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EV Group Brings Digital Lithography to Heterogeneous Integration HVM Applications with LITHOSCALE® XT

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LITHOSCALE XT provides up to five-fold increase in throughput versus previous industry benchmark LITHOSCALE system; EVG maskless exposure technology to be highlighted at ECTC 2025

ST. FLORIAN, Austria, May 26, 2025 /PRNewswire/ — EV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today introduced the LITHOSCALE® XT maskless exposure (MLE™) system, the industry’s first true high-throughput/high-resolution digital lithography solution for high-volume-manufacturing (HVM) heterogeneous integration applications.

With a new dual-stage design, up to six exposure units, a dual-wavelength direct laser source as well as additional hardware and software enhancements, the LITHOSCALE XT offers up to a five-fold increase in throughput compared to EVG’s current-generation LITHOSCALE solution, which previously was the highest-throughput maskless lithography system at comparable resolution. The LITHOSCALE XT is ideally suited for applications involving multi-die patterning, fan-out wafer-level packaging (FoWLP) for AI and high-performance computing (HPC) devices, panel-level packaging, MEMS, advanced imaging sensors, and die traceability for security and automotive applications.

Maskless Exposure Technology – Ideal Patterning Solution for Heterogeneous Integration
Heterogeneous integration—the manufacturing, vertical assembly and packaging of multiple different dies into a single package—has led to greater package complexity, as well as a greater number of package options available. This in turn is driving the need for greater design flexibility and the ability to adopt both die-level and wafer-level designs simultaneously in back-end lithography. Accurate reconstitution of wafers is a key parameter in integrating dies from various wafer fabs or fab lines in multi-die solutions. Steppers and other mask-based patterning systems struggle to cope with inaccuracies from die-placement and die-shift variations caused by over-molding. In addition, the reticle size and optics dimensions of static exposure systems limit the exposure area. This is particularly challenging in large die interposer fabrications, where stitch-lines and/or mismatches overlap regions of the reticle exposure field, which can affect the electrical properties within the redistribution layer (RDL). The ability to generate a homogenous pattern for interposers that exceed current reticle size is crucial for devices with complex designs, such as those used in advanced graphic processing, 5G, AI and HPC.

EVG MLE Technology Advantages
LITHOSCALE XT tackles legacy bottlenecks associated with steppers by combining powerful digital processing that enables real-time data transfer and immediate exposure, with high structuring resolution and high throughput. Key features include:

Up to six exposure heads to cover a 300-mm wafer or 300-mm x 300-mm panel substrate in a parallel exposure processHigh-resolution (down to sub-2-micron lines/spaces), stitch-free, full-wafer patterning with no field-exposure or die-size limitationsSimple switching between mask layouts, supporting multi-die patterning without the associated high cost of ownership for having many masksReal-time wafer-level distortion and die-shift compensation for bowed or warped wafers, enabling improved die-placement accuracy and patterning yield without impact on throughputSupports a wide range of exposure applications thanks to a dual-wavelength laser source (e.g., thin and thick photoresists, <1 micron up to >100 microns in thickness, chemically amplified resists, positive and negative tone, dielectrics, high-aspect-ratio patterning, etc.)

According to Dr. Bernhard Thallner, pathfinding and optics director at EV Group, “The adoption and evolution of heterogeneous integration is driving tighter performance requirements for back-end lithography that can no longer be fully met with traditional mask-based solutions like steppers and mask aligners. While the technical advantages of MLE technology are abundantly clear, throughput has been a barrier to HVM adoption until now. Our newest MLE platform, LITHOSCALE XT, supports our customers’ unique patterning needs in HVM, not only for advanced packaging but also numerous other applications that can benefit from its combination of high versatility, resolution and throughput. We are ready to engage with customers and partners to help them leverage the myriad benefits of our MLE technology for their respective unique manufacturing needs.”

Automotive, Security and Imaging Benefits from EVG MLE Technology
In addition to advanced packaging, LITHOSCALE XT is also ideal for use in the manufacture of advanced image sensors—which involve complex shapes and highly functional optical materials that present challenges to stepper technologies—thanks to its high resolution and excellent sidewall profile performance on structures with complex shapes and/or high aspect ratios. LITHOSCALE XT’s Dynamic Die Annotation capability also enables on-the-fly generation of unique die identifiers for each individual wafer, supporting industry standards for individual die identification and traceability—such as SEMI E142 and SEMI T23—that are designed to meet the needs of the highly demanding security and automotive markets.

See EVG at ECTC 2025
Attendees at the 2025 IEEE 75th Electronic Components and Technology Conference (ECTC) interested in learning more about the LITHOSCALE XT and other innovative process solutions from EVG that are enabling advances in AI, HPC, advanced packaging, and sustainable semiconductor manufacturing, are invited to visit EVG at Booth #330 on May 27-30 in Dallas, Texas. In addition, Dr. Ksenija Varga, business development manager for EV Group, will unveil the latest results from EVG’s MLE technology in her oral presentation “Advanced FO PLP Digital Lithography Patterning Development for AI Devices” (co-authored with Fujifilm Electronic Materials) in Session 21 on Thursday, May 29 at 2:40pm in Room Texas 4-6.

Product Availability
EVG is now accepting orders for the LITHOSCALE XT maskless exposure system, and is offering product demonstrations at EVG’s headquarters. For more information, please visit https://www.evgroup.com/products/lithography/lithoscale-maskless-exposure-lithography-systems/lithoscale-xt

About EV Group (EVG)
EV Group (EVG) provides innovative process solutions and expertise that serve leading-edge and future semiconductor designs and chip integration schemes. The company’s vision of being the first in exploring new techniques and supporting next-generation applications of micro- and nanofabrication technologies enables customers to successfully commercialize new product ideas. EVG’s high-volume-manufacturing-ready products, which include wafer bonding, lithography, thin-wafer processing and metrology equipment, enable advances in semiconductor front-end scaling, 3D integration and advanced packaging, as well as in other electronics and photonics applications. More information about EVG is available at www.EVGroup.com.

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SOURCE EV Group

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Manufacturing Category at 139th Canton Fair Presents Smarter, Lighter and More Connected Solutions

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GUANGZHOU, China, April 24, 2026 /PRNewswire/ — At the 139th Canton Fair, Manufacturing category presented a clear view of how industrial equipment is evolving to address efficiency, labor shortages, and sustainability goals. Across power equipment, machinery, automation systems, and industrial robots, exhibitors pointed to a common direction: smarter operation, stronger engineering performance, and deeper integration with digital manufacturing systems.

Industrial equipment is advancing towards intelligence with products emphasizing built-in sensing and automatic adjustment to enhance reliability and efficiency. Silent inverter generators, for example, can detect operating conditions and ambient temperature to regulate cooling for better fuel use and stability. Pumps and cleaning equipment with variable-frequency drives and integrated protection systems follow the same approach, prioritizing smooth operation, longer service life, and consistent output.

Lightweight, high-performance design has also become a priority across categories. Advances in materials and structural engineering are enabling major weight reductions without compromising power or durability. Aluminum-extrusion housings in three-phase asynchronous motors cut weight by up to 40% while improving heat dissipation and installation efficiency. Lightweight permanent-magnet submersible pumps delivered stronger flow stability despite smaller size and reduced weight.

AI-based visual inspection and quality control are also becoming essential. AI-powered optical inspection stations demonstrated full-process, high-speed inspection without relying on manual sampling. By turning experience-based judgment into standardized, repeatable rules, these systems help manufacturers improve scalability and consistency.

Industrial robots are taking on more active roles as well. Security patrol robot dogs and inspection robots are moving beyond monitoring to direct intervention, such as carrying fire-suppression modules for emergency response. This shift marks a broader move from passive observation to active execution in high-risk or labor-intensive environments.

Finally, more industrial devices are being designed as system nodes rather than standalone machines. Intelligent industrial gateways that combine data collection, protocol conversion, edge computing, and secure transmission show how equipment value increasingly depends on its ability to connect with enterprise-level digital systems.

The 139th Canton Fair vividly showcased the accelerated shift of industrial equipment toward intelligent and system-level development.

For pre-registration, please click: https://buyer.cantonfair.org.cn/register/buyer/email?source_type=16

 

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SOURCE Canton Fair

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Zhejiang unicorn ranks grow to 58 as Hangzhou tightens lead, top ranking shows

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Province adds three unicorns, expands high-growth pipeline
Hangzhou accounts for 83% as new entrants and startups scale up

HANGZHOU, China, April 24, 2026 /PRNewswire/ — Zhejiang’s roster of unicorn companies has expanded to 58 as of April 2026, highlighting the province’s growing role as a hub for emerging technologies and industrial upgrading.

The latest rankings, released at the 10th All Blossom Conference in Hangzhou on April 23, show companies spread across seven cities, including Hangzhou, Ningbo, Jiaxing, Jinhua, Shaoxing, Taizhou and Wenzhou.

While Hangzhou, Ningbo and Jiaxing remain the top three hubs, the broader distribution points to a more geographically balanced innovation landscape. The province’s unicorn count rose by three from a year earlier.

Hangzhou continues to dominate the landscape, home to 48 of Zhejiang’s unicorns, up from 44 last year—when it already accounted for roughly four out of every five such startups.

The annual rankings also include tiered lists of “future unicorns,” valued between $100 million and $1 billion, and early-stage “seed unicorns” worth $10 million to $100 million.

Together, they map a full pipeline of high-growth companies across sectors such as artificial intelligence, embodied intelligence, life sciences, new energy, semiconductors, advanced manufacturing and aerospace, and have become a key barometer of Zhejiang’s startup ecosystem.

Among the top 100 future unicorns, integrated circuits lead with 22 companies, followed by artificial intelligence and life sciences with 19 each. Advanced manufacturing accounts for 16 firms, new energy and materials 15, and next-generation information technology nine.

In the seed unicorn category, new energy and life sciences each count 22 companies, ahead of advanced manufacturing with 19, while AI, next-generation IT and semiconductors each have 11 firms, and aerospace-related companies total four.

Against that provincial backdrop, Hangzhou remains the clear center of gravity—continuing to generate both the largest share of unicorns and the deepest pipeline of emerging startups.

The city added eight companies to its unicorn ranks on April 23, bringing the total to 48, according to the same conference ranking.

The new entrants—Hailiang Technology Services, Geener Microelectronics, Spirit AI, Geespace, Sunrise, Seepin, DEEP Robotics and Simplexity Robotics—span sectors from semiconductors and robotics to commercial aerospace.

As of April, Hangzhou accounted for 83% of Zhejiang’s unicorns, up from 80% a year earlier, underscoring its outsized role in the province’s innovation economy.

The conference also released a list of 413 quasi-unicorns—companies typically valued between $100 million and $1 billion—including 50 new additions.

Several firms, such as Diagens Biotechnology, Manycore Tech, Mirxes, Promisemed, Saint Bella, Tide Pharmaceutical, Tongshifu and ISV, exited the list after scaling into unicorn status or completing initial public offerings.

Quasi-unicorns are concentrated in sectors aligned with Hangzhou’s broader “296X” industrial strategy. Life sciences lead with 118 firms, followed by next-generation information technology with 78 and AI and embodied intelligence with 50—together accounting for about 60% of the total.

The “296X” is an industrial cluster blueprint the city introduced in October 2025 in an effort to speed up the integration of technological and industrial innovation.

More than half of both unicorns and quasi-unicorns—255 companies—are classified as nationally recognized “specialized and refined” enterprises, including 20 unicorns and 235 quasi-unicorns, reflecting a structured pipeline of high-growth firms.

Since 2018, Hangzhou’s unicorn count has risen from 26 to 48, while quasi-unicorns have expanded from 105 to 413, underscoring sustained growth in its innovation-driven economy.

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SOURCE All Blossom Conference

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KUN Unveils AI Intelligent Strategy at Money20/20 Asia: Reconstructing Global Commercial Efficiency with “1-1-4-6” Layout

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BANGKOK, April 24, 2026 /PRNewswire/ — At the prestigious Money20/20 Asia held at QSNCC, KUN showcased its upgraded brand identity and launched the “1-1-4-6” Intelligent Strategic Blueprint. This milestone marks KUN’s comprehensive transition toward a globalized, full-stack, and intelligent ecosystem.

Dr. Louis Liu, Founder & Group CEO of KUN, stated at the launch: “While the convergence of Web2 and Web3 defines the current era, we believe the embedded ecosystem synergy of AI and Web3 is the inevitable future of commerce. Our evolution is an intelligent reconstruction of commercial efficiency. By leveraging decades of vertical payment expertise, we provide enterprise clients with full-stack, end-to-end payment and financial solutions. Through digital orchestration and operations, we deliver secure, compliant, and high-velocity transaction safeguards to empower global business growth.”

Money20/20 Roundtable: Compliance as the “Scaling Layer” for Institutional Adoption

At the “Bridging TradFi and DeFi” roundtable, Dr. Liu shared three key insights on the future of cross-border finance:

Asia as the Hub for Real-World Stablecoin Settlement: Asia has emerged as a critical hub for cross-border trade flows and stablecoin settlement, connecting high-growth emerging markets. Currently, 60% of the world’s on-chain stablecoin trade volume is centered in Asia, making it a primary corridor for capital flows between Asia, LATAM, Africa, and the Middle East.

Compliance as the “Scaling Layer”: The bottleneck for scaling digital payments is not technology or licensing, but the ability to embed jurisdictional compliance frameworks into business logic. Integrating AML and risk controls directly into the payment flow is the prerequisite for the explosion of global institutional applications.

Accelerating AI and Web3 Ecosystem Convergence: As AI agents increasingly enter commercial decision-making, payments are shifting from human-controlled to autonomous. Blockchain and stablecoins will serve as the default infrastructure for Agent-to-Agent (A2A) transactions.

Exhibition Interaction: From Platform Governance to Vertical Efficiency

At the main exhibition area, KUN demonstrated its dual-brand synergy through a new visual identity:

KUN: Positioned as the Trusted Vertical Digital Payments Platform for Real Economy, providing one-stop digital payments and scenario-based on-chain financial solutions.

YeeZ: A KUN Group brand specializing in 2B2C Global Corporate Card Issuance for global enterprises.

The “1-1-4-6” Strategic Blueprint: Driving Global Growth

KUN decoded its “1-1-4-6” strategy—an AI-powered blueprint designed for seamless asset mobility. The ecosystem integrates KUN Space™ (the digital payments & financial services platform) with KUN Nexus™ (the AI-orchestrated liquidity network). Driven by four core engines—KUN | Pay, KUN | Cards, KUN | Money, and KUN | Agent—the strategy empowers liquidity for six vertical sectors: Bulk Commodity, General Trade, B2B Cross-border E-Commerce, Service Trade, Web3 Ecosystems, and AI Applications.

Future Vision: The Era of “Driverless” Intelligent Payments

The launch highlighted KUN | Agent as the pioneer of the “driverless” era of intelligent global payments.

KUNClaw.AI: Orchestrates autonomous financial workflows to drive intelligent cost reduction and efficiency.

AI Agent Wallet: Features programmable KYC and authorization fences to ensure secure, compliant execution where “decision is payment”.

Seamless Network, Borderless Payments.

KUN remains dedicated to serving as the engine for the real economy, providing secure, compliant, and efficient one-stop cross-border payment solutions in an uncertain global environment.

About KUN

KUN is an innovative financial infrastructure company centered on digital payments and embedded finance. Built on a globally distributed licensing framework and a robust compliance and risk-management system, KUN connects Asia with high-growth emerging markets across Africa, Latin America, and the Middle East.

Positioned as a trusted vertical digital payments platform for real economies, the company operates across four core pillars—Cross-Border Digital Payments, On-Chain Finance, Card Issuing, and AI Agentic Payments. By integrating artificial intelligence and blockchain technologies, KUN delivers secure, compliant, and efficient one-stop payment and transaction services for enterprise clients across industries including commodity trade, B2B cross-border e-commerce, service trade, Web3 ecosystems, and AI applications.

Through this integrated infrastructure, KUN serves as a growth engine enabling enterprises to expand globally with speed, trust, and financial connectivity.

Learn more about KUN → www.kun.global

Contact: KUN: brandmkt@kun.global  

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SOURCE KUN

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