Connect with us

Technology

Chenbro Debuts at COMPUTEX 2025 with AI Server Chassis Solutions and Three Service Models

Published

on

SAN JOSE, Calif., May 22, 2025 /PRNewswire/ — Chenbro (TWSE: 8210), a global leader in the server chassis industry, is making its most significant appearance to date at COMPUTEX 2025, taking place from May 20 to 23 in Taipei. This year’s expanded presence highlights Chenbro’s strategic focus on three core service models: OTS, JDM, and OEM Plus. Chenbro showcases its latest AI server enclosure solutions, along with cloud server products co-developed with leading partners from the U.S. and Taiwan. Demonstrating a full spectrum of capabilities—from standard products to fully customized solutions—Chenbro reaffirms its robust R&D and manufacturing strength in addressing the evolving needs of global enterprise and cloud markets.

Exemplifying Chenbro’s Core Values with Three Service Models

At COMPUTEX 2025, Chenbro showcases its strength through three key service models. The OTS demonstration highlights the latest NVIDIA MGX and DC-MHS solutions, along with a product roadmap spanning AI, Cloud, Storage, and Edge applications. Its modular design approach enables flexible configurations to meet diverse customer requirements, including OTS-customization solutions. In the JDM area, Chenbro features high-density AI servers and 21-inch OCP ORV3-compliant chassis, co-developed with clients. This model also underscores Chenbro’s global R&D collaboration, along with its JPDP (Joint Product Design Process) and DFM (Design for Manufacturing) capabilities that enhance collaboration efficiency and improve product quality. Meanwhile, the OEM Plus showcase emphasizes Chenbro’s manufacturing glocalization strategy, Lean Intelligent Manufacturing, and tooling knowledge management, demonstrating its achievements in lean production and manufacturing transformation.

Chenbro CEO, Corona Chen, stated that with its strong capabilities in electro-mechanical integration, Chenbro has adopted innovative and diversified business models to expand its market reach. By operating three parallel service models, Chenbro can meet the needs of a wide range of customers—including cloud service providers, system integrators, brand vendors, and channel partners—offering quick and efficient responses to market demands. This approach accelerates the deployment of AI, HPC, and big data infrastructure across data centers and enterprises. Looking ahead, Chenbro will continue to strengthen its global presence by expanding localized manufacturing and R&D teams, aiming to capture new growth opportunities in the AI and cloud server markets in collaboration with its customers.

Deepening AI Strategy with NVIDIA MGX Architecture and Server Development

AI servers remain a key focus in the market. With the release of NVIDIA’s GB300 NVL72 platform, Chenbro, an NVIDIA MGX ecosystem provider, showcases the next-generation NVIDIA GB300 compute tray at COMPUTEX 2025. Chenbro also displays a full range of AI products based on the NVIDIA MGX architecture, including 1U, 2U, and 4U server chassis. Many leading technology companies at the event have also demonstrated AI servers co-developed with Chenbro, highlighting the collaborative momentum among industry leaders and the promising future of AI applications.

In addition to its work with NVIDIA, Corona further emphasized that Chenbro will continue to strengthen its collaborations with CPU providers such as AMD, Intel, and Ampere. Chenbro is committed to investing in the R&D and manufacturing of next-generation servers, exploring the future landscape of AI, and addressing diverse application needs to build a mutually beneficial and thriving industry ecosystem.

About Chenbro

Founded in 1983, Chenbro has been the trailblazer in designing and manufacturing of own-brand rackmount system, tower server and PC chassis for over 42 years. Chenbro is not only qualified by the first-tier server brands and provides OEM Plus and ODM/JDM services with EMS companies, but also successfully develops its OTS (Off The Shelf) products to meet market demand. Chenbro extends its business footprint to datacenters and industrial solutions by continuously investing in technologies and delivers the most trusted server chassis with the highest standard of innovation. For more information, please visit www.chenbro.com

View original content to download multimedia:https://www.prnewswire.com/news-releases/chenbro-debuts-at-computex-2025-with-ai-server-chassis-solutions-and-three-service-models-302463971.html

SOURCE Chenbro Micom

Continue Reading
Click to comment

Leave a Reply

Your email address will not be published. Required fields are marked *

Technology

Chef Robotics Physical AI Models Can Now Automate Baked Goods Packing

Published

on

By

SAN FRANCISCO, April 29, 2026 /PRNewswire/ — Chef Robotics, a leader in physical AI for the food industry, today announced that Chef robots can now automate tray assembly for baked goods packing. The application places baked products, such as burger buns, chocolate chip cookies, biscotti, butter cookies, biscuits, fortune cookies, granola bars, rusks, and shortbreads into trays and packaging containers before sealing.

Watch Chef robots in action.

Baked goods packing has historically been difficult to automate for high-mix production. Each item behaves differently on the production line—a granola bar compresses under the wrong grip, while a biscotti or rusk can crack if placed at the wrong angle. Surface textures range from glazed and smooth to crumbly and irregular, and strict presentation requirements leave little room for error. This variability has made it challenging for automation systems to reliably handle baked goods at production speeds, leaving food manufacturers dependent on manual labor and traditional bakery equipment.

To address this, Chef built its baked goods packing application on its existing piece-picking capability, which uses Chef’s AI-powered computer vision and physical AI models trained across diverse real-world production environments. This allows Chef robots to assess each item’s position, shape, and orientation in real time and determine how to pick the items from the pan and place them quickly and precisely without damaging them.

The baked goods packing application supports four distinct placement capabilities.

First, Chef’s vision system detects the angle at which each item sits in the pan and reorients it after picking, placing it on the tray at the exact angle required, regardless of its original position, enabling retail-ready presentation for SKUs that require precise angular placement.

Second, Chef robots can place multiple baked goods into the same packaging container in a single automated pass, completing full tray assembly without manual intervention.

Third, for packaging containers with multiple small compartments, Chef robots can precisely place items into each designated section, including multiple items in the same compartment, using Chef’s AI vision model to detect compartment positions and orientations in real time.

Fourth, Chef’s vision system identifies the exact center of each tray and places every item at a predefined offset from that center, ensuring a uniform, consistent arrangement across every pack regardless of how trays arrive on the conveyor.

For food manufacturers evaluating bakery systems and baked goods packaging automation, the application offers higher throughput, reduced labor dependency, and consistent presentation across shifts. The capability runs on Chef’s existing robotic hardware and software, allowing manufacturers to deploy it without requiring any changes to their production lines.

Chef’s baked goods packing application is available in the U.S., Canada, Germany, and the UK and is included as part of Chef’s robotics-as-a-service (RaaS) pricing model.

About Chef Robotics
Chef is the first company to have commercialized a scalable AI-driven food robotics solution. With over 104 million servings made in production, Chef leverages ChefOS, an AI platform for food manipulation, to offer a Robotics-as-a-Service solution that helps industry-leading food companies increase production volume and meet demand. Headquartered in San Francisco, CA, Chef aims to empower humans to do what humans do best by accelerating the advent of intelligent machines. Visit https://chefrobotics.ai to learn more.

View original content:https://www.prnewswire.com/news-releases/chef-robotics-physical-ai-models-can-now-automate-baked-goods-packing-302756923.html

SOURCE Chef Robotics

Continue Reading

Technology

Chef Robotics Physical AI Models Can Now Automate Baked Goods Packing

Published

on

By

SAN FRANCISCO, April 29, 2026 /PRNewswire/ — Chef Robotics, a leader in physical AI for the food industry, today announced that Chef robots can now automate tray assembly for baked goods packing. The application places baked products, such as burger buns, chocolate chip cookies, biscotti, butter cookies, biscuits, fortune cookies, granola bars, rusks, and shortbreads into trays and packaging containers before sealing.

Watch Chef robots in action.

Baked goods packing has historically been difficult to automate for high-mix production. Each item behaves differently on the production line—a granola bar compresses under the wrong grip, while a biscotti or rusk can crack if placed at the wrong angle. Surface textures range from glazed and smooth to crumbly and irregular, and strict presentation requirements leave little room for error. This variability has made it challenging for automation systems to reliably handle baked goods at production speeds, leaving food manufacturers dependent on manual labor and traditional bakery equipment.

To address this, Chef built its baked goods packing application on its existing piece-picking capability, which uses Chef’s AI-powered computer vision and physical AI models trained across diverse real-world production environments. This allows Chef robots to assess each item’s position, shape, and orientation in real time and determine how to pick the items from the pan and place them quickly and precisely without damaging them.

The baked goods packing application supports four distinct placement capabilities.

First, Chef’s vision system detects the angle at which each item sits in the pan and reorients it after picking, placing it on the tray at the exact angle required, regardless of its original position, enabling retail-ready presentation for SKUs that require precise angular placement.

Second, Chef robots can place multiple baked goods into the same packaging container in a single automated pass, completing full tray assembly without manual intervention.

Third, for packaging containers with multiple small compartments, Chef robots can precisely place items into each designated section, including multiple items in the same compartment, using Chef’s AI vision model to detect compartment positions and orientations in real time.

Fourth, Chef’s vision system identifies the exact center of each tray and places every item at a predefined offset from that center, ensuring a uniform, consistent arrangement across every pack regardless of how trays arrive on the conveyor.

For food manufacturers evaluating bakery systems and baked goods packaging automation, the application offers higher throughput, reduced labor dependency, and consistent presentation across shifts. The capability runs on Chef’s existing robotic hardware and software, allowing manufacturers to deploy it without requiring any changes to their production lines.

Chef’s baked goods packing application is available in the U.S., Canada, Germany, and the UK and is included as part of Chef’s robotics-as-a-service (RaaS) pricing model.

About Chef Robotics
Chef is the first company to have commercialized a scalable AI-driven food robotics solution. With over 104 million servings made in production, Chef leverages ChefOS, an AI platform for food manipulation, to offer a Robotics-as-a-Service solution that helps industry-leading food companies increase production volume and meet demand. Headquartered in San Francisco, CA, Chef aims to empower humans to do what humans do best by accelerating the advent of intelligent machines. Visit https://chefrobotics.ai to learn more.

View original content:https://www.prnewswire.com/news-releases/chef-robotics-physical-ai-models-can-now-automate-baked-goods-packing-302756923.html

SOURCE Chef Robotics

Continue Reading

Technology

Air Products to Expand Industrial Gas Supply for Samsung Electronics’ Next-Generation Semiconductor Fab in South Korea

Published

on

By

New investment underscores the company’s long-term commitment to Korea and its leading role in the global semiconductor industry 

LEHIGH VALLEY, Pa., April 29, 2026 /PRNewswire/ — Air Products (NYSE:APD), a world-leading industrial gases company and serving Samsung globally, today announced it has been selected by Samsung to supply industrial gases for its new advanced semiconductor fab in Pyeongtaek, Gyeonggi Province, South Korea.

Under the agreement, Air Products will build, own and operate multiple state-of-the-art production facilities and a bulk specialty gas supply system to supply nitrogen, oxygen, argon, and hydrogen for Samsung’s new semiconductor fab. The new facilities are expected to come onstream in multiple phases from 2028 through 2030.

Air Products has a long track record of executing multiple phase expansions in Pyeongtaek to support Samsung’s growing manufacturing needs. This latest project represents Air Products’ largest investment to date in the semiconductor industry and will establish Pyeongtaek as the company’s single largest operations site globally supporting the electronics industry. 

“Air Products is honored to be selected once again by Samsung and to have their continued confidence as a trusted partner supporting their strategic growth plans,” said SR Kim, President, Air Products Korea. “This significant investment reinforces Air Products’ role as a leading global supplier to the semiconductor industry and underscores our long-standing commitment to supporting our strategic customers with safety, reliability, efficiency and excellent service.”

Air Products has served the global electronics industry for more than 40 years, supplying industrial gases safely and reliably to many of the world’s leading technology companies. The company has operated in Korea for more than 50 years and has established a strong position in electronics and manufacturing sectors.

About Air Products

Air Products (NYSE: APD) is a world-leading industrial gases company in operation for over 85 years focused on serving energy, environmental, and emerging markets and generating a cleaner future. The Company supplies essential industrial gases, related equipment and applications expertise to customers in dozens of industries, including refining, chemicals, metals, electronics, manufacturing, medical and food. As the leading global supplier of hydrogen, Air Products also develops, engineers, builds, owns and operates some of the world’s largest clean hydrogen projects, supporting the transition to low- and zero-carbon energy in the industrial and heavy-duty transportation sectors. Through its sale of equipment businesses, the Company also provides turbomachinery, membrane systems and cryogenic containers globally.

Air Products had fiscal 2025 sales of $12 billion from operations in approximately 50 countries. For more information, visit airproducts.com or follow us on LinkedInXFacebook or Instagram.

This release contains “forward-looking statements” within the safe harbor provisions of the Private Securities Litigation Reform Act of 1995. These forward-looking statements are based on management’s expectations and assumptions as of the date of this release and are not guarantees of future performance. While forward-looking statements are made in good faith and based on assumptions, expectations and projections that management believes are reasonable based on currently available information, actual performance and financial results may differ materially from projections and estimates expressed in the forward-looking statements because of many factors, including the risk factors described in our Annual Report on Form 10-K for the fiscal year ended September 30, 2025 and other factors disclosed in our filings with the Securities and Exchange Commission. Except as required by law, we disclaim any obligation or undertaking to update or revise any forward-looking statements contained herein to reflect any change in the assumptions, beliefs or expectations or any change in events, conditions or circumstances upon which any such forward-looking statements are based.

View original content to download multimedia:https://www.prnewswire.com/news-releases/air-products-to-expand-industrial-gas-supply-for-samsung-electronics-next-generation-semiconductor-fab-in-south-korea-302757497.html

SOURCE Air Products

Continue Reading

Trending