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IDTechEx Discusses Ag Sintering and Cu Sintering

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2 years ago

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BOSTON, June 5, 2024 /PRNewswire/ — Thermal management for EV power electronics has long posed significant challenges. The ongoing shift from Si IGBT and SiC MOSFET to potentially GaN HEMT in the future results in higher junction temperatures and increased demand for die-attach materials in EV power modules. In traditional Si IGBT power modules, die-attach materials like Pb95Sn5 and Pb92.5Sn5Ag2.5 struggle to meet reliability requirements for packaging power devices in high-temperature applications due to creep-fatigue concerns. Additionally, substrate-attach materials such as Sn96.5Ag3Cu0.5, with lower melting temperatures than solder used for die attachment, further constrain the reliability of SiC power modules for high-temperature applications. These challenges drive the market toward silver sinter materials, with the potential to extend to copper sinter materials, offering cost reductions.

Despite cost advantages, the IDTechEx report “Thermal Management for EV Power Electronics 2024-2034: Forecasts, Technologies, Markets, and Trends” identifies barriers hindering the widespread commercialization of copper sintering, such as challenging manufacturing environments due to copper oxidation and comparable or even higher costs than silver sintering as of early 2024 due to smaller commercialization scales.

Conventional die-attach and substrate-attach materials typically consist of solder alloys, featuring bondline thicknesses ranging from 50 to 100µm for die attachment and 100 to 150µm for substrate attachment. Despite their satisfactory performance, IDTechEx observes a growing preference for Ag sintering, driven by major automotive OEMs like Tesla, BYD, and Hyundai. Compared to traditional solder alloys, Ag sintering offers higher thermal conductivity (between 200 and 300W/mK), potentially reducing thermal resistance from junction to case by over 40%, along with significantly higher melting points and decreased electrical resistivity.

With the adoption of SiC MOSFETs, IDTechEx forecasts that Ag sintering will capture nearly or over 50% market share in regions like China in the near future, presenting significant market opportunities for thermal material suppliers.

Much of the available sintered Ag on the market requires pressure during sintering to enhance bond characteristics and reduce porosity, significantly reducing sintering time. However, this approach has drawbacks, including decreased yield and efficiency for bonding multiple chips, especially with complex architecture. Further, it also requires additional steps and machines, leading to higher costs. Therefore, manufacturers tend to avoid this and wait for solutions that are easy to implement in their already existing infrastructure: pressure-less sintering. Pressure-less sintering offers lower cost barriers and benefits in sinter-bonding multiple chips but is reliable only for surfaces with areas between 4 and 25mm2. More details about the pressure-less sintering process are included in IDTechEx’s report, ‘Thermal Management for EV Power Electronics 2024-2034: Forecasts, Technologies, Markets, and Trends’.

The cost of Ag sintering can vary significantly based on factors like customer relationships, order volumes, and suppliers. Ag sintered paste costs can easily be five to ten times higher than solder alloys. For instance, IDTechEx learned of an Ag sintered paste developed by a Japanese company costing around US$2-3/g, though this price has the potential to decrease significantly with increased volume and other material properties. Another supplier suggests that its sintered silver paste costs around US$1,400/kg. Overall, driven by leading automotive players, there is a discernible trend toward replacing solder alloys with Ag sintering pastes, creating market opportunities for material suppliers.

Cu sintering is proposed as an alternative approach to address the cost factor. Compared to Ag sintering, Cu sintering aims to offer similar performance at a lower cost. A supplier informed IDTechEx that Cu sintering technology can cost as little as half as much as Ag sintering technology. However, oxidation remains a significant challenge for Cu sintering. Therefore, a combination of a controlled atmosphere and reducing solvent/binders is the focus on the production of reliable materials. Cu sintering pastes have pressure and pessure-less variants under N2 or H2. However, this presents challenges during processing, leading to concerns around reliability.

IDTechEx is not aware of any automaker using Cu sintered materials as of early 2024, but given the historic timeline for Ag sintering adoption, IDTechEx forecasts that the large-scale commercialization will happen within five years and potentially as soon as late 2024 or early 2025.

IDTechEx’s ‘Thermal Management for EV Power Electronics 2024-2034’ provides a comprehensive overview of Ag and Cu sintering technologies market opportunities, competitive landscapes, supply chains, and key players in the substrate-attach and die-attach sectors. To find out more about this report, including downloadable sample pages, please see www.IDTechEx.com/TMPE.

IDTechEx has also published a report on thermal interface materials, which includes details on die-attach and TIM2s for other emerging applications, including advanced driver-assisted systems (ADAS), 5G, data center semiconductors, EV batteries, and consumer electronics. To find out more about this report, including downloadable sample pages, please see www.IDTechEx.com/TIM.

For the full portfolio of thermal management market research from IDTechEx, please visit www.IDTechEx.com/Research/Thermal.

About IDTechEx:

IDTechEx provides trusted independent research on emerging technologies and their markets. Since 1999, we have been helping our clients to understand new technologies, their supply chains, market requirements, opportunities and forecasts. For more information, contact research@IDTechEx.com or visit www.IDTechEx.com.

Media Contact:
Lucy Rogers
Sales and Marketing Administrator
press@IDTechEx.com
+44(0)1223 812300

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LinkedIn: www.linkedin.com/company/IDTechEx

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LEAP Group Relaunches HumanView, a Growth Intelligence System Built to Explain Why Customers Behave the Way They Do

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5 hours ago

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October 24, 2026

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Reimagined from the ground up, HumanView pairs statistical modeling with expert analysts to turn millions of real-world customer signals into business decisions

LOUISVILLE, Ky., Oct. 23, 2026 /PRNewswire/ — LEAP Group today announced the relaunch of HumanView, its growth intelligence service. The new version has been rebuilt from the ground up and now has a dedicated home at leapgroupnetwork.com/humanview.

HumanView analyzes what customers say and do across social platforms, e-commerce sites, review platforms, search behavior and user-generated content, including signals from Reddit, TikTok, YouTube, Meta, Amazon and Walmart+ that general AI tools cannot always access. Because the data reflects unprompted, real-world behavior, it avoids the response bias built into surveys and focus groups.

The service works in three layers. HumanView captures signals at scale, decodes millions of records through validated statistical models such as regression, correlation and clustering, and then relies on experienced analysts to interpret the patterns. Clients receive clear, human-validated insights instead of another dashboard.

“Machines find the patterns. Humans find the point,” said Alan Gilleo, CEO at LEAP Group. “The first version of HumanView showed us how much customers reveal when nobody is asking them questions. This version is built to explain why they act the way they do, and to put those answers in front of everyone making decisions, from product to service to marketing.”

HumanView focuses on three areas:

Growth Intelligence: customer motivations and how people perceive a brand and its competitors

Market and Category Intelligence: product pain points, service friction, unmet needs and competitive gaps

Audience Intelligence: new segments, positioning opportunities and gaps in the market

Every model is designed and validated by data scientists and benchmarked before it informs a recommendation.

To learn more about HumanView, visit leapgroupnetwork.com/humanview.

About LEAP Group
LEAP Group is a boutique marketing agency holding company with offices in Louisville, Indianapolis, Cincinnati and Chicago. Guided by the belief that brands should “Market Less. Matter More.,” LEAP gives clients access to specialized experts across its entire network. Learn more at leapgroupnetwork.com.

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SOURCE LEAP Group

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STEPHEN A. SMITH ADDRESSES WHITE HOUSE DINNER ATTENDANCE, REAFFIRMS COMMITMENT TO HBCUs AND PROTECTING CORPORATE INVESTMENT IN BLACK EDUCATION

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6 hours ago

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October 24, 2026

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NEW YORK, Oct. 23, 2026 /PRNewswire/ — Stephen A. Smith, media mogul, New York Times bestselling author, and proud 1991 graduate of Winston-Salem State University, is addressing the public discussion surrounding his decision to attend a White House dinner with President Donald Trump, emphasizing his commitment to the long-term financial stability of Historically Black Colleges and Universities (HBCUs).

For Smith, the decision was rooted in a commitment to institutions that have educated generations of Black leaders, professionals, entrepreneurs, and public servants.

“I will always advocate for HBCUs and the students whose futures depend on them,” Smith said. “My reason for attending the White House dinner was to discuss the challenges these institutions face in securing long-term funding and to make the case that corporate America must continue to invest in them.”

Smith acknowledged federal support through the FUTURE Act while expressing concern that political tensions surrounding diversity, equity, and inclusion (DEI) could discourage private companies from supporting HBCUs. He maintains that these institutions deserve sustained corporate partnerships, philanthropic contributions, and public investment.

“If we truly believe in free-market capitalism, businesses should be able to support educational institutions and charitable causes without fear of criticism or repercussions,” Smith said. “HBCUs have made extraordinary contributions to this country. They deserve sustained public and private investment.”

Ashley Christopher, Esq., Founder and CEO of the HBCU Week Foundation, recognized Smith’s advocacy and decision to engage with the administration.

“Stephen A. Smith has been a powerful advocate for HBCUs, using his platform and influence to shine a national spotlight on our institutions,” expressed Christopher, “His continued support of HBCU Week helps advance our mission of connecting students with life-changing educational opportunities, and we are proud to have him as our ambassador.”

Since Smith became an HBCU Week Ambassador in 2019, the initiative has facilitated more than 15,000 on-the-spot college acceptances and raised and awarded more than $150 million in scholarships, according to the HBCU Week Foundation.

As public discussion continues, Smith is emphasizing the importance of ensuring HBCUs have the resources and partnerships needed to educate future generations and expand opportunities for students.

CLICK HERE to watch Smith’s full response to his White House visit.

MEDIA CONTACT:

media@mrsasinc.com

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SOURCE Straight Shooter Media

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Advantex Announces Completion of Financing and Extension of Maturity Date of Previously Issued Debentures

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6 hours ago

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October 24, 2026

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TORONTO, Oct. 23, 2026 /CNW/ — Advantex Marketing International Inc. (CSE: ADX) (“Advantex”), a leader in the merchant cash advance and loyalty marketing products for merchants, today announced the completion of a $250,000 secured debt financing. Advantex issued a $250,000 non-convertible debenture which bears an interest rate at 12% per annum and matures December 15, 2027. The proceeds raised from this issuance of the Debenture will be used for working capital purposes.

Advantex has also extended the maturity of its existing $700,000 in 12% secured debentures from October 10, 2026 to December 15, 2027.

About Advantex Marketing International Inc.

Advantex provides working capital to merchants. Advantex also provides specialized marketing programs that enable members of Aeroplan to earn Aeroplan points at participating merchants.

Advantex shares trade on the Canadian Securities Exchange under the symbol ADX. For more information go to Advantex’s profile on www.sedar.com

Forward-Looking Information

This news release contains “forward-looking statements” within the meaning of applicable securities laws relating to the future business and operations of Advantex. Actual results and developments may differ materially from those contemplated by these statements. The business and operations of Advantex described herein is dependent on a number of factors and is subject to a number of risks and uncertainties. Factors that could cause actual results to differ material include, but are not limited to, changes in Advantex’s economic and competitive conditions including but not limited to the industry sectors in which Advantex operates.

The statements in this news release are made of the date of this release. Forward-looking statements are made based on management’s beliefs, estimates and opinions on the date the statements are made and Advantex undertakes no obligation to update forward-looking statements if these beliefs, estimates and opinions or other circumstances should change, except as required by applicable law.

SOURCE Advantex Marketing International Inc.

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