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Advanced Semiconductor Packaging Market Forecast to Grow at 7.5% CAGR Through 2031 – Find Out Why | Valuates Reports

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BANGALORE, India, April 24, 2025 /PRNewswire/ — Advanced Semiconductor Packaging Market is Segmented by Type (Fan-Out Wafer-Level Packaging (FO WLP), Fan-In Wafer-Level Packaging (FI WLP), Flip Chip (FC), 2.5D/3D), by Application (Telecommunications, Automotive, Aerospace and Defense, Medical Devices, Consumer Electronics).

The Advanced Semiconductor Packaging Market was valued at USD 18090 Million in the year 2024 and is projected to reach a revised size of USD 29800 Million by 2031, growing at a CAGR of 7.5% during the forecast period.

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Major Factors Driving the Growth of Advanced Semiconductor Packaging Market:

The advanced semiconductor packaging market is poised for robust, double digit growth through 2030 as value creation shifts decisively from front end scaling to back end integration. Demand for heterogeneous chiplet architectures, high bandwidth memory stacks, ultra thin fan out modules, and automotive grade power packages is expanding. Continuous 5 G densification, cloud AI acceleration, and electric vehicle adoption keep volumes rising and average selling prices escalating, even as substrate and equipment supply tightens.

With sustainability goals favouring yield efficient known good die assembly and governments underwriting regional resiliency, the market is set to outpace the broader semiconductor industry, cementing advanced packaging as the chief engine of performance and profitability in the silicon value chain.

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TRENDS INFLUENCING THE GROWTH OF THE ADVANCED SEMICONDUCTOR PACKAGING MARKET:

Flip chip packaging energises the advanced semiconductor packaging landscape by eliminating long wire bonds and replacing them with dense arrays of solder bumps that connect the die face down to the substrate. The ultra short electrical path lowers inductance, cuts signal latency, and boosts bandwidth—precisely the performance mix demanded by AI accelerators, high end mobile SoCs, and data centre GPUs. FC’s excellent thermal profile distributes heat efficiently across copper pillars, enabling higher power envelopes without throttling. Yield learning on 3 nm and 2 nm nodes has driven down bump pitch variability, making FC the default choice for heterogeneously integrated chiplets as well as monolithic dies. As fabless giants push multi die systems, FC capacity expansion directly converts into market wide revenue uplift.

Fan out WLP sidesteps the substrate entirely, redistributing I/O in epoxy mould compound and delivering ultra thin packages ideal for space constrained devices. By decoupling die size from I/O count, FO WLP unlocks high pin count connectivity for wearables, true wireless earbuds, RF front ends, and millimetre wave 5 G modules. The ability to singulate multiple known good dies on a reconstituted wafer trims test time and boosts overall yield. Simpler stack ups translate to fewer materials and lower assembly cost relative to FC substrates, extending advanced packaging economics to mid range handsets and IoT sensors. As panel level fan out lines ramp in Korea, Taiwan, and China, the technology’s keen cost per area advantage is widening its addressable market and fuelling sustained revenue growth.

Automotive electrification and autonomy require rugged, high reliability packaging that survives extreme temperature cycles, vibration, and humidity over 15 plus year lifetimes. ADAS domain controllers, radar, LiDAR, battery management ICs, and power inverters now employ advanced packaging—embedded die, FC CSP, and molded array packages—to meet stringent AEC Q100 Grade 0 standards. Meanwhile, zonal E/E architectures multiply the number of high speed SerDes links in a vehicle, driving demand for advanced substrates with sub 10 µm line width/spacing. Automakers’ push for over the air update capability places server class processors under the hood, intensifying the need for high density interposers and chiplet based designs. As electric vehicle volumes climb, long term supply agreements between tier one OSATs and OEMs lock in robust, multi year growth for advanced semiconductor packaging.

The shift from monolithic scaling to heterogeneous integration is propelling demand for advanced packaging as the primary vehicle for combining logic, memory, analog, and photonics dies in a single system in package. High density interposers, hybrid bonding, and through silicon vias allow designers to mix process nodes cost effectively, squeezing more functionality into smaller footprints while sidestepping reticle limits and yield cliff risks. The move brings architectural freedom that conventional wire bond could never match, positioning advanced packaging as a critical enabler of continued silicon centric innovation despite slowing Moore’s law node progression.

Ubiquitous 5 G base stations, open RAN radios, and edge AI gateways rely on RF front end modules and high performance baseband processors that can only meet thermal and signal integrity targets through advanced fan out, FC BGA, or system in package approaches. Carrier aggregation, beam forming, and ultra low latency requirements all drive higher bandwidth density, tighter phase noise, and harsher heat loads—parameters that modern packaging resolves far better than legacy solutions. As telcos spread mmWave and sub 6 GHz coverage, orders for multi chip, antenna in package modules scale in lock step with network densification.

Large language model training, graph analytics, and computational lithography require massive chip to chip bandwidth inside servers. Silicon interposers with micro bump pitches under 40 µm deliver terabytes per second of parallel throughput between logic tiles and HBM stacks, slashing energy per bit and shrinking board level congestion. Hyperscalers’ appetite for AI accelerators forces OSATs to develop bigger organic substrates, advanced underfills, and multi bridge configurations, translating directly into higher ASPs and multi year capacity investments.

Power electronics for traction inverters and fast chargers call for wide bandgap GaN and SiC dies co packaged with control ICs on high thermal conductivity substrates such as AlN or SiN. Advanced packaging enables epoxy mould compound alterations to withstand 500 A per phase, while integrated heat spreaders lower junction temperatures. Sensor fusion ECUs and domain controllers likewise consolidate into high pin count packages, further expanding automotive share of the total addressable market.

Demand for sleeker smartphones, AR glasses, and health monitoring wearables compresses z height budgets, pushing OEMs toward fan in WLP, FO PLP, and moulded core embedded packages. The reduction in discrete components per board frees up battery space, enhances water resistance, and shortens design cycles. As brands fight for feature differentiation within pocket size constraints, advanced packaging’s ability to co integrate MEMS, PMICs, and RF circuits sustains its growth momentum.

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ADVANCED SEMICONDUCTOR PACKAGING MARKET SHARE:

Asia Pacific dominates volume with Taiwan and South Korea housing the world’s largest OSATs and foundry adjacent packaging lines, but mainland China’s accelerated investment is narrowing the gap. North America leads in advanced interposer R&D thanks to hyperscaler co development, while Europe’s automotive strength sustains steady demand for rugged packages. Emerging hubs in India and Southeast Asia benefit from supply chain diversification, collectively creating a vibrant, geographically stratified demand profile.

Key Companies:

IMF GmbHAmkorSPILIntel Corp.JCETASETFMETSMCHuatianPowertech Technology IncUTACNepesWalton Advanced EngineeringKyoceraChipbondChipMOS

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DISCOVER MORE INSIGHTS: EXPLORE SIMILAR REPORTS!

Semiconductor Advanced Packaging Market was estimated to be worth USD 15670 Million in 2023 and is forecast to a readjusted size of USD 26270 Million by 2030 with a CAGR of 7.5% during the forecast period 2024-2030.Semiconductor Advanced Packaging Materials Market was valued at USD 13610 Million in the year 2024 and is projected to reach a revised size of USD 28050 Million by 2031, growing at a CAGR of 10.2% during the forecast period.Advanced Packaging Inspection and Metrology Equipment Market was valued at USD 817 Million in the year 2024 and is projected to reach a revised size of USD 1530 Million by 2031, growing at a CAGR of 9.5% during the forecast period.Semiconductor Packaging and Test Systems Market was valued at USD 14540 Million in the year 2024 and is projected to reach a revised size of USD 21780 Million by 2031, growing at a CAGR of 6.0% during the forecast period.Advanced Packaging Inspection Systems market is projected to grow from USD 419.7 Million in 2024 to USD 723.5 Million by 2030, at a Compound Annual Growth Rate (CAGR) of 9.5% during the forecast period.Mold Release Film for Semiconductor Packaging MarketAdvanced Packaging Lithography Equipment MarketAdvanced Packaging Interconnect Electroplating Solution MarketTin Plating Solution for Semiconductor Packaging Market3D-IC Packaging Market was valued at USD 18470 Million in the year 2024 and is projected to reach a revised size of USD 29850 Million by 2031, growing at a CAGR of 7.2% during the forecast period.Advanced Packaging for Automotive Chips market was valued at USD 463 Million in 2023 and is anticipated to reach USD 969.1 Million by 2030, witnessing a CAGR of 11.7% during the forecast period 2024-2030.

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Meridian Singapore Immigration Launches New Website to Simplify the PR Application Journey for Foreigners in Singapore

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New online platform provides clear, structured guidance for Employment Pass and S Pass holders navigating Singapore’s residency and Permanent Residency pathways

SINGAPORE, April 30, 2026 /PRNewswire/ — Meridian Singapore Immigration Pte. Ltd. has officially launched its new website at meridianimmigration.sg, a resource built specifically for foreigners living and working in Singapore who are exploring Permanent Residency or long-term residency options.

The platform arrives at a time when Singapore’s expatriate and foreign professional community is growing rapidly, yet many EP and S Pass holders report struggling to find clear, reliable information on the PR application process. Singapore’s immigration framework is among the most structured in Southeast Asia, with eligibility criteria, documentation requirements, and submission windows that change frequently. For individuals navigating this process without professional guidance, the stakes are high and the margin for error is narrow.

Meridian’s website was built to address that gap directly. The platform offers detailed explanations of available immigration pathways, structured consultation options, and educational resources developed by the firm’s team of immigration specialists. Rather than presenting a services catalogue, the site walks users through the considerations relevant to their specific situation, whether they hold an Employment Pass, S Pass, or are planning for their family’s long-term residency in Singapore.

“We built this platform because we saw how overwhelming and confusing the immigration process can be for people who genuinely want to build their lives here,” said a spokesperson for Meridian Singapore Immigration. “Our goal is to be the trusted partner that walks them through every step with clarity and integrity.”

Singapore’s continued attractiveness as a regional hub for multinational corporations, financial institutions, and technology firms means the pipeline of foreigners seeking long-term residency options remains substantial. At the same time, the ICA’s PR application framework has grown more nuanced, with factors such as economic contributions, family ties, and community integration weighed during assessment. Applicants who proceed without a clear understanding of these criteria often submit applications that are either premature or structurally incomplete.

Meridian’s approach centres on preparation and transparency, helping applicants understand where they stand before they apply and what supporting documentation strengthens their case.

Meridian Singapore Immigration Pte. Ltd. is a professional immigration consultancy dedicated to guiding individuals and families through Singapore’s immigration process. Specialising in Permanent Residency (PR) applications, residency pathways, and compliance support, Meridian offers clear, structured solutions tailored to each client’s unique circumstances. Founded on the values of Guidance, Integrity, and Success, Meridian is committed to making immigration simple, transparent, and accessible for everyone. For more information, visit meridianimmigration.sg or contact info@meridianimmigration.sg / +65 8873 1113.

 

View original content:https://www.prnewswire.com/apac/news-releases/meridian-singapore-immigration-launches-new-website-to-simplify-the-pr-application-journey-for-foreigners-in-singapore-302757392.html

SOURCE Meridian Singapore Immigration Pte. Ltd.

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Socomec, Daitron team up to meet Japan’s growing power demands

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TOKYO, April 30, 2026 /PRNewswire/ — Socomec, a century-old electrical group specialising in mission-critical energy, and Japan’s Daitron, an electronics components distributor, have signed a partnership to deliver power conversion solutions and service backup power and electrical-switching systems across Japan.

The deal combines Socomec’s equipment with Daitron’s on-the-ground engineering team, which has more than 74 years of experience in the Japanese market. The two companies will handle everything from project delivery to ongoing maintenance and spare parts.

The partnership covers three product areas: uninterruptible power supplies (UPS), which keep facilities running during outages; power conversion systems, which ensure the availability and continuity of high-quality energy; and static transfer switches, which automatically reroute power loads between sources without interruption.

Beyond equipment sales, the agreement includes training, spare parts, long-term service contracts and a full range of expert services covering prevention, measurement and analysis, consultancy, deployment and optimisation. Socomec will provide product and technical training to Daitron’s team, while Daitron handles installation, servicing and day-to-day client support in Japan.

The target market spans data centres, semiconductor plants, industrial facilities, hospitals and green buildings, all areas where even brief power interruptions can prove costly. Data center demand in particular is surging, driven by the rapid expansion of artificial intelligence infrastructure, with colocation and enterprise facilities among the primary targets.

“Daitron knows the Japanese market inside and out. They have the people, the relationships, and the hands-on experience, and we bring the technology to match,” said Socomec Asia-Pacific CEO O’Niel Dissanayake. “It’s a natural fit, and together we can offer something neither company could deliver alone.”

“Japan’s data centres, chip factories and industrial plants all require power systems they can count on,” said Masaharu Kato, corporate officer of Daitron. “Socomec’s technology is exactly what these customers need, and our job is to make sure it’s installed, maintained and supported properly. That’s what we do best.”

The partnership comes as Japan faces a step change in power demand. Electricity consumption is expected to grow 5.3% over the next decade, driven by data centres and semiconductor factories, according to the country’s grid operator. Industrial energy demand alone is forecast to rise 18.3% over the same period.

That growth is creating strong demand for reliable power infrastructure. Data centres, for example, run around the clock and cannot afford downtime, making backup power and efficient energy management essential. Socomec’s systems are designed to reduce power consumption without sacrificing reliability, a balance that is becoming increasingly important as operators look to manage both costs and environmental commitments.

Both companies say project planning and bids are already underway, with a long-term goal of expanding the partnership’s reach across Japan as demand grows.

About Daitron

Daitron Co., Ltd. is a Japanese engineering and trading company founded in 1952 and headquartered in Osaka. Listed on the Tokyo Stock Exchange (TYO: 7609), Daitron sells and manufactures electronic components, semiconductor processing equipment and power supply systems. The company has more than seven decades of experience serving Japan’s electronics and manufacturing industries.

SOCOMEC: When energy matters

Founded in 1922, SOCOMEC is an independent industrial group of more than 4,800 experts spread across the world in 30 subsidiaries. Our vocation: design, manufacture and sale of electrical equipment, with a strong expertize in critical power applications. In 2025, SOCOMEC achieved a turnover of 997 million euros (not yet audited).

View original content to download multimedia:https://www.prnewswire.com/apac/news-releases/socomec-daitron-team-up-to-meet-japans-growing-power-demands-302755570.html

SOURCE Socomec

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Multi-Destination Travel Surges Across Asia-Pacific This Labour Day, Trip.com Group Data Shows

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Multi-city travel across Asia-Pacific grew 35% year-on-yearMulti-city travel outpaces single-destination growth by more than 2xSoutheast Asia sees strong double-digit growth, with Thailand up to 52% YoY

SINGAPORE, April 29, 2026 /CNW/ — Multi-city travel across Asia-Pacific grew 35% year-on-year this Labour Day period, according to data from Trip.com Group. Several Asia-Pacific markets including Japan, South Korea, parts of Southeast Asia and Mainland China celebrate Labour Day, driving strong cross-border and domestic travel flows across the region.

Over 30% of international trips now span multiple destinations, highlighting a continued shift towards more complex, itinerary-led travel. This shift reflects a growing preference to maximise time and value with multiple destinations within a single trip rather than a single location.

Multi-destination trips become a defining travel pattern

While single-destination travel continues to account for most bookings, growth is increasingly driven by more complex itineraries. Multi-destination bookings are growing at more than twice the pace of single-destination travel, reflecting stronger demand for flexibility and deeper exploration.

Travellers are increasingly structuring trips across multiple cities to maximise both time and value, with popular combinations including:

Tokyo – Osaka – Kyoto (Japan)Seoul – Busan (South Korea)Bangkok – Phuket (Thailand)

These itineraries reflect a growing preference for multi-stop journeys that blend urban experiences with leisure destinations.

Southeast Asia sees fast growth in multi-destination travel 

Across Southeast Asia, demand for multi-destination travel is rising steadily, with strong growth across key markets of Thailand: 52%, Malaysia: 40%, and Singapore: 17%, according to Trip.com Group data.

Top outbound destinations across Southeast Asian markets include Japan (Tokyo, Osaka), South Korea (Seoul), China (Shanghai, Beijing), Thailand (Bangkok), Indonesia (Bali).

In other parts of Asia such as Hong Kong SAR, multi-destination travel also grew by over 50% year-on-year, highlighting growing preference for more complex itineraries over traditional single-destination trips, particularly in well-connected urban markets.

In Mainland China, domestic travel remains a strong base, while overseas journeys are increasingly shaped by multi-destination itineraries, with over 40% of outbound trips spanning multiple destinations and continuing to grow.

This suggests that travellers in this region are increasingly combining multiple cities within a single trip, supported by strong regional connectivity.

Japan’s domestic travel momentum on the rise

Japan is also seeing shifts in domestic travel behaviour, even as outbound demand continues to grow.

In Japan, domestic travel is growing rapidly, indicating rising interest in travelling within the country, accounting for one-quarter of all flight bookings, and to cities such as Tokyo, Sapporo and Okinawa.

Intra-Asia travel dominates Labour Day demand

The Labour Day holiday period continues to be driven by regional travel within Asia-Pacific, with travellers favouring destinations that offer ease of access, diverse experiences, and flexible itineraries.

The Group’s data highlights the continued strength of short-haul travel, supported by strong connectivity and shorter flight durations.

More broadly, the way people travel across Asia-Pacific is evolving. Travellers taking a more deliberate approach to how they plan their trips. While cross-border journeys are increasingly shaped by multi-city itineraries, domestic travel remains a strong and steady part of the landscape. Together, these patterns point to a more flexible and value-conscious mindset, as travellers look to make the most of both time and budget.

About Trip.com Group

Trip.com Group is a leading global travel service provider comprising of Trip.com, Ctrip, Skyscanner, and Qunar. Across its platforms, Trip.com Group helps travellers around the world make informed and cost-effective bookings for travel products and services and enables partners to connect their offerings with users through the aggregation of comprehensive travel-related content and resources, and an advanced transaction platform consisting of apps, websites and 24/7 customer service centres. Founded in 1999 and listed on NASDAQ in 2003 and HKEX in 2021, Trip.com Group has become one of the best-known travel groups in the world, with the mission “to pursue the perfect trip for a better world”. Find out more about Trip.com Group here: group.trip.com.

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SOURCE Trip.com Group

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