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AI is Transforming the IoT Chip Market, Expected Growth of USD 10.37 Billion from 2023 to 2027 Driven by Rising Smart Devices and Applications

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NEW YORK, Sept. 26, 2024 /PRNewswire/ — Report with market evolution powered by AI- The global iot chip market  size is estimated to grow by USD 10.37 billion from 2023-2027, according to Technavio. The market is estimated to grow at a CAGR of  13.59%  during the forecast period.  Increasing number of smart devices and applications is driving market growth, with a trend towards introduction of nb-iot technology. However, privacy and security concerns  poses a challenge. Key market players include Advanced Micro Devices Inc., Analog Devices Inc., Arduino Srl, Huawei Technologies Co. Ltd., Infineon Technologies AG, Intel Corp., Marvell Technology Inc., MediaTek Inc., Microchip Technology Inc., NVIDIA Corp., NXP Semiconductors NV, Park Ohio Holdings Corp., Qualcomm Inc., Renesas Electronics Corp., Samsung Electronics Co. Ltd., Silicon Laboratories Inc., SoftBank Group Corp., STMicroelectronics NV, Texas Instruments Inc., and Twilio Inc..

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Forecast period

2023-2027

Base Year

2022

Historic Data

2017 – 2021

Segment Covered

Application (Smart cities, Industrial ethernet, Smart wearables, Connected vehicles, and Connected homes), Type (Logic devices, Sensors, Processors, Connectivity integrated circuits, and Memory devices), and Geography (APAC, North America, Europe, South America, and Middle East and Africa)

Region Covered

APAC, North America, Europe, South America, and Middle East and Africa

Key companies profiled

Advanced Micro Devices Inc., Analog Devices Inc., Arduino Srl, Huawei Technologies Co. Ltd., Infineon Technologies AG, Intel Corp., Marvell Technology Inc., MediaTek Inc., Microchip Technology Inc., NVIDIA Corp., NXP Semiconductors NV, Park Ohio Holdings Corp., Qualcomm Inc., Renesas Electronics Corp., Samsung Electronics Co. Ltd., Silicon Laboratories Inc., SoftBank Group Corp., STMicroelectronics NV, Texas Instruments Inc., and Twilio Inc.

Key Market Trends Fueling Growth

The introduction of NB-IoT technology in the IoT chip market has significantly expanded the use of IoT-based chipsets. NB-IoT is a wireless technology that operates on the Low Power Wide Area (LPWA) network and is distinct from LTE-based hardware. This technology trend is expected to positively impact the IoT market. Factors such as the deployment of a wide area network, increased power efficiency, absence of a gateway for NB-IoT use, cost savings, reliability, and connection to a wide range of frequencies are driving the adoption of NB-IoT. NB-IoT allows devices with small form factors and sensors to connect to a licensed narrow bandwidth and transfer data at higher rates. For instance, LTE has a link budget of 142.7 dB, and GPRS has a link budget of 144 dB. An NB-IoT system has a link budget of 164 dB, providing a 20 dB margin for better battery life and data latency. NB-IoT also enables mobile communication devices to reuse older technologies and offers growth opportunities for emerging and newer technologies in the market. This technology has encouraged end-users to utilize IoT in various sectors, including agriculture and automotive, and will become a major driver for the global IoT chip market in the future. 

The IoT chip market is surging with trends like encryption security keys for data protection, energy conservation through smart meters and HVAC controls, and security system improvements for connected homes and businesses. NXP Semiconductors, Intel Corporation, and Texas Instruments Incorporated lead the charge with energy-efficient chips for smart home appliances, inventory management, and supply chain management. Real-time advertising, analytics-based decisions, and digital signage rely on IoT devices’ connectivity and networking protocols. Vulnerabilities in software and cyberattacks demand low-power security chips. Energy consumption and miniaturization of chips are crucial for automotive and healthcare applications. IoT connections require networking and supply chain shortages call for connectivity competence. IoT devices in consumer electronics, automotive, and healthcare industries need energy efficiency and security to thrive. 

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Market Challenges

The Internet of Things (IoT) market is witnessing significant growth as various devices, such as connected home appliances and cars, become interconnected. This technology allows users to access information from anywhere and at any time through the cloud. However, the implementation of IoT raises privacy and security concerns. An IoT device consists of three layers: transport, network, and physical. Each layer is vulnerable to attacks, with the physical layer being the most dangerous as it involves accessing the device to extract sensitive information. The network layer, which is crucial due to its features like low power consumption and high-speed Internet, can be attacked by misconfiguring routing or analyzing data traffic. The rise of IoT has led to the generation of vast amounts of data, enabling edge devices to work according to users’ preferences. Smart devices collect personal information and provide targeted advertisements and application options based on this data, leading to privacy concerns. Factors contributing to these issues include a lack of secure configuration, unsecured software updates, and the absence of privacy and security regulations. The low priority given to security solutions by governments and companies further hinders the adoption of IoT devices. Misconfigured networks can expose information to outsiders, while unsecured software updates can provide entry points for hackers. The lack of regulations increases the risk of attacks and decreases user trust. To mitigate these concerns, it is essential to prioritize security and privacy in IoT device design and implementation.The IoT chip market is experiencing significant growth due to the increasing demand for automated processes, machine-to-machine connections, and embedded sensors in various industries. However, challenges such as movement restrictions and logistics chains disruptions have affected the semiconductor manufacturing facilities of companies like Western Digital Corporation. To address these issues, IoT chip providers like Cyient and WiSig Networks are developing wireless chip solutions for domestic automation and logistics, warehousing, and manufacturing. Predictive maintenance and data analytics are also crucial for factory efficiency and economic times. IoT chips are used in smart cameras, connected devices, and building automation applications, including intelligent transportation systems, connected cars, and wearables. Memory devices, logic devices, and application-specific or general-purpose MCUs are essential semiconductor products for these applications. Ensuring data confidentiality is vital for the IoT chip market’s growth, with connectivity ICs and edge devices playing a significant role in cloud services. The market for IoT chips in energy management, medical applications, and real-time sensors is also expanding with the increasing internet penetration.

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Segment Overview 

This iot chip market report extensively covers market segmentation by

Application 1.1 Smart cities1.2 Industrial ethernet1.3 Smart wearables1.4 Connected vehicles1.5 Connected homesType 2.1 Logic devices2.2 Sensors2.3 Processors2.4 Connectivity integrated circuits2.5 Memory devicesGeography 3.1 APAC3.2 North America3.3 Europe3.4 South America3.5 Middle East and Africa

1.1 Smart cities-  The IoT chip market is experiencing growth due to the increasing adoption of smart city initiatives worldwide. Smart cities integrate various information and communication technologies into urban infrastructure, requiring connectivity solutions such as IoT chipsets. Factors like the implementation of smart grid technologies, Wi-Fi availability, and mobile application landscapes contribute to designating a city as smart. Cities like Singapore, London, and Barcelona are leading the way. The US, in collaboration with Intel, is implementing Intel’s IoT chip for its smart city initiatives. In San Jose, this collaboration aims to create a sustainability lens for the city, measuring air and noise pollution and managing traffic flow and energy consumption. IoT devices and technologies, including chipsets, are integral to this project. The growth of the global IoT chip market is driven by the increasing number of smart city projects in developing economies, advancements in Wi-Fi technologies, and the extensive use of Wi-Fi and the Internet. Key players like IBM, Microsoft, Cisco Systems, and Schneider Electric are contributing to the development of smart cities through initiatives and IT solutions. Smart meters, a significant contributor to the growth of this segment, record utility consumption levels and send data to utility companies for monitoring and billing. Smart grids, which require numerous smart meters, are electrical grids equipped with computational intelligence and network capabilities. Chipset manufacturers are developing chips with efficient communication technologies to support the growth of smart meters and grids. Government agencies and utility companies are replacing traditional meters with smart meters, with Great Britain introducing 34.8 million smart meters by 2023. The growing popularity of smart meters will further drive the development of smart grid projects.

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Research Analysis

The IoT chip market is experiencing rapid growth due to the increasing number of IoT connections and devices across various industries such as healthcare, consumer electronics, automotive, and building automation. IoT devices require connectivity competence, networking protocols, and low-power security chips to ensure efficient communication and data transfer. The market for IoT chips includes memory devices, logic devices, and connectivity ICs. Vulnerabilities in IoT devices have become a major concern, necessitating the development of advanced embedded technologies and security solutions. The healthcare sector is expected to witness significant growth in the IoT chip market due to the integration of wearables and smart consumer devices. Automotive applications, including connected cars and intelligent transportation systems, are also driving demand for IoT chips. Energy efficiency is a key consideration in the design of IoT chips for applications such as smart HVAC controls and vending machines. NXP Semiconductors, Intel Corporation, and Texas Instruments Incorporated are major players in the IoT chip market, offering innovative solutions to meet the demands of the digital infrastructure.

Market Research Overview

The IoT chip market is experiencing significant growth due to the increasing number of IoT devices in various industries such as healthcare, consumer electronics, automotive, and manufacturing. The demand for connectivity competence, networking protocols, and low-power security chips is driving the market. However, vulnerabilities, including software and cyberattacks, and supply chain shortages due to movement restrictions, are challenges. The chip requirement for miniaturization of chips, energy consumption, and security are key considerations. The healthcare sector is leveraging IoT for predictive maintenance, data analytics, and smart devices. Consumer electronics are seeing growth in smart home appliances, wearables, and connected devices. Automotive applications include connected cars and intelligent transportation systems. The manufacturing sector benefits from automated processes, logistics chains, and real-time sensors. The Economic Times reported on Western Digital Corporation’s semiconductor manufacturing facilities producing wireless chip solutions for various IoT applications. Cyient, WiSig Networks, and Koala NB-IoT SoC are contributing to the market with their RAIN RFID providers, logistics, and warehousing solutions. Smart cameras, memory devices, logic devices, and application-specific MCUs are essential components in building automation applications, connected cars, and edge devices. Cloud services, data confidentiality, and energy conservation are crucial for IoT security and efficiency. Smart meters, security system improvements, and power consumption are critical areas of focus in the energy sector. The wearables segment, connectivity ICs, and smart consumer devices are driving growth in the energy management market. The increasing Internet penetration and the demand for energy efficiency are fueling the growth of IoT chips. NXP Semiconductors, Intel Corporation, and Texas Instruments Incorporated are major players in the market. The market is expected to grow further with the integration of real-time advertising, analytics-based decisions, and digital signage in vending machines.

Table of Contents:

1 Executive Summary
2 Market Landscape
3 Market Sizing
4 Historic Market Size
5 Five Forces Analysis
6 Market Segmentation

ApplicationSmart CitiesIndustrial EthernetSmart WearablesConnected VehiclesConnected HomesTypeLogic DevicesSensorsProcessorsConnectivity Integrated CircuitsMemory DevicesGeographyAPACNorth AmericaEuropeSouth AmericaMiddle East And Africa

7 Customer Landscape
8 Geographic Landscape
9 Drivers, Challenges, and Trends
10 Company Landscape
11 Company Analysis
12 Appendix

About Technavio

Technavio is a leading global technology research and advisory company. Their research and analysis focuses on emerging market trends and provides actionable insights to help businesses identify market opportunities and develop effective strategies to optimize their market positions.

With over 500 specialized analysts, Technavio’s report library consists of more than 17,000 reports and counting, covering 800 technologies, spanning across 50 countries. Their client base consists of enterprises of all sizes, including more than 100 Fortune 500 companies. This growing client base relies on Technavio’s comprehensive coverage, extensive research, and actionable market insights to identify opportunities in existing and potential markets and assess their competitive positions within changing market scenarios.

Contacts

Technavio Research
Jesse Maida
Media & Marketing Executive
US: +1 844 364 1100
UK: +44 203 893 3200
Email: media@technavio.com
Website: www.technavio.com/

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Singtel Receives Four Frost & Sullivan 2026 Recognitions for Leadership in Enterprise Connectivity, Cybersecurity, and Digital Transformation

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The recognitions highlight Singtel’s leadership in secure connectivity, network transformation, IoT innovation, and cybersecurity, delivering customer value through intelligent digital infrastructure and AI-enabled enterprise services.

SAN ANTONIO, July 19, 2026 /CNW/ — Frost & Sullivan is pleased to honor Singtel with the 2026 Southeast Asia IoT Connectivity Service Provider Company of the Year, 2026 Singapore Network Transformation Customer Value Leadership, 2026 Singapore Cybersecurity Services Company of the Year, and 2026 Singapore SD-WAN and SASE Service Provider Company of the Year recognitions. These acknowledgements reflect Singtel’s outstanding achievements in delivering secure, intelligent, and scalable digital infrastructure that enables enterprises to modernize operations, simplify complexity, and accelerate digital transformation across Singapore and Southeast Asia. They underscore the company’s consistent leadership in strategy execution, customer value creation, and innovation across enterprise connectivity, cybersecurity, software-defined networking, and IoT connectivity services.

Frost & Sullivan evaluates companies through a rigorous benchmarking process across two core dimensions: strategy effectiveness and strategy execution. Singtel excelled in both, demonstrating its ability to anticipate evolving enterprise requirements while consistently translating long-term vision into measurable customer outcomes. Through platforms such as Singtel CUBΣ (CUBE) and its multidomestic IoT connectivity architecture, the company continues to unify networking, cybersecurity, automation, and AI-driven intelligence into integrated solutions that address the growing complexity of hybrid, multicloud, and connected environments. “Singtel has established itself as a benchmark for enterprise digital infrastructure by converging connectivity, cybersecurity, network intelligence, and IoT orchestration into a unified, customer-centric ecosystem. Its disciplined execution, platform-led innovation, and commitment to simplifying complex enterprise environments continue to strengthen operational resilience and deliver sustained value for organizations across the region,” said Kenny Yeo, Director at Frost & Sullivan.

Guided by a long-term strategy focused on digital innovation, intelligent infrastructure, and customer-centric transformation, Singtel has moved well-beyond traditional telecommunications to a trusted technology partner for enterprises navigating increasingly connected and data-driven environments. Its strategic investments in AI-enabled operations, cloud-native platforms, secure connectivity, and ecosystem partnerships enable organizations to modernize critical infrastructure while maintaining the flexibility to support future business growth.

The company’s strategic agility and sustained investment in integrated digital platforms have enabled it to scale innovative services across local, regional, and global enterprise environments. Innovation remains central to Singtel’s approach through solutions including the CUBΣ connected intelligence platform, multidomestic IoT connectivity powered by eSIM orchestration, managed cybersecurity services, AI-driven network automation, and network-as-a-service capabilities. These solutions simplify network and security management, strengthen cyber resilience, improve operational visibility, and provide enterprises with scalable, secure, and high-performing connectivity across cloud, edge, IoT, and hybrid infrastructures.

By streamlining service delivery through intelligent automation, centralized orchestration, proactive monitoring, and flexible managed and co-managed service models, Singtel continues to help organizations reduce operational complexity while improving service reliability and business agility. Its ability to integrate best-of-breed technologies in a unified operational framework, combined with strong regional network ownership and localized expertise, enables customers to confidently scale digital initiatives while maintaining security, governance, and operational excellence.

Frost & Sullivan commends Singtel for setting a high standard in competitive strategy, execution, and customer value across multiple technology domains. By combining intelligent networking, secure digital infrastructure, AI-enabled operations, and cross-border IoT capabilities in an integrated platform strategy, the company is shaping the future of enterprise connectivity while helping organizations build resilient, future-ready digital ecosystems.

Each year, Frost & Sullivan presents its Company of the Year and Customer Value Leadership recognitions to organizations that demonstrate outstanding strategy development and implementation, resulting in measurable improvements in customer satisfaction, competitive positioning, and business performance. These recognitions honor forward-thinking companies that continuously raise industry standards through innovation, operational excellence, and long-term value creation.

Frost & Sullivan Best Practices Recognition
Frost & Sullivan’s Best Practices Recognitions honor companies across regional and global markets that exhibit exceptional achievement and consistent excellence in areas such as leadership, technological innovation, customer experience, and strategic product development. Each recognition is the result of a rigorous analytical process in which Frost & Sullivan industry experts benchmark performance through comprehensive interviews, deep-dive analysis, and extensive secondary research. The goal is to identify true best-in-class organizations that are driving transformative growth and setting new industry standards.
Contact us: Start the discussion.

Contact:
Tarini Singh
E: Tarini.Singh@frost.com

 

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Emdoor Launches “Ailyn” AI Hub at WAIC 2026: Unifying Intelligence Across Every Device

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SHANGHAI, July 18, 2026 /PRNewswire/ — Emdoor, a leading provider of intelligent computing devices, unveiled its latest innovation — Ailyn, an integrated software-hardware AI hub — at the World Artificial Intelligence Conference (WAIC) 2026. Under the theme “Intelligence in All Things, Boundless Edge Intelligence”, Emdoor’s Booth X1B-804 showcases four immersive scenarios spanning personal, home, enterprise, and industrial use cases, demonstrating how AI can flow seamlessly across devices.

With decades of experience across cloud, edge, device, and wearable form factors, Emdoor has established one of the industry’s most comprehensive intelligent hardware portfolios. Yet the company recognized a critical gap: while individual devices grow smarter, they often operate in isolation.

Ailyn is Emdoor’s answer to this challenge. Introduced on the WAIC Magic Box stage, Ailyn serves as a unified intelligence layer that orchestrates storage, computing power, AI models, and data across PCs, NAS systems, computing boxes, and IoT devices. The result is a scalable, centrally managed intelligence platform that delivers seamless cross-device collaboration, data privacy, and AI capabilities that improve with use.

At its core, Ailyn follows a device-first, multi-device connected philosophy. By prioritizing on-device model deployment, it reduces costs while preserving privacy, minimizing latency, and enabling offline functionality. Key capabilities include unified data access, uninterrupted task handoff between devices, intelligent multi-model routing, and dynamic compute scaling — plus built-in features for knowledge accumulation, skill expansion, persona customization, and automated task execution.

Four Scenarios, One Intelligent Ecosystem

The enterprise lineup features high-performance AI workstations, AI servers, AI NAS, Mini PCs, and motherboards. Workstations support up to 96-core processors and four double-width GPUs with integrated BMC remote management. AI servers run dual Intel Xeon scalable processors with up to eight mainstream AI accelerators. The single-GPU workstation series offers dual-platform compatibility with both Intel and AMD, featuring a PCIe 5.0 ×16 slot and up to 128GB DDR5 memory. Available in two form factors — a 23.9L tower chassis and a 15.3L compact chassis with tempered glass side panel — it delivers balanced performance for both creative workloads and local AI inference. The AI NAS unifies storage and AI computing power in one device, with192GB of octa-channel LPDDR5X memory to support local large model deployment. Ailyn unifies these resources into a private computing backbone, intelligently offloading heavy workloads so users get instant on-device responsiveness with datacenter-grade power on demand.

For individual users, the showcase includes Mini PCs, AI PCs, AI tablets, and multimodal wearables. The AP16, powered by Intel’s 3rd Generation Core™ Ultra processor, delivers 180 TOPS of AI performance with sustained 54W output — capable of running large models locally. Multimodal wearable solutions built on Qualcomm and BES chips offer faster time-to-market for brand partners. Within the Ailyn ecosystem, PCs handle heavy computing while wearables provide continuous environmental awareness, each device strengthening the whole.

Industrial visitors will find AI BOX units, rugged AI notebooks, handheld terminals, and industrial PCs. AI BOX devices come preloaded with industry-specific models for production line visual inspection. Rugged notebooks deliver reliable performance for mobile field operations. Industrial PCs feature industrial-grade architecture for 24/7 uptime. Through Ailyn, these connected devices break down traditional data silos, enabling intelligent resource orchestration and a closed-loop perception-decision-execution system that accelerates industrial digital transformation.

At the center of the home scenario are AI tablets and home NAS, connected to a full-house AIoT network. The NAS acts as the family’s private data and computing hub, while the tablet serves as the primary interface for senior health reminders and children’s learning support. Ailyn weaves these devices into a cohesive system covering family memories, health care, companionship, and home security — bringing intelligence into daily life without intruding on it.

The launch of Ailyn marks a significant evolution for Emdoor — shifting from a hardware manufacturer to a builder of intelligent infrastructure. It represents the convergence of the company’s deep hardware heritage and its AI innovation roadmap. Moving forward, Emdoor will continue investing in edge AI technology and expanding the Ailyn ecosystem alongside partners, bringing distributed intelligence from the showroom into everyday life.

Company: Emdoor Digital Technology Co.,Ltd.
Contact Person: Yao Zhou
Email: marketing.digi@emdoor.com
Website: http://www.emdoordigi.com/
City: Shenzhen, China

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AI-Powered Connectivity: APAC Charts a Path to a Smarter Digital Future

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Asia-Pacific’s first Broadband Development Summit brings regulators and operators to Bangkok to set the agenda

BANGKOK, July 19, 2026 /PRNewswire/ — Government officials, standards bodies and telecom operators gathered in Bangkok on 14 July for the inaugural Broadband Development Summit APAC 2026, convened by the World Broadband Association (WBBA) to build consensus on AI-era networks.

Participants included the ITU, Thailand’s National Board of the Digital Economy and Society, WBBA, IAB, FNCAP, WAA, NIDA and the IPv6 Council, alongside operators Telkomsel, XLSmart, Surge, Globe, AIS, CMI and HKT and Huawei.

Denny Deng, President of Huawei Asia Pacific Carrier Business, envisions a “faster, smarter, greener” Asia-Pacific.

VOICES FROM THE SUMMIT

“To seize the opportunities of the AI era, we call on the industry to accelerate broadband evolution, advance computing-network synergy, and strengthen the cross-border connectivity. Together, let us build faster, smarter, and greener digital infrastructure for Asia-Pacific.”
— Denny Deng, President of Asia Pacific Carrier Business, Huawei

“High-speed broadband is no longer just about ‘getting online’ — it is the vital infrastructure upon which the entire AI revolution is being built. We view AI not merely as a tool, but as a primary engine for national competitiveness and a catalyst for improving the quality of life for all.”
— Wetang Phuangsup, Ph.D., Secretary-General, the National Board of the Digital Economy and Society, Thailand

“Three initiatives define the road to 2030. We must close the quality divide so the value of broadband reaches everyone. We must build AI-ready networks — 10G access, 800GE cores, intelligence end to end. And we must do it together, through shared standards.”
— Martin Creaner, Director General of WBBA

“Moving towards next-generation networks, network architectures must continue to evolve to deliver broader connectivity, superior quality, enhanced security, and greater intelligence. This evolution is essential for Net5.5G, positioning the network not simply as infrastructure, but as the foundation that enables AI, strengthens resilience and efficiency, and supports digital transformation across industries.”
— Dhruv Dhody, Industry Standardization Expert at Huawei, Chair of the IAB, IETF

“Across Asia-Pacific, fibre is extending beyond homes and offices into rooms, devices, and machines. By working together, we can accelerate fibre innovation and adoption to build truly AI-ready infrastructure.”
— Ilham Nandana, Chair of the Market Intelligence Committee, Fiber Network Council APAC (FNCAP)

“We fixed it before you feel it!  AIS is redefining premium home broadband by combining ultra-fast connectivity with AI-driven network intelligence and smart home ecosystem — delivering proactive, invisible service excellence that transforms connectivity into differentiated customer value and sustainable ARPU growth.”
— Thanit Chaiyaboonthanit, Head of Technology Department, Broadband Business, AIS

“Connecting the Unconnected: Affordable Broadband at Scale. Create equal access to global information and empower Indonesia’s digital society.”
— Shannedy Ong, CTO of Surge Indonesia

“Beyond Connectivity: Telkomsel is transforming into a true value creator. By leveraging our FBB market-leading footprint, we power growth through service excellence, customer loyalty, and a next-generation home ecosystem.”
— Stanislaus Susatyo, Director of Sales, Telkomsel Indonesia

“We stopped treating AI as an add-on feature. Instead, our approach at Globe starts with architecture, embedding intelligence into the very core of how we build, how we sell, and how we operate.
AI continuously monitors network health, customer behavior and service quality. Rather than waiting for failures, the system predicts degradation and initiates corrective actions. By maintaining minute-level awareness of network health, our systems automatically resolve 30% of all Wi-Fi issues without any human intervention.”
— Danny Theseira, Head of Broadband Business Group at Globe Telecom

“Huawei is driving the Optics-AI Synergy to foster their collaborative growth. Through AI-ON, operators could build an AI-centric all-optical target network and establish 1-5-20ms latency circles across the Asia Pacific region. AI-ON also supports efficient computing access and usage while delivering an ultimate network experience through gigabit/ultra-gigabit home broadband, accelerating the widespread adoption of AI services.”
— Kim Jin, Vice President & Chief Marketing Officer Optical Business Product Line, Huawei

“Connectivity is not just about technology. It is a lifeline, a platform for opportunity, and a driver of sustainable development. I believe the intersection of connectivity and artificial intelligence will shape the future of smarter, more resilient networks.”
— Dr. Cosmas Zavazava, Director of the Telecommunication Development Bureau, ITU

“Performance and user experience are the essential path to the next-generation WLAN. Based on standards and AI-driven innovation, let’s jointly explore the path to the future autonomous WLAN with all the stakeholders.”
— Dr. Crane H. Yang, Secretary-General, World WLAN Application Alliance (WAA)

“At the summit, NIDA and WBBA signed an MOU to accelerate next-generation network evolution and establish pioneering smart city benchmarks through the co-development of industry standards, the harmonization of global regulations, and the sharing of vertical industry insights.
NIDA focuses on advancing network architecture standards, while WBBA drives global consensus on broadband evolution. This natural strategic complementarity creates vast opportunities for future collaboration.”
— Joey Deng, Secretary-General of NIDA

“ION-2030 develops the global standard for next generation optical networks in the AI era. It provides exceptional AI application and service experience. The WBBA and ITU will jointly accelerate its development, and this is a unique opportunity for Asia-Pacific stakeholders to actively influence the future of optical broadband networks.”
— Dr. Marcus Brunner, Chief Expert Standardization, WBBA WG1 Chair and Vice-Chair of ETSI ISG F5G

“The transition into the AI era demands a high-quality, deterministic digital foundation. By releasing Net5.5G policy guidelines, Malaysia is accelerating the evolution of next-generation network standards based on IPv6, establishing an innovative infrastructure to unleash AI’s value and drive a prosperous digital economy for 2030.”
— Prof. Sureswaran Ramadass, Chair of APAC at IPv6 Council, Industry Partner of WBBA

“The digital economy is thriving across the Asia-Pacific region, with AI emerging as a core catalyst for intelligent transformation. China Mobile International (CMI) is driving regional growth by integrating China’s advanced AI capabilities with comprehensive communications, computing, and AI services. Moving forward, CMI will collaborate closely with industry partners to foster a shared, AI-driven future for the region.”
— Paul Lin, Managing Director of Commercial and Technology, Asia Pacific, China Mobile International

“Next-generation network infrastructure is the oxygen of the intelligent economy. By integrating cutting-edge 800G connectivity with quantum-safe security, HKT is laying the essential foundations to keep Hong Kong’s enterprises highly competitive, secure, and ready for the computing paradigm shifts of tomorrow.”
— Wilson Cheung, Vice President, Broadband Design & Cyber Security, HKT

“The evolution toward Net5.5G AI WAN is an important step in strengthening XLSMART’s transport network for the future. By progressively adopting AI-assisted operations, SRv6, SDN, service differentiation, and higher-capacity transport infrastructure, we are enhancing network intelligence, operational efficiency, and service resilience while supporting long-term sustainability. This transformation is a continuous journey that aligns with the industry’s vision of AI-native broadband networks. Through collaboration with our technology partners and the broader ecosystem, we will continue to develop capabilities that deliver better network performance and support Indonesia’s growing digital connectivity needs.”
— Regie Ginanjar, Head of Transport Autonomy & Orchestration, Transport Network Transformation, XLSMART

“For the AI era, Huawei upgrades the IP bearer network via security resilience, multi-dimensional awareness, and network autonomy. This empowers carriers to guarantee service experience, accelerate monetization, and enhance efficiency, ushering in a new chapter of intelligent connectivity.”
— Arthur Wang, Vice President of Data Communication Product Line, Huawei

A CONVERGING VIEW

Speakers agreed AI is shifting networks from connectivity to intelligent connectivity, as broadband, IP, computing and cross-border infrastructure converge to support innovation and coordination.

WBBA launched the AI-Net Certification, a global benchmark for national policy, industrial ecosystems and network intelligence. XLSmart was named first AI-Net Champion, and Indonesia was among the first with a certified operator, backed by its Net5.5G roadmap.

In another high-profile segment, WBBA Director General Martin Creaner presented the Gigacity Certification to KOMDIGI, SURGE, Telkomsel, AIS, TRUE, HKT and Globe, recognizing regional broadband pioneers.

 

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