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Supermicro Showcases Largest Portfolio of HPC-Optimized Multi-Node Systems at SuperComputing 2024

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All-new FlexTwin™ and New Generation SuperBlade® Maximize Compute Density with up to 36,864 Cores per Rack, featuring Direct to Chip Liquid Cooling and Upgraded Technologies to Maximize HPC Performance

SAN JOSE, Calif. and ATLANTA, Nov. 19, 2024 /PRNewswire/ — Supercomputing Conference — Supermicro, Inc. (NASDAQ: SMCI) a Total IT Solution Provider for AI/ML, HPC, Cloud, Storage, and 5G/Edge, is showcasing its latest high-compute-density multi-node solutions which are optimized for high intensity HPC workloads. These systems include the innovative liquid-cooled FlexTwin 2U 4-node purpose-built HPC architecture and the industry leading SuperBlade with up to 20 nodes in a 6U or an 8U chassis with a range of storage drive options. Each SuperBlade can accommodate an NVIDIA GPU per node, accelerating specific applications. Supermicro multi-nodes feature shared resources to enhance efficiency and reduce raw materials usage, with significant density improvements compared to standard rackmount systems.

“Since the release of the industry-first Twin systems back in 2007, Supermicro has consistently been a pioneer in developing the densest, most efficient multi-node architectures for HPC workloads,” said Charles Liang, president and CEO of Supermicro. “The new FlexTwin houses either the Intel Xeon 6 processors with P-cores or the new AMD EPYC 9005 processors, giving customers the choice for their HPC racks scale deployments. The combination of Supermicro’s liquid cooling experience, extensive multi-node development expertise, rack-scale integration capacity, and the latest industry technologies enables us to provide our customers with HPC solutions of unprecedented performance and scale, helping to solve the world’s most complex computational challenges.”

See these new systems and learn more about Supermicro at SC24 by visiting www.supermicro.com/hpc.

The Supermicro multi-node systems are optimized for HPC workloads, including financial services, manufacturing, climate & weather modeling, oil & gas, and scientific research. Each distinct product family is designed with an optimized combination of density, performance, and efficiency.

FlexTwin – All-new dual-processor platform designed for maximum performance density in a liquid-cooled multi-node architecture, featuring support for the latest CPUs, memory, storage, and cooling technologies. Purpose-built to support demanding HPC workloads at scale, including financial services, manufacturing, scientific research, and complex modeling, FlexTwin is optimized for performance per dollar. Using a 48U rack as an example, FlexTwin can support up to 96 dual processor nodes and 36,864 cores within this rack size.

SuperBlade – High-performance, density-optimized, and energy-efficient architecture with up to 100 servers and 200 GPUs per rack. Direct liquid cooling (DLC) can support servers with the highest power CPUs to achieve the lowest PUE with the best TCO. SuperBlade utilizes shared, redundant components, including power supplies, cooling fans, chassis management modules (CMMs), ethernet and InfiniBand switches, and pass-thru modules to deliver the most cost-effective, green computing solutions. Depending on customer requirements, the flexible SuperBlade is available in either a 6U or 8U form factor.

BigTwin – The versatile Supermicro BigTwin is available as a 2U-4Node or 2U-2Node system. The Supermicro BigTwin shares power supplies and fans, which reduce power consumption. The BigTwin is available with the Intel Xeon 6 processor.

With its Complete Rack Integration Services, Supermicro works closely with customers to architect and design rack and entire data center solutions for HPC workloads. After the design is validated with customer close involvement, Supermicro offers on-site deployment services, reducing the time-to-deployment. Supermicro has a global manufacturing footprint with production facilities in the USA, Europe, and Asia. It can produce a total of 5,000 racks per month, including 2,000 liquid-cooled racks, with lead times of weeks, not months.

Supermicro’s multi-node systems feature the latest technologies to enhance HPC performance.

New-generation processors – Dual Intel® Xeon 6900 series processors with P-cores up to 500W and 128 cores or AMD EPYC™ 9005 series processors up to 500W and 192 cores are available in a range of Supermicro HPC servers. In addition, dual Intel Xeon 6700 processors with E-cores up to 330W and 144 cores are also available in select Supermicro servers.

Higher bandwidth memory – Support for DDR5 up to 6400MT/s improves throughput for memory-intensive and in-memory computing HPC applications. Systems featuring Intel Xeon 6 processors also support the new MRDIMMs with a bandwidth of up to 8800MT/s.

Direct Liquid Cooling – Supermicro’s complete liquid cooling solutions include CPU and DIMM module cold plates, cooling distribution manifolds (CDM), in-rack and in-row cooling distribution units (CDM), connectors, tubing, and cooling towers, efficiently cooling high-powered CPUs and reducing instances of thermal throttling. Supermicro has deployed more than 2,000 fully integrated liquid-cooled racks in the past three months.

EDSFF drives – New support for EDSFF E1.S and E3.S drives improves storage density and enhances throughput, providing better storage performance for data-intensive HPC applications. EDSFF drives also have a more efficient thermal design than standard storage drives, allowing a higher drive density in space-constrained multi-node architectures.

Supermicro at Supercomputing Conference 2024

Supermicro will showcase a full AI and HPC infrastructure solutions portfolio at the Supercomputing Conference, including our liquid-cooled GPU servers for AI SuperClusters.

Check out the speaking sessions at our in-booth theater, where customers, experts from Supermicro, and our technology partners will be presenting on the latest breakthroughs in computing technology.

Visit Supermicro at booth #2531, Hall B at SC24.

About Super Micro Computer, Inc.

Supermicro (NASDAQ: SMCI) is a global leader in Application-Optimized Total IT Solutions. Founded and operating in San Jose, California, Supermicro is committed to delivering first-to-market innovation for Enterprise, Cloud, AI, and 5G Telco/Edge IT Infrastructure. We are a Total IT Solutions manufacturer with server, AI, storage, IoT, switch systems, software, and support services. Supermicro’s motherboard, power, and chassis design expertise further enable our development and production, enabling next-generation innovation from cloud to edge for our global customers. Our products are designed and manufactured in-house (in the US, Taiwan, and the Netherlands), leveraging global operations for scale and efficiency and optimized to improve TCO and reduce environmental impact (Green Computing). The award-winning portfolio of Server Building Block Solutions® allows customers to optimize for their exact workload and application by selecting from a broad family of systems built from our flexible and reusable building blocks that support a comprehensive set of form factors, processors, memory, GPUs, storage, networking, power, and cooling solutions (air-conditioned, free air cooling or liquid cooling).

Supermicro, Server Building Block Solutions, and We Keep IT Green are trademarks and/or registered trademarks of Super Micro Computer, Inc.

All other brands, names, and trademarks are the property of their respective owners.

 

 

 

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Mastech Digital to Announce Second Quarter 2026 Financial Results; Participate in Upcoming Investor Conference

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PITTSBURGH, July 24, 2026 /PRNewswire/ — Mastech Digital, Inc. (NYSE American: MHH) (“Mastech Digital”), a leading provider of Digital Transformation IT Services, today announced the date for the release of its financial results for the second quarter ended June 30, 2026, and its participation in an upcoming investor conference.

Second Quarter 2026 Earnings:

Mastech Digital will report its financial results for the second quarter 2026 before the market opens on Thursday, August 6, 2026. Management will host a live conference call and webcast at 9:00 a.m. Eastern Time on that day to discuss the Company’s financial performance and operating results.  The conference call will be hosted by Nirav Patel, President and CEO, and Kannan Sugantharaman, Chief Financial and Operations Officer.

Those wishing to participate via webcast should access the call through Mastech Digital’s Investor Relations website at https://investors.mastechdigital.com. Those wishing to participate via telephone may dial in at 1-800-715-9871 (USA) or 1-646-307-1963 (International) with the passcode 7506988. The replay will be available via webcast through Mastech Digital’s Investor Relations website.

Upcoming Investor Conference:

Mr. Sugantharaman will host a fireside chat at the Sidoti Micro-Cap Investor Conference on Wednesday, August 19, 2026, at 9:15 a.m. Eastern Time.

Mastech Digital management is scheduled to host virtual one-on-one and small group meetings with investors during the conference on August 19-20, 2026. Investors interested in arranging a meeting should contact their Sidoti representative or reach out to the Mastech Digital investor relations team at investors@mastechdigital.com.

About Mastech Digital, Inc.

Mastech Digital (NYSE American: MHH) is a leading provider of Digital Transformation IT Services. The Company offers Data Management, Analytics & AI Solutions, and IT Staffing Services with a digital-first approach. A minority-owned enterprise, Mastech Digital is headquartered in Pittsburgh, PA, with offices across the U.S., Canada, Europe, and India. Visit us at www.mastechdigital.com.

Investor Relations Contact:
investors@mastechdigital.com 

 

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SOLAI Limited Announces Extraordinary General Meeting

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AKRON, Ohio, July 24, 2026 /PRNewswire/ — SOLAI Limited (NYSE: SLAI) (“SOLAI” or the “Company”) (previously known as “BIT Mining Limited”), a technology-driven personal AI and digital infrastructure provider, today announced that it will hold its extraordinary general meeting of shareholders at 428 South Seiberling Street, Akron, Ohio, US on August 14, 2026 at 10:00 a.m., New York time.

Holders of record of ordinary shares and preference shares of the Company at the close of business on July 20, 2026, New York time (the “Record Date”) are entitled to receive notice of, and to attend and vote at, the extraordinary general meeting or any adjournment thereof. Holders of the Company’s American Depositary Shares (“ADSs”) who wish to exercise their voting rights for the underlying ordinary shares must act through the depositary of the Company’s ADS program, Deutsche Bank Trust Company Americas.

The notice of the extraordinary general meeting, which sets forth the resolutions to be submitted to shareholder approval at the extraordinary general meeting is available on the Investor Relations section of the Company’s website at https://ir.solai.com

About SOLAI Limited

SOLAI Limited (previously known as “BIT Mining Limited”) (NYSE: SLAI) (previously traded under “BTCM”) is a technology-driven personal AI and digital infrastructure provider. Building upon its historical legacy in digital asset mining and blockchain network operations, the Company is leveraging extensive experience in large-scale hardware deployment, data center operations, and high-performance computing to build the foundational infrastructure for personal AI computing and digital asset ecosystems globally.

For more information:

SOLAI Limited
ir@solai.com
ir.solai.com
www.solai.com 

Christensen Advisory
Jason Ng
Tel: +852-2117-0861
Email: solai@christensencomms.com 

 

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/U P D A T E — TrendAI/

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This release has been updated to include new information provided by TrendAI. The complete, corrected release follows, with additional details at the end:

TrendAI™ Adopts Claude Opus 5 to Advance Vulnerability Prioritization and Virtual Patching

As a participant in Anthropic’s Cyber Verification Program, TrendAI applies frontier reasoning to convert vulnerability intelligence into faster protection across hybrid environments

DALLAS, July 24, 2026 /PRNewswire/ — TrendAI™, the enterprise AI security leader from Trend Micro Incorporated (TYO: 4704; TSE: 4704), today announced it is adopting Claude Opus 5, Anthropic’s latest and most capable Opus model, to help security teams convert vulnerability intelligence into immediate protection, from prioritization to virtual patching. The move builds on TrendAI’s collaboration with Anthropic on Claude Opus 4.8, extending the same defensive focus to a model that delivers step-change gains in advanced reasoning, agentic workflows, and long-horizon analysis. As AI makes finding vulnerabilities easier than ever, the harder problem becomes protecting organizations faster than software can be permanently patched, and that is where TrendAI is putting Opus 5 to work.

As a participant in Anthropic’s Cyber Verification Program, which credentials organizations for the defensive use of frontier AI models, TrendAI is positioned to apply Claude Opus 5 to defensive security as access becomes available. The model is Zero Data Retention compatible, supporting TrendAI’s governance and data-protection requirements as it scales AI across security operations.

The work extends to TrendAI Threat Research, where frontier AI models are combined with our proprietary frontier intelligence engine and human expertise to generate pre-disclosure intelligence. Those insights power TrendAI Vision One™, delivering stronger detection, deeper forensic insights, and proactive protection through virtual patching.

Rachel Jin, Chief Platform and Business Officer, Head of TrendAI™:
“With Claude Opus 5, TrendAI can move from vulnerability intelligence to action faster than ever, prioritizing what matters most by exploitability and business impact. Finding the vulnerability was always the hard part. Now the challenge is protecting organizations faster than software can be permanently patched, and frontier reasoning is what changes that equation, extending all the way to virtual patching that protects customers before a vendor fix ships. This is what it means to secure the AI age, fearlessly.”

These capabilities support TrendAI Vision One™ in helping security analysts, AppSec teams, and SOC teams prioritize exposure, map attack paths, and accelerate mitigation, including virtual patching, across hybrid environments, moving vulnerability management from a static scanning process into a faster, context-aware risk mitigation workflow.

About TrendAI™
TrendAI™, the global AI security leader and enterprise business unit of Trend Micro, empowers organizations with full AI visibility and consolidated security that inspires confidence, drives innovation, and eliminates risk. Trusted by the largest enterprises and governments across 185 countries, TrendAI™ secures the entire organization, from identities, to infrastructure, to data. Global Fortune 500 companies rely on TrendAI™ to cut risk and stop threats up to three months earlier, powered by world-leading threat and attack intelligence. Through deep ecosystem partnerships with market leaders like NVIDIA, Anthropic, AWS, Google, and Microsoft, TrendAI™ empowers your organization to securely drive forward at the speed of AI. AI Fearlessly. Learn more: trendaisecurity.com

About Anthropic
Anthropic is an AI safety and research company dedicated to building reliable, interpretable, and steerable AI systems. Its Claude family of models, including Claude Opus 5, enables advanced capabilities across a wide range of applications, including code understanding and security analysis.

Update: The latest version of this release includes additional statements from TrendAI related to the original announcement.

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