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Kulicke & Soffa Receives SEMI Award for North America for Breakthrough Fluxless Thermocompression Bonding Technology

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Recognition Highlights Company’s Leadership in Enabling Advanced Heterogeneous Integration and AI-Driven Semiconductor Innovation

FORT WASHINGTON, Pa., Oct. 13, 2026 /PRNewswire/ — Kulicke & Soffa Industries, Inc. (NASDAQ: KLIC) (“Kulicke & Soffa,” “K&S” or the “Company”) today announced that it has been selected as the recipient of the 2026 SEMI Award for North America, one of the semiconductor industry’s highest honors recognizing exceptional technical and commercial contributions to semiconductor manufacturing.

The award recognizes Kulicke & Soffa’s pioneering formic acid in-situ bonding technology, an innovative Fluxless Thermo Compression bonding (FTC) solution that addresses critical interconnect scaling challenges and is actively enabling the next generation of heterogeneous integration architectures supporting artificial intelligence, high-performance computing, and advanced photonics applications.

Presented during the CEO Summit Keynotes at SEMICON West, the award underscores the growing industry adoption and significance of K&S’s advanced packaging portfolio, including its industry-leading APTURA™ platform.

“As semiconductor performance is now critically dependent on advanced packaging and heterogeneous integration, the industry’s ability to scale interconnect density efficiently and economically becomes more important than ever,” said Raj Talluri, Chief Executive Officer of Kulicke & Soffa. “We are honored to receive this recognition from SEMI. This award reflects the ingenuity, dedication, and relentless execution of our global teams, who continue to develop innovative solutions which enable customers to overcome the industry’s most complex manufacturing challenges.”

Traditional Thermo-Compression bonding often requires a post-bond flux cleaning processes that becomes increasingly difficult at finer interconnect pitches. At the same time, hybrid bonding solutions, while highly capable, can introduce significant manufacturing complexity and cost. Kulicke & Soffa’s proprietary Fluxless Thermo-Compression bonding technology combines advanced plasma pre-cleaning and in-situ formic acid oxide reduction to deliver high-yield, ultra-fine-pitch interconnect capabilities while simplifying the manufacturing processes and reducing production costs.

FTC technology has become a foundational element of the Company’s advanced packaging roadmap and enables customers to pursue interconnect pitches below 10 microns while supporting applications across wafer-level, substrate-level, and panel-level manufacturing environments.

“This recognition validates our innovation-driven strategy of selecting differentiated technologies that solve real customer challenges,” said John Molnar, VP & General Manager, Advanced Solutions. “By enabling hybrid-bonding-class performance with more accessible manufacturing, we are accelerating the adoption of advanced packaging solutions required for next-generation AI, high-performance computing, silicon photonics, and other rapidly growing semiconductor markets.”

The award further reinforces Kulicke & Soffa’s position as a leading provider of semiconductor interconnect solutions. The company’s advanced packaging portfolio spans thermocompression bonding, hybrid bonding enablement technologies, wedge bonding, and vertical interconnect solutions that support some of the industry’s most complex heterogeneous applications.

As semiconductor complexity continues to increase, interconnect and packaging innovations are now a requirement in delivering system-level performance across the semiconductor space. This award highlights the critical role Kulicke & Soffa is playing to shape the industry’s future.

About Kulicke & Soffa

Kulicke & Soffa is a global leader in semiconductor assembly technology, advancing device performance across automotive, compute, industrial, memory and communications markets. Founded on innovation in 1951, K&S is uniquely positioned to overcome increasingly dynamic process challenges – creating and delivering long-term value by aligning technology with opportunity.

About SEMI

SEMI® is the global industry association connecting over 4,000 companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON® expositions and events, technology communities, standards and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more. 

Contacts

Kulicke & Soffa
Marilyn Sim
Public Relations
P: +65-6880-9309
msim@kns.com

Kulicke & Soffa  
Joseph Elgindy
Investor Relations
P: +1-215-784-7500
investor@kns.com

 

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SOURCE Kulicke & Soffa Industries, Inc.

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X1 Health Unveils Three-Supplement Daily Stack to Take the Guesswork Out of Wellness Shopping

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72% of U.S. adults reported seeing diet, nutrition or weight-loss content on social media in the previous month. X1 Health aims to cut through the noise with a science-informed approach: three proprietary formulas, one daily wellness stack. Free early-access signups are open at X1Health.com.

LAS VEGAS, Oct. 15, 2026 /PRNewswire-PRWeb/ — Another diet trend. Another supplement. Another influencer telling you what to buy.

The challenge is not a lack of information. It is knowing which information is grounded in credible research.

For consumers, the difficult part is deciding what makes sense for their daily routine.

X1 Health Inc is opening free early-access signups at X1Health.com for a three-part daily wellness stack: Morning Fast, First Meal and Deeper Sleep. The idea is straightforward—bring three supplements together in one routine, with a clear place for each.

A July 2025 KFF poll found that 72% of U.S. adults had seen weight-loss, diet or nutrition information on social media in the previous month. Seeing advice, however, is different from knowing whether it is reliable or right for you.

A short video may introduce a product without explaining its ingredients, the research behind it or how it fits with other supplements. Recommendations can also conflict, leaving consumers to build their own routine from separate pieces of advice.

X1 Health’s approach starts with looking at the whole day.

Food and exercise matter. So do sleep and stress. Poor sleep can affect hunger and how the body handles blood sugar. Stress can influence eating habits. These connections are reasons to consider daily habits together instead of chasing one ingredient or the next diet trend.

The X1 Daily Wellness Pack organizes its three powdered supplements around familiar moments:

Morning Fast: the morning formula, designed around a fasting-focused routine.First Meal: the mealtime formula, intended for use around the day’s first meal.Deeper Sleep: the evening formula, developed with a focus on relaxation and made without melatonin.

Three formulas. Three moments. One daily routine.

The company’s goal is to make supplement shopping easier to understand. Visitors can explore each product and its ingredients at X1Health.com before deciding whether the system fits their needs.

Early-access registration is free and requires no purchase. Subscribers will receive launch and availability updates. Products are not yet available for immediate shipment.

About X1 Health Inc

X1 Health Inc is a wellness company developing powdered dietary supplements for morning, mealtime and bedtime routines. Its upcoming collection includes Morning Fast, First Meal and Deeper Sleep.

Learn more and join the early-access list at https://x1health.com.

Media Contact

Alex, Campbell, 1 2068195251, info@x1health.com, https://x1health.com/

View original content:https://www.prweb.com/releases/x1-health-unveils-three-supplement-daily-stack-to-take-the-guesswork-out-of-wellness-shopping-302909813.html

SOURCE X1 Health Inc

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RoboParty Launches RP1 in Southeast Asia, Bringing Full-Stack Open Robotics to Education and Research

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With RP1 and RPO, RoboParty offers open humanoid platforms spanning hands-on education, foundational robotics development, and advanced embodied AI research.

SHANGHAI, Oct. 16, 2026 /PRNewswire/ — On October 15, 2026, RoboParty launches RP1 (ROBOTO 01), a high-performance, full-stack open-source humanoid platform, to Southeast Asian markets. Together with RPO, its fully open-source humanoid robotics kit, RoboParty offers universities, researchers, and developers a path from hands-on learning to advanced robotics research.

Different research goals demand different platforms. Openness gives developers the freedom to adapt the robot to their work, rather than the other way around.

RP1 is designed for advanced robotics and embodied AI research. Its full-stack open architecture spans mechanical design, in-house-developed ROMOMO actuator modules, low-level control, simulation, SDKs, and training tools. Researchers can understand, modify, and validate the robot itself, tracing problems across model policies, control systems, and physical execution to optimize the complete system.

True openness puts full control of the robot back into developers’ hands.

RP1 also provides established motion capabilities, including continuous walking, disturbance recovery, and getting up after a fall. These capabilities help teams reduce repetitive development of basic motion skills and focus on model training, locomotion research, and complex task validation.

PartyOS is RoboParty’s open development foundation for humanoid robotics, connecting motion retargeting, policy training, simulation validation, and deployment on real robots.

From Robotics Education to Advanced Research: RPO and RP1 Expand Open Platform Choices

RP1 carries forward an open-source journey that began with RPO, RoboParty’s first fully open-source humanoid robot.

RPO is a cost-effective humanoid robot sold as a DIY kit, designed for hands-on embodied AI learning and customization. Its publicly available mechanical, electrical, training, and deployment resources enable developers to assemble their own robot, understand the complete system, and extend its capabilities. The project has earned more than 2,600 GitHub stars and has been replicated by over 100 users.

Together, RPO and RP1 address complementary needs: RPO provides a practical foundation for robotics education and early-stage development, while RP1 supports more demanding research in humanoid locomotion, control, and embodied AI.

For universities and research institutions across Southeast Asia, this means greater flexibility to choose, adapt, and build upon an open platform that matches their research objectives.

From the classroom to the research frontier, RoboParty is working to make humanoid robotics more open, accessible, and adaptable to the people building its future.

GitHub: https://github.com/Roboparty/RP1
Website: https://roboparty.com
Media Contact: marketing@roboparty.com

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SOURCE RoboParty

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LITEON Showcases at NVIDIA MGX Ecosystem at OCP, Highlighting 800 VDC Power Technologies to Advance Next-Generation AI Infrastructure

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SAN JOSE, Calif., Oct. 15, 2026 /PRNewswire/ — LITEON Technology (2301.tw) is invited to participate in the NVIDIA MGX Ecosystem Ceremony held during the 2026 OCP Global Summit. Representing LITEON were John Chang, General Manager of LITEON Cloud Infrastructure Platform and Solution SBG, Bob Weng, General Manager of the AIDC Platform SBU, and Simon Ong, President of LITEON USA. The ceremony brought together NVIDIA and global ecosystem partners to celebrate the continued growth of the AI infrastructure ecosystem.

During OCP Global Summit 2026, LITEON also showcased its NVIDIA 800 VDC Power Rack and 800V-to-50V Power Brick in the NVIDIA MGX ecosystem exhibit area, highlighting its key technological capabilities in next-generation AI power infrastructure. Covering solutions from rack-level power architectures to high-efficiency power conversion technologies, these offerings are designed with high efficiency and power density to meet the energy efficiency and scalability requirements of AI data centers. The solutions help establish a robust and scalable power foundation for the development of AI Factories.

LITEON has been a NVIDIA MGX ecosystem partner, continuously investing in power and thermal management innovation. Through the modular NVIDIA MGX architecture, LITEON helps customers accelerate the deployment of solutions ranging from single-node servers to rack-scale systems. In recent years, LITEON has been regularly invited to participate in the NVIDIA MGX Ecosystem Ceremony, underscoring the long-standing collaboration between the two companies and LITEON’s strategic role within the AI infrastructure ecosystem.

“AI workloads continue to grow in scale and power density, accelerating the transformation of data center power architectures,” said John Chang, General Manager of LITEON Cloud Infrastructure Systems & Platforms SBG. “Leveraging our expertise in power management and system integration, LITEON continues to deepen collaboration with NVIDIA and ecosystem partners. From rack-level power architectures to server-level power conversion technologies, we are working together to build highly efficient and scalable AI infrastructure that supports the next generation of AI Factories.”

As AI computing demand continues to grow rapidly, data centers are evolving toward higher power densities and megawatt-scale deployments. In addition to showcasing its comprehensive 800 VDC power architecture and thermal management solutions, LITEON also featured an interactive virtual rack experience at its booth, illustrating deployment scenarios at 330kW, 880kW, and 1.2MW power levels. The demonstration visualized the evolution of data center energy architectures, from single-rack deployments to megawatt-scale AI computing environments, highlighting LITEON’s end-to-end capabilities spanning rack-level power and thermal management to data center-scale energy infrastructure. Looking ahead, LITEON will continue working closely with NVIDIA and ecosystem partners to accelerate the adoption of 800 VDC architectures and next-generation energy infrastructure, enabling more efficient and resilient power architectures for megawatt-scale AI data centers.

 

View original content to download multimedia:https://www.prnewswire.com/news-releases/liteon-showcases-at-nvidia-mgx-ecosystem-at-ocp-highlighting-800-vdc-power-technologies-to-advance-next-generation-ai-infrastructure-302910804.html

SOURCE LITEON Technology

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