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Semiconductor Wafer Bonding Materials Market to Reach $400.17 Million by 2031, Driven by Packaging Advancements | Valuates Reports

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BANGALORE, India, May 16, 2025 /PRNewswire/ — The Global Temporary Wafer Bonding Materials Market is Segmented by Type (Thermoplastic Materials, UV Curing Materials, Composite Films, Metallic Materials), by Application (Wafer-level Packaging, MEMS, Compound Semiconductor).

The Temporary Wafer Bonding Materials Market was estimated to be worth USD 269.58 Million in 2024 and is forecast to a readjusted size of USD 400.17 Million by 2031 with a CAGR of 5.56% during the forecast period 2025-2031.

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Major Factors Driving the Growth of Temporary Wafer Bonding Materials Market:

 The temporary wafer bonding materials market is expanding rapidly due to advancements in semiconductor packaging, demand for thin wafer processing, and the proliferation of compound semiconductor applications. Key material types like UV-curable and thermoplastic adhesives address diverse needs in MEMS, 3D packaging, and wafer-level integration. Factors such as environmental compliance, foundry adoption, and miniaturization trends are further fueling growth. As industries embrace next-generation chips and sensor-rich devices, temporary bonding solutions that offer stability, reliability, and clean debonding become indispensable. With consistent investments in chip manufacturing and packaging innovations worldwide, the market for temporary wafer bonding materials is poised for sustained and diversified expansion.

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TRENDS INFLUENCING THE GROWTH OF THE TEMPORARY WAFER BONDING MATERIALS MARKET:

UV curing materials are significantly contributing to the growth of the temporary wafer bonding materials market due to their fast-processing capabilities and precision bonding. These materials offer excellent thermal stability and allow easy debonding under UV light exposure, making them ideal for advanced semiconductor packaging applications. As device miniaturization becomes essential in electronics, UV-curable adhesives provide high alignment accuracy and minimal substrate distortion. Their compatibility with thin wafers used in 3D stacking and advanced memory packaging strengthens their demand. Additionally, their low contamination levels and solvent-free nature align with environmental and safety regulations. With the growing use of advanced packaging in logic, memory, and RF devices, UV curing materials continue to drive market adoption across global foundries and IDMs.

Thermoplastic materials are propelling market growth by offering reversible bonding capabilities, high flexibility, and excellent temperature resistance. Their ability to soften upon heating and resolidify upon cooling makes them ideal for temporary bonding applications during wafer thinning and back-end processing. As chip designs become more complex and wafer handling more delicate, thermoplastics provide mechanical stability without permanent adhesion. These materials are especially favored in MEMS, compound semiconductors, and flexible device fabrication, where thermal cycling and mechanical stress are frequent. Their adaptability to various substrate materials, along with clean debonding characteristics, improves manufacturing yields and lowers damage risks. The reliability and process compatibility of thermoplastics enhance their value in advanced wafer-level packaging technologies.

The rise of compound semiconductors and wafer-level packaging is accelerating demand for temporary wafer bonding materials due to their unique processing needs. Compound semiconductors like GaN and SiC are fragile and require strong but easily removable bonding solutions during thinning and etching. Temporary bonding enables precision processing of these substrates without breakage. Similarly, wafer-level packaging techniques demand materials that can withstand backgrinding, polishing, and etching while allowing clean removal post-processing. As high-frequency, power, and optoelectronic applications expand, the use of compound semiconductors grows, thereby fueling the need for reliable temporary bonding. The synergy between compound materials and wafer-level integration directly influences the market for advanced bonding materials.

The growth in advanced packaging technologies such as 2.5D, 3D-ICs, and fan-out packaging is creating a strong demand for temporary wafer bonding materials. These complex architectures involve multiple wafer handling, thinning, and stacking processes, where temporary bonding plays a vital role in structural support and protection. The ability of bonding materials to provide strong adhesion and easy debonding is essential to preserve wafer integrity and ensure high yield. As packaging shifts from traditional wire bonding to wafer-level and chip-scale integration, manufacturers increasingly rely on materials that ensure both precision and reversibility. This trend fuels continuous innovation and market growth in temporary bonding solutions.

In semiconductor manufacturing, yield optimization is critical, and temporary bonding materials contribute by minimizing wafer breakage and contamination during thinning, lithography, and etching. The fragility of ultra-thin wafers demands materials that provide robust mechanical support while remaining inert to subsequent processing steps. Temporary bonding materials help maintain wafer planarity and surface quality, which are essential for photolithographic alignment and patterning. Their clean debonding properties also reduce the risk of residue, thereby maintaining surface cleanliness for downstream processes. With device geometries shrinking and wafer fragility increasing, the demand for bonding materials that enhance process stability and protect wafer integrity is driving market expansion.

Integrated Device Manufacturers (IDMs) and semiconductor foundries are the major consumers of temporary wafer bonding materials due to their adoption of advanced front-end and back-end processing. As these players expand their capabilities in 3D packaging, MEMS, CMOS image sensors, and power devices, they require materials that offer consistent performance across varying process conditions. Foundries prefer materials with high throughput compatibility and easy integration into automated production lines. Additionally, collaboration between material suppliers and IDMs on customized bonding formulations is becoming more common, enabling tailored solutions for specific device needs. This increasing engagement and scale of adoption in fabrication facilities bolster overall market growth.

Device miniaturization in electronics is leading to the widespread use of ultra-thin wafers, which are more susceptible to cracking and warping. Temporary bonding materials play a crucial role in enabling these thin wafers to be safely processed during backgrinding, etching, and lithography. The demand for thinner and lighter consumer devices, such as smartphones and wearables, accelerates the need for bonding materials that ensure structural integrity during manufacturing. These materials allow temporary integration with carrier wafers, providing necessary support. As the trend toward miniaturization continues, the significance of temporary wafer bonding materials in ensuring process success becomes increasingly critical.

Microelectromechanical systems (MEMS) and sensors are witnessing high adoption across automotive, consumer electronics, healthcare, and industrial sectors. Manufacturing of these devices involves complex wafer-level processes where temporary bonding materials offer handling support and process compatibility. MEMS fabrication includes etching, doping, and thinning steps, which require stable temporary adhesives to prevent damage or misalignment. Additionally, the need for cost-efficient and miniaturized sensor solutions encourages volume production using wafer bonding techniques. As sensor-rich applications such as autonomous driving, IoT, and biomedical diagnostics expand, the corresponding demand for robust and flexible bonding materials in MEMS production continues to surge.

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TEMPORARY WAFER BONDING MATERIALS MARKET SHARE:

Asia-Pacific dominates the temporary wafer bonding materials market, driven by the presence of major semiconductor fabrication hubs in China, Taiwan, South Korea, and Japan. These countries are home to leading foundries and OSAT companies that are increasingly adopting advanced packaging techniques.

North America follows, led by technological innovation and high R&D investments in chip design and manufacturing.

Europe also contributes significantly due to the region’s strength in automotive electronics and sensor technologies. Meanwhile, emerging markets in Southeast Asia and the Middle East are beginning to establish semiconductor fabs, offering new opportunities for material providers. Regional dynamics strongly influence production trends, partnerships, and regulatory compliance in the global bonding materials market.

Key Companies:

Brewer Science3MTokyo Ohka KogyoSamcien Semiconductor MaterialsSekisui ChemicalDOWHenkelNissan ChemicalAI TechnologyHD MicroSystems (DuPont)

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DISCOVER MORE INSIGHTS: EXPLORE SIMILAR REPORTS!

–          Thin Wafer Temporary Bonding Adhesive Market was estimated to be worth USD 178 Million in 2023 and is forecast to a readjusted size of USD 343.5 Million by 2030 with a CAGR of 9.8% during the forecast period 2024-2030.

–          The global market for Temporary Wafer Debonding System was estimated to be worth USD 322 Million in 2023 and is forecast to a readjusted size of USD 551.6 Million by 2030 with a CAGR of 8.4% during the forecast period 2024-2030.

–          The global market for Thin Wafers Temporary Bonding Equipment was valued at USD 161 Million in the year 2023 and is projected to reach a revised size of USD 244 Million by 2030, growing at a CAGR of 5.9% during the forecast period.

–          Temporary Bonding and Debonding Systems Market

–          Temporary Bonding Adhesives for Semiconductor Market

–          Wafer Bonding Equipment Market was valued at USD 321 Million in the year 2024 and is projected to reach a revised size of USD 449 Million by 2031, growing at a CAGR of 5.0% during the forecast period.

–          Temporary Bonding Adhesive Market revenue was USD 195.9 Million in 2022 and is forecast to a readjusted size of USD 342.3 Million by 2029 with a CAGR of 8.2% during the forecast period (2023-2029).

–          Wafer Bonding and Debonding Equipment Market was valued at USD 276 Million in the year 2023 and is projected to reach a revised size of USD 429 Million by 2030, growing at a CAGR of 5.0% during the forecast period.

–          Chip Bonding Adhesive Market was valued at USD 355 Million in the year 2023 and is projected to reach a revised size of USD 510 Million by 2030, growing at a CAGR of 5.3% during the forecast period.

–          Wafer Debonding System Market

–          Automatic Wafer Bonding Equipment Market was valued at USD 321 Million in the year 2024 and is projected to reach a revised size of USD 449 Million by 2031, growing at a CAGR of 5.0% during the forecast period.

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Global AI Data Center Market to Reach USD 84.52 Billion by 2032, Growing at a CAGR of 25.8% – Report by Maximize Market Research

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November 5, 2026

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PUNE, India, Nov. 5, 2026 /PRNewswire/ — According to Maximize Market Research, the Global AI Data Center Market was valued at USD 16.95 billion in 2025 and is projected to reach USD 84.52 billion by 2032, growing at a CAGR of 25.8% from 2026 to 2032.

Global AI Data Center Market Size & Forecast

Market Size (Base Year 2025) : USD 16.95 Bn.
Forecast Market Size (2032) : USD 84.52 Bn.
CAGR (2026-2032) : 25.8%
Base Year : 2025
Forecast Period : 2026-2032
Historical Period : 2020-2025

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Global AI Data Center Market Overview & Industry Outlook

The Global AI Data Center Market is growing due to increasing demand for artificial intelligence computing infrastructure, generative AI applications, machine learning, and large language models. Rising investments by hyperscale cloud providers and AI companies are supporting the development of specialized data centers capable of handling high-density computing workloads. Increasing requirements for AI training and inference are driving demand for AI-optimized IT infrastructure, high-performance networking, power systems, and advanced cooling technologies.

Additionally, rising rack power density and increasing electricity requirements are encouraging investments in direct-to-chip liquid cooling, immersion cooling, power distribution, and energy management solutions. The expansion of hyperscale campuses, colocation facilities, and neocloud or GPU-as-a-Service providers is creating new opportunities across the global AI data center industry. Growing sovereign AI initiatives and investments in regional computing infrastructure are further supporting market expansion through 2032.

Global AI Data Center Market Trends and Key Highlights:

The Global AI Data Center Market is witnessing rising demand for AI-optimized infrastructure, hyperscale facilities, liquid cooling technologies, and high-performance networking. Growing investments in AI computing capacity, sovereign AI programmes, and advanced power infrastructure are supporting market expansion. Increasing adoption of inference workloads and high-density computing is further driving industry growth.

Global AI Data Center Market Size in 2025: USD 16.95 Billion

Projected Global AI Data Center Market Size by 2032: USD 84.52 Billion

Global AI Data Center Market Growth Rate (2026–2032): 25.8% CAGR

Projected AI Data Center Market Revenue Expansion by 2032: USD 67.57 Billion

Major AI Data Center Components: Hardware, Software, and Services

Key Data Center Types: Hyperscale, Colocation, Enterprise, Edge, and Neocloud/GPU-as-a-Service

Major AI Workloads: Training, Inference, and Fine-tuning & HPC

Key Cooling Technologies: Air Cooling, Direct-to-Chip Liquid Cooling, Immersion Cooling, and Rear-Door Heat Exchangers

Major AI Data Center Capacity Markets: United States, China, India, Saudi Arabia, UAE, and Japan

Emerging AI Data Center Trends: Generative AI, Liquid Cooling, Sovereign AI, Gigawatt Campuses, and Advanced Networking

Hardware Segment Represents the Largest Component of the Global AI Data Center Market in 2025

By component, the Hardware segment represents the largest share of the Global AI Data Center Market, accounting for approximately 66% in 2025. Increasing investments in AI-optimized IT infrastructure, networking and interconnect systems, power infrastructure, and cooling systems are supporting segment growth. Rising demand for high-density computing facilities and advanced thermal management solutions is further strengthening the hardware segment. Software and services also contribute to market development through data center infrastructure management, AI workload orchestration, energy management, design, integration, and managed services.

Get Insightful Data on Regions, Market Segments, Customer Landscape, and Top Companies (Charts, Tables, Figures and More) https://www.maximizemarketresearch.com/request-sample/327467/ 

Hyperscale Segment Dominates the Global AI Data Center Market in 2025

By data center type, the Hyperscale segment accounted for approximately 62% of the Global AI Data Center Market in 2025. Growing investments by major cloud service providers and technology companies in large-scale AI computing facilities are supporting segment dominance. By AI workload, the Training segment held approximately 58% share in 2025, driven by increasing computational requirements for developing and training large AI models. However, Inference is expected to witness the fastest growth during the forecast period as AI applications expand across enterprise, cloud, and edge environments.

North America Represents a Leading Market for the Global AI Data Center Industry During 2026–2032

By region, North America represents a leading market for the Global AI Data Center Market, supported by the presence of major hyperscale cloud providers, AI technology companies, and large-scale data center development projects. The United States remains a major center for AI infrastructure investments, with developments across Texas, Louisiana, Wisconsin, and Ohio. Asia-Pacific is witnessing increasing AI infrastructure development, particularly across India, Malaysia, Japan, and South Korea. Europe is focusing on regional computing capacity and data sovereignty, while the Middle East is attracting investments through sovereign AI programmes and large-scale data center projects. South America is gradually developing its AI data center ecosystem, supported by renewable power availability and digital infrastructure investments.

Global AI Data Center Market Competitive Landscape & Key Players

The Global AI Data Center Market is highly competitive, with major players including Microsoft Corporation (US), Amazon Web Services (US), Alphabet (Google Cloud) (US), Meta Platforms (US), Oracle Corporation (US), Equinix (US), Digital Realty (US), and NVIDIA Corporation (US). These companies are focusing on expanding AI computing capacity, developing hyperscale infrastructure, strengthening networking capabilities, and improving power and cooling efficiency. Growing investments in liquid cooling, high-performance computing infrastructure, sovereign AI facilities, and GPU-as-a-Service are creating new opportunities across the global AI data center industry through 2032.

Explore Emerging Market Opportunities: Data Center Infrastructure Market Analysis & Growth Consulting

Drax, Brookfield and Radiant Partner on a Gigawatt-Scale AI Data Center Project in the UK

In November 2026, Drax partnered with Brookfield and AI infrastructure platform Radiant to develop an AI data center exceeding 1 GW at Drax Power Station in northern England. The project is expected to attract more than USD 26 billion in investment, with the first phase planned to begin commercial operations in early 2028, subject to required approvals and investment decisions. The development highlights growing investments in large-scale AI infrastructure, power availability, and gigawatt-scale data center capacity across the global AI Data Center Market.

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Key Players:

Microsoft CorporationAmazon Web ServicesAlphabet (Google Cloud)Meta PlatformsOracle CorporationAlibaba CloudTencent CloudHuawei TechnologiesEquinixDigital RealtyNTT DATAVantage Data CentersSTACK InfrastructureQTS Data CentersCyrusOneAligned Data CentersCrusoeRelated DigitalSwitchIron Mountain Data CentersAirTrunkAdaniConneXYotta Data ServicesCtrlS DatacentersKhazna Data Centers (G42)HUMAINCoreWeaveNebius GroupLambdaNVIDIA CorporationArista NetworksCisco SystemsBroadcomDell TechnologiesHewlett Packard EnterpriseSuper Micro ComputerSchneider ElectricVertiv HoldingsEaton CorporationABB LtdSiemens AGLegrandDelta ElectronicsGE Vernova

Access Full Summary: https://www.maximizemarketresearch.com/market-report/ai-data-center-market/327467/ 

MMR Analyst Perspective – Global AI Data Center Market

According to Maximize Market Research, the Global AI Data Center Market is evolving rapidly as increasing AI workloads drive demand for specialized computing infrastructure. With the market projected to expand by USD 67.57 billion between 2025 and 2032, investments in hyperscale facilities, high-density hardware, advanced cooling, and power infrastructure are expected to remain important growth factors. While training workloads continue to support infrastructure demand, the expansion of inference applications is creating opportunities for colocation, edge facilities, and neocloud providers. Companies securing reliable power capacity and developing energy-efficient, liquid-cooled AI infrastructure are expected to be better positioned to capture market opportunities through 2032.

View Related Data Center Market Reports:

Data Center Optical Transceiver Market by Data Rate, Form Factor, Reach, Technology, Application, and Region – Global Forecast to 2034.Data Center Power Market by Power Infrastructure, UPS Systems, Power Distribution, and Region – Global Forecast to 2034.Data Center Busway Market by Product Type, Conductor Material, Power Rating, Installation, Data Center Type, and Region – Global Forecast to 2034.Data Center Battery / BESS Market by System Type, Battery Chemistry, Data Center Type, Application, Storage Capacity, and Region – Global Forecast to 2034.Edge Data Center Market by Component, Facility Type, Application, End-Use Industry, and Region – Global Forecast to 2034.Data Center Liquid Cooling Market by Component, Technology, Rack Density, Deployment, Data Center Type, and Region – Global Forecast to 2034.Data Center Networking Market by Component Type, End Users, and Region – Global Forecast to 2034.Global Data Center Automation Software and Services Market by Product, Application, End User, and Region – Global Forecast to 2034.Global Data Center Generator Market by Product Type, Capacity, Tier Standards, and Region – Global Forecast to 2034.Global Data Center Power Consumption Market by Power Consumption Component, Power Source, Data Center Type, Workload Type and Region 2034Data Center Transfer Switches and Switchgears Market by Transfer Switches Type, by Switchgears Type, and Region – Global Forecast to 2034.

About Maximize Market Research – Global AI Data Center Market

Maximize Market Research is a global market research and consulting firm providing insights across technology, IT infrastructure, electronics, energy, and industrial sectors. Its Global AI Data Center Market research covers AI-optimized hardware, software, services, data center types, AI workloads, cooling technologies, power capacity, end users, regional demand, competitive strategies, and recent industry developments. The report helps businesses understand AI infrastructure investments, hyperscale data center expansion, power and cooling requirements, sovereign AI initiatives, and emerging market opportunities through 2032.

Hyper Scale Data Center Market Size by Power Capacity, Data Center Type, Component, End User, Region, Country-level Analysis, Competitive Landscape, and Future Outlook (2026–2032)- Stellar Market Research

Stellar Market Research is a strategic partner of Maximize Market Research, providing global and region-wise market research reports across multiple industries. Its research focuses on market trends, competitive developments, regional opportunities, industry dynamics, and growth outlooks, complementing Maximize Market Research with broader market coverage and region-specific business intelligence.

Contact:
Lumawant Godage
MAXIMIZE MARKET RESEARCH PVT. LTD.
+91 96073 65656
Email: sales@maximizemarketresearch.com   
Visit Our Web Site: https://www.maximizemarketresearch.com/  

 

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OID 2026: Advancing Technology Partnerships to Power the Next-Gen Industrial City

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HO CHI MINH CITY, Vietnam, Nov. 5, 2026 /PRNewswire/ — Open Innovation Day 2026 (OID 2026), themed “Power the Next-Gen Industrial City,” took place in Ho Chi Minh City, bringing together policymakers, businesses, investors and technology partners from Viet Nam and abroad. Spanning AI infrastructure, green energy and the low-altitude economy, the event focused on the conditions needed to turn technological potential into industrial capacity and real-world market opportunities.

OID 2026 kicked off the Autumn Economic Forum 2026 (AEF 2026). Led by SoiHub – Open Innovation Hub, it was jointly organized with the Open Innovation and Technopreneur Institute (OITI); the National Academy for Advanced Technology and Innovation (NACENTECH) under the Ministry of Science and Technology of Viet Nam; Saigon Telecommunication & Technologies Corporation (SAIGONTEL); and the Viet Nam Centre for the Fourth Industrial Revolution in Ho Chi Minh City (HCMC C4IR), together with other co-organizers and partners.

From Policy Direction to Technological Capabilities

Speaking at the event, Mr. Truong Minh Huy Vu, Vice Chairman of the Ho Chi Minh City People’s Committee, said the city is laying the groundwork for next-generation industries, from spatial planning for high-tech industry and energy infrastructure to innovation support mechanisms. Notably, the city has rolled out policies to bridge the gap between research and commercialization, including a VND 500 billion venture capital fund. He noted that developing next-generation industries requires not only infrastructure investment but also an ecosystem capable of bringing ideas and technologies to market.

At the national level, Mr. Nguyen Khac Lich, Director General of the Department of Digital Technology and Artificial Intelligence, under the Ministry of Science and Technology of Viet Nam, stressed the need to strengthen Viet Nam’s capacity to master strategic technologies such as AI, semiconductors and unmanned aerial vehicles (UAVs). He said Viet Nam needs to deepen its involvement in research, design and manufacturing while developing regulatory sandboxes to validate new technologies and support their progressive commercialization.

OID 2026 Highlights: Strategic Partnerships Geared Toward Real-World Deployment

Ms. Bui Thanh Hang, Director of SoiHub and Head of the OID 2026 Organizing Committee, said SoiHub has connected and co-developed 50 domestic and international technologies, received 15 technology orders from the market and established 20 strategic cooperation agreements. At OID 2026, partnerships with MobiFone, MOBY Robotics, TADI Global, NACENTECH and CITARES further expanded SoiHub’s network across smart cities, deep-sea robotics, technology transfer and technical workforce development. According to Ms. Hang, these results show that open innovation can deliver tangible value when research and technology are directly linked to the needs of businesses and the market.

AI Infrastructure: Competitiveness Goes Beyond Technology

The morning session, “Foundations of Next-Generation Industry in the AI Era,” examined the factors that will determine Viet Nam’s ability to attract investment in AI infrastructure. Mr. Samuel Ang, Senior Advisor to the Asian Development Bank (ADB), highlighted a shift in site selection criteria for AI data centers: power availability and grid capacity are becoming the top priorities, ahead of location and cost. He said countries that align their digital infrastructure ambitions with energy planning and grid modernization will be better positioned to attract international capital.

Discussions further addressed requirements for data security, computing capacity, clean energy and storage systems. On the workforce front, Ms. Sinwon Park, Director of the International Labour Organization (ILO) Country Office for Viet Nam, discussed AI’s impact on jobs and the need to upskill workers, underscoring that industrial development in the AI era demands coordinated preparation in both infrastructure and human capital.

Low-Altitude Economy: From Technology Testing to Market Development

The afternoon session, “Low-Altitude Economy – Creating New Engines of Growth,” focused on what it takes to scale UAVs and autonomous systems from standalone applications to large-scale industrial development. Drawing on experience from test sites in Japan and the United States, Mr. Joe Felter, CEO of Pickaxe Technologies, emphasized: “Start with the use case, not the equipment.” He said Viet Nam needs to develop a network of test sites integrated with research, training, manufacturing and operational standards, rather than invest in standalone testing facilities.

During the panel discussion, representatives from Viettel High Tech, the Viet Nam Aerospace Association (VASA), SoiHub and EHang further explored commercial viability, regulatory sandboxes and supply chain development. Mr. Bui Trung Hieu, representing SoiHub, raised a pivotal question: once a pilot succeeds, who will be the next customer? The question underscores that building a low-altitude economy requires not only technological capability but also a sufficiently large market and scalable business models.

From the partnership commitments announced to the challenges surrounding AI infrastructure, energy and autonomous technologies, OID 2026 pointed to a shared approach: next-generation industrial development must start from market demand, be underpinned by enabling infrastructure and policies, and involve meaningful participation from businesses, research institutions and investors.

PR Newswire is the official media partner of Open Innovation Day 2026.

Event information: https://oid.openinnovationhub.vn/

SoiHub Organizing Committee Representative: Ms. Trinh Thi Lan Huong, Email: huong.trinh@soihub.vn 

Open Innovation and Technopreneur Institute (OITI) Organizing Committee Representative: Ms. Hoang Ngoc Mai, Email: mai.hoang@oiti.vn 

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SOURCE The Open Innovation and Technology Entrepreneurship Institute

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CORONATION SECURITIES RECOGNISED AS FASTEST GROWING DIGITAL BROKERAGE PLATFORM IN NIGERIA AT THE GLOBAL BRAND AWARDS 2026

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LONDON, Nov. 5, 2026 /PRNewswire/ — Coronation Securities Limited has been named ‘Fastest Growing Digital Brokerage Platform – Nigeria’ at the Global Brand Awards 2026, organised by Global Brands Magazine.

The Global Brand Awards recognise organisations that have shown consistent performance, innovation and clear results in their industries. Coronation Securities Limited was recognised for the progress it has made in digital brokerage. It brings its market expertise and technology together to offer investment products that meet the changing needs of investors.

The company has built a strong position in Nigeria’s financial services sector by making investing accessible, running a disciplined operation and staying close to its investors. Its expanding digital offering and client-focused approach are helping more people take part in the capital market and are contributing to the growth of Nigeria’s investment landscape.

Commenting on the recognition, Jay Reddy, CEO of Global Brands Magazine, said:

“Coronation Securities Limited is part of a wider move towards investing that is more accessible and driven by technology. Its progress in digital brokerage shows how innovation can bring more people into the market and give investors in Nigeria a better experience.”

Responding to the award, the CEO of Coronation Securities Limited, Mr. Jibola Odedina, stated:

“This recognition reflects Coronation Securities Limited’s continued commitment to building a digital brokerage experience that investors can trust and access with ease. As the way people invest changes, we remain focused on offering technology-enabled solutions that help clients take part in the capital markets with confidence and build lasting wealth over the long term. Being recognised alongside leading global institutions strengthens our ambition to deliver financial solutions of the highest standard, widen access to investment and support market development in Nigeria.”

ABOUT CORONATION SECURITIES LIMITED

Coronation Securities Limited is a securities trading and stockbroking firm that has served all segments of the investing public since 1992. Over the years, it has advised on some of the most significant transactions in the Nigerian capital market and is known as a trusted and experienced partner in financial services.

Its offerings include Equities Brokerage, with both full-service and self-service accounts supported by online digital trading platforms and securities lending services. In Fixed Income, it offers access to a wide range of sovereign and corporate debt securities, as well as mutual funds, to meet different investment needs.

Its Research division provides detailed market research, investment portfolio analytics and tailored investment advisory services, giving clients the information they need to make informed decisions. Its Advisory services cover equity capital listings, debt capital listings and capital raising, supporting businesses as they grow and expand.

Coronation Securities is committed to high standards, drawing on its market expertise and innovative solutions to deliver real value to its clients.

ABOUT GLOBAL BRANDS MAGAZINE

Global Brands Magazine (GBM) is a UK-based publication offering independent insights, analysis and recognition of brands that are shaping industries around the world. Through its editorial platform and annual awards programme, GBM assesses organisations on their performance, innovation, relevance and long-term impact across global markets.

The publication reaches more than 8 million readers a year, records over 10 million page views and has a growing international audience across digital and social platforms.

ABOUT THE GLOBAL BRAND AWARDS

The Global Brand Awards, organised by Global Brands Magazine (GBM), recognise outstanding organisations across a wide range of industries and international markets. Winners are selected through GBM’s research and evaluation process, which looks at performance, innovation, customer experience and consistency in their respective fields.

The 14th Global Brand Awards ceremony took place at Address Sky View, Dubai, on 2 October 2026. Organisations represented included Emirates NBD, ADNOC Distribution, Saudi Global Ports, HP Computing and Printing Middle East and Sobha Realty, alongside businesses from other international markets.

Further information is available on the Global Brand Awards winners page. Organisations interested in future editions can submit nominations through the Global Brand Awards nomination form.

 

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