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The automotive semiconductor market is projected to grow by USD 31.29 Billion from 2024-2028, with AI driving transformation and rising ADAS adoption boosting growth – Technavio

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NEW YORK, Sept. 25, 2024 /PRNewswire/ — Report with the AI impact on market trends – The Global Automotive Semiconductor Market size is estimated to grow by USD 31289.7 mn from 2024-2028, according to Technavio. The market is estimated to grow at a CAGR of  9.45%  during the forecast period. Rising adoption of advanced driver assistance system adas features in vehicles is driving market growth, with a trend towards increasing developments in semi-autonomous and autonomous vehicles  However, lack of standard protocols  poses a challenge – Key market players include Allegro MicroSystems Inc., Analog Devices Inc., BorgWarner Inc., Continental AG, DENSO Corp., Elmos Semiconductor AG, Infineon Technologies AG, Intel Corp., Microchip Technology Inc., Micron Technology Inc., NXP Semiconductors NV, ON Semiconductor Corp., Qualcomm Inc., Renesas Electronics Corp., Robert Bosch GmbH, ROHM Co. Ltd., Samsung Electronics Co. Ltd., STMicroelectronics International N.V., Texas Instruments Inc., and Toshiba Corp..

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Automotive Semiconductor Market Scope

Report Coverage

Details

Base year

2023

Historic period

2018 – 2022

Forecast period

2024-2028

Growth momentum & CAGR

Accelerate at a CAGR of 9.45%

Market growth 2024-2028

USD 31289.7 million

Market structure

Fragmented

YoY growth 2022-2023 (%)

8.42

Regional analysis

APAC, North America, Europe, South America, and Middle East and Africa

Performing market contribution

APAC at 64%

Key countries

China, US, Japan, South Korea, and Germany

Key companies profiled

Allegro MicroSystems Inc., Analog Devices Inc., BorgWarner Inc., Continental AG, DENSO Corp., Elmos Semiconductor AG, Infineon Technologies AG, Intel Corp., Microchip Technology Inc., Micron Technology Inc., NXP Semiconductors NV, ON Semiconductor Corp., Qualcomm Inc., Renesas Electronics Corp., Robert Bosch GmbH, ROHM Co. Ltd., Samsung Electronics Co. Ltd., STMicroelectronics International N.V., Texas Instruments Inc., and Toshiba Corp.

Market Driver

The automotive semiconductor market is experiencing significant growth due to the integration of advanced technologies in self-driving cars. These vehicles, also known as autonomous or driverless cars, use sensors and processors to read and interpret the environment, enabling minimal human intervention. Companies are investing heavily in sensor-processing technologies, superior quality planning, adaptive algorithms, and communication technologies to expand production capacities and enhance vehicle automation. The adoption of autonomous vehicles is projected to decrease operating costs, increase travel convenience, and encourage long-distance commutes, making it a key market driver during the forecast period. 

The Automotive Semiconductor Market is experiencing significant growth due to increasing demand for integrated electronics in motor vehicles. Power devices and Logic ICs are popular semiconductor types used in gasoline-powered engines and vehicle electrification. Connectivity devices, including cell phones and GPS receivers, are driving the demand for telematics and infotainment systems in passenger cars, sedans, hatchbacks, vans, and commercial vehicles. Semiconductor content in automobile production units is increasing due to advanced safety systems, comfort features, and vehicle diagnostics. Vehicle production is also adopting semiconductor technology for telematics, location tracking, job dispatch, and vehicle diagnostics. The market includes Electric Vehicles, Hybrid Electric Vehicles, Solar-powered vehicles, Electric Cars, Electric Vans, and Battery Electric Vehicles. Semiconductor technology plays a crucial role in vehicle electrification and the development of advanced safety and comfort systems. 

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Market Challenges

The automotive semiconductor market faces significant challenges due to the absence of standardized protocols in the industry. Regulations governing vehicle production impact both new and existing products, with various governmental standards dictating safety, theft prevention, and environmental impact. These regulations vary by country or region, requiring automakers to adapt their production processes to meet different market requirements. This results in financial losses as companies must establish separate assembly units to meet these diverse standards. For instance, vehicles in Asia are predominantly right-hand drive, while those in North America are left-hand drive. The constantly evolving regulations pose a major challenge to the expansion of the global automotive semiconductor market during the forecast period.The automotive semiconductor market is experiencing significant growth due to the increasing use of integrated electronics in motor vehicles. Semiconductor content in vehicles is on the rise, driven by trends like vehicle electrification, advanced safety systems, comfort systems, and telematics. Electric vehicles (EVs), hybrid electric vehicles (HEVs), solar-powered vehicles, electric cars, and electric vans are leading the charge in this area. However, challenges remain. Power electronics for EVs and HEVs require high accuracy and reliability. Advanced sensors, such as radar, LiDAR, and image sensors, must be secure against spoofing, evasion attacks, and poisoning. Environmental concerns, including emission norms and harmful exhaust emissions, also necessitate the use of emission control devices. The premium segment cars and luxury components are also driving demand for advanced semiconductor technology. Power electronics, microprocessors, cable harnesses, network systems, and analog ICs are essential components in this space. As the industry moves towards autonomous cars, security and reliability will be paramount. The future of automotive semiconductors is bright, with Tesla and other industry leaders pushing the boundaries of what’s possible.

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Segment Overview 

This automotive semiconductor market report extensively covers market segmentation by

Application 1.1 Telematics and infotainment1.2 Powertrain1.3 Safety1.4 Body electronics1.5 ChassisVehicle Type2.1 Passenger vehicle2.2 Light commercial vehicle2.3 Heavy commercial vehicleGeography 3.1 APAC3.2 North America3.3 Europe3.4 South America3.5 Middle East and Africa

1.1 Telematics and infotainment-  The automotive semiconductor market is experiencing significant growth due to increasing demand for advanced driver assistance systems (ADAS) and electric vehicles (EVs). Automakers are integrating more semiconductors into their vehicles to enhance safety features and improve fuel efficiency. Major players in the market include Infineon Technologies AG, NXP Semiconductors, and Texas Instruments Incorporated. These companies are investing in research and development to offer innovative solutions and expand their customer base. The market is expected to continue growing at a steady pace in the coming years.

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Research Analysis

The automotive semiconductor market is experiencing significant growth due to the increasing integration of semiconductor technology in motor vehicles. Integrated electronics play a crucial role in enabling advanced features such as vehicle electrification, electric and hybrid powertrains, solar power, telematics, on-board infotainment, and safety systems. Semiconductor content in vehicles includes power electronics for electric motor control, emission control devices, luxury components for premium segment cars, and safety features like lane departure warning, blind spot detection, and collision avoidance systems. The shift towards electric vehicles (EVs), hybrid electric vehicles (HEVs), and environmental concerns have led to stringent emission norms and a focus on reducing harmful exhaust emissions. The market for automotive semiconductors is expected to continue growing as the demand for more efficient, connected, and eco-friendly vehicles increases.

Market Research Overview

The automotive semiconductor market is a dynamic and growing sector that focuses on the integration of semiconductor technology into motor vehicles. This includes electric vehicles (EVs), hybrid electric vehicles (HEVs), solar powered vehicles, and traditional gasoline-powered engines. Semiconductor content in vehicles is essential for vehicle electrification, advanced safety systems, comfort systems, telematics, and on-board infotainment. Semiconductor technology plays a crucial role in vehicle handling, safety features, emission control devices, luxury components, and the premium segment cars. Environmental concerns and emission norms are driving the demand for more efficient and cleaner power electronics, leading to the development of autonomous cars and advanced sensors like radar, LiDAR, and image sensors. The market for automotive semiconductors includes various types of semiconductor devices such as microprocessors, power devices, logic ICs, connectivity devices, and analog ICs. The passenger car segment, including sedans and hatchbacks, as well as vans, is a significant market for automotive semiconductors. The integration of semiconductor technology in vehicles also brings challenges such as security concerns, including spoofing, evasion attacks, and poisoning attacks. The market for automotive semiconductors is also influenced by the increasing use of cable harnesses, network systems, and telematics and infotainment systems, which include cell phones, GPS receivers, and location tracking for job dispatch and vehicle diagnostics. Automotive electronics are a critical component of vehicle production and automobile production units, and the market for automotive semiconductors is expected to continue growing as the demand for more advanced and connected vehicles increases.

Table of Contents:

1 Executive Summary
2 Market Landscape
3 Market Sizing
4 Historic Market Size
5 Five Forces Analysis
6 Market Segmentation

ApplicationTelematics And InfotainmentPowertrainSafetyBody ElectronicsChassisVehicle TypePassenger VehicleLight Commercial VehicleHeavy Commercial VehicleGeographyAPACNorth AmericaEuropeSouth AmericaMiddle East And Africa

7 Customer Landscape
8 Geographic Landscape
9 Drivers, Challenges, and Trends
10 Company Landscape
11 Company Analysis
12 Appendix

About Technavio

Technavio is a leading global technology research and advisory company. Their research and analysis focuses on emerging market trends and provides actionable insights to help businesses identify market opportunities and develop effective strategies to optimize their market positions.

With over 500 specialized analysts, Technavio’s report library consists of more than 17,000 reports and counting, covering 800 technologies, spanning across 50 countries. Their client base consists of enterprises of all sizes, including more than 100 Fortune 500 companies. This growing client base relies on Technavio’s comprehensive coverage, extensive research, and actionable market insights to identify opportunities in existing and potential markets and assess their competitive positions within changing market scenarios.

Contacts

Technavio Research
Jesse Maida
Media & Marketing Executive
US: +1 844 364 1100
UK: +44 203 893 3200
Email: media@technavio.com
Website: www.technavio.com/

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SOURCE Technavio

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Neusoft Showcases Full-Stack & Global Innovations at Auto China 2026

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BEIJING, April 26, 2026 /PRNewswire/ — At Auto China 2026, Neusoft Corporation hosted a press conference on April 25th and announced three key strategic moves: the iteration of Neusoft OneCoreGo® Global In-Vehicle Intelligent Mobility Solution 7.0, the launch of Neusoft NAGIC.AI Cockpit Software Platform, and the strategic upgrade of its subsidiary, Neusoft Smart Go. By leveraging full-stack technology and a global ecosystem to drive innovation and empowerment, Neusoft is transforming vehicles into proactive, connected and collaborative mobile intelligent spaces.

OneCoreGo® Global In-Vehicle Intelligent Mobility Solution 7.0: An Evolved AI Companion for Global Intelligent Mobility

Intelligent mobility requires proactive perception, scenario integration, and global connectivity to meet personalized user needs and complex driving scenarios. Neusoft, whose products cover over 130 countries and regions worldwide, addresses these challenges with its OneCoreGo® Global In-Vehicle Intelligent Mobility Solution 7.0 through AI-driven innovation and global ecosystem collaboration. Powered by One Mate’s cross-agent collaboration and a sub-product matrix including One Map, One Sight, One Cloud, One Pay, One Store, One Link, and One Guard, the solution delivers full-link global mobility services spanning navigation, in-cabin AR, payment, app ecosystem services, connectivity and security. By breaking down functional silos, it streamlines multi-step operations into a single “depart” command, leveraging full-stack AI technology across perception, decision-making, interaction, and execution processes.

Guan Xin, Vice President of Neusoft and General Manager of Neusoft Automotive Innovative Solutions Division, said, “Adhering to the core principles of AI and globalization, OneCoreGo® 7.0 keeps innovating, evolving into a globally intelligent mobility companion that truly understands user needs.”

To enhance driving safety and mobility efficiency, OneCoreGo® 7.0 has also comprehensively upgraded its sub-products: One Map Global Navigation newly introduces 3D city effects, 3D lane-level maps, and traffic light guidance, offering dedicated solutions for two-wheelers and commercial vehicles as well. One Sight AR For Car improves navigation display effects, reducing instances of taking wrong routes. One Pay In-Vehicle Payment achieves over 90% payment coverage for parking services across core European cities. Combined with One Cloud’s global compliance cloud monitoring platform and One Guard’s full-stack vehicle networking security services, it creates a truly comprehensive OneCoreGo® Global In-Vehicle Intelligent Mobility Solution.

Neusoft NAGIC.AI Cockpit Software Platform: Dual-track Architecture for AI Integration in Every Vehicle

Amid the AI-driven transformation of the automotive industry, the market faces two challenges: limited computing power in legacy vehicles and high adaptation difficulties for next-gen models. Neusoft’s NAGIC.AI Cockpit Software Platform adopts a flexible “distributed + centralized” dual-track architecture approach. For existing vehicle models, it introduces the AI BOX solution, rapidly boosting computing power via external AI computing units, significantly reducing upgrade costs and timelines. For new vehicle models built on next-gen central computing platforms, Neusoft provides a full-stack AI cockpit software product suite, meeting automakers’ stringent requirements for system stability, reliability, and full-domain control.

Pang Hongyan, Vice President of Neusoft and General Manager of the Automotive Intelligent Software Division, said, “Our dual-track architecture enables every vehicle to embrace AI and enjoy an intelligent future. Both existing models and new-generation vehicles can find the most suitable path to intelligentization.”

Moreover, Neusoft’s NAGIC.AI Cockpit Software Platform features scenario-based, human-centric AI Agents seamlessly integrating driving safety, occupant care services, intelligent assisted driving and in-cabin entertainment. Neusoft also collaborates with global ecosystem partners to drive intelligent upgrades of in-cabin interaction products, fostering a more open and dynamic intelligent cockpit ecosystem.

Strategic Upgrade of Neusoft Smart Go: A World-leading Provider of Full-Domain Upper-Body Electronics Solutions for Intelligent Vehicles

Aligning with the trend of E/E architecture evolution from distributed control to “central computing + zonal control”, Neusoft Smart Go, a subsidiary of Neusoft in the field of intelligent vehicle connectivity, has completed a strategic upgrade, aiming to become a global leader in full-domain upper-body electronics solutions for intelligent vehicles.

This strategic upgrade positions Neusoft Smart Go to focus on full-domain scenarios in upper-body electronics, building a product matrix covering full-category in-vehicle electronics solutions, including central computing platforms, cockpit-driving-parking integration, intelligent cockpits, intelligent communications, intelligent audio systems, and zonal control units, and pioneering the integration of large model algorithms.

Jian Guodong, Senior Vice President of Neusoft and CEO of Neusoft Smart Go, said, “This strategic upgrade represents a significant leap from partial focus to comprehensive layout. Through our dual-track strategy of high-end cutting-edge solutions and mature standardized products, we can flexibly meet the mass production needs of vehicle models across different regions and price segments worldwide.” Neusoft Smart Go will provide mass-producible, adaptable hardware-software integrated solutions, empowering global automakers in achieving intelligent transformation.

Neusoft’s President, Mr.Gai Longjia stated, “In the future, Neusoft Smart Go will create stronger synergy with Neusoft Corporation by sharing internal technologies and capabilities while responding jointly to external demands. This specialized yet collaborative model will preserve business unit’s agility and expertise while enhancing Neusoft’s full-stack technological advantages.”

As a trusted partner in a smarter world, Neusoft is committed to collaborating with global automakers and ecosystem partners to build an open and inclusive intelligent automotive community together for the future of global mobility.

For more information about Neusoft, please visit www.neusoft.com.

 

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SOURCE Neusoft Corporation

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Lianlian DigiTech Returns to Money20/20 Asia to Expand Partnerships, Share Industry Trends, and Explore AI-Enabled Global Financial Infrastructure

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BANGKOK, April 26, 2026 /PRNewswire/ — Lianlian DigiTech, a leading global provider of digital payment services, was once again invited to participate in Money20/20 Asia, one of the world’s most influential fintech gatherings, held in Bangkok, Thailand from April 21 to 23. At the event, the company presented its latest developments in cross-border payment infrastructure, technology innovation, and ecosystem collaboration, offering a comprehensive view of its work enhancing global cross-border payment capabilities.

During the conference, Lianlian DigiTech announced a strategic partnership with UK-based fintech company USI Money to further strengthen its global cross-border payment network, delivering more efficient and reliable fund flows for merchants worldwide. Shen Enguang, Co-President of Lianlian DigiTech; Mark Ma, Head of Global Banking Partnership at LianLian Global; and Bryan Jiang, General Manager Hong Kong of LianLian Global, attended the event and engaged with representatives from international financial institutions. They shared perspectives on fintech trends and global payment innovation, offering industry insight into the continued evolution of a more integrated and interoperable cross-border payments ecosystem.

Building a Borderless Payment Network with Global Partners Including USI Money

At the event, Lianlian DigiTech formalized a strategic collaboration with London-headquartered USI Money to further develop its global payment infrastructure.

The partnership will focus on cross-border remittance and foreign exchange services, combining both companies’ technological capabilities and resources to deliver a one-stop payment and collection solution for global businesses. The offering is built to be efficient, secure, and cost-effective, improving overall fund flow efficiency and streamlining foreign exchange execution.

Syed Bukhari, Group Chief Business and Operating Officer at USI Money, said: “Our partnership with Lianlian will strengthen our remittance capabilities, creating greater value for our customers through broader network coverage and improved transaction performance.”

Bryan Jiang, General Manager Hong Kong of LianLian Global, said: “By leveraging the complementary strengths of our ecosystem partners in technology and compliance, Lianlian will continue to scale its global payment network and improve transaction efficiency. We remain committed to enhancing financial connectivity across global financial markets and delivering more efficient and reliable cross-border payment solutions for our customers.”

Founded in 2009 and listed on the Main Board of the Hong Kong Stock Exchange in 2024 (2598.HK), Lianlian DigiTech is a China-based, globally focused digital payment company with increasingly integrated AI capabilities across its platform. Guided by its mission of “Connecting the world, Empowering global commerce,” the company focuses on developing a trusted and scalable financial infrastructure. As of the end of 2025, Lianlian DigiTech has built a cross-border payment network covering more than 100 countries and regions, serving over 10.4 million customers worldwide.

USI Money is a foreign exchange and international remittance service provider offering tailored cross-border financial solutions for businesses and individuals. With competitive real-time exchange rates and efficient execution as its core strengths, the company delivers fast, secure, and reliable global fund transfers.

In addition, Lianlian DigiTech co-hosted a networking session with Unlimit during the event, providing a forum for industry dialogue. The session brought together a broad group of fintech partners to explore collaborative models and help foster a more connected ecosystem.

Industry Roundtables: Unlocking Layered Collaboration in AI-Driven Cross-Border Payments and Advancing Financial Inclusion in Emerging Markets

At the same time, Mark Ma and Bryan Jiang were invited to the themed roundtable discussions, where they shared insights drawn from industry practice and outlined new approaches to aligning fintech innovation with the global financial system.

At the roundtable on “Fintech and Banks,” Mark Ma noted that the global payment system is rapidly shifting from isolated capabilities to a layered, collaborative model. Banks continue to serve as the foundational infrastructure, responsible for clearing networks and liquidity management. Fintech firms like Lianlian, meanwhile, build on top of this foundation to deliver application-layer services for businesses, transforming complex cross-border payment channels into more accessible solutions that support a wider range of practical business scenarios. He also emphasized fintech’s growing role in compliance and value creation. By embedding risk controls and verification processes into technology workflows, fintech companies can act as compliance intermediaries, improving efficiency while filtering risk and enabling banks to operate more effectively at scale. Meanwhile, insights derived from transaction data and business flows allow for more precise evaluation of small and medium-sized businesses, shifting capital allocation from experience-based decisions to data-driven approaches and improving access to financial services.

At the roundtable titled “Different Worlds, Shared Challenges: Bridging Emerging Markets,” Bryan Jiang pointed out that the core of financial inclusion is shifting from scale of coverage to practical usability in everyday financial activity. The ability to serve underserved segments such as small and micro merchants and overseas workers in a sustained and reliable manner ultimately depends on continuous improvements in product design and operational capabilities. Using emerging markets as an example, Jiang explained that small and medium-sized businesses in these regions often face challenges such as difficult account setup, complex cross-border collections, high foreign exchange costs, and multi-layered tax requirements. Many existing solutions still follow traditional business-focused models, resulting in cumbersome KYB processes and lengthy review cycles that are misaligned with the asset-light, high-frequency, fast-turnover nature of these businesses. In response, Lianlian has lowered barriers to fund flows by offering local collection accounts, optimizing foreign exchange mechanisms, and improving settlement efficiency. The company has also restructured account architecture, streamlined review processes, and enhanced fund visibility, creating a more seamless and intuitive user experience that better aligns financial services with its clients’ business operations and day-to-day activities.

As digital technologies increasingly integrate with the real economy, innovations in AI and blockchain are reshaping the foundations of global financial services. Lianlian DigiTech has long invested in AI capabilities, global compliance, and the growth of its international service network. Its broad licensing coverage, regulatory track record, localized service capabilities, and technical reliability have earned the trust of regulators, customers, and partners worldwide.

Looking ahead, Lianlian DigiTech will continue to build on its cross-border expertise and compliance experience to further develop its AI capabilities and deepen collaboration with global partners. The company aims to extend its role beyond payment network services into more integrated financial infrastructure solutions. Lianlian DigiTech remains committed to serving as a trusted platform for global financial transactions in an increasingly digital environment, enabling businesses and individuals worldwide to access faster, more efficient, and more seamless cross-border financial services.

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SOURCE LianLian Global

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The Building & Furniture Category Highlights Sustainable and Human‑Centric Design at the 139th Canton Fair

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GUANGZHOU, China, April 26, 2026 /PRNewswire/ — Phase 2 of the 139th Canton Fair has seen the Building & Furniture category emphasize green Infrastructure and human-centric design.

A major highlight of the building and decorative materials section is the introduction of photovoltaic marble-textured cladding. This innovative surfacing material bridges the gap between high-end aesthetics and renewable energy. Unlike traditional solar panels that rely on glass, this non-opaque cladding uses precise microscopic structures to guide light to internal PV cells.

This technology offers 60% higher efficiency than traditional transparent solar systems while reducing carbon emissions by over 50%. Its ability to reproduce stone, wood, or brick‑like 3D textures allows architects to integrate power generation into a wide range of building styles without the industrial appearance of traditional solar panels.

Indoor environments are also becoming smarter and safer. Manufacturers are showcasing high-efficiency antibacterial surfacing, utilizing visible light catalysis to provide 24-hour protection against mold and bacteria. These advanced decorative papers and panels are becoming the new standard for high-end interior decoration, prioritizing long-term hygiene in residential and commercial spaces.

The sanitary ware sector is increasingly focused on the aging global population and those with limited mobility. A standout innovation is the electric lift-and-rotate shower chair. Designed for the dry-wet separation bathroom layout, it allows users to sit in a dry area and be safely rotated and lifted into the shower via remote control. This waterproof, low-voltage system provides dignity and independence for the elderly while reducing the physical strain on caregivers.

Hygiene and ease of maintenance have also seen a breakthrough with wall-mounted toilets. By moving the lid connection to the tank wall and adopting a mortise‑and‑tenon structure, the design eliminates the hard‑to‑clean areas where bacteria typically accumulate. Many of these units also incorporate ergonomic grab bars directly into the frame, blending safety with a minimalist aesthetic.

In the sports and leisure industry, the shift toward sustainability is seen in non-infill synthetic turf. This next-generation football grass eliminates the need for rubber granules or sand, providing a natural touch and superior shock absorption while significantly reducing maintenance costs and microplastic pollution.

All these innovations demonstrate how the Building & Furniture sector is advancing toward greener materials, smarter functionality, and more human‑centered design, setting new benchmarks for the future of living spaces.

For pre-registration, please click: https://buyer.cantonfair.org.cn/register/buyer/email?source_type=16

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