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EXPLR ANNOUNCES TOP STUDENT INNOVATORS NAMED NATIONAL STEM CHAMPIONS

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106 students will receive expense-paid trips to the National STEM Festival in Washington, D.C.
EXPLR is founded by Jenny Buccos and co-founded by Kari Byron (former Discovery Channel Mythbuster) and Andrew Zimmern (Bizarre Foods)

NEW YORK, Dec. 18, 2024 /PRNewswire/ — EXPLR announces the 106 students whose outstanding projects have earned them the title of National STEM Champions. These students will be recognized at the National STEM Festival in Washington, D.C., March 19-22, 2025.

Each student and a guardian will receive an expense-paid trip, including lodging and travel, to attend the Festival and showcase their projects to the public and business and government leaders. In addition, each National STEM Champion will receive free access to EXPLR’s educational streaming video and curriculum platform for the teacher of their choice.

EXPLR invited students in grades 7-12 from across the U.S. and its territories to conceive and submit STEM innovations, inventions, and research across six categories: Aerospace Innovation, Environmental Stewardship, Future Food, Health and Medicine, Powering the Planet, and Tech for Good.

“Congratulations to all the students selected as National STEM Champions! EXPLR created the National STEM Festival to spotlight the next generation of innovators—students who are bold thinkers, dynamic leaders, and creators with the power to make a real impact. I’m incredibly excited to welcome our STEM Champions to the Festival this spring, where their ideas will inspire us all,” said Jenny Buccos, Founder & CEO of EXPLR and Co-Director of the National STEM Festival.

In addition to being selected as National STEM Champions, select students were also recognized for the following special awards:

The AISES Indigenous Ingenuity Award recognizes the creativity, ingenuity, and technical prowess of the first scientists by honoring Indigenous students from North American tribes or the Pacific Islands who have developed research projects that answer burning questions or address real-world challenges from their communities.The Congressional Innovation Award recognizes the creativity, ingenuity, and technical prowess of students who have developed outstanding mobile and web applications that address real-world challenges.EXPLR Catalyst Award recognizes an outstanding entrant who demonstrates exceptional ingenuity and a commitment to solving real-world problems through innovative solutions. This award honors an individual whose project relentlessly pursues practical applications to address significant societal challenges with creativity and innovation.The Autodesk Design & Make Champion Award honors one 2025 National STEM Champion for exceptional creativity and innovation in completing a project that demonstrates outstanding skills throughout the entire design and make process.

The following students were named National STEM Champions:

ALABAMA
Aanchal Behara (Birmingham), Ashu Anand (Birmingham)

ALASKA
Sara DeVolld (Soldotna)

AMERICAN SAMOA
Amelie Chen (Pago Pago)

ARIZONA
Humberto Gil Villalobos (Yuma), Akshay Karthik (Chandler), Carmen Martinez (Yuma)

ARKANSAS
Harshith Guduru (Bentonville), Bennet Chen (Little Rock)

CALIFORNIA
David He (San Diego), Shriya Nedumaran (San Jose), Joanna Deng* (Orinda)
*Joanna Deng is also a recipient of the Congressional Innovation Award

COLORADO
Alexander Zhang (Boulder), Anirudh Rao (Highlands Ranch)

CONNECTICUT
Snigtha Mohanraj (New Haven), Tyler Malkin* (Greenwich)
*Tyler Malkin is also the recipient of the Alumni Award

DELAWARE
Cailyn Pan (Wilmington), Riddik Sri Satya Neetipalli (Wilmington)

FLORIDA
Carson Granese (St. Petersburg), Gabriella Weiner (Melbourne), Rudra Patel (Tampa)

GEORGIA
Daniel Li (Suwanee), Hannah Coley (Conyers)
From the NASEF Farmcraft team from Brookwood High School in Snellville: Nakariana Jones, Evie Moore, Sydney King, Indus Lewis, Layla Young, Wren Hall, Ella Foghis Myers

GUAM
Mitekshi Ghosh (Chalan Pago)

HAWAII
Liam Chattergy* (Honolulu), Jinghao Li (Kapolei)
*Liam Chattergy is also a recipient of the Congressional Innovation Award

ILLINOIS
Manaal Siddiqui (Naperville), Sammit Chidambaram (Dunlap)

INDIANA
Sophia Fu (Carmel), Rohan Bhosale (Carmel), Tara Kim (West Lafayette)

IOWA
Amal Eltayib (Iowa City), Ritvik Gupta (Johnston)

KANSAS
Elizabeth Barnes (Overland Park), Mahi Kohli (Olathe)

KENTUCKY
Lucy Teng (Louisville),  Vallabh Ramesh (Louisville)

LOUISIANA
Abigail Qi (Baton Rouge),  Gyeongyun Min (Lake Charles)
From the NASEF Farmcraft team from University View Academy in Baton Rouge: Alanna Piper, Elison Hebert, Diego Santana, Charles Steele

MAINE
Gabriel Kirmani (Limestone)

MARYLAND
Megan Yeager (Hanover), Bryan Hijam (Baltimore)

MASSACHUSETTS
Nichelle Thinagar (Shrewsbury), Sarah Wang (Andover)

MICHIGAN
Chikanma Okoisor (Midland), Elliot LeClair (Midland), Tanay Panja* (Ann Arbor)
* Tanay Panja is also a recipient of the Congressional Innovation Award

MINNESOTA
Tyler Clair (Minnetonka), Kevin Qiu (Plymouth), Surjosnato Dhar (Plymouth)

MISSISSIPPI
Celia Lane (Ridgeland), Pranav Reddy (Ridgeland)

MISSOURI
Elizabeth Saleeby (Saint Louis), Anikait Rawat (Manchester)

MONTANA
Akira Lanes (Bozeman)

NEBRASKA
Dakota Sage (Central City), Thanvi Bhat (Omaha)

NEVADA
Jordan Chong (Reno), Jayna Kim (Las Vegas)

NEW HAMPSHIRE
Viktor Osadsky (Exeter), Jiaxuan Dai (Exeter)

NEW JERSEY
Ishaan Kunwar (Edison), Krithik Alluri (Medford)

NEW MEXICO
Steven Xu (Roswell), Natashia Anderson*  (Farmington)
* Natashia Anderson is also the recipient of the AISES Indigenous Ingenuity Award

NEW YORK
Tristan Burchett* (Brooklyn),  Mai Tran (New York City), Isabella Wissa (Lincolndale), Chase Ende (Harrison)
*Tristan Burchett is also the recipient of the EXPLR Catalyst Award

NORTH CAROLINA
Sakhyata Gurram (Cary), Swayam Shah (Raleigh), Keertana Ramars Jillella Venkata*  (Raleigh)
* Keertana Ramars Jillella Venkata is also a recipient of the Congressional Innovation Award

NORTH DAKOTA
Fatemeh Saeedi (Grand Forks)

NORTHERN MARIANA ISLANDS
Misha Kim (Northern Mariana Island, Saipan)

OHIO
Deepthisri Paruchuri (Columbus), Anuki Mudalige (Delaware)

OKLAHOMA
Caytie Couch* (Quapaw), Emma Zhang (Jenks)
* Caytie Couch is also the recipient of the AISES Indigenous Ingenuity Award

OREGON
Anisha Dhoot (Portland), Liam Aranda-Michel (Lake Oswego), Nidhi Yadalam (Portland)

PENNSYLVANIA
Aadi Deshmukh (Bethlehem), Audrey Rozea (West Chester), Dharunish Yugeswardeenoo (Warrington)

PUERTO RICO
Shanti Isaac (Guaynabo)

RHODE ISLAND 
Jimin Shon (Portsmouth)

SOUTH CAROLINA
Karthik  Arumugam (Mauldin), Sydney Poliakoff (Charleston)

SOUTH DAKOTA
Kambria Tamayo* (Lower Brule),  Lila Vanderlei (Avon),  Steven Swallow (Porcupine)
* Kambria Tamayo is also is also the recipient of the AISES Indigenous Ingenuity Award

TENNESSEE 
Benjamin Taylor (Memphis), Shashank Lahoti (Mount Juliet)

TEXAS
Hasini Leo Jayaraj (Leander),  Adel Sisy* (Manvel)
* Adel Sisy is also a recipient of the Congressional Innovation Award

UTAH
Aadhi Umamageswaran (Salt Lake City), Ian JakeKim (Salt Lake City)

VIRGINIA
Ashrita Gandhari (Alexandria), Ani Nishanian (Chantilly), Linda Pistun (Alexandria)

WASHINGTON
Lakshmi Agrawal (Bellevue), Matthew “Jerry” Yao* (Walla Walla)
*Matthew Yao is also the recipient of the Autodesk Design & Make Champion Award

WISCONSIN
Aditi Muduganti* (Onalaska), Ritisha Dey (Shorewood)
*Aditi Muduganti is also a recipient of the Congressional Innovation Award

WYOMING
Padmalakshmi Ramesh (Laramie), Teagan Thomas (Greybull)

The National STEM Festival, presented by EXPLR, is able to offer inspiring and engaging experiences to participants, both in Washington, D.C. and online, thanks to the support of co-presenting sponsors Autodesk and Broadcom Foundation, in addition to a number of supporting organizations that share a commitment to advancing innovation and STEM education. A full list of sponsors and supporters can be found on the National STEM Festival website.

For media and interview requests or inquiries about National STEM Festival coverage, please contact Skai Blue Media at teamexplr@skaibluemedia.com.

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Firmable breaks into G2’s global top five for momentum in Sales Intelligence

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Firmable earned 17 badges in G2’s Fall 2026 reports and improved its ranking in 28 of the 32 reports it featured in last season, holding its position in the other four.

MELBOURNE, Australia and SAN FRANCISCO, Oct. 27, 2026 /PRNewswire/ — Firmable, the AI-native B2B sales platform, has climbed from #8 to #4 on G2’s global Momentum Grid for Sales Intelligence, which ranks the fastest-rising products in the category worldwide. It also ranked #1 for SMB sales intelligence in both Australia and ANZ and moved into the top 10 across Asia-Pacific.

The results span regional, segment and global reports in both the Sales Intelligence and Lead Intelligence categories. They are based on verified reviews from Firmable customers, alongside G2’s measures of market presence and growth.

Global momentum as Firmable scales in North America

Firmable is now one of the fastest-rising sales intelligence products worldwide. Its jump to #4 on G2’s global Momentum Grid for Sales Intelligence was matched by strong gains in G2’s global satisfaction indexes:

Relationship Index for Sales Intelligence: #3, up from #24Implementation Index for Sales Intelligence: #3, up from #17Results Index for Sales Intelligence: #4, up from #16

The results arrive as Firmable expands across the US and Canada, following its $14 million Series A in March and the launch of the Firmable MCP in July. They were followed by the launch of Tech Intelligence earlier in October.

“G2 rankings come straight from customers, and that’s why these results matter to us,” said Leigh Jasper, co-founder and co-CEO of Firmable. “Customers are telling the market three things: Firmable is easy to work with, fast to roll out, and it delivers results. Those scores climbed the most this season. That’s exactly the proof point sales leaders look for when they evaluate a new platform. We built Firmable as an AI-native product from day one, and teams in North America and elsewhere are responding. Breaking into the global top five for momentum is a strong signal of where we’re headed.”

#1 in Australia and in ANZ

Firmable took the top spot for small-business sales intelligence in both of its home markets. It rose from #2 to #1 on G2’s Small-Business Australia Regional Grid for Sales Intelligence, and from #3 to #1 on the Small-Business ANZ Regional Grid. Firmable also held #1 overall in both Australia and ANZ for Lead Intelligence.

“Ranking top in Australia and ANZ and climbing across Asia-Pacific comes down to one thing: our customers are booking more meetings with less effort,” said Paul Perrett, co-founder and co-CEO of Firmable. “Growing sales teams can’t afford to waste a rep’s day on bad data or cold accounts. We give them verified contacts and buying signals that tell them who to call and when. These results show that approach is working for teams in every market we serve. And with the launch of Tech Intelligence last week, we’re not slowing down.”

Top 10 across Asia-Pacific

Firmable moved into the top 10 for small-business sales intelligence across Asia-Pacific. It climbed from #13 to #10 on G2’s Small-Business Asia Pacific Regional Grid for Sales Intelligence. It also rose from #14 to #9 on the matching Lead Intelligence grid.

Firmable debuted on G2’s Mid-Market Asia Pacific Regional Grid for Sales Intelligence at #13. That reflects growing adoption among larger revenue teams in the region. On the overall Asia Pacific grid for Sales Intelligence, Firmable moved from #18 to #15.

About G2

G2 is the world’s largest and most trusted software marketplace. More than 90 million people annually use G2 to make smarter software decisions based on authentic peer reviews.

About Firmable

Firmable is an AI-native B2B sales platform, your AI sales teammate, that helps revenue teams find, understand and connect with the right buyers at the right time. Combining verified company and contact data with technology intelligence, CRM context, buyer intent and agentic AI, Firmable powers go-to-market teams across the US, Canada and Asia-Pacific. Firmable is ISO 27001 certified. Learn more at firmable.ai.

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KLEVV UNVEILS ALL-NEW CRAS V RGB PRIME DDR5 GAMING/OC MEMORY

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SUPPORTS AMD EXPO™ Technology: Featuring Ultra Low Latency
WITH AWARD-WINNING FLAGSHIP DESIGN

HONG KONG, Oct. 27, 2026 /PRNewswire/ — KLEVV, the leading consumer memory and storage brand introduced by Essencore, unveils the all-new CRAS V RGB PRIME DDR5 Gaming/OC Memory. Purpose-built for elite gaming rigs and demanding creative workloads, this new premium memory unleashes ultra-low CAS latency down to CL26 at 6000 MT/s and blazing overclocking speeds of up to 8000 MT/s at CL38, dressed in a striking black-and-gold finish and armed with dual-platform overclocking support for gamers, PC builders, and performance enthusiasts who demand nothing but the best. 

Refined Flagship Design and Craftsmanship
Building on the aluminum heat spreader design of the flagship CRAS V RGB, winner of both the Red Dot and iF Design Awards, the CRAS V RGB PRIME introduces a striking new black-and-gold interpretation of the series’ signature look.

An advanced hard-anodizing process, combined with a specialized surface treatment, gives the modules a smooth, piano-lacquer-like sheen that adds depth and sophistication from every angle. The result is an understated yet luxurious aesthetic that offers users a fresh, premium design choice while preserving the refined craftsmanship of the original CRAS V RGB.

High-Speed Performance with Lower Latency
The CRAS V RGB PRIME further advances KLEVV’s DDR5 overclocking memory lineup with tested speeds of 6000, 6400, and 8000 MT/s and CAS latencies of CL26, CL28, and CL38, respectively.

The 6000 MT/s configuration features tested timings of 26-36-36-76, while the 6400 MT/s configuration delivers timings of 28-38-38-78. For users seeking extreme frequencies, the 8000 MT/s models operate at tested timings of 38-48-48-128. All configurations are tested at 1.4V.

The 6000 and 6400 MT/s configurations are available in dual-channel kits ranging from 32GB (16GBx2), 64GB (32GBx2), to 128GB (64GBx2), while the 8000 MT/s models are offered in both 32GB (16GBx2) and 48GB (24GBx2) kits. This diverse range gives users greater flexibility to select the ideal balance of speed, latency, and capacity for their systems.

Next-Generation AMD EXPO™ Technology: Featuring Ultra Low Latency
“AMD EXPO™ Technology: Featuring Ultra Low Latency” is the latest evolution of AMD’s established memory overclocking technology. The new AMD EXPO ULL profile incorporates optimized memory sub-timing settings designed to reduce latency and improve overall performance on compatible AMD platforms. As the first product in KLEVV’s overclocking memory lineup to adopt this technology, the CRAS V RGB PRIME delivers a more responsive gaming and overclocking experience.

The 6000 MT/s and 6400 MT/s 32GB (16GBx2) configurations are certified for AMD EXPO Ultra Low Latency. According to AMD, certified Ultra Low Latency memory can deliver an average 4% improvement in FPS compared with non-ULL AMD EXPO memory on compatible systems.*

Broad Intel and AMD Platform Support
Offering broad support across the latest desktop platforms, the CRAS V RGB PRIME is compatible with AMD Ryzen™ processors on the AM5 platform and Intel® Core™ Ultra 200S Plus processors.

Each kit comes preloaded with both Intel® Extreme Memory Profile and AMD EXPO™ Technology overclocking profiles, allowing users to unlock high-speed performance through a simple BIOS setting on compatible motherboards with supported BIOS versions. With both profiles included, users can confidently choose their preferred speed and capacity without the hassle of selecting separate Intel- or AMD-specific models.

Premium Components for Uncompromising Stability
The CRAS V RGB PRIME features rigorously screened, high-quality memory ICs from a leading Korean manufacturer, ensuring consistent high-speed performance and exceptional stability under demanding workloads.

Paired with a high-density 10-layer PCB, the modules deliver enhanced signal integrity and greater resistance to interference during high-speed operation. Integrated PMIC and on-die ECC technologies further support stable power management and long-term reliability, creating a robust foundation for gaming and overclocking performance.

To ensure broad compatibility, the CRAS V RGB PRIME has also been validated on the QVLs (Qualified Vendor Lists) of four major motherboard manufacturers. Its RGB lighting supports ASUS Aura Sync, GIGABYTE RGB Fusion, MSI Mystic Light Sync, and ASRock Polychrome Sync, allowing users to seamlessly coordinate lighting across compatible components and systems.

A Complete DDR5 Gaming/OC Memory Lineup
The introduction of the CRAS V RGB PRIME further expands KLEVV’s comprehensive DDR5 Gaming/OC memory portfolio.

With the CRAS, URBANE, BOLT, and FIT series available across a wide range of designs and specifications, KLEVV continues to provide flexible memory choices for different performance requirements, system configurations, and aesthetic preferences.

Warranty and Availability
The CRAS V RGB PRIME DDR5 comes with a limited lifetime peace of mind warranty and will be available from November 2026. Please visit the KLEVV website to check product availability across online and offline retail channels. 

ABOUT KLEVV
KLEVV is a premium brand of Essencore, a major vendor of memory modules and NAND flash application products. The KLEVV range focuses on high-performance gaming memory modules and solid-state drives, engineered for enthusiasts who demand world-class quality and reliability. KLEVV memory and SSD products have been recognized with Germany’s Red Dot Design Award and iF Design Award for their innovative design. For more information, please visit www.klevv.com.

ABOUT ESSENCORE
Established in 2014, Essencore Limited aims to become the world’s top vendor of DRAM modules and NAND flash application products. The company started with one goal: to “Change the world and be a leader in semiconductor distribution.” The business strategies of Essencore are to adopt the newest technologies to differentiate themselves from competitors, deliver dedicated Memory products, and offer various product portfolios for customers’ competition readiness. For more information, please visit www.essencore.com.

*Based on AMD testing. Actual performance may vary depending on processor, motherboard, BIOS version, memory configuration, and application workload.

Overclocking and/or Undervolting AMD processors and memory, including without limitation, altering clock frequencies / multipliers or memory timing / voltage, to operate outside of AMD’s published specifications will void any applicable AMD product warranty, even when enabled via AMD hardware and/or software. This may also void warranties offered by the system manufacturer or retailer. Users assume all risks and liabilities that may arise out of overclocking / undervolting AMD processors, including, without limitation, failure of or damage to hardware, reduced system performance and/or data loss, corruption or vulnerability. GD-106.

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CDNetworks’ Cybersecurity Capabilities in APAC Recognized in IDC China’s 2026 Assessment

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Combining global network reach, AI-powered security, and local expertise, CDNetworks helps enterprises protect critical applications and operate securely across diverse APAC markets.

SINGAPORE, Oct. 28, 2026 /PRNewswire/ — CDNetworks, the APAC-leading network to deliver edge as a service, has been recognized in IDC China’s 2026 assessment of cybersecurity product and service capabilities across Asia-Pacific markets. CDNetworks received the highest ratings of five stars in six markets: Hong Kong SAR, Vietnam, Singapore, Japan, Malaysia, and South Korea, highlighting its cybersecurity expertise, extensive regional presence, and ability to address diverse security needs across APAC.

The assessment examines providers’ security offerings, regional operations, and service delivery across APAC. It highlights CDNetworks’ strengths in:

Extensive Global Infrastructure: With over 3,000 global Points of Presence and China CDN capabilities, CDNetworks supports secure, high-performance digital delivery across APAC, including cross-border acceleration for businesses serving users in mainland China.Strong APAC Presence and Local Expertise: Established local service teams in key APAC markets, including Singapore, Malaysia, Vietnam, Japan, South Korea, and China, provide multilingual consultation, solution design, deployment, and 24/7 technical support tailored to local business needs.Advanced WAAP and AI-Powered Security: CDNetworks delivers comprehensive Web Application and API Protection (WAAP), combining DDoS protection, intelligent WAF, bot management, API security, and AI-powered security operations to safeguard business-critical applications, detect emerging threats, and accelerate incident response.Adaptability to Diverse APAC Markets: CDNetworks adapts its services to different network environments, industry-specific requirements, and applicable data protection regulations, including PDPA and GDPR, helping enterprises address local market needs while maintaining consistent security standards.

“IDC’s recognition is an encouraging acknowledgment of our ongoing efforts to advance cybersecurity across APAC,” said Antony Li, APAC Head of Sales at CDNetworks. “As AI creates new opportunities and security challenges, businesses across APAC need protection that works consistently across markets while adapting to local requirements. We will continue investing in intelligent security and local expertise to help our customers innovate securely and build long-term digital resilience.”

About CDNetworks

As the APAC-leading network with over 3,000 global Points of Presence and more than 20 years of technology experience, CDNetworks delivers the fastest and most secure digital experiences to end users. Our diverse products and services include web performance, media delivery, cloud security, edge computing, zero-trust security, and colocation services, all designed to spur business innovation.

To learn more, visit cdnetworks.com and follow us on LinkedIn.

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