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Tomocube Launches HT-T1 Desktop for 3D Glass Substrate Defect Analysis in Advanced Packaging

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Provides non-destructive 3D analysis of the location, morphology, and depth profile of internal defects in glass substratesIntroduces TAMI, a dedicated 3D analysis software platform that connects R&D analysis with production-line reviewAccelerates root-cause analysis and yield learning for glass substrates, a key material for next-generation advanced packaging

DAEJEON, South Korea, July 13, 2026 /PRNewswire/ — Tomocube, a 3D non-destructive inspection and metrology company, today announced the launch of HT-T1 Desktop (HT-T1D), a desktop holotomography system for high-resolution 3D defect analysis of glass substrates used in next-generation semiconductor packaging.

HT-T1D is optimized for glass-substrate inspection and metrology workflows. When conventional in-line panel inspection tools, such as automated optical inspection (AOI) systems, flag a potential defect, HT-T1D takes the corresponding coordinates and reconstructs the interior of the glass substrate in three dimensions, resolving the location, morphology, and depth-wise characteristics of defects that surface inspection alone cannot reveal.

Glass core substrates and glass interposers are drawing growing attention as key enabling materials for AI accelerators, high-bandwidth memory (HBM), and other advanced packaging applications. As these substrates move toward mass production, however, manufacturers face mounting challenges in identifying the root causes of micro-defects introduced during complex process steps such as laser drilling, etching, metallization, and singulation. A single critical defect can scrap an entire unit. As a result, the ability to quickly turn inspection data into process improvements has become critical to production-line stability.

HT-T1D applies Tomocube’s visible-light holotomography to visualize the three-dimensional refractive-index distribution inside glass with a refractive-index sensitivity of 10⁻⁴. Because the measurement is non-destructive, the same location can be measured repeatedly across successive process stages, allowing users to track when and how a defect forms, propagates, or enlarges. The system is expected to shorten defect-analysis cycles that have traditionally depended on destructive failure analysis, reducing analysis time from days or weeks to minutes in applicable workflows and supporting earlier intervention ahead of high-cost downstream steps.

Alongside the hardware, Tomocube also introduced TomoAnalysis MI (TAMI), a dedicated 3D analysis software platform for metrology and inspection. TAMI quantitatively analyzes 3D refractive-index volume data and generates structured reports for engineering review. It also processes data from HT-T1M, Tomocube’s planned in-line module for deployment through system integration partners, in the same format — providing a unified workflow from R&D investigation through production-line review.

“Glass substrates are emerging as a critical material for next-generation semiconductor packaging, but true competitiveness in mass-production will depend on how quickly manufacturers can understand defects and translate that understanding into process improvements,” said YongKeun Park, Chief Executive Officer of Tomocube. “HT-T1D goes beyond defect detection, helping customers identify root causes and refine process conditions. We believe it will become an essential metrology platform for accelerating yield learning in glass-substrate manufacturing.” He added, “The same platform can also address glass photonic integrated substrates for co-packaged optics (CPO), where the refractive index itself directly affects device performance. This expands its applicability beyond defect analysis to areas that require functional metrology.”

With the launch of HT-T1D, Tomocube will engage glass-substrate manufacturers, advanced-packaging companies, and system integration partners to support 3D defect analysis, process review, and yield-learning workflows for glass-substrate manufacturing. The company will also continue to expand its glass-substrate inspection and metrology portfolio, including future in-line deployment through system integration partners, as it addresses the growing demand for defect-analysis and yield-learning solutions in advanced semiconductor packaging.

About Tomocube

Tomocube (www.tomocube.com) develops non-destructive 3D inspection and metrology solutions based on holotomography. Building on optics and three-dimensional imaging expertise established in bioimaging, the company is expanding into industrial markets including semiconductor packaging, displays, and glass substrates.

Forward-Looking Statements

This press release contains forward-looking statements, including statements regarding expected product capabilities, potential customer applications, future in-line deployment, market opportunities, and Tomocube’s business plans. These statements are based on current assumptions and expectations and are subject to risks and uncertainties that could cause actual results to differ materially. Tomocube undertakes no obligation to update any forward-looking statements, except as required by applicable law.

 

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UGREEN’s Productivity Collection Brings High-Power Charging and Connectivity to the Apple Workflow

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DUBAI, UAE and RIYADH, Saudi Arabia, Nov. 9, 2026 /PRNewswire/ — As MacBook and other Apple devices make it easier to work from anywhere, reliable power and seamless connectivity remain essential to a productive workflow. UGREEN’s new Productivity Collection brings both together, featuring chargers that power several devices at once with automatic balancing, and docks that integrate external displays and accessories into a single desk setup.

The flagship Nexode Pro 160W Charger with Retractable Cable puts out up to 160W of power, enough to charge two laptops at once, or power up to four devices together, including a laptop, tablet, smartphone and camera. The charger automatically adjusts power distribution, while a smart display shows real-time power, voltage and temperature. What sets it apart is the built-in retractable USB-C cable, which pulls out to eight different lengths to reduce cable clutter.

For a professional Apple workstation, the Nexode Pro 300W Desktop Charger consolidates device cables into one 8-port hub, including six USB-C ports, one USB-A and one DC output. It supports up to 300W in total and up to 140W from each of ports C1 to C3, enough for high-performance laptops, while a built-in smart display shows real-time charging and connection status at a glance.

When it comes to travel and outdoor use, the Nexode Pro Power Bank keeps an Apple ecosystem running with a 25,000mAh capacity and up to 200W of total output. Its built-in retractable and fixed USB-C cables deliver up to 100W each. Paired with an additional USB-C and USB-A port, it can charge up to four devices simultaneously.

For MacBook users with demanding workflows, the Revodok Max 11-in-1 Docking Station USB4 supports a single 4K@240Hz display or dual extended 4K@120Hz monitors, plus up to 20Gbps data transfer through a single USB4 port.

Price and Availability:

The Productivity Collection is now available across Amazon KSA, Amazon UAE, noon KSA and noon UAE:

Nexode Pro 160W Charger with Retractable Cable (SAR459; AED459)Nexode Pro 300W Desktop Charger (SAR699; AED699)Nexode Pro Power Bank 25000mAh 200W (SAR399; AED399)Revodok Max 11-in-1 Docking Station USB4 (SAR529; AED529)

About UGREEN:

UGREEN is a leading global consumer technology company. Since its founding in 2012, UGREEN has upheld its core values of being user-centric, sincere, and dedicated. With a global presence under the renowned “UGREEN” brand, its business covers over 180 countries and regions, serving more than 300 million users.

tonya@ugreen.com
pr@ugreen.com 

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Onodrim Industries secures $300 million Series A at $1.3 billion valuation to strengthen Europe’s defence and industrial foundations

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AMSTERDAM, Nov. 9, 2026 /PRNewswire/ — Onodrim Industries (“Onodrim”), the European defence and industrial scale-up platform, today announced a $300 million Series A led by Lux Capital, with participation from new and existing investors including General Catalyst, Lakestar, Altimeter, Strike Capital, 137 Ventures, 8090, Expeditions, and more. The financing values Onodrim at $1.3 billion and follows the $45 million seed round announced earlier this year.

Onodrim will use the capital to acquire established businesses across aerospace and defence, and industrial manufacturing. The company takes controlling stakes with permanent capital and applies cutting-edge technology, operational and business development expertise to accelerate their growth. Onodrim focuses on dual-use businesses in critical industries across supply chains, services, and products that solve major bottlenecks for the European defence industry. Onodrim and its companies are united by a common mission: strengthening Europe’s defence and industrial foundations.

“Europe has no shortage of exceptional companies. The challenge has been access to the resources needed to help them grow at the scale and speed the moment demands,” said Aistis Šimaitis, Co-Founder and CEO of Onodrim. “We are bringing permanent capital, technology and world-class operators to Europe’s best companies, giving them the resources to expand, compete and strengthen the continent’s defence industrial base.”

“Europe needs a stronger industrial foundation to meet the security challenges ahead,” said Brandon Reeves, Partner at Lux Capital. “We see an enormous opportunity to bring a new model of ownership and investment to the continent’s most important businesses. Aistis and Alex have assembled an exceptional team with the technical depth and operational experience to realize that opportunity, combining permanent capital with the ambition to build businesses for the long term.”

Onodrim expects to announce its first acquisitions in the coming months. The company is also expanding its European presence with the office openings of Onodrim Germany in Munich and Onodrim Italy in Turin, joining its existing offices in Amsterdam, London and Vilnius.

“Every country needs to be in control of its own destiny, and that starts with what it can build,” said Jeannette zu Fürstenberg, President and Managing Director at General Catalyst. “Europe’s established manufacturers already have the expertise, customers, and trust. What they need is technology that helps them evolve and take on larger programmes. Aistis and Alex have reimagined what an industrial group can be, matching world-class engineering talent with deep respect for the businesses they join. That is how Europe’s industrial base renews itself from within.”

Onodrim is led by Co-Founder and CEO Aistis Šimaitis, a former advisor to the Lithuanian Government and technology leader at Palantir Technologies, who holds a DPhil from the University of Oxford, and Co-Founder and CTO Alexander Blessing, formerly Forward Deployed Engineer at Palantir Technologies, who holds degrees from Stanford University and the University of Cambridge. Christian Garrett, Partner at 137 Ventures, is also a co-founder.

The company has assembled a global and diverse team spanning private equity, aerospace and defence, technology, and government. Its shared purpose is to rebuild Europe’s industrial capacity and strengthen its security.

Companies backed by Onodrim gain capital, operational, business development, and technology resources to grow faster, take on larger programmes and serve customers across Europe. They also gain access to engineering teams that can develop new products and modernize manufacturing and operations, backed by a platform built to scale alongside them.

“Our approach at Onodrim is rooted in long-term partnership and collaboration. We believe Europe’s industrial champions are built by investing in great businesses, empowering the people behind them and giving them the resources to grow for the long term,” said Alex Blessing. “We welcome approaches from owners of defence, aerospace, manufacturing and industrial businesses who share this ambition, as well as exceptional engineering and operational talent looking to help build Europe’s industrial future.”

About Onodrim Industries

Onodrim Industries is a European, technology-driven scale-up platform that strengthens the continent’s defence and industrial foundations. It brings technology, capital and operational expertise to critical industries, including defence, aerospace, and manufacturing. Its leadership draws on senior experience in private equity, government, advanced engineering and global technology companies.

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NIAGARA NETWORKS INTRODUCES ECH-AWARE TLS 1.3 DECRYPTION WITH POST-QUANTUM CRYPTOGRAPHY & 90+ Gbps PERFORMANCE

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New ePacketron capabilities combine selective encrypted traffic inspection, post-quantum key exchange & million-session scalability, with live demonstrations at Cisco Live Melbourne 2026, Booth B14

FREMONT, Calif., Nov. 9, 2026 /PRNewswire/ — Niagara Networks, a Silicon Valley-based provider of high-performance Network Intelligence and visibility solutions, today announced new TLS 1.3 decryption capabilities for its ePacketron platform, extending encrypted traffic visibility with Encrypted Client Hello (ECH)-aware selective inspection, Post-Quantum Cryptography (PQC) support & high-performance TLS processing.

The enhanced solution delivers over 90 Gbps of TLS decryption throughput, supports up to 110,000 new decrypted TLS sessions per second & scales to 1 million concurrent decrypted sessions, according to Niagara Networks’ performance testing.

Addressing the Next Generation of Encrypted Traffic Visibility
As TLS 1.3 adoption accelerates and encryption standards evolve, traditional network visibility architectures face growing challenges in maintaining access to security-relevant traffic. Encrypted Client Hello (ECH), defined in RFC 9849, protects sensitive TLS handshake information, including the actual destination hostname, reducing the effectiveness of conventional passive monitoring and hostname-based security policies.

At the same time, the transition toward post-quantum cryptography introduces new key-exchange mechanisms that security infrastructure must support to maintain effective inspection. Niagara Networks addresses these challenges by extending its ePacketron Network Intelligence platform with advanced TLS interception, intelligent policy enforcement & quantum-resistant key-exchange support.

Rather than relying on ECH blocking or downgrading connections to non-ECH TLS, ePacketron is designed to maintain ECH-aware negotiation for supported enterprise-managed clients while enabling authorized, policy-driven inspection.

ECH-Aware Decryption Meets Post-Quantum TLS
The enhanced ePacketron TLS decryption engine introduces capabilities designed to preserve security visibility as encrypted communications evolve:

ECH-Aware TLS 1.3 Decryption: Supports selective interception of eligible ECH-protected connections without stripping or downgrading ECH, subject to enterprise certificate trust & client compatibility.Post-Quantum Cryptography by Default: Supports hybrid TLS 1.3 key exchange using X25519MLKEM768 as the preferred configuration, combining classical X25519 with ML-KEM-768.  ML-KEM-1024 is also supported when negotiated with compatible peers.High-Performance TLS Decryption: Delivers over 90 Gbps decrypted throughput, with decrypted traffic mirrored to downstream security tools.  Million-Session Scalability: Supports up to 110,000 new decrypted TLS sessions per second & 1 million concurrent decrypted TLS sessions.Policy-Based Selective Inspection: Enables organizations to apply configurable TLS handling policies, including decryption, logging, blocking or encrypted bypass, based on supported destination intelligence & security requirements.Optimized Security Tool Delivery: Integrates with Niagara Networks’ packet broker architecture to deliver selected decrypted traffic to existing NDR, IDS/IPS, SOC & NOC monitoring platforms.

Extending Network Intelligence Beyond Traditional Packet Brokers

The new capabilities build on Niagara Networks’ ePacketron acceleration architecture, which provides up to 600 Gbps of advanced Layer 4–7 packet processing through a dedicated Network Intelligence layer.

By offloading compute-intensive TLS decryption, traffic filtering, packet transformation & optimization from downstream security tools, ePacketron helps organizations improve inspection efficiency while extending the value of their existing security infrastructure.

The architecture combines encrypted traffic intelligence with high-performance packet processing, allowing security teams to prioritize traffic requiring deeper analysis while preserving encrypted communications that do not require inspection.

Decrypt What Matters. Bypass What Is Private.

This approach enables a more selective model for encrypted traffic visibility, balancing security requirements, privacy considerations & operational performance.

“Encryption is evolving faster than traditional network visibility architectures. With ECH-aware TLS inspection, post-quantum key-exchange support & high-performance decryption, we are extending ePacketron beyond conventional packet brokering into a new generation of Network Intelligence,” said Ben Askarinam, Founder & CEO of Niagara Networks. “Our objective is to give organizations greater control over encrypted traffic visibility while helping their existing security infrastructure operate more efficiently.”

“Supporting modern TLS 1.3 inspection requires more than raw decryption throughput. It requires compatibility with emerging encryption standards, scalable session processing & intelligent traffic handling,” said Vitaliy Ivanov, Vice President of Software Engineering at Niagara Networks. ” We built ePacketron from the ground up to combine ECH-aware interception, post-quantum key exchange and selective policy enforcement, helping security teams maintain actionable visibility as TLS evolves.”

Live Demonstrations at Cisco Live Melbourne 2026

Niagara Networks will showcase its enhanced ePacketron TLS decryption solution at Cisco Live Melbourne, November 9–12, 2026, Booth B14.

Schedule a meeting with Niagara Networks at Cisco Live Melbourne >>

Availability
The enhanced TLS 1.3 decryption capabilities are released for the ePacketron platform with FabricFlow 12.14 ver. Product availability, supported deployment configurations & licensing details will be provided by Niagara Networks.

 
Niagara Networks is a Silicon Valley-based company delivering high-performance, reliable network visibility and traffic delivery solutions for mission-critical environments. Its solutions empower Security and Network Operations Centers (SOC/NOC) with actionable intelligence across physical, virtual & cloud networks. Niagara Networks provides the building blocks for advanced visibility architectures, including network packet brokers, bypass switches, network TAPs, Network Intelligence acceleration & centralized management software. For more information, visit www.niagaranetworks.com.

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SOURCE Niagara Networks Inc

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