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Optical Interconnect Market size is set to grow by USD 16.80 billion from 2024-2028, Adoption of cloud database boost the market, Technavio

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NEW YORK, July 26, 2024 /PRNewswire/ — The global optical interconnect market size is estimated to grow by USD 16.80 billion from 2024-2028, according to Technavio. The market is estimated to grow at a CAGR of 20.62% during the forecast period. Adoption of cloud database is driving market growth, with a trend towards demand for millimeter wave connectivity. However, high cost of optical interconnectors poses a challenge. Key market players include 3M Co., Amphenol Corp., Cisco Systems Inc., Corning Inc., FIBERONE LLC, Fischer Connectors Holding SA, Fujikura Ltd., Fujitsu Ltd., Furukawa Electric Co. Ltd., II VI Inc., InnoLight Technology Ltd., Japan Aviation Electronics Industry Ltd., Lumentum Holdings Inc., Molex LLC, NINGBO LONGXING TELECOMMUNICATIONS EQUIPMENT MANUFACTURING CO. LT, NVIDIA Corp., Radiall SA, Sterlite Technologies Ltd., Sumitomo Electric Industries Ltd., and TE Connectivity Ltd..

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Optical Interconnect Market Scope

Report Coverage

Details

Base year

2023

Historic period

2018 – 2022

Forecast period

2024-2028

Growth momentum & CAGR

Accelerate at a CAGR of 20.62%

Market growth 2024-2028

USD 16804.9 million

Market structure

Fragmented

YoY growth 2022-2023 (%)

16.56

Regional analysis

APAC, North America, Europe, South America, and Middle East and Africa

Performing market contribution

APAC at 62%

Key countries

China, US, South Korea, Japan, and Canada

Key companies profiled

3M Co., Amphenol Corp., Cisco Systems Inc., Corning Inc., FIBERONE LLC, Fischer Connectors Holding SA, Fujikura Ltd., Fujitsu Ltd., Furukawa Electric Co. Ltd., II VI Inc., InnoLight Technology Ltd., Japan Aviation Electronics Industry Ltd., Lumentum Holdings Inc., Molex LLC, NINGBO LONGXING TELECOMMUNICATIONS EQUIPMENT MANUFACTURING CO. LT, NVIDIA Corp., Radiall SA, Sterlite Technologies Ltd., Sumitomo Electric Industries Ltd., and TE Connectivity Ltd.

Market Driver

The global optical interconnect market is anticipated to experience growth due to the increasing demand for high bandwidth applications in 5G networks. ISPs face the challenge of managing 5G wireless backhaul traffic effectively. Two typical network architectures for wireless backhaul traffic are small cell and millimeter wave. The demand for optical interconnect components will rise as they are used to connect millimeter wave connectivity, which is economical and energy-efficient for deploying future 5G networks. The data transmission requirement is expanding rapidly and is expected to continue growing during the forecast period. Millimeter wave connectivity is extensively used in small cell backhaul networks, making it a significant growth opportunity for the optical interconnect market. 

The optical interconnect market is experiencing significant growth due to the increasing demand for efficient data communication solutions. Trends like machine learning and real-time data processing are driving the need for high-bandwidth, low-latency networks. Optical engines and ML/AI networks are at the heart of this transformation. Edge computing and data-intensive technologies require network interconnection solutions that can handle large data traffic. Both single mode fiber and multimode fiber segments are in focus, with single mode fiber leading the way for long-distance data transmissions and high-performance computing applications. 5G networks and the data communication segment are key drivers, particularly in the areas of cloud services, large-scale datacenters, and data storage. Semiconductor companies and infrastructure software solutions are investing heavily in this space. IoT, driverless vehicles, and wireless communication are also contributing to the increased bandwidth requirements. Overall, the optical interconnect market is poised for continued growth in the coming years. 

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Market Challenges

The optical interconnect market offers a range of interconnectors with varying average selling prices (ASP). The price can fluctuate based on factors such as applications, package weight, bandwidth, split ratios, custom wavelength, coupling ratio, sample rate, and channels. Interconnectors with high bandwidths up to ±200 nm and center wavelengths up to 2,000 nm have a higher ASP. These interconnectors are capable of analyzing signals from standard cables like USB, coaxial, and Ethernet, with several automatic measurements. However, the high cost of these interconnectors represents a significant capital expenditure for industries, which could potentially hinder the growth of the global optical interconnect market during the forecast period.The Optical Interconnect Market is experiencing significant growth due to increasing data traffic in cloud storage, deep learning, and hyperscale datacenters. Efficient data communication is crucial for next-generation applications like 5G services, driverless vehicles, smart gaming, and the Internet of Things. Optical interconnect technologies, such as fiber mode, offer higher bandwidth requirements and lower latency compared to copper-based interconnects. However, challenges remain. Alignment and packaging, compatibility, and interoperability are key concerns for datacenter companies. The commercialization of 5G services and high-performance computing demands for big data analytics, artificial intelligence, and high-bandwidth data centers networks. Telecommunications networks and data communication infrastructure require optical interconnect solutions to meet the needs of cloud computing, big data, and fiber optics. To address these challenges, optical interconnect manufacturers must focus on developing innovative solutions that cater to the unique requirements of various industries while ensuring seamless integration with existing infrastructure. Optical interconnect solutions must be designed to meet the evolving needs of next-generation applications and services.

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Segment Overview 

This optical interconnect market report extensively covers market segmentation by  

Fiber Type1.1 Single-mode fiber1.2 Multimode fiberConnectivity 2.1 Rack level2.2 Long-haul level2.3 Chip and board levelProduct Type3.1 Optical transceivers3.2 Connectors3.3 Cable assemblies3.4 OthersGeography 4.1 APAC4.2 North America4.3 Europe4.4 South America4.5 Middle East and Africa

1.1 Single-mode fiber-  Single-mode optical fibers are the most common type of fibers used for long-distance communication in fiber optics. These fibers allow light to travel directly through the core without bouncing at the edges, resulting in less signal deformation and lower attenuation. Single-mode fibers have a small core diameter of 8-9 microns and a larger cladding diameter of 125 microns, reducing reflections and enabling longer transmission distances. Major vendors in this market include Sterlite Technologies Ltd., The 3M Co., and Molex, LLC. Applications of single-mode fibers span across telecommunications, education, CATV companies, military, ships, aerospace, data centers, medical cases, and telemetry. The advantages of single-mode fibers include faster transmission over long distances, lower integrity loss, and cost-effectiveness. The market for single-mode fibers is expanding due to these advantages and the increasing demand for long-distance communication in various industries.

For more information on market segmentation with geographical analysis including forecast (2024-2028) and historic data (2017-2021) – Download a Sample Report

Learn and explore more about Technavio’s in-depth research reports

The global photonics market is experiencing robust growth, driven by advancements in technology and increased demand for high-speed communication and imaging systems. Key sectors include telecommunications, healthcare, and manufacturing, with significant investments in research and development. Major players such as Intel, Bosch, and Nikon are leading innovations in laser technology, optical components, and imaging systems, fueling market expansion and enhancing applications across various industries.

Research Analysis

The optical interconnect market is experiencing significant growth due to the increasing demand for high-speed data transmission in various industries. Cloud computing, big data analytics, artificial intelligence, and high-performance computing are driving the need for advanced optical interconnect technologies. Data centers, telecommunications networks, and IoT are key areas where optical interconnects are finding extensive applications. The market is segmented into multimode fiber and single mode fiber segments based on the type of fiber used. Optical interconnects offer increased bandwidth, making them ideal for short-distance data transmissions in data centers and hyper-scale datacenters. The commercialization of 5G services and the rise of high-efficiency processing in high-performance computing applications are further boosting the market. Alignment and packaging are critical factors influencing the performance and cost of optical interconnects. The market is expected to grow significantly in the coming years due to the increasing demand for high-speed data transmission in various applications, including data center networks, driverless vehicles, and data analytics.

Market Research Overview

The optical interconnect market is experiencing significant growth due to the increasing demand for high-speed data communication in various industries, including cloud computing, big data analytics, artificial intelligence, high-performance computing, and telecommunications networks. Optical interconnect technologies, such as single mode fiber and multi-mode fiber, are becoming essential for next-generation applications and services that require increased bandwidth and real-time data processing. Optical interconnect solutions offer compatibility and interoperability, making them ideal for network interconnection in data centers, hyperscale datacenters, and large-scale cloud service providers. The market is also driven by the commercialization of 5G networks, IoT, and edge computing, which require high-bandwidth, efficient data communication. Optical engines, ML/AI networks, and infrastructure software solutions are key components of optical interconnects, enabling machine learning, real-time data processing, and high-efficiency processing. Copper-based interconnects are being replaced by optical interconnects due to their higher performance and bandwidth capabilities. The data communication segment and data communication applications are the primary drivers of the optical interconnect market. The market is expected to grow significantly in the coming years due to the increasing demand for data-intensive technologies and the need for high-performance networking in various industries.

Table of Contents:

1 Executive Summary
2 Market Landscape
3 Market Sizing
4 Historic Market Size
5 Five Forces Analysis
6 Market Segmentation

Fiber TypeSingle-mode FiberMultimode FiberConnectivityRack LevelLong-haul LevelChip And Board LevelProduct TypeOptical TransceiversConnectorsCable AssembliesOthersGeographyAPACNorth AmericaEuropeSouth AmericaMiddle East And Africa

7 Customer Landscape
8 Geographic Landscape
9 Drivers, Challenges, and Trends
10 Company Landscape
11 Company Analysis
12 Appendix

About Technavio

Technavio is a leading global technology research and advisory company. Their research and analysis focuses on emerging market trends and provides actionable insights to help businesses identify market opportunities and develop effective strategies to optimize their market positions.

With over 500 specialized analysts, Technavio’s report library consists of more than 17,000 reports and counting, covering 800 technologies, spanning across 50 countries. Their client base consists of enterprises of all sizes, including more than 100 Fortune 500 companies. This growing client base relies on Technavio’s comprehensive coverage, extensive research, and actionable market insights to identify opportunities in existing and potential markets and assess their competitive positions within changing market scenarios.

Contacts

Technavio Research
Jesse Maida
Media & Marketing Executive
US: +1 844 364 1100
UK: +44 203 893 3200
Email: media@technavio.com
Website: www.technavio.com/

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SOURCE Technavio

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Neusoft Showcases Full-Stack & Global Innovations at Auto China 2026

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BEIJING, April 26, 2026 /PRNewswire/ — At Auto China 2026, Neusoft Corporation hosted a press conference on April 25th and announced three key strategic moves: the iteration of Neusoft OneCoreGo® Global In-Vehicle Intelligent Mobility Solution 7.0, the launch of Neusoft NAGIC.AI Cockpit Software Platform, and the strategic upgrade of its subsidiary, Neusoft Smart Go. By leveraging full-stack technology and a global ecosystem to drive innovation and empowerment, Neusoft is transforming vehicles into proactive, connected and collaborative mobile intelligent spaces.

OneCoreGo® Global In-Vehicle Intelligent Mobility Solution 7.0: An Evolved AI Companion for Global Intelligent Mobility

Intelligent mobility requires proactive perception, scenario integration, and global connectivity to meet personalized user needs and complex driving scenarios. Neusoft, whose products cover over 130 countries and regions worldwide, addresses these challenges with its OneCoreGo® Global In-Vehicle Intelligent Mobility Solution 7.0 through AI-driven innovation and global ecosystem collaboration. Powered by One Mate’s cross-agent collaboration and a sub-product matrix including One Map, One Sight, One Cloud, One Pay, One Store, One Link, and One Guard, the solution delivers full-link global mobility services spanning navigation, in-cabin AR, payment, app ecosystem services, connectivity and security. By breaking down functional silos, it streamlines multi-step operations into a single “depart” command, leveraging full-stack AI technology across perception, decision-making, interaction, and execution processes.

Guan Xin, Vice President of Neusoft and General Manager of Neusoft Automotive Innovative Solutions Division, said, “Adhering to the core principles of AI and globalization, OneCoreGo® 7.0 keeps innovating, evolving into a globally intelligent mobility companion that truly understands user needs.”

To enhance driving safety and mobility efficiency, OneCoreGo® 7.0 has also comprehensively upgraded its sub-products: One Map Global Navigation newly introduces 3D city effects, 3D lane-level maps, and traffic light guidance, offering dedicated solutions for two-wheelers and commercial vehicles as well. One Sight AR For Car improves navigation display effects, reducing instances of taking wrong routes. One Pay In-Vehicle Payment achieves over 90% payment coverage for parking services across core European cities. Combined with One Cloud’s global compliance cloud monitoring platform and One Guard’s full-stack vehicle networking security services, it creates a truly comprehensive OneCoreGo® Global In-Vehicle Intelligent Mobility Solution.

Neusoft NAGIC.AI Cockpit Software Platform: Dual-track Architecture for AI Integration in Every Vehicle

Amid the AI-driven transformation of the automotive industry, the market faces two challenges: limited computing power in legacy vehicles and high adaptation difficulties for next-gen models. Neusoft’s NAGIC.AI Cockpit Software Platform adopts a flexible “distributed + centralized” dual-track architecture approach. For existing vehicle models, it introduces the AI BOX solution, rapidly boosting computing power via external AI computing units, significantly reducing upgrade costs and timelines. For new vehicle models built on next-gen central computing platforms, Neusoft provides a full-stack AI cockpit software product suite, meeting automakers’ stringent requirements for system stability, reliability, and full-domain control.

Pang Hongyan, Vice President of Neusoft and General Manager of the Automotive Intelligent Software Division, said, “Our dual-track architecture enables every vehicle to embrace AI and enjoy an intelligent future. Both existing models and new-generation vehicles can find the most suitable path to intelligentization.”

Moreover, Neusoft’s NAGIC.AI Cockpit Software Platform features scenario-based, human-centric AI Agents seamlessly integrating driving safety, occupant care services, intelligent assisted driving and in-cabin entertainment. Neusoft also collaborates with global ecosystem partners to drive intelligent upgrades of in-cabin interaction products, fostering a more open and dynamic intelligent cockpit ecosystem.

Strategic Upgrade of Neusoft Smart Go: A World-leading Provider of Full-Domain Upper-Body Electronics Solutions for Intelligent Vehicles

Aligning with the trend of E/E architecture evolution from distributed control to “central computing + zonal control”, Neusoft Smart Go, a subsidiary of Neusoft in the field of intelligent vehicle connectivity, has completed a strategic upgrade, aiming to become a global leader in full-domain upper-body electronics solutions for intelligent vehicles.

This strategic upgrade positions Neusoft Smart Go to focus on full-domain scenarios in upper-body electronics, building a product matrix covering full-category in-vehicle electronics solutions, including central computing platforms, cockpit-driving-parking integration, intelligent cockpits, intelligent communications, intelligent audio systems, and zonal control units, and pioneering the integration of large model algorithms.

Jian Guodong, Senior Vice President of Neusoft and CEO of Neusoft Smart Go, said, “This strategic upgrade represents a significant leap from partial focus to comprehensive layout. Through our dual-track strategy of high-end cutting-edge solutions and mature standardized products, we can flexibly meet the mass production needs of vehicle models across different regions and price segments worldwide.” Neusoft Smart Go will provide mass-producible, adaptable hardware-software integrated solutions, empowering global automakers in achieving intelligent transformation.

Neusoft’s President, Mr.Gai Longjia stated, “In the future, Neusoft Smart Go will create stronger synergy with Neusoft Corporation by sharing internal technologies and capabilities while responding jointly to external demands. This specialized yet collaborative model will preserve business unit’s agility and expertise while enhancing Neusoft’s full-stack technological advantages.”

As a trusted partner in a smarter world, Neusoft is committed to collaborating with global automakers and ecosystem partners to build an open and inclusive intelligent automotive community together for the future of global mobility.

For more information about Neusoft, please visit www.neusoft.com.

 

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SOURCE Neusoft Corporation

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Lianlian DigiTech Returns to Money20/20 Asia to Expand Partnerships, Share Industry Trends, and Explore AI-Enabled Global Financial Infrastructure

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BANGKOK, April 26, 2026 /PRNewswire/ — Lianlian DigiTech, a leading global provider of digital payment services, was once again invited to participate in Money20/20 Asia, one of the world’s most influential fintech gatherings, held in Bangkok, Thailand from April 21 to 23. At the event, the company presented its latest developments in cross-border payment infrastructure, technology innovation, and ecosystem collaboration, offering a comprehensive view of its work enhancing global cross-border payment capabilities.

During the conference, Lianlian DigiTech announced a strategic partnership with UK-based fintech company USI Money to further strengthen its global cross-border payment network, delivering more efficient and reliable fund flows for merchants worldwide. Shen Enguang, Co-President of Lianlian DigiTech; Mark Ma, Head of Global Banking Partnership at LianLian Global; and Bryan Jiang, General Manager Hong Kong of LianLian Global, attended the event and engaged with representatives from international financial institutions. They shared perspectives on fintech trends and global payment innovation, offering industry insight into the continued evolution of a more integrated and interoperable cross-border payments ecosystem.

Building a Borderless Payment Network with Global Partners Including USI Money

At the event, Lianlian DigiTech formalized a strategic collaboration with London-headquartered USI Money to further develop its global payment infrastructure.

The partnership will focus on cross-border remittance and foreign exchange services, combining both companies’ technological capabilities and resources to deliver a one-stop payment and collection solution for global businesses. The offering is built to be efficient, secure, and cost-effective, improving overall fund flow efficiency and streamlining foreign exchange execution.

Syed Bukhari, Group Chief Business and Operating Officer at USI Money, said: “Our partnership with Lianlian will strengthen our remittance capabilities, creating greater value for our customers through broader network coverage and improved transaction performance.”

Bryan Jiang, General Manager Hong Kong of LianLian Global, said: “By leveraging the complementary strengths of our ecosystem partners in technology and compliance, Lianlian will continue to scale its global payment network and improve transaction efficiency. We remain committed to enhancing financial connectivity across global financial markets and delivering more efficient and reliable cross-border payment solutions for our customers.”

Founded in 2009 and listed on the Main Board of the Hong Kong Stock Exchange in 2024 (2598.HK), Lianlian DigiTech is a China-based, globally focused digital payment company with increasingly integrated AI capabilities across its platform. Guided by its mission of “Connecting the world, Empowering global commerce,” the company focuses on developing a trusted and scalable financial infrastructure. As of the end of 2025, Lianlian DigiTech has built a cross-border payment network covering more than 100 countries and regions, serving over 10.4 million customers worldwide.

USI Money is a foreign exchange and international remittance service provider offering tailored cross-border financial solutions for businesses and individuals. With competitive real-time exchange rates and efficient execution as its core strengths, the company delivers fast, secure, and reliable global fund transfers.

In addition, Lianlian DigiTech co-hosted a networking session with Unlimit during the event, providing a forum for industry dialogue. The session brought together a broad group of fintech partners to explore collaborative models and help foster a more connected ecosystem.

Industry Roundtables: Unlocking Layered Collaboration in AI-Driven Cross-Border Payments and Advancing Financial Inclusion in Emerging Markets

At the same time, Mark Ma and Bryan Jiang were invited to the themed roundtable discussions, where they shared insights drawn from industry practice and outlined new approaches to aligning fintech innovation with the global financial system.

At the roundtable on “Fintech and Banks,” Mark Ma noted that the global payment system is rapidly shifting from isolated capabilities to a layered, collaborative model. Banks continue to serve as the foundational infrastructure, responsible for clearing networks and liquidity management. Fintech firms like Lianlian, meanwhile, build on top of this foundation to deliver application-layer services for businesses, transforming complex cross-border payment channels into more accessible solutions that support a wider range of practical business scenarios. He also emphasized fintech’s growing role in compliance and value creation. By embedding risk controls and verification processes into technology workflows, fintech companies can act as compliance intermediaries, improving efficiency while filtering risk and enabling banks to operate more effectively at scale. Meanwhile, insights derived from transaction data and business flows allow for more precise evaluation of small and medium-sized businesses, shifting capital allocation from experience-based decisions to data-driven approaches and improving access to financial services.

At the roundtable titled “Different Worlds, Shared Challenges: Bridging Emerging Markets,” Bryan Jiang pointed out that the core of financial inclusion is shifting from scale of coverage to practical usability in everyday financial activity. The ability to serve underserved segments such as small and micro merchants and overseas workers in a sustained and reliable manner ultimately depends on continuous improvements in product design and operational capabilities. Using emerging markets as an example, Jiang explained that small and medium-sized businesses in these regions often face challenges such as difficult account setup, complex cross-border collections, high foreign exchange costs, and multi-layered tax requirements. Many existing solutions still follow traditional business-focused models, resulting in cumbersome KYB processes and lengthy review cycles that are misaligned with the asset-light, high-frequency, fast-turnover nature of these businesses. In response, Lianlian has lowered barriers to fund flows by offering local collection accounts, optimizing foreign exchange mechanisms, and improving settlement efficiency. The company has also restructured account architecture, streamlined review processes, and enhanced fund visibility, creating a more seamless and intuitive user experience that better aligns financial services with its clients’ business operations and day-to-day activities.

As digital technologies increasingly integrate with the real economy, innovations in AI and blockchain are reshaping the foundations of global financial services. Lianlian DigiTech has long invested in AI capabilities, global compliance, and the growth of its international service network. Its broad licensing coverage, regulatory track record, localized service capabilities, and technical reliability have earned the trust of regulators, customers, and partners worldwide.

Looking ahead, Lianlian DigiTech will continue to build on its cross-border expertise and compliance experience to further develop its AI capabilities and deepen collaboration with global partners. The company aims to extend its role beyond payment network services into more integrated financial infrastructure solutions. Lianlian DigiTech remains committed to serving as a trusted platform for global financial transactions in an increasingly digital environment, enabling businesses and individuals worldwide to access faster, more efficient, and more seamless cross-border financial services.

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SOURCE LianLian Global

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The Building & Furniture Category Highlights Sustainable and Human‑Centric Design at the 139th Canton Fair

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GUANGZHOU, China, April 26, 2026 /PRNewswire/ — Phase 2 of the 139th Canton Fair has seen the Building & Furniture category emphasize green Infrastructure and human-centric design.

A major highlight of the building and decorative materials section is the introduction of photovoltaic marble-textured cladding. This innovative surfacing material bridges the gap between high-end aesthetics and renewable energy. Unlike traditional solar panels that rely on glass, this non-opaque cladding uses precise microscopic structures to guide light to internal PV cells.

This technology offers 60% higher efficiency than traditional transparent solar systems while reducing carbon emissions by over 50%. Its ability to reproduce stone, wood, or brick‑like 3D textures allows architects to integrate power generation into a wide range of building styles without the industrial appearance of traditional solar panels.

Indoor environments are also becoming smarter and safer. Manufacturers are showcasing high-efficiency antibacterial surfacing, utilizing visible light catalysis to provide 24-hour protection against mold and bacteria. These advanced decorative papers and panels are becoming the new standard for high-end interior decoration, prioritizing long-term hygiene in residential and commercial spaces.

The sanitary ware sector is increasingly focused on the aging global population and those with limited mobility. A standout innovation is the electric lift-and-rotate shower chair. Designed for the dry-wet separation bathroom layout, it allows users to sit in a dry area and be safely rotated and lifted into the shower via remote control. This waterproof, low-voltage system provides dignity and independence for the elderly while reducing the physical strain on caregivers.

Hygiene and ease of maintenance have also seen a breakthrough with wall-mounted toilets. By moving the lid connection to the tank wall and adopting a mortise‑and‑tenon structure, the design eliminates the hard‑to‑clean areas where bacteria typically accumulate. Many of these units also incorporate ergonomic grab bars directly into the frame, blending safety with a minimalist aesthetic.

In the sports and leisure industry, the shift toward sustainability is seen in non-infill synthetic turf. This next-generation football grass eliminates the need for rubber granules or sand, providing a natural touch and superior shock absorption while significantly reducing maintenance costs and microplastic pollution.

All these innovations demonstrate how the Building & Furniture sector is advancing toward greener materials, smarter functionality, and more human‑centered design, setting new benchmarks for the future of living spaces.

For pre-registration, please click: https://buyer.cantonfair.org.cn/register/buyer/email?source_type=16

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