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IDTechEx Discusses Co-Packaged Optics (CPO) Packaging Technology Trends and Market Trajectory

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BOSTON, July 24, 2024 /PRNewswire/ — Over the past decade, the capacity of data center Ethernet switches has surged from 0.64 Tbps to 25.6 Tbps, driven by the adoption of 64×400 Gbps or 32×800 Gbps pluggable optical transceiver modules. However, these high-speed modules, within their current form factors, pose significant challenges. Issues include the required densities of electrical and optical connectors, as well as escalating power consumption.

To achieve next-generation optical engines supporting 800 Gbps and beyond per module, the communication rate must double to at least 100 Gbps per lane. This increase introduces substantial signal integrity issues across the switch socket, motherboard, and edge connector, leading to heightened power dissipation at SerDes interfaces. In future Ethernet switching, these signal integrity problems may cause I/O power consumption to exceed that of the switch core. Additionally, the integration density of standard pluggable modules is limited by the QSFP/OSFP form factor, necessitating advanced thermal management solutions not yet widely available.

Co-Packaged Optics (CPO) presents a promising solution to these challenges. Unlike traditional pluggable models, CPO integrates optical modules directly onto the switch ASIC substrate, reducing electrical reach and effectively addressing signal integrity issues. This approach has gained traction among major data centers. However, optimizing the packaging strategy for CPO remains a topic of ongoing industry discussion and development. IDTechEx’s latest report, “Co-Packaged Optics (CPO) 2025-2035: Technologies, Market, and Forecasts“, explores these advancements in CPO technology and packaging techniques enabling its adoption.

The importance of advanced semiconductor packaging technologies for Co-Packaged Optics (CPO)

The integration of CPO in data centers aims to boost I/O bandwidth and reduce energy consumption. The way photonic integrated circuits (PICs) are combined with electronic integrated circuits (EICs) and switch ICs, can significantly influence the areal and edge bandwidth density, as well as packaging parasitics. These factors directly affect the transceiver’s I/O bandwidth and energy efficiency, meaning improper integration can negate the advantages of silicon photonics.

For CPO, the integration of photonic and electronic components can be achieved through various methods, each with unique advantages and challenges. The most advanced, and still in the R&D phase, is the 3D monolithic integration. This embeds photonic components within an existing electronic process node with minimal alterations, co-locating active photonics and driving electronics within the same die. This reduces parasitics and simplifies packaging by eliminating the need for interface pads and bumps. However, monolithic integration typically uses older CMOS nodes, resulting in suboptimal photonic performance and higher energy consumption. Despite these limitations, it offers minimal impedance mismatch and simplified packaging.

Conversely, 2D integration places the PIC and EIC side by side on a PCB, connected by wire bonds or flip-chip. This method is straightforward and cost-effective, but introduces significant parasitic inductance, limiting aggregate I/O due to single-edge connections. While 2D integration is easy to package, the reliance on wire bonds constrains the transceiver bandwidth and increases energy consumption, making it less efficient for high-performance applications.

3D hybrid integration offers a more advanced solution by placing the EIC on top of the PIC, via various advanced semiconductor packaging technologies including Through-Si-Via (TSV), high density fan-out, Cu-Cu hybrid bonding, and active photonic interposer, significantly reducing parasitics. The use of advanced semiconductor packaging technologies in 3D integration allows for dense pitch capabilities, enhancing performance. However, thermal dissipation remains a challenge, as the heat generated by the EIC can impact the PIC, necessitating advanced thermal management solutions. Despite these thermal challenges, 3D hybrid integration achieves higher performance due to minimized packaging parasitics.

2.5D integration serves as a compromise, with both the EIC and PIC flip-chipped onto a passive interposer with TSVs. This approach maintains manageable parasitics and dense pitch capabilities similar to 3D integration but adds complexity with the need for interposer traces. While 2.5D integration balances performance, cost, and fabrication turnaround, it incurs higher parasitics than 3D hybrid integration.

In summary, each integration method presents trade-offs between performance, complexity, and cost, with the choice based on specific application requirements and constraints.

Co-Packaged Optics (CPO) market trajectory

According to IDTechEx, the Co-Packaged Optics (CPO) market is projected to exceed $1.2 billion by 2035, growing at a robust CAGR of 28.9% from 2025 to 2035. CPO network switches are expected to dominate revenue generation, driven by each switch potentially incorporating up to 16 CPO PICs. Optical interconnects for AI systems will constitute approximately 20% of the market, with each AI accelerator typically utilizing one optical interconnect PIC to meet increasing demands for high-speed data processing and communication in advanced computing applications.

IDTechEx’s latest report, “Co-Packaged Optics (CPO) 2025-2035: Technologies, Market, and Forecasts”, offers extensive exploration into the latest advancements within Co-Packaged Optics technology. The report delves deep into key technical innovations and packaging trends, providing a comprehensive analysis of the entire value chain. It thoroughly evaluates the activities of major industry players and delivers detailed market forecasts, projecting how the adoption of CPO will reshape the landscape of future data center architecture.

Central to the report is the recognition of advanced semiconductor packaging as the cornerstone of Co-Packaged Optics technology. IDTechEx places significant emphasis on understanding the potential roles that various semiconductor packaging technologies may play within the realm of CPO.

Key aspects of the report include:

Market Dynamics: Examination of key players such as Nvidia, Broadcom, Cisco, Ranovus, and Intel, and the forces shaping the CPO landscape.Innovations in CPO Design: Exploration of advanced CPO designs and their implications for enhancing data center efficiency and shaping future architecture.Semiconductor Packaging Breakthroughs: Insight into the latest advancements in semiconductor packaging, including 2.5D and 3D technologies, and their role in enabling CPO innovation.Optical Engines: Analysis of the drivers behind CPO’s performance and efficiency advantages.CPO for AI Interconnects: Exploration of how optical I/O can address the limitations of copper connections in AI applications, improving efficiency, latency, and data rates.CPO for Switches: Assessment of the potential 25% efficiency gains in high-performance network switches through CPO integration.Challenges and Solutions: Critical review of obstacles to CPO adoption and strategies to overcome them.Future Analysis: Predictions and insights into the next generation of CPO and its anticipated impact on the industry.

The report is based on extensive research and interviews with industry experts and provides valuable insights for anyone interested in gaining a strategic understanding of Co-Packaged Optics’ role in advancing the future of data centers and AI technology.

Market Forecasts:10-year Data Center Population Cumulative Forecast10-year AI Accelerator Unit Shipments Forecast10-year CPO Interconnect for AI (Optical I/O) Unit Shipments Forecast10-year CPO Interconnect for AI (Optical I/O) Market Revenue Forecast10-year CPO-enabled Network Switch Unit Shipments Forecast10-year CPO-enabled Network Switch Market Revenue Forecast10-year Total CPO Market Revenue

For more information on this IDTechEx report, including downloadable sample pages, please visit www.IDTechEx.com/CPO.

For the full portfolio of related research available from IDTechEx please see www.IDTechEx.com/Research/Semiconductors.

About IDTechEx

IDTechEx provides trusted independent research on emerging technologies and their markets. Since 1999, we have been helping our clients to understand new technologies, their supply chains, market requirements, opportunities and forecasts. For more information, contact research@IDTechEx.com or visit www.IDTechEx.com

Media Contact: 
Charlotte Martin 
Subscriptions Marketing Manager
press@IDTechEx.com 
+44(0)1223 812300

Social Media Links: 
X: https://www.twitter.com/IDTechEx 
LinkedIn: https://www.linkedin.com/company/idtechex/ 

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62% of financial services professionals say an AI-generated error has reached a client

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New Macabacus report finds AI adoption has outpaced the guardrails needed to keep client-facing models and documents accurate.

NEW YORK, Sept. 10, 2026 /PRNewswire/ — Macabacus, the leading M365 productivity platform for finance and professional services teams, today released the report: GenAI for Financial Services: Velocity and Verification. The report finds that AI now sits at the core of model creation and client presentation development, but most firms lack the review and verification layer needed to catch AI-generated errors before they reach clients.

New Macabacus report finds AI adoption has outpaced the guardrails to keep client-facing models and documents accurate

Drawing on a survey of Macabacus’ 75,000 users and analysis of conversations with hundreds of clients and prospects, the report quantifies the gap between how fast AI is being adopted and how slowly firms are building guardrails to ensure their clients can trust their deal content.

“AI is now involved in the majority of models and documents that reach clients, with 87% of firms saying they use AI daily or weekly for this work,” said Paul Ross, Chief Marketing Officer, Macabacus. “Deal teams should not slow down their use of AI. They need guardrails that let them move faster while maintaining accuracy and their clients’ trust. That is what Macabacus is built for.”

Key findings include:

62% of respondents believe an AI-generated error has reached a client or internal decision-maker in the past 12 months, with 46% saying an error has “probably” landed in a deliverable without anyone catching it.87% use AI daily or weekly to generate financial models and client presentations, but only 23% have comprehensive guardrails (approved tools, accuracy checks, brand compliance, and review workflows) in place.AI has created a divergence in confidence at the review handoff stage for models and presentations: 43% of analysts and associates say AI has made them more confident in their work, while only 29% VPs, directors, and MDs state the same. That leadership group is also 6 points more likely to say AI has made them less confident.

Download the report here:  https://macabacus.com/lp/2026-ai-report

About Macabacus

Macabacus is the leading Microsoft-native productivity platform for finance and professional services teams. When a deal document has to be right, professionals use Macabacus. Trusted by 3,000 firms and 75,000 users across investment banking, private equity, asset management, consulting, advisory, and corporate finance, Macabacus helps users rapidly create and check financial models and deal documents. By combining powerful productivity tools with AI-powered review and automation, Macabacus enables organizations to execute with greater speed, accuracy, and confidence. Learn more at www.macabacus.com

Media Contact

Paul Ross

paul.ross@macabacus.com

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SOURCE Macabacus Inc.

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ChipMOS to Participate in UBS Taiwan Summit 2026

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HSINCHU, Sept. 10, 2026 /PRNewswire-FirstCall/ — ChipMOS TECHNOLOGIES INC. (“ChipMOS” or the “Company”) (Taiwan Stock Exchange: 8150 and Nasdaq: IMOS), an industry leading provider of outsourced semiconductor assembly and test services (“OSAT”), today announced that it will present to institutional investors at UBS Taiwan Summit 2026, at the W Taipei Hotel on September 15 and 16, 2026.

Management from the Company, including Jesse Huang, Senior Vice President of Strategy and Investor Relations, will discuss the Company’s recent financial results, business trends and growth opportunities. The Company’s investor presentation is available on the investor relations’ section of its website at www.chipmos.com.

About ChipMOS TECHNOLOGIES INC.:

ChipMOS TECHNOLOGIES INC. (“ChipMOS” or the “Company”) (Taiwan Stock Exchange: 8150 and Nasdaq: IMOS) (www.chipmos.com) is an industry leading provider of outsourced semiconductor assembly and test services. With advanced facilities in Hsinchu Science Park, Hsinchu Industrial Park and Southern Taiwan Science Park in Taiwan, ChipMOS is known for its track record of excellence and history of innovation. The Company provides end-to-end assembly and test services to leading fabless semiconductor companies, integrated device manufacturers and independent semiconductor foundries serving virtually all end markets worldwide.

Forward-Looking Statements:

This press release may contain certain forward-looking statements. These forward-looking statements may be identified by words such as ‘believes,’ ‘expects,’ ‘anticipates,’ ‘projects,’ ‘intends,’ ‘should,’ ‘seeks,’ ‘estimates,’ ‘future’ or similar expressions or by discussion of, among other things, strategies, goals, plans or intentions. These statements may include financial projections and estimates and their underlying assumptions, statements regarding current macroeconomic conditions, including the impacts of high inflation, foreign exchange rates and risk of recession, on demand for our products, consumer confidence and financial markets generally; changes in trade regulations, policies, and agreements and the imposition of tariffs that affect our products or operations, including potential new tariffs that may be imposed and our ability to mitigate with respect to future operations, products and services, and statements regarding future performance. Actual results may differ materially in the future from those reflected in forward-looking statements contained in this document, based on a number of important factors and risks, which are more specifically identified in the Company’s most recent U.S. Securities and Exchange Commission (the “SEC”) filings. Further information regarding these risks, uncertainties and other factors are included in the Company’s most recent Annual Report on Form 20-F filed with the SEC and in its other filings with the SEC.

Contacts:

In Taiwan

Jesse Huang

ChipMOS TECHNOLOGIES INC.

+886-6-5052388 ext. 7715

IR@chipmos.com

In the U.S.

David Pasquale

Global IR Partners

+1-914-337-8801

dpasquale@globalirpartners.com

View original content:https://www.prnewswire.com/news-releases/chipmos-to-participate-in-ubs-taiwan-summit-2026-302873463.html

SOURCE ChipMOS TECHNOLOGIES INC.

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NGP VAN Overhauls Bulk Upload, Making a Critical Campaign Workflow Faster and Easier

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New experience catches errors before imports begin and reduces the manual work required to bring data into NGP VAN

WASHINGTON, Sept. 10, 2026 /PRNewswire/ — NGP VAN, the leading technology provider for Democratic and progressive campaigns, today announced major improvements to Bulk Upload, making one of the platform’s most frequently used workflows faster, more intuitive, and less prone to errors.

The improved Bulk Upload experience addresses longstanding pain points for campaign staff and data managers. The new workflow automatically detects the file type, identifies formatting and matching issues before an import runs, and intelligently maps spreadsheet columns to the appropriate fields in NGP VAN.

“Bulk upload is something we do constantly, and the struggle has always been real,” said Laurie Van Hall, Partner at Bee Compliance. “Smarter column mapping and catching errors up front before the import runs is the kind of upgrade that actually changes how a day goes. Really glad to see NGP VAN tackling this one.”

The improvements arrive as campaigns and organizations head into the busiest stretch of the election cycle, when the volume and urgency of critical data moving into NGP and VAN peaks. By surfacing potential issues before an import begins and reducing repetitive manual mapping, the redesigned workflow helps users spend less time troubleshooting uploads and more time acting on their data.

“The new Bulk Upload workflow lowers the learning curve for new NGP VAN users,” said Candy Emmons, Executive Director of the Democratic Party of Oregon. “With new people joining our team throughout the cycle, making these tools more intuitive helps staff become confident, independent users much more quickly.”

The updated experience includes:

Automatic file-type detection that eliminates the need for users to manually identify the data type they’re importing.Pre-validation checks that surface formatting and matching issues before an import runs.Improved column mapping that automatically matches spreadsheet columns to NGP VAN fields and reduces repetitive setup.A redesigned upload experience, with streamlined opening steps, a cleaner mapping screen, and a refreshed status page built on a modernized foundation.

“We’re hyperfocused on our users and how we can make their jobs easier every single day. Nearly every user I’ve spoken with has had something to say about Bulk Upload – and rarely was it good,” said Francis Brown, Senior Product Manager at NGP VAN. “We listened, pulled together a team, and went after the things that were creating the most frustration. This is exactly the kind of investment we want to make in the core NGP VAN experience – improving the workflows our users rely on every day. The response from beta testers has been incredibly encouraging, and I’m excited for users to get their hands on the new experience. “

The improved Bulk Upload experience does not change existing upload specifications, data models, field mappings, access permissions, or supported file formats. It will be optional at launch, and the existing Bulk Upload workflow will remain available.

About NGP VAN
NGP VAN is the winningest technology platform in the history of democratic and progressive causes, working tirelessly to innovate and advance the technology our clients rely on to bolster our democracy. A proud unionized employer, we help power the trailblazers, campaigners, and advocates fighting up and down the ticket for equality, racial justice, reproductive freedom, democracy, climate reform, and more—including the national Democratic committees and progressive organizations, thousands of Democratic campaigns, hundreds of labor unions, advocacy organizations, progressive and non-partisan PACs, and other organizations.

Press Contact:
Simone Hassan-Bey
NGP VAN
press@ngpvan.com

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SOURCE NGP VAN

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