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The Third Hong Kong Science Fair Gathers Creative Technologies of the Next Generation

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Over 30,000 Participants Attended the Annual I&T Mega Event

Gold Award-Winning Teams will Embark on a Journey to the International Exhibition of Inventions Geneva to Broaden Their Horizons

HONG KONG, June 10, 2024 /PRNewswire/ — The third Hong Kong Science Fair (‘Science Fair’), organised by the Hong Kong Innovation Foundation (‘HKIF’), was held on June 8 and 9 at the Hong Kong Convention and Exhibition Centre. The event showcased smart solutions and creative technology projects from 120 teams of local and international primary and secondary school students. Local young talent and experts were also invited to share their accomplishments, demonstrating the prowess of Hong Kong’s new generation of creative technology talent. The two-day signature event attracted more than 30,000 visitors, including parents who brought their children to explore the joy of technology, with games and workshops in interactive zones inspiring an innovative spirit from an early age and promoting the culture of innovation and technology (I&T).

Today’s award presentation ceremony was graced by distinguished guests including Professor Sun Dong, JP, Secretary for Innovation, Technology and Industry of the HKSAR Government; Mr Zhang Zhihua, Director General of the Youth Department of the Liaison Office of the Central People’s Government in the HKSAR; Dr Daryl Ng, SBS, JP, Chairman of the HKIF; Mr David Taji-Farouki, President of the Jury, International Exhibition of Inventions Geneva; and members of the Hong Kong Science Fair judging panel including Mrs Ruth Lau, Supervisor, Li Po Chun United World College of Hong Kong; Professor Anderson Shum, Associate Vice-President (Research and Innovation), The University of Hong Kong; Ir Andrew Young, Associate Director (Innovation) of Sino Group. They have shown their support to the young inventors participating in the event, encouraged them to continue shining in the I&T sectors in Hong Kong and globally, and witnessed the naming of the Gold, Silver, and Bronze award-winning teams across the Primary, Junior Secondary, and Senior Secondary divisions, as well as the ‘Most Popular Award’ voted by the public attendees.

Professor Sun Dong, JP, Secretary for Innovation, Technology and Industry of the HKSAR Government, said, ‘The country has recently been advocating the development of “new quality productive forces”, while Hong Kong is moving at full steam to develop into an international innovation and technology (I&T) centre to foster high-quality economic development, and that these are centered on the I&T development. One of the eight major strategies set out by the Government in the “Hong Kong Innovation and Technology Development Blueprint” is to promote an I&T culture for all. The popularisation of science helps enhance the overall I&T atmosphere in the community and facilitate the I&T development in the long run. The Hong Kong Science Fair, through the competition format, encourages students to apply science to address real-life challenges with the “innovative” and “people-oriented” approach. The Government has been making substantial effort to promote STEM education, and the promotion by the community is also crucial. Today’s Science Fair serves as a commendable demonstration of how community-driven initiatives can promote the popularisation of science and technology. The enthusiastic participation and vibrant atmosphere onsite indicate the success of this well-received science event.’

To equip the young inventors with global perspectives, HKIF will support the primary and secondary school teams that won Gold Awards at this year’s Science Fair to participate in the global invention event, the ‘International Exhibition of Inventions Geneva’ in Switzerland, where they will have an opportunity to exchange ideas and share their creative concepts with inventors. ‘The International Exhibition of Inventions Geneva is the largest international invention exhibition in the world,’ said Mr David Taji-Farouki, President of the Jury, the International Exhibition of Inventions Geneva, who came to Hong Kong to participate in the Science Fair for the second time. ‘The recently concluded 49th exhibition featured over 1,000 inventions from around 40 countries and regions. I was delighted to see that the gold award-winning primary and secondary school students from last year’s Hong Kong Science Fair brought their exhibits and showcased their confidence and outstanding communication skills when interacting with people from all over the world during the exhibition. Some of their works were also recognised with awards, demonstrating the creativity of the younger generation in Hong Kong and their global perspective on the application of innovative technologies for tomorrow’s world.’

Dr Daryl Ng, SBS, JP, Chairman of the Hong Kong Innovation Foundation, said during his speech, ‘Innovation and technology are key drivers of nation’s prosperity and sustainable development. The Hong Kong Government is committed to working towards establishing Hong Kong as an international hub for innovation and technology. We are delighted that the Science Fair has received widespread support and participation and is able to play a role in inspiring the I&T journey of young innovators. I notice that many parents participated in the event with their children today, aiming to nurture their interest and capability in I&T. I look forward to seeing these young people utilise technology and an innovative mindset to contribute to society in the future, injecting fresh vitality into Hong Kong’s I&T ecosystem.’

The third Hong Kong Science Fair was successfully concluded with the support of Cyberport, Hong Kong Science and Technology Parks Corporation, The University of Hong Kong, The Hong Kong University of Science and Technology, MIT Hong Kong Innovation Node, and over 40 partners from different sectors in society. The Science Fair received around 330 entries from around 1,400 Primary 4 to Secondary 6 students and teachers representing 130 local and international schools, including about 50 schools participating for the first time. The projects covered categories including ‘Smart City & Smart Home’, ‘Medical & Healthcare’, ‘Sustainability’, and ‘Education’. 120 shortlisted teams presented their innovative concepts and development processes at the Science Fair, and the Gold Awards winners are Ng Clan’s Association Tai Pak Memorial School (Project: 「掃」書郎), Pui Shing Catholic Secondary School (Project: 除除善友) and TWGHs Li Ka Shing College (Project: 盲人回憶攝錄機) from the Primary, Junior Secondary and Senior Secondary divisions respectively. Singapore International School (Hong Kong) (Project: Smart Anti-Flooding Environment (SAFE)), St. Stephen’s Girls’ College (Project: 智惜冷藏) and St. Paul’s Convent School (Project: Tide) were voted by the on-site public as the winners of the ‘Most Popular Award’.

The Science Fair featured innovative technological advancements from local universities and institutions, allowing young talent to share their passion and experiences. The showcases included the Surface Sampling and Packing System developed by the research team of the Hong Kong Polytechnic University in collaboration with the China Academy of Space Technology for the country’s first lunar sample return mission, ‘Chang’e 5’, and the first sample return mission to the far side of the moon in human history, ‘Chang’e 6’. The latest generation solar electric vehicle models,  SOPHIE 8 and MOBO-II, developed by the Solar Car Team of the Vocational Training Council, and the Marine-cleaning Robot from a local startup, Clearbot, were also exhibited. The event also invited guest speakers from different institutions to share insights on real-world applications of innovative technologies and their development, fostering collaboration between industry, academia, and the public.

The Science Fair also featured six interactive zones to engage families in the exploration of innovative technologies through games and activities, including the most popular ‘Laboratory Series’ workshops. In the ‘Magic Vit-C’ workshop, participants were able to explore the chemical interactions between vitamin C and fresh cut fruits and deepen their understanding of food science; the ‘Sand-sitivity’ workshop offered a creative learning experience by manipulating the texture and colour of sand to stimulate the senses; while in ‘Draw Me to the Stars’, technology was used to transform physical drawings into a virtual imaginary world, bringing a fantastic immersive experience to the Science Fair.

The above press release is published by Ogilvy Public Relations on behalf of Hong Kong Innovation Foundation.

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SOURCE Hong Kong Innovation Foundation

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CM Global Services Announces Project Santos, a Planned 50-Megawatt AI Data Center Campus in ERCOT South

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CM Global Services targets a site and engages with strategic partners to become operational in the AI data center space.

DENVER, July 23, 2026 /PRNewswire/ — CM Global Services, LLC (CMGS) today announced Project Santos, its plan to develop a 50-megawatt AI data center campus for a site in the ERCOT South grid zone. CMGS is a long-standing strategic partner of Compass Mining, Inc. and is a global provider of logistics, hardware sales, and infrastructure services, with a growing focus on AI infrastructure and building site development. The announcement was made by Shanon Squires, Chief Mining Officer of Compass Mining, during a panel on bitcoin mining companies diversifying into AI infrastructure at the Energy Investors Forum.

CMGS intends to deliver Project Santos in two phases. The first phase, a 7-megawatt, 5 MW of IT Load Tier III facility purpose-built for AI inference workloads, is targeted for completion by the end of the first quarter of 2027. A subsequent 43-megawatt expansion, bringing the site to its fully planned 50-megawatt capacity

“This is a disciplined next step for CM Global Services, drawing upon its expertise in standing up infrastructure, while Compass Mining simultaneously continues to be the gold standard in Bitcoin mining-related services,” said Shanon Squires. “Bitcoin mining remains the core of Compass Mining. CMGS’ Project Santos reflects the power infrastructure and site development discipline CMGS built over years, and we’re pursuing this initiative on our own terms.”

“This is a new step forward for CMGS, as we continue building for the future,” said Vishnu Mackenchery, Managing Director at CMGS. “Project Santos marks our entry into AI infrastructure and inference, and we’re charting our own path, moving fast to get there.”

GPU-as-a-Service for Enterprise and Neocloud Customers

Project Santos is being developed as a GPU-as-a-Service (GPUaaS) platform. Rather than requiring customers to bring their own hardware, CMGS is securing NVIDIA GB300 Blackwell GPU capacity to offer directly to off-takers as dedicated, single-tenant or multi-tenant compute. The company’s ideal customer profile is AI enterprise organizations seeking dedicated capacity, and CMGS is also in active discussions with neocloud providers.

Project Status

Site: located in the ERCOT South grid zoneCompute: CMGS is securing NVIDIA GB300 Blackwell GPU capacity to offer as GPU-as-a-Service to off-takersTotal planned capacity: 50 megawatts, 35 MW of IT to be delivered in two phasesPhase 1: 7 megawatts, 5 MW of IT load Tier III, targeted for completion by end of Q1Phase 2: adding a 43-megawatt expansion, 30 MW of IT load with utility-supported expansionCustomer profile: AI enterprise companies are the ideal customer; CMGS is also in active discussions with neocloud providers

About CMGS

CM Global Services (CMGS) is a global provider of logistics, hardware sales, and infrastructure services, with a growing focus on AI infrastructure and building site development. CMGS supports clients with end-to-end logistics solutions, hardware procurement, and site-level execution for next-generation compute infrastructure.

About CMGS and Compass Mining Partnership

Compass Mining serves as a strategic partner and advisor to CM Global Services (CMGS), supporting its growth across global logistics, hardware sales, and infrastructure services. As CMGS expands its focus into AI infrastructure and site development, Compass Mining’s guidance helps shape its strategic direction and execution. Together, the two organizations continue to collaborate on delivering end-to-end solutions for clients building next-generation compute infrastructure.

Disclaimer

This communication contains forward-looking statements relating to a potential closing of a transaction. There can be no assurance that the proposed transaction will be completed on the terms described, or at all. Forward-looking statements are subject to significant business, economic, and competitive uncertainties, many of which are beyond our control. This communication is for informational purposes only and does not constitute an offer to sell, or a solicitation of an offer to buy, any securities of the company. Furthermore, investing in or engaging with our company involves substantial risk, and past performance or previous communications are not indicative of future results. There is no guarantee, assurance, or warranty that any specific financial outcome, return on investment, or overall results will be achieved. Actual results may differ materially and adversely from those expressed, projected, or implied in any forward-looking statements. Investors and stakeholders should not rely solely on preliminary press releases regarding potential transactions or projected financial metrics when making investment decisions. We undertake no obligation to publicly update or revise any forward-looking statements, whether as a result of new information, future events, or otherwise, except as required by applicable securities laws. Prospective investors are strongly encouraged to conduct their own independent due diligence and consult with a qualified, independent financial or legal advisor prior to making any investment.

Contact
All inquiries can be made to: Santos@CMGlobalServices.io 

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SOURCE CM Global Services

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Advantech Unveils Next-Gen AI Infrastructure Solutions Powered by AMD EPYC™ 9006 Series Processors

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TAIPEI, July 23, 2026 /PRNewswire/ — Advantech, a global leader in industrial edge computing and edge AI solutions, today announced its next-generation server and network platforms powered by the latest AMD EPYC™ 9006 Series processors. Designed to accelerate AI infrastructure from the data center to the intelligent edge, Advantech’s 6th Gen AMD EPYC-powered servers deliver the performance, scalability, and reliability organizations need for AI, HPC, storage, networking, and mission-critical industrial workloads.

At AMD Advancing AI 2026, Advantech will showcase its latest 2U 4-node edge server and EATX server board, demonstrating how its workload-ready server solutions enable customers to build scalable, high-performance AI and edge computing infrastructure with greater deployment confidence.

Continuing Performance Leadership with AMD EPYC 9006 Series Processors

6th Gen AMD EPYC server CPUs bring continued leadership in performance, efficiency, memory bandwidth, and next-generation I/O. Featuring up to 128 cores and 256 threads, advanced 2nm process technology, “Zen 6” and “Zen 6c” architecture, up to 20% average generational performance uplift, and up to 20% performance-per-watt improvement, AMD EPYC 9006 Series processors are designed to support more virtual machines, higher throughput, and better system efficiency. With up to 128 PCIe Gen6 lanes per CPU, CXL™ 3.1 memory expansion, and support for DDR5 8000NHz and MRDIMM 12800MHz for high memory bandwidth, Advantech edge server solutions deliver balanced compute, memory, and I/O performance for next-generation AI, telco, edge, and storage infrastructure.

Key Features Include:

Up to 128 cores / 256 threads with “Zen 6” and “Zen 6c” architectureAdvanced 2nm process technology for improved performance and efficiencyUp to 20% average generational performance uplift and 20% performance-per-watt improvementDDR5-8000 and MRDIMM 12.8G support for higher memory bandwidth and capacityPCIe® Gen6 scalability: up to 128 lanes for 1 CPU and up to 196 lanes for 2 CPUsCXL™ 3.1 support for optimized memory expansion

Comprehensive Edge Server Solutions from Edge to Cloud

Advantech’s edge server portfolio powered by AMD EPYC™ 9006 Series processors delivers a complete board-to-system lineup for AI infrastructure, data centers, cloud, HCI, HPC, edge computing, industrial applications, and high-performance networking. The first-wave portfolio includes:
(1) The SKY-642E5, 4U MGX GPU server, for large-scale AI acceleration
(2) The SKY-722E5, 2U DC-MHS server with DC-SCM support, for modular data center and edge AI deployments
(3) The SKY-712E5, 1U DC-MHS server, supporting HHHL and FH-3/4L expansion cards for high-density enterprise edge and cloud workloads
(4) The SKY-822E5, 2U short-depth DC-SCM modular server, supporting 2–3 dual-slot GPU cards for space-constrained edge data centers
(5) The SKY-924E5F, 2U 4-node front-access server, for distributed edge computing,
(6) The ASMB-982 & ASMB-832 server boards for flexible, high-expandability system designs.

These new platforms also support PCIe Gen6 scalability, GPU-optimized architecture, advanced DDR5/MRDIMM memory, and AFA-ready high-density E1.S/E3.S NVMe SSD storage to meet low-latency data access, high-throughput storage performance, and scalable infrastructure for data-intensive AI and edge-cloud workloads.

Expanding the portfolio further, Advantech also introduces the FWA-6084, the 2U network appliance and is designed for demanding network security and edge AI workloads. It features DDR5/MRDIMM memory capability, eight Gen6 network module cards, and one PCIe Gen5 x16 slot for GPU or add-on card expansion. It is well positioned to support line-speed multiple 200G network workloads without compromise.

Together with Advantech’s unique service advantages—including 3-5-10 service guarantee, strict revision control, stable component supply, worldwide local support, and custom-ready integration—the new portfolio supports customers reduce deployment risk, secure long-term product roadmaps, and accelerate workload-ready AI and edge-cloud infrastructure from concept to deployment.

Explore more product information, please contact us or visit the Advantech x AMD website.

About Advantech

Advantech is a global leader in IoT intelligent systems and embedded platforms, driven by its vision of “Enabling an Intelligent Planet.” To address the growth of edge computing and AI, Advantech focuses on five key markets: Edge Intelligence Systems, Manufacturing, Energy and Utilities, iHealthcare, and iCity Services & iRetail. By integrating edge computing hardware, WISE-IoT software, sector-specific AI solutions, and domain expertise, Advantech creates an orchestration model that connects industrial ecosystems and accelerates industrial intelligence with partners and customers.(www.advantech.com

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SOURCE Advantech Co., Ltd.

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MulticoreWare and AMD Collaborate to Advance Physical AI and Autonomous Robotics on AMD Platforms

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Companies Demonstrated Real-Time Multimodal AI and Vision-Language-Action Workflows on AMD Ryzen™ AI Platforms at AMD Advancing AI 2026

SAN JOSE, Calif., July 23, 2026 /PRNewswire/ — MulticoreWare, Inc., a global technology company specializing in AI software solutions, physical AI, accelerated computing, and engineering services, today announced its ongoing collaboration with AMD to advance autonomous robotics and edge intelligence on AMD platforms.

As part of this collaboration, MulticoreWare joined AMD at AMD Advancing AI 2026 to present ‘Enabling Physical AI on AMD’, demonstrating how advanced vision, language, and action (VLA) models can drive real-time robotic intelligence on AMD Ryzen™ AI Embedded platforms.

As AI increasingly moves from the cloud into robots, autonomous systems, and intelligent edge devices, organizations need efficient ways to run sophisticated AI models closer to where decisions need to be made. Together, AMD and MulticoreWare are helping developers bring advanced perception, reasoning, and action capabilities to AMD-powered systems.

At AMD Advancing AI 2026, AMD and MulticoreWare demonstrated how multimodal VLA models run on AMD Ryzen™ AI Embedded integrated GPUs using AMD ROCm™, enabling robots to perceive, reason, and act in real time. The session showcased practical guidance for AI developers, robotics engineers, and innovators building next-generation intelligent machines on AMD Embedded platforms.

“Physical AI is reshaping how machines perceive, decide and act in the real world,” said Sumit Shah, Head of Product Management and Marketing, Adaptive and Embedded Computing Group, AMD. “AMD Ryzen™ AI Embedded X100 Series processors deliver a scalable, open x86 Embedded platform that unifies AI, real-time control and industrial reliability to enable the generation of autonomous systems without locking developers into a single compute architecture or software stack.”

“A Physical AI system depends on a tightly integrated loop between perception and actuation. It must operate in real time, on real hardware, and in environments that are inherently unpredictable,” said Vish Rajalingam, VP & GM, Mobility and Transportation BU at MulticoreWare. “That makes it a hardware-software co-design challenge, not simply an AI inference problem. Building on the open-source AMD Robotics Software Suite, we work closely with OEMs to optimize the entire stack so that latency, reliability and accuracy targets are consistently achieved in production environments. That’s the integration MulticoreWare and AMD deliver together to move intelligent robotic systems from prototype to deployment.”

This session builds on more than 15 years of collaboration, with MulticoreWare delivering software optimization, AI, and engineering expertise across the AMD ecosystem, including Ryzen™ AI, Ryzen™, AMD EPYC™, AMD Instinct™, AMD Radeon™, and adaptive computing technologies.

About MulticoreWare

MulticoreWare, Inc. is a global technology company delivering AI software solutions and engineering services that accelerate innovation in Physical AI, Agentic AI, Robotics, Edge Intelligence, and Accelerated Computing. With expertise in multimodal AI, Vision-Language-Action (VLA) models, sensor perception and fusion, AI optimization, embedded systems, and high-performance software, MulticoreWare helps customers transform advanced AI technologies into production-ready solutions. Its innovations power applications across automotive, robotics, industrial automation, smart cities, healthcare, defense, and intelligent edge devices, while its video codec technologies enable next-generation video experiences worldwide.
www.multicorewareinc.com

AMD, the AMD Arrow logo, EPYC, Instinct, Radeon, Ryzen and combinations thereof are trademarks of Advanced Micro Devices, Inc.

Contact:
Suchithra Thyagarajan
VP – Corporate Marketing
marcom@multicorewareinc.com 

 

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SOURCE MulticoreWare Inc.

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