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Telecom Argentina S.A. Announces Final Results and Expected Final Settlement for its Exchange Offer

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BUENOS AIRES, Argentina, Aug. 8, 2024 /PRNewswire/ — Telecom Argentina S.A. (“Telecom”) announced today the Expiration Date results for its offer to exchange (the “Exchange Offer”) up to U.S.$200,000,000 in aggregate principal amount of its outstanding 8.000% Notes due July 18, 2026 (the “Old Notes”) validly tendered and accepted for exchange for newly issued 9.500% Senior Amortizing Notes due 2031 (the “New Notes”) of Telecom.

The Exchange Offer was made on the terms and subject to the conditions set forth in (i) the exchange offer memorandum, dated July 11, 2024 (the “Exchange Offer Memorandum”), (ii) the supplement to the Exchange Offer Memorandum, dated July 15, 2024 (such supplement together with the Exchange Offer Memorandum, the “Offering Memorandum”), (iii) the related eligibility letter (the “Eligibility Letter” and, together with the Offering Memorandum, the Exchange Offer Documents”) and (iv) Telecom’s press release dated July 25, 2024, whereby Telecom announced an extension of the Early Participation Consideration. Capitalized terms used but not defined herein have the meanings assigned to them in the Exchange Offer Documents.

The Exchange Offer expired at 5:00 p.m., New York City time, on August 8, 2024 (the “Expiration Date”), and is expected to settle on August 9, 2024 (such date, as the same may be extended, the “Final Settlement Date”).

The following table summarizes the Expiration Date results for the Exchange Offer and the principal amount of Old Notes that Telecom has accepted for exchange:

Description of
Bonds

CUSIP/ISIN Nos.

Principal Amount
Outstanding(1)

Principal Amount
Tendered on or prior to
the Early Participation
Date and Accepted for
Exchange(2)

 

Principal Amount
Tendered After the
Early Participation Date
and on or prior to the
Expiration Date and
Accepted for Exchange

8.000% Notes due
July 18, 2026

Rule 144A:
CUSIP No.: 879273 AR1
ISIN No.:
US879273AR14

 

Regulation S:
CUSIP No.: P9028N
AV3
ISIN No.:
USP9028NAV30

U.S.$400,000,000

U.S.$115,299,000

U.S.$1,954,000

(1)  Principal amount outstanding immediately prior to the Early Settlement Date.
(2)  The Early Settlement Date with respect to the Old Notes accepted for exchange on the Early Acceptance Date occurred on July 26, 2024.

The New Notes issued as exchange consideration pursuant to the Exchange Offer will be issued as additional notes under the indenture, dated July 18, 2024, pursuant to which Telecom issued its outstanding U.S.$500,000,000 9.500% senior amortizing notes due 2031 (the “New Money Notes”). The New Notes will be issued pursuant to a Company Order (as defined in the Indenture), in accordance with the terms of Sections 2.01 and 2.09 of the Indenture.

On the terms and subject to the conditions set forth in the Offering Memorandum, Telecom will issue U.S.$1,954,000 aggregate principal amount of New Notes as exchange consideration for Old Notes accepted in the Exchange Offer after the Early Participation Date and on or prior to the Expiration Date. Considering the aggregate principal amount of New Money Notes outstanding prior to the Expiration Date, the aggregate principal amount outstanding of 9.500% senior amortizing notes due 2031 after the Expiration Date is expected to be U.S.$617,217,000 considering, (i) the U.S.$500,000,000 aggregate principal amount of New Notes originally issued by Telecom on July 18, 2024, (ii) the U.S.$115,263,000 aggregate principal amount of New Notes issued by Telecom on July 26, 2024 and (iii) the U.S.$1,954,000 aggregate principal amount of New Notes expected to be issued by Telecom on August 9, 2024.

As a result of being issued in a “qualified reopening” of the New Money Notes under U.S. Treasury Regulation section 1.1275-2(k)), the New Notes will be treated as part of the same issue as the New Money Notes for U.S. federal income tax purposes. As such, although the New Notes are expected to be issued on August 9, 2024, the New Notes will have the same issue date (i.e., July 18, 2024) and issue price as the New Money Notes for U.S. federal income tax purposes.

In accordance with the terms of the Exchange Offer, because the New Notes accrue interest from July 18, 2024 (i.e., the issuance date of the New Money Notes) to the Final Settlement Date and such accrued interest will exceed accrued interest on the Old Notes from the last payment date to the Final Settlement Date, the Accrued Coupon Payment for Old Notes accepted in the Exchange Offer is expected to be zero.

Morrow Sodali International LLC acted as the information and exchange agent (the “Information and Exchange Agent”) for the Exchange Offer. Deutsche Bank Securities Inc., J.P. Morgan Securities LLC, Santander US Capital Markets LLC, BBVA Securities Inc., BCP Securities, Inc., Latin Securities, S.A., Agente de Valores, and UBS Securities LLC acted as dealer managers (the “Dealer Managers”) for the Exchange Offer.

This press release is neither an offer to purchase nor a solicitation of an offer to sell the Old Notes, the New Notes or the New Money Notes. The Exchange Offer was not made to holders in any jurisdiction in which Telecom was aware that the making of the Exchange Offer would not be in compliance with the laws of such jurisdiction. In any jurisdiction in which the securities laws or blue sky laws require the Exchange Offer to be made by a licensed broker or dealer, the Exchange Offer was deemed to be made on Telecom’s behalf by the Dealer Managers or one or more registered brokers or dealers that are licensed under the laws of such jurisdiction. Any questions or requests for assistance regarding the Exchange Offer may be directed to the Dealer Managers. Requests for additional copies of the Statement and related documents may be directed to the Information and Exchange Agent.

Only holders of Old Notes who returned a duly completed electronic Eligibility Letter certifying that they are (1) “qualified institutional buyers” (“QIBs”) as defined in Rule 144A under the Securities Act of 1933, as amended (the “Securities Act”), (2) located outside of the United States (other than “U.S. persons” (as defined in Rule 902 under the Securities Act)), who are qualified offerees in other jurisdictions and who are not Argentine Entity Offerees (as defined in the Eligibility Letter) or Non-Cooperative Jurisdiction Offerees (as defined in the Eligibility Letter), (3) “non-U.S. persons” who are Argentine Entity Offerees, (4) “non-U.S. persons” who are Non-Cooperative Jurisdictions Offerees, or (5) “non-U.S. persons” who are Eligible Canadian Holders (as defined in the Eligibility Letter), were authorized to receive the Exchange Offer Memorandum and to participate in the Exchange Offer (such holders, “Eligible Holders”).

Forward-Looking Statements

All statements in this announcement, other than statements of historical fact, are forward-looking statements. These statements are based on expectations and assumptions on the date of this announcement and are subject to numerous risks and uncertainties which could cause actual results to differ materially from those described in the forward-looking statements. Risks and uncertainties include, but are not limited to, market conditions, and factors over which Telecom has no control. Telecom assumes no obligation to update these forward-looking statements, and does not intend to do so, unless otherwise required by law.

The Information and Exchange Agent for the Exchange Offer is:

Morrow Sodali International LLC

E-mail: telecomargentina@investor.morrowsodali.com

 

Exchange Offer Website: https://projects.morrowsodali.com/telecomargentinaexchange

In London

103 Wigmore Street

W1U 1QS

London

Telephone: +44 20 4513 6933

In Stamford

333 Ludlow Street,

South Tower, 5th Floor

Stamford, CT 06902

Telephone: +1 203 658 9457

The Dealer Managers for the Exchange Offer are: 

Deutsche Bank Securities Inc.

1 Columbus Circle
New York, New York, 10019
United States
Attention: Liability
Management
Call Collect: (212) 250-2955

Toll-Free: (866) 627-0391

 

 

J.P. Morgan

Securities LLC

383 Madison Avenue

New York, New York 10179

United States

Attention: Latin America Debt
Capital Markets

Call Collect: (212) 834-7279

Toll-Free: (866) 846-2874

Santander US Capital Markets
LLC

437 Madison Ave
New York, New York 10022

United States

Attention: Liability Management
Call Collect: (212) 350-0660
Toll-Free: (855) 404-3636

BBVA Securities Inc.

1345 Avenue of the
Americas,

44th Floor

New York, New York
10105

United States of America

Attn: Liability Management

Collect: +1 (212) 728 2446

U.S. Toll Fee: +1 (800) 422
8692

Email:
liabilitymanagement@bbva
.
com

BCP Securities, Inc.

289 Greenwich Avenue

Greenwich, CT 06830

United States

Attention: James Harper

(203) 629-2186

Email:
jharper@bcpsecurities.com

Latin Securities S.A.
Agente de Valores

Zonamérica

Ruta 8, Km 17,500

Edificio M2, Ofic. 002

Montevideo, CP 91600

Uruguay

Attention:
m.sagaseta@latinsecurities.
com.uy

UBS Securities LLC

 

1285 Avenue of the
Americas

New York, NY 10019

Attention: Liability
Management Group

Call Collect: (212) 882-
5723

Toll Free: (833) 690-0971

Email: Americas-
lm@ubs.com

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SOURCE Telecom Argentina S.A.

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CM Global Services Announces Project Santos, a Planned 50-Megawatt AI Data Center Campus in ERCOT South

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CM Global Services targets a site and engages with strategic partners to become operational in the AI data center space.

DENVER, July 23, 2026 /PRNewswire/ — CM Global Services, LLC (CMGS) today announced Project Santos, its plan to develop a 50-megawatt AI data center campus for a site in the ERCOT South grid zone. CMGS is a long-standing strategic partner of Compass Mining, Inc. and is a global provider of logistics, hardware sales, and infrastructure services, with a growing focus on AI infrastructure and building site development. The announcement was made by Shanon Squires, Chief Mining Officer of Compass Mining, during a panel on bitcoin mining companies diversifying into AI infrastructure at the Energy Investors Forum.

CMGS intends to deliver Project Santos in two phases. The first phase, a 7-megawatt, 5 MW of IT Load Tier III facility purpose-built for AI inference workloads, is targeted for completion by the end of the first quarter of 2027. A subsequent 43-megawatt expansion, bringing the site to its fully planned 50-megawatt capacity

“This is a disciplined next step for CM Global Services, drawing upon its expertise in standing up infrastructure, while Compass Mining simultaneously continues to be the gold standard in Bitcoin mining-related services,” said Shanon Squires. “Bitcoin mining remains the core of Compass Mining. CMGS’ Project Santos reflects the power infrastructure and site development discipline CMGS built over years, and we’re pursuing this initiative on our own terms.”

“This is a new step forward for CMGS, as we continue building for the future,” said Vishnu Mackenchery, Managing Director at CMGS. “Project Santos marks our entry into AI infrastructure and inference, and we’re charting our own path, moving fast to get there.”

GPU-as-a-Service for Enterprise and Neocloud Customers

Project Santos is being developed as a GPU-as-a-Service (GPUaaS) platform. Rather than requiring customers to bring their own hardware, CMGS is securing NVIDIA GB300 Blackwell GPU capacity to offer directly to off-takers as dedicated, single-tenant or multi-tenant compute. The company’s ideal customer profile is AI enterprise organizations seeking dedicated capacity, and CMGS is also in active discussions with neocloud providers.

Project Status

Site: located in the ERCOT South grid zoneCompute: CMGS is securing NVIDIA GB300 Blackwell GPU capacity to offer as GPU-as-a-Service to off-takersTotal planned capacity: 50 megawatts, 35 MW of IT to be delivered in two phasesPhase 1: 7 megawatts, 5 MW of IT load Tier III, targeted for completion by end of Q1Phase 2: adding a 43-megawatt expansion, 30 MW of IT load with utility-supported expansionCustomer profile: AI enterprise companies are the ideal customer; CMGS is also in active discussions with neocloud providers

About CMGS

CM Global Services (CMGS) is a global provider of logistics, hardware sales, and infrastructure services, with a growing focus on AI infrastructure and building site development. CMGS supports clients with end-to-end logistics solutions, hardware procurement, and site-level execution for next-generation compute infrastructure.

About CMGS and Compass Mining Partnership

Compass Mining serves as a strategic partner and advisor to CM Global Services (CMGS), supporting its growth across global logistics, hardware sales, and infrastructure services. As CMGS expands its focus into AI infrastructure and site development, Compass Mining’s guidance helps shape its strategic direction and execution. Together, the two organizations continue to collaborate on delivering end-to-end solutions for clients building next-generation compute infrastructure.

Disclaimer

This communication contains forward-looking statements relating to a potential closing of a transaction. There can be no assurance that the proposed transaction will be completed on the terms described, or at all. Forward-looking statements are subject to significant business, economic, and competitive uncertainties, many of which are beyond our control. This communication is for informational purposes only and does not constitute an offer to sell, or a solicitation of an offer to buy, any securities of the company. Furthermore, investing in or engaging with our company involves substantial risk, and past performance or previous communications are not indicative of future results. There is no guarantee, assurance, or warranty that any specific financial outcome, return on investment, or overall results will be achieved. Actual results may differ materially and adversely from those expressed, projected, or implied in any forward-looking statements. Investors and stakeholders should not rely solely on preliminary press releases regarding potential transactions or projected financial metrics when making investment decisions. We undertake no obligation to publicly update or revise any forward-looking statements, whether as a result of new information, future events, or otherwise, except as required by applicable securities laws. Prospective investors are strongly encouraged to conduct their own independent due diligence and consult with a qualified, independent financial or legal advisor prior to making any investment.

Contact
All inquiries can be made to: Santos@CMGlobalServices.io 

View original content:https://www.prnewswire.com/news-releases/cm-global-services-announces-project-santos-a-planned-50-megawatt-ai-data-center-campus-in-ercot-south-302833610.html

SOURCE CM Global Services

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Advantech Unveils Next-Gen AI Infrastructure Solutions Powered by AMD EPYC™ 9006 Series Processors

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TAIPEI, July 23, 2026 /PRNewswire/ — Advantech, a global leader in industrial edge computing and edge AI solutions, today announced its next-generation server and network platforms powered by the latest AMD EPYC™ 9006 Series processors. Designed to accelerate AI infrastructure from the data center to the intelligent edge, Advantech’s 6th Gen AMD EPYC-powered servers deliver the performance, scalability, and reliability organizations need for AI, HPC, storage, networking, and mission-critical industrial workloads.

At AMD Advancing AI 2026, Advantech will showcase its latest 2U 4-node edge server and EATX server board, demonstrating how its workload-ready server solutions enable customers to build scalable, high-performance AI and edge computing infrastructure with greater deployment confidence.

Continuing Performance Leadership with AMD EPYC 9006 Series Processors

6th Gen AMD EPYC server CPUs bring continued leadership in performance, efficiency, memory bandwidth, and next-generation I/O. Featuring up to 128 cores and 256 threads, advanced 2nm process technology, “Zen 6” and “Zen 6c” architecture, up to 20% average generational performance uplift, and up to 20% performance-per-watt improvement, AMD EPYC 9006 Series processors are designed to support more virtual machines, higher throughput, and better system efficiency. With up to 128 PCIe Gen6 lanes per CPU, CXL™ 3.1 memory expansion, and support for DDR5 8000NHz and MRDIMM 12800MHz for high memory bandwidth, Advantech edge server solutions deliver balanced compute, memory, and I/O performance for next-generation AI, telco, edge, and storage infrastructure.

Key Features Include:

Up to 128 cores / 256 threads with “Zen 6” and “Zen 6c” architectureAdvanced 2nm process technology for improved performance and efficiencyUp to 20% average generational performance uplift and 20% performance-per-watt improvementDDR5-8000 and MRDIMM 12.8G support for higher memory bandwidth and capacityPCIe® Gen6 scalability: up to 128 lanes for 1 CPU and up to 196 lanes for 2 CPUsCXL™ 3.1 support for optimized memory expansion

Comprehensive Edge Server Solutions from Edge to Cloud

Advantech’s edge server portfolio powered by AMD EPYC™ 9006 Series processors delivers a complete board-to-system lineup for AI infrastructure, data centers, cloud, HCI, HPC, edge computing, industrial applications, and high-performance networking. The first-wave portfolio includes:
(1) The SKY-642E5, 4U MGX GPU server, for large-scale AI acceleration
(2) The SKY-722E5, 2U DC-MHS server with DC-SCM support, for modular data center and edge AI deployments
(3) The SKY-712E5, 1U DC-MHS server, supporting HHHL and FH-3/4L expansion cards for high-density enterprise edge and cloud workloads
(4) The SKY-822E5, 2U short-depth DC-SCM modular server, supporting 2–3 dual-slot GPU cards for space-constrained edge data centers
(5) The SKY-924E5F, 2U 4-node front-access server, for distributed edge computing,
(6) The ASMB-982 & ASMB-832 server boards for flexible, high-expandability system designs.

These new platforms also support PCIe Gen6 scalability, GPU-optimized architecture, advanced DDR5/MRDIMM memory, and AFA-ready high-density E1.S/E3.S NVMe SSD storage to meet low-latency data access, high-throughput storage performance, and scalable infrastructure for data-intensive AI and edge-cloud workloads.

Expanding the portfolio further, Advantech also introduces the FWA-6084, the 2U network appliance and is designed for demanding network security and edge AI workloads. It features DDR5/MRDIMM memory capability, eight Gen6 network module cards, and one PCIe Gen5 x16 slot for GPU or add-on card expansion. It is well positioned to support line-speed multiple 200G network workloads without compromise.

Together with Advantech’s unique service advantages—including 3-5-10 service guarantee, strict revision control, stable component supply, worldwide local support, and custom-ready integration—the new portfolio supports customers reduce deployment risk, secure long-term product roadmaps, and accelerate workload-ready AI and edge-cloud infrastructure from concept to deployment.

Explore more product information, please contact us or visit the Advantech x AMD website.

About Advantech

Advantech is a global leader in IoT intelligent systems and embedded platforms, driven by its vision of “Enabling an Intelligent Planet.” To address the growth of edge computing and AI, Advantech focuses on five key markets: Edge Intelligence Systems, Manufacturing, Energy and Utilities, iHealthcare, and iCity Services & iRetail. By integrating edge computing hardware, WISE-IoT software, sector-specific AI solutions, and domain expertise, Advantech creates an orchestration model that connects industrial ecosystems and accelerates industrial intelligence with partners and customers.(www.advantech.com

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SOURCE Advantech Co., Ltd.

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MulticoreWare and AMD Collaborate to Advance Physical AI and Autonomous Robotics on AMD Platforms

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Companies Demonstrated Real-Time Multimodal AI and Vision-Language-Action Workflows on AMD Ryzen™ AI Platforms at AMD Advancing AI 2026

SAN JOSE, Calif., July 23, 2026 /PRNewswire/ — MulticoreWare, Inc., a global technology company specializing in AI software solutions, physical AI, accelerated computing, and engineering services, today announced its ongoing collaboration with AMD to advance autonomous robotics and edge intelligence on AMD platforms.

As part of this collaboration, MulticoreWare joined AMD at AMD Advancing AI 2026 to present ‘Enabling Physical AI on AMD’, demonstrating how advanced vision, language, and action (VLA) models can drive real-time robotic intelligence on AMD Ryzen™ AI Embedded platforms.

As AI increasingly moves from the cloud into robots, autonomous systems, and intelligent edge devices, organizations need efficient ways to run sophisticated AI models closer to where decisions need to be made. Together, AMD and MulticoreWare are helping developers bring advanced perception, reasoning, and action capabilities to AMD-powered systems.

At AMD Advancing AI 2026, AMD and MulticoreWare demonstrated how multimodal VLA models run on AMD Ryzen™ AI Embedded integrated GPUs using AMD ROCm™, enabling robots to perceive, reason, and act in real time. The session showcased practical guidance for AI developers, robotics engineers, and innovators building next-generation intelligent machines on AMD Embedded platforms.

“Physical AI is reshaping how machines perceive, decide and act in the real world,” said Sumit Shah, Head of Product Management and Marketing, Adaptive and Embedded Computing Group, AMD. “AMD Ryzen™ AI Embedded X100 Series processors deliver a scalable, open x86 Embedded platform that unifies AI, real-time control and industrial reliability to enable the generation of autonomous systems without locking developers into a single compute architecture or software stack.”

“A Physical AI system depends on a tightly integrated loop between perception and actuation. It must operate in real time, on real hardware, and in environments that are inherently unpredictable,” said Vish Rajalingam, VP & GM, Mobility and Transportation BU at MulticoreWare. “That makes it a hardware-software co-design challenge, not simply an AI inference problem. Building on the open-source AMD Robotics Software Suite, we work closely with OEMs to optimize the entire stack so that latency, reliability and accuracy targets are consistently achieved in production environments. That’s the integration MulticoreWare and AMD deliver together to move intelligent robotic systems from prototype to deployment.”

This session builds on more than 15 years of collaboration, with MulticoreWare delivering software optimization, AI, and engineering expertise across the AMD ecosystem, including Ryzen™ AI, Ryzen™, AMD EPYC™, AMD Instinct™, AMD Radeon™, and adaptive computing technologies.

About MulticoreWare

MulticoreWare, Inc. is a global technology company delivering AI software solutions and engineering services that accelerate innovation in Physical AI, Agentic AI, Robotics, Edge Intelligence, and Accelerated Computing. With expertise in multimodal AI, Vision-Language-Action (VLA) models, sensor perception and fusion, AI optimization, embedded systems, and high-performance software, MulticoreWare helps customers transform advanced AI technologies into production-ready solutions. Its innovations power applications across automotive, robotics, industrial automation, smart cities, healthcare, defense, and intelligent edge devices, while its video codec technologies enable next-generation video experiences worldwide.
www.multicorewareinc.com

AMD, the AMD Arrow logo, EPYC, Instinct, Radeon, Ryzen and combinations thereof are trademarks of Advanced Micro Devices, Inc.

Contact:
Suchithra Thyagarajan
VP – Corporate Marketing
marcom@multicorewareinc.com 

 

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SOURCE MulticoreWare Inc.

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