HSINCHU, Taiwan, May 6, 2026 /PRNewswire/ — Gemtek Technology Company Ltd, a global leader in advanced networking solutions, today announced the AiPhoton 1.6T OSFP transceiver. Built in collaboration with NewPhotonics®, a pioneer in photonic integrated circuits, the module features the NPG10204 DR8 PIC transmitter-on-chip. This latest PIC-based pluggable enables simplified manufacturing of photonic ICs delivering advanced DSP functionality in octal channel 224Gbps per lane for scale-out interconnect solutions at hyperscaler AI data centers.

The multi-channel monolithic PIC with integrated laser and modulator offers single-mode PAM4 (IMDD) with low power and improved signal integrity for 200G/channel applications. The highly integrated flip chip eliminates complex optical assembly and wire-bonding steps, simplifying manufacturing challenges to improve yield maturity, reliability, and efficiencies that accelerate time to deployment.

“With the introduction of AiPhoton we are well-positioned to meet the hyperscaler shift into high-volume demand for 1.6T pluggables,” said James Lee, President, Gemtek. “Our automated manufacturing capabilities, combined with the highly integrated NewPhotonics PIC designed for fast, reliable time-to-market production, ensure next-gen connectivity solution availability that fills the supply gap driven by AI.”

The AiPhoton 1.6Tbps DR8 OSFP module design introduces a new generation of low-power transceivers that can be produced at volume and quality scale.

“Gemtek demonstrates how integrated advanced silicon photonics translates directly into scalable, power-efficient 1.6T connectivity for AI infrastructure,” said Doron Tal, SVP and GM of Optical Connectivity at NewPhotonics. “Combining our laser-integrated PIC with Gemtek’s proven high-volume manufacturing capabilities enables a new class of 200G-per-lane pluggables designed to meet the market’s urgent need for 1.6T optics at hyperscale.”

To learn more about Gemtek products and the AiPhoton pluggable transceiver modules, please visit https://www.gemteks.com/en.

Gemtek Technology
Founded over three decades ago, Gemtek Technology is a global leader in communication modules and advanced networking solutions. Renowned for its innovation and quality, Gemtek partners with leading telecom operators and global brands to shape the future of connectivity through high-performance modules and integrated systems. For more information, visit https://www.gemteks.com/.

NewPhotonics
NewPhotonics® is a fabless semiconductor company delivering innovative photonic IC solutions that scale hyperscaler and data center interconnect for AI cluster performance. The company’s laser-integrated PICs and OSPic™ optical signal processing enable market-disrupting energy efficiency and production simplicity for DSP and LPO+ pluggable, NPO, and CPO chip solutions. Founded in 2020, NewPhotonics is privately held and funded. For more information, visit www.newphotonics.com.

Contacts:
sales@gemteks.com, +88635985535
press.relations@newphotonics.com,+97236143147

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SOURCE Gemtek Technology Co. Ltd

Tianma, a leading global manufacturer of flat panel displays, will showcase its latest consumer display innovations at SID Display Week 2026, taking place May 5-7 at the Los Angeles Convention Center. Tianma’s consumer display portfolio, featured at Booth 805 in the South Hall, includes a range of AMOLED and LTPS-LCD technologies engineered for next-generation smartphones, wearables, and personal electronic devices. The lineup highlights advancements in OLED material systems, high-efficiency device structures, and high-performance backplanes, supporting improved brightness, lower power consumption, and increasingly compact and flexible product designs.

CHINO, Calif., May 6, 2026 /PRNewswire-PRWeb/ — Tianma, a leading global manufacturer of flat panel displays, will showcase its latest consumer display innovations at SID Display Week 2026, taking place May 5-7 at the Los Angeles Convention Center.

Tianma’s consumer display portfolio, featured at Booth 805 in the South Hall, includes a range of AMOLED and LTPS-LCD technologies engineered for next-generation smartphones, wearables, and personal electronic devices. The lineup highlights advancements in OLED material systems, high-efficiency device structures, and high-performance backplanes, supporting improved brightness, lower power consumption, and increasingly compact and flexible product designs.

“Consumer display innovation continues to center on balancing performance, power efficiency, and form factor flexibility,” said Dale Maunu, Director of Marketing, Tianma America. “Our latest portfolio reflects ongoing advancements in OLED materials, device architecture, and high-performance LCD technologies, enabling brighter, more efficient, and more immersive user experiences across smartphones, wearables, and other personal devices.”

Tianma’s key smartphone demonstrations at Display Week 2026 include:

6.78″ SLOD AM-OLED Display – This display utilizes Tianma’s proprietary Stacked Layer OLED Device (SLOD) technology. Unlike traditional tandem-stacked OLED designs, Tianma’s approach introduces a Charge Generation Layer (CGL) with exceptionally low device voltage and a differentiated light-emitting unit. This structure achieves superior luminous efficiency – where one emissive layer, in combination with another, produces more light than two conventional layers. Compared to a single-layer device, power consumption is reduced by 30%, brightness is increased by 25%, and lifespan is extended up to four times, supporting longer battery life and improved durability.

6.58″ U11 AM-OLED Display – This 6.58-inch AM-OLED display adopts Tianma’s U11 OLED stack, featuring NFT (New Fluorescent Technology) based on New Fluorescent Blue (NFB) and Phosphor-Sensitized Fluorescence (PSF). The NFT device structure improves exciton utilization efficiency, addressing limitations of conventional OLED emitters. Compared with the previous generation, U11 reduces overall power consumption by approximately 12% while doubling lifespan. Optimized RGB spectrum and light-extraction design also enable an ultra-low blue-light ratio while maintaining high efficiency.

6.32″ Ultra-high Refresh Rate AM-OLED Display – This 6.32-inch FSD (Full Screen Display) AM-OLED integrates a 240Hz refresh rate with a dual-track pixel driving architecture to overcome the traditional trade-off between speed and precision. By separating data writing and TFT threshold compensation, the design enables stable and accurate pixel driving at high refresh rates. Extended compensation time (0.6µs to 6µs) preserves low-gray detail, reduces motion artifacts, and improves image stability.

6.9″ Creaseless AM-OLED Display – This foldable 6.9-inch AM-OLED minimizes both visual crease and tactile discontinuity through an optimized module stack and fold structure. The design incorporates an ultra-thin stack, ultra-low loss adhesive materials, water-drop bending architecture, and multi-layer stress optimization. A dual-coating UTG structure further reduces deformation and improves rebound performance at the fold.

Together, these demonstrations highlight Tianma’s expanding role in enabling next-generation handheld display applications, combining advanced materials, OLED device innovation, and high-performance LCD technologies to support more efficient, immersive, and adaptable experiences across smartphones, wearables, and personal electronic devices.

More information about the innovative new display solutions being displayed by Tianma is available at Booth 805 at Display Week and in the Tianma press kits, accessible online at usa.tianma.com/press. Visit usa.tianma.com for more details.

Additional details can be found at usa.tianma.com.

About Tianma America, Inc.

Tianma America delivers advanced display solutions for the Americas, leveraging the global resources and innovation of the Tianma Group. Our expertise spans small to medium-size displays for a wide range of applications, including automotive, industrial, medical, consumer electronics, and emerging technologies.

As part of the Tianma Group, we combine world-class R&D with manufacturing capabilities across China and Japan to offer cutting-edge technologies such as TFT, LTPS, Oxide-TFT, AMOLED, flexible and transparent displays, and integrated touch solutions.

Through a strong network of distributors and partners, Tianma America provides complete display module solutions that meet the highest standards of quality and performance.

For more information, visit us at usa.tianma.com or connect with us on LinkedIn.

Specifications and pricing are subject to change without notice.

Media Contact

Dale Maunu, Tianma America, 1 408-313-5642, dale.maunu@tianma.com, usa.tianma.com

Bill Maurer, Macrovision, Inc., 1 215-327-8109, bill@macrovis.com, www.macrovis.com

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SOURCE Tianma America

NEW YORK, May 5, 2026 /PRNewswire/ — Vernal Capital Acquisition Corp. (NYSE: VECA) (“Vernal”) announced the pricing of its initial public offering (the “IPO”) of 10,000,000 units at $10.00 per unit. The units are expected to trade on the New York Stock Exchange (“NYSE”) under “VECAU” beginning May 6, 2026. Each unit consists of one ordinary share and one right to receive one-fourth of one ordinary share upon consummation of an initial business combination. Upon separate trading, the ordinary shares and rights are expected to be listed on NYSE under “VECA” and “VECAR,” respectively.

D. Boral Capital LLC is acting as sole book-running manager of the offering. The underwriters have a 45-day option to purchase up to 1,500,000 additional units to cover any over-allotments. The offering is expected to close on May 7, 2026, subject to customary closing conditions.

A registration statement for these securities was declared effective by the SEC on May 5, 2026. The offering is made only by means of a prospectus. Copies of the prospectus may be obtained, from D. Boral Capital LLC, 590 Madison Ave., 39th Floor, New York, New York 10022, by telephone at (212) 970-5150 or by email at dbccapitalmarkets@dboralcapital.com.

This press release shall not constitute an offer to sell or to buy, nor shall there be any sale where such offer, solicitation or sale would be unlawful prior to registration or qualification under the applicable securities laws.

About Vernal

Vernal is a blank check company formed to effect a merger, share exchange, asset acquisition, share purchase, reorganization or similar business combination with one or more businesses. Vernal’s target search will not be limited to a particular industry or geographic region.

Forward-Looking Statements

This press release contains “forward-looking statements,” including statements regarding Vernal’s IPO. These statements are subject to risks and uncertainties that could cause actual results to differ materially. No assurance can be given that the offering will be completed on the terms described, or at all. Forward-looking statements are subject to numerous conditions, beyond Vernal’s control, including those in the Risk Factors section of Vernal’s registration statement filed with the SEC. Copies are available on the SEC’s website, www.sec.gov. Vernal disclaims any obligation to release publicly updates or revisions to any forward-looking statements to reflect any change in Vernal’s expectations, except as required by law.

Contact

Binghan Yi, CFO
binghan@vernal.com
www.vernalspac.com

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SOURCE Vernal Capital Acquisition Corp.