Display, the V3 handheld POS Terminal and L3 Industrial PDA. These products stood out with three core design concepts: integration, versatility and human-centricity.

Known as “The Oscars” of global industrial design, the Red Dot Award has strict evaluation criteria covering aesthetics, ergonomics, scenario adaptability and sustainability. SUNMI adheres to original commercial scenario customization, rejecting crudely modified consumer devices. All winning products are originally developed for real commercial scenarios such as cash register, food delivery, industrial inspection and store operations, covering the entire commercial track with high scenario adaptability. Meanwhile, it practices ESG concepts, adopting eco-friendly materials and modular structures to extend equipment service life, reduce consumable consumption, and implement low-carbon and long-term design, which perfectly meets the Red Dot’s sustainability evaluation criteria.

Simplify Complexity: With highly integrated design, SUNMI eliminates the “patchwork feeling” of cluttered devices and tangled cables in traditional commercial scenarios, streamlining store operations and saving space.All-in-One Versatility: Beyond a single tool function, SUNMI’s products achieve flexible transformation through modular and multi-form designs to proactively adapt to changing business needs. The CPad series with modular accessories and FLEX 3’s Lego-style modular design enable multi-scenario application and long-term reuse.Human-Centric Design: Every detail is human-oriented, focusing on real pain points to enhance scenario experience. The L3 Industrial PDA reduces high-frequency work fatigue through scientific weight distribution; the V3 Smart POS Terminal balances large-screen visibility and grip comfort; CPad PAY integrates full-link functions to simplify workflows.

These honors stem from SUNMI’s long-term commitment to a sustainable society, original commercial R&D and ESG. In the future, SUNMI will uphold its core concepts, expand the boundaries of commercial industrial design, and empower global businesses with user-oriented, eco-friendly and high-value products.

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