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Advanced Semiconductor Packaging Market Forecast to Grow at 7.5% CAGR Through 2031 – Find Out Why | Valuates Reports

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BANGALORE, India, April 24, 2025 /PRNewswire/ — Advanced Semiconductor Packaging Market is Segmented by Type (Fan-Out Wafer-Level Packaging (FO WLP), Fan-In Wafer-Level Packaging (FI WLP), Flip Chip (FC), 2.5D/3D), by Application (Telecommunications, Automotive, Aerospace and Defense, Medical Devices, Consumer Electronics).

The Advanced Semiconductor Packaging Market was valued at USD 18090 Million in the year 2024 and is projected to reach a revised size of USD 29800 Million by 2031, growing at a CAGR of 7.5% during the forecast period.

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Major Factors Driving the Growth of Advanced Semiconductor Packaging Market:

The advanced semiconductor packaging market is poised for robust, double digit growth through 2030 as value creation shifts decisively from front end scaling to back end integration. Demand for heterogeneous chiplet architectures, high bandwidth memory stacks, ultra thin fan out modules, and automotive grade power packages is expanding. Continuous 5 G densification, cloud AI acceleration, and electric vehicle adoption keep volumes rising and average selling prices escalating, even as substrate and equipment supply tightens.

With sustainability goals favouring yield efficient known good die assembly and governments underwriting regional resiliency, the market is set to outpace the broader semiconductor industry, cementing advanced packaging as the chief engine of performance and profitability in the silicon value chain.

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TRENDS INFLUENCING THE GROWTH OF THE ADVANCED SEMICONDUCTOR PACKAGING MARKET:

Flip chip packaging energises the advanced semiconductor packaging landscape by eliminating long wire bonds and replacing them with dense arrays of solder bumps that connect the die face down to the substrate. The ultra short electrical path lowers inductance, cuts signal latency, and boosts bandwidth—precisely the performance mix demanded by AI accelerators, high end mobile SoCs, and data centre GPUs. FC’s excellent thermal profile distributes heat efficiently across copper pillars, enabling higher power envelopes without throttling. Yield learning on 3 nm and 2 nm nodes has driven down bump pitch variability, making FC the default choice for heterogeneously integrated chiplets as well as monolithic dies. As fabless giants push multi die systems, FC capacity expansion directly converts into market wide revenue uplift.

Fan out WLP sidesteps the substrate entirely, redistributing I/O in epoxy mould compound and delivering ultra thin packages ideal for space constrained devices. By decoupling die size from I/O count, FO WLP unlocks high pin count connectivity for wearables, true wireless earbuds, RF front ends, and millimetre wave 5 G modules. The ability to singulate multiple known good dies on a reconstituted wafer trims test time and boosts overall yield. Simpler stack ups translate to fewer materials and lower assembly cost relative to FC substrates, extending advanced packaging economics to mid range handsets and IoT sensors. As panel level fan out lines ramp in Korea, Taiwan, and China, the technology’s keen cost per area advantage is widening its addressable market and fuelling sustained revenue growth.

Automotive electrification and autonomy require rugged, high reliability packaging that survives extreme temperature cycles, vibration, and humidity over 15 plus year lifetimes. ADAS domain controllers, radar, LiDAR, battery management ICs, and power inverters now employ advanced packaging—embedded die, FC CSP, and molded array packages—to meet stringent AEC Q100 Grade 0 standards. Meanwhile, zonal E/E architectures multiply the number of high speed SerDes links in a vehicle, driving demand for advanced substrates with sub 10 µm line width/spacing. Automakers’ push for over the air update capability places server class processors under the hood, intensifying the need for high density interposers and chiplet based designs. As electric vehicle volumes climb, long term supply agreements between tier one OSATs and OEMs lock in robust, multi year growth for advanced semiconductor packaging.

The shift from monolithic scaling to heterogeneous integration is propelling demand for advanced packaging as the primary vehicle for combining logic, memory, analog, and photonics dies in a single system in package. High density interposers, hybrid bonding, and through silicon vias allow designers to mix process nodes cost effectively, squeezing more functionality into smaller footprints while sidestepping reticle limits and yield cliff risks. The move brings architectural freedom that conventional wire bond could never match, positioning advanced packaging as a critical enabler of continued silicon centric innovation despite slowing Moore’s law node progression.

Ubiquitous 5 G base stations, open RAN radios, and edge AI gateways rely on RF front end modules and high performance baseband processors that can only meet thermal and signal integrity targets through advanced fan out, FC BGA, or system in package approaches. Carrier aggregation, beam forming, and ultra low latency requirements all drive higher bandwidth density, tighter phase noise, and harsher heat loads—parameters that modern packaging resolves far better than legacy solutions. As telcos spread mmWave and sub 6 GHz coverage, orders for multi chip, antenna in package modules scale in lock step with network densification.

Large language model training, graph analytics, and computational lithography require massive chip to chip bandwidth inside servers. Silicon interposers with micro bump pitches under 40 µm deliver terabytes per second of parallel throughput between logic tiles and HBM stacks, slashing energy per bit and shrinking board level congestion. Hyperscalers’ appetite for AI accelerators forces OSATs to develop bigger organic substrates, advanced underfills, and multi bridge configurations, translating directly into higher ASPs and multi year capacity investments.

Power electronics for traction inverters and fast chargers call for wide bandgap GaN and SiC dies co packaged with control ICs on high thermal conductivity substrates such as AlN or SiN. Advanced packaging enables epoxy mould compound alterations to withstand 500 A per phase, while integrated heat spreaders lower junction temperatures. Sensor fusion ECUs and domain controllers likewise consolidate into high pin count packages, further expanding automotive share of the total addressable market.

Demand for sleeker smartphones, AR glasses, and health monitoring wearables compresses z height budgets, pushing OEMs toward fan in WLP, FO PLP, and moulded core embedded packages. The reduction in discrete components per board frees up battery space, enhances water resistance, and shortens design cycles. As brands fight for feature differentiation within pocket size constraints, advanced packaging’s ability to co integrate MEMS, PMICs, and RF circuits sustains its growth momentum.

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ADVANCED SEMICONDUCTOR PACKAGING MARKET SHARE:

Asia Pacific dominates volume with Taiwan and South Korea housing the world’s largest OSATs and foundry adjacent packaging lines, but mainland China’s accelerated investment is narrowing the gap. North America leads in advanced interposer R&D thanks to hyperscaler co development, while Europe’s automotive strength sustains steady demand for rugged packages. Emerging hubs in India and Southeast Asia benefit from supply chain diversification, collectively creating a vibrant, geographically stratified demand profile.

Key Companies:

IMF GmbHAmkorSPILIntel Corp.JCETASETFMETSMCHuatianPowertech Technology IncUTACNepesWalton Advanced EngineeringKyoceraChipbondChipMOS

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Semiconductor Advanced Packaging Market was estimated to be worth USD 15670 Million in 2023 and is forecast to a readjusted size of USD 26270 Million by 2030 with a CAGR of 7.5% during the forecast period 2024-2030.Semiconductor Advanced Packaging Materials Market was valued at USD 13610 Million in the year 2024 and is projected to reach a revised size of USD 28050 Million by 2031, growing at a CAGR of 10.2% during the forecast period.Advanced Packaging Inspection and Metrology Equipment Market was valued at USD 817 Million in the year 2024 and is projected to reach a revised size of USD 1530 Million by 2031, growing at a CAGR of 9.5% during the forecast period.Semiconductor Packaging and Test Systems Market was valued at USD 14540 Million in the year 2024 and is projected to reach a revised size of USD 21780 Million by 2031, growing at a CAGR of 6.0% during the forecast period.Advanced Packaging Inspection Systems market is projected to grow from USD 419.7 Million in 2024 to USD 723.5 Million by 2030, at a Compound Annual Growth Rate (CAGR) of 9.5% during the forecast period.Mold Release Film for Semiconductor Packaging MarketAdvanced Packaging Lithography Equipment MarketAdvanced Packaging Interconnect Electroplating Solution MarketTin Plating Solution for Semiconductor Packaging Market3D-IC Packaging Market was valued at USD 18470 Million in the year 2024 and is projected to reach a revised size of USD 29850 Million by 2031, growing at a CAGR of 7.2% during the forecast period.Advanced Packaging for Automotive Chips market was valued at USD 463 Million in 2023 and is anticipated to reach USD 969.1 Million by 2030, witnessing a CAGR of 11.7% during the forecast period 2024-2030.

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Technology

Mixx Technologies Acquires Sophic Silicon Technologies and Announces Manufacturing Collaboration with Kaynes Semicon

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July 23, 2026

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A landmark dual announcement signals India’s emergence as a vertically integrated force in global AI semiconductor infrastructure, spanning design to deployment

BENGALURU, India, July 23, 2026 /PRNewswire/ — Mixx Technologies, Inc., a US based venture-backed deep-tech company building the interconnect layer for hyperscale AI infrastructure, today announced two simultaneous strategic moves that together mark a defining moment in India’s semiconductor journey. First, the acquisition of Sophic Silicon Technologies, a Bengaluru-based semiconductor IP design firm, beneficiary of India’s DLI and whose analog mixed-signal design expertise is now integral to Mixx’s co-packaged optics platform. Second, a manufacturing collaboration with Kaynes Semicon Private Limited, an Outsourced Semiconductor Assembly and Test (OSAT) specialist and beneficiary of India’s Production Linked Incentive (PLI) scheme, to establish a test and assembly facility that will support Mixx’s optical IC packaging roadmap. Taken together, the two announcements represent the first time an international deep-tech company has anchored both the design and manufacturing layers of a next-generation AI silicon platform in India, turning the country’s policy ambition into commercial reality.

The Acquisition: Completing the Full-Stack Foundation for Co-Packaged Optics
Every major cloud provider is deploying GPUs at a pace and scale that would have seemed implausible three years ago. But raw compute density is only half the equation. The harder problem is making sure those GPUs are working to its full potential and not waiting. In large AI clusters, accelerators spend a significant fraction of their time stalled on data waiting to move between chips fast enough to keep compute fed. The interconnect, not the GPU itself, is increasingly the binding constraint on utilization. And utilization directly determines the cost of a token and the energy burned to produce it. For hyperscalers running inference at billions of queries a day, the economics are unforgiving: every percentage point of GPU idle time is waste at scale. Introducing optics to declutter the data path improves efficiency. Co-packaged optics (CPO), the most effective solution to the interconnect bottleneck, integrates photonic engines directly alongside ASICs and accelerators, moving data at optical speeds and at a fraction of the power of conventional electrical interconnects. It unlocks the bandwidth density required to keep GPUs utilized efficiently and sustainably, bringing down both the cost of a token and the energy consumed to produce it.

The industry is focused, the demand is now, and Mixx is ready for real-world deployments.

Delivering CPO at hyperscale, however, requires precision across the full electronic-photonic stack; the hardest layer to design is the analog mixed-signal interface between the photonics and the digital system. That is precisely what Sophic Silicon Technologies has designed using advanced CMOS process nodes. Their IP now forms the electronic IC foundation of Mixx’s HBxIO™ platform – a multi-terabit, ultra-high-radix optical interconnect architecture purpose-built for large-scale AI inference and training. The acquisition brings Sophic Silicon’s full team and IP portfolio into Mixx, effective immediately.

“Our vision has always been to build the complete electronic-photonic stack. Sophic Silicon brings critical analog mixed-signal expertise that reinforces HBxIO and moves us closer to deploying optical connectivity at hyperscale.”

        — Vivek Raghuraman, CEO, Mixx Technologies

Sophic Silicon’s founders and core engineers, with backgrounds spanning advanced CMOS process design, EDA and IP development, and high-speed networking, will join Mixx’s core product development organization and continue expanding R&D operations in India.

“Sophic Silicon exists because optical connectivity at hyperscale demands more – lower power, higher bandwidth, seamless multi-protocol integration, and latency that lets networks perform at their absolute best. Mixx gives us the platform, the ecosystem, and the global reach to take that work where it was always meant to go. What we built in Bengaluru is now part of the infrastructure that the world’s largest computing deployments will run on.”

         — Deepak Pancholi, Founder, Sophic Silicon Technologies

The Collaboration: From Design to Deployment with Kaynes Semicon
Designing world-class semiconductor IP in India is a milestone. Manufacturing and testing it there is a transformation. Mixx Technologies’ collaboration with Kaynes Semicon Private Limited, a leading Indian OSAT provider and PLI beneficiary, is precisely that second step.

The collaboration brings together Kaynes Semicon’s advanced OSAT capabilities and Mixx’s optical IC design expertise to build a dedicated test and assembly capability for next-generation optical integrated circuits. Kaynes Semicon brings deep process knowledge in semiconductor assembly, packaging, and test, backed by the capital investment and institutional credibility of a PLI-supported program. For Mixx, the partnership creates a tightly integrated domestic manufacturing pathway for components of the HBxIO™ platform, enabling faster development cycles, closer collaboration between design and production teams, and the kind of end-to-end control that is essential when pushing the limits of optical IC performance.

“This multi-year collaboration with Mixx Technologies is a strong signal of where India’s semiconductor manufacturing ecosystem is headed. We have built the infrastructure and the process depth to support advanced optical IC packaging. Working with Mixx brings a world-class design partner into that ecosystem, demonstrating that PLI-backed Indian manufacturers can play at the leading edge of the global AI hardware supply chain.”

          — Raghu Panicker, CEO, Kaynes Semicon Private Limited

From India, for the World: A New Model for Semiconductor Globalization
Mixx Technologies has maintained R&D operations in India since its founding, alongside its San Jose headquarters and Taiwan facilities. The acquisition of Sophic Silicon deepens that presence significantly, embedding a team with leading-edge analog mixed-signal and photonics design experience into Mixx’s core product organization. The collaboration with Kaynes Semicon adds a manufacturing dimension: for the first time, a next-generation optical interconnect platform will have both its design and its assembly and test operations anchored in India. This is not an offshoring story. It is a story about India becoming a primary node in the global AI semiconductor value chain, with design, manufacturing, and IP origination happening here, at global scale.

“Mixx Technologies is committed to developing next-generation silicon photonics IP and system designs in India, contributing to the country’s ambition of becoming a global hub for semiconductor design and advanced manufacturing. The talent here is exceptional. The policy environment has matured to support it. And today’s announcements are what happens when both come together.”

           — Vivek Raghuraman, CEO, Mixx Technologies

The Road Ahead: Building the AI Interconnect Layer, in India
Sophic Silicon’s mixed-signal IPs is now being integrated across the HBxIO™ platform stack. Mixx is actively engaged with cloud service providers to qualify the platform across both scale-up and scale-out network, connecting servers and clusters across data center fabric.

The Kaynes Semicon collaboration is underway, focused on qualifying advanced optical IC assembly and test processes that meet the stringent performance and reliability standards hyperscale deployments demand. Mixx continues to expand its India R&D organization, with Bengaluru at the center of its global analog mixed-signal and photonics IC development.

The global AI chip market is projected to exceed $400 billion by 2030. The interconnect layer, tracking how data moves between chips, between accelerators and between clusters, is where the next wave of differentiation will be won. Mixx Technologies is building that layer. And it is building it in India.

About Mixx Technologies
Mixx Technologies, Inc. is venture-backed deep-tech company founded by the team that commercialized many zero-to-one silicon photonics products. The company is solving the data-movement bottleneck for AI compute infrastructure through its HBxIO™ platform, a multi-terabit, ultra-high-radix co-packaged optical interconnect architecture enabling cloud service providers to deploy large-scale AI inference at the speed and efficiency hyperscale demands. Headquartered in San Jose, California, with R&D operations in India and Taiwan. Visit: www.mixxtech.io.

About Sophic Silicon Technologies
Sophic Silicon Technologies is a Bengaluru-based semiconductor IP design firm specializing in analog mixed-signal, wireless and photonics ICs for AI-scale infrastructure. A beneficiary of India’s Design Linked Incentive (DLI) Scheme under the India Semiconductor Mission, the company developed its IP at leading-edge CMOS process nodes to address the electro-optic interface challenges central to co-packaged optics and next-generation AI scale-up interconnects. Sophic Silicon Technologies is now part of Mixx Technologies.

About Kaynes Semicon Private Limited
Kaynes Semicon Private Limited is an Indian OSAT (Outsourced Semiconductor Assembly and Test) company and beneficiary of the Government of India’s Production Linked Incentive (PLI) scheme for semiconductors. With infrastructure and advanced assembly capabilities at its Sanand, Gujarat facility, Kaynes Semicon is building India’s domestic semiconductor manufacturing ecosystem for next-generation packaging and test requirements.

Media Contact
Ramya Barna
Marketing and Investor Relations, Mixx Technologies, Inc
info@mixxtech.io

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Hydra X Launches HX Gateway API to Advance Institutional Adoption on the Canton Network

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July 23, 2026

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The HX Gateway API supports financial institutions and developers building on Canton, reducing go-to-market timelines by up to 80% and deployment time by 50%.

SINGAPORE, July 23, 2026 /PRNewswire/ — Hydra X, a regulated market infrastructure operator for tokenised capital markets, today announced the launch of HX Gateway API, a REST API layer that supports financial institutions and application developers building on the Canton Network without requiring specialised expertise in Daml, Canton’s underlying programming language.

The API provides a straightforward integration layer that maps directly to familiar business workflows – onboarding participants, issuing and managing assets, and executing transfers. Now, institutions can go from decision to deployment without needing to build infrastructure from the ground up.

Built on Production Experience on the Canton Network

The HX Gateway API is built on Hydra X’s own production experience operating on the Canton Network. The firm has tokenised over US$100 million in assets for institutional clients across multiple regulatory frameworks on Canton through DA Registry – a secure tokenisation solution with regulatory-grade compliance built by Digital Asset, creators of the Canton Network.

That operational depth informed the design of the API, resulting in measurable gains for institutional deployments:

Rapid Go-to-Market: Up to an 80% acceleration in go-to-market timelines.Faster Path-to-Production: A 50% reduction in deployment time.Flexible Integration: Available as a hosted service or as an external deployment for clients with existing validator infrastructure.

“The HX Gateway API was designed to advance institutional adoption on the Canton Network.  It is built on the same infrastructure we run in production for regulated clients, and it means that banks, asset managers and exchanges no longer need to treat Canton integration as a specialist engineering project. It is a business decision now, and the timelines reflect that,” said Mark Tang, VP of Client Solutions, Hydra X.

A Broader Shift in Tokenised Capital Markets

The launch marks a broader shift in how regulated financial institutions can engage with the Canton Network. As tokenised capital markets around the world move from pilot programmes to production deployments, the ability to integrate quickly and reliably into shared network infrastructure is becoming a competitive differentiator. The HX Gateway API is designed to meet that moment, providing institutional-grade tooling that significantly accelerates the path from deciding to build on the Canton Network to achieving a live deployment.

About Hydra X

Hydra X is a regulated market infrastructure operator for tokenised capital markets, with live deployments across Asia-Pacific. The firm builds and operates the full lifecycle of digital capital market infrastructure, spanning tokenisation, distribution, trading, custody and settlement. Hydra X serves financial institutions seeking to issue, trade and custodise digital assets on regulated, institutional-grade infrastructure.

www.hydrax.io

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Unfold Your Passions with a $0 Galaxy on StarHub 5G Unlimited+ Plans

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July 23, 2026

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Pre-order the new Samsung Galaxy Z Fold8 Ultra, Galaxy Z Fold8 and Galaxy Z Flip8 with StarHub to unlock exclusive perks

SINGAPORE, 23 July 2026 /PRNewswire/ — Your next Galaxy upgrade just got easier. Whether it’s streaming Premier League action on the go, multi-tasking on a larger foldable display or enjoying immersive entertainment, StarHub is making it easier than ever to own Samsung’s latest Galaxy foldables.

From today, customers can pre-order the new Samsung Galaxy Z Fold8 Ultra, Galaxy Z Fold8, and Galaxy Z Flip8 on StarHub’s 5G Unlimited+ Plans, enjoying up to $1,688 in device savings, up to $2,880 in DeviceDollars (over 36 months) to offset interest-free device instalments, bringing the cost of owning Samsung’s latest foldables down to as low as $0.

More Value with Every Upgrade

Designed to make upgrading easier and more rewarding, StarHub’s 5G Unlimited+ Plans combine exclusive pre-order offers with perks, so customers get even more from Samsung’s latest Galaxy foldables:

Up to $2,880 in DeviceDollars (over 36 months) to offset interest-free instalments, with flexible payment options across 12, 24 or 36 monthsUpfront pay later device discounts with 5G Unlimited+ PlansUp to $350 off device for new lines and port-insGuaranteed $300 trade-in bonus on top of device’s base trade-in valueComplimentary Premier League Annual Pass worth $380 with Galaxy Z Fold8 Ultra or Fold8Complimentary storage upgrade to 512GB at the price of 256GB worth $300, with 5G Unlimited+ Plus Plans and aboveComplimentary 3 months SmartSupport (worth $42.78) to lock in the 50% trade-in guarantee on your new Galaxy Z Foldable[1]$38 e-voucher for customers who registered their interestWatch add-on savings of up $250 off Galaxy Watch Ultra2 and $100 off Galaxy Watch9

More Freedom with 5G Unlimited+ Plans

Beyond the device, StarHub’s 5G Unlimited+ Plans include unlimited data, built-in global roaming across 165 destinations, and unlimited calls and SMS, giving customers greater peace of mind whether they’re staying connected at home or travelling overseas.

Pre-Order Details

Customers can pre-order the new Samsung Galaxy Z Series, Galaxy Watch Ultra2 and Galaxy Watch9 on StarHub’s 5G Unlimited+ Plans from 23 July 2026, 9am to 13 August 2026, 11.59pm via the StarHub App and online at starhub.com/samsung. Customers who prefer to pre-order in person can do so at StarHub Shops from 4 August 2026, during operating hours.

The Samsung Galaxy Z Series will be available for walk-in purchase at StarHub shops from 14 August 2026, 11am, and online via the StarHub eShop from 14 August 2026, 12am, while stocks last.

For more information, visit: starhub.com/samsung.

[1] Terms and conditions apply, please refer to starhub.com/samsung

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